阅读说明：本技术 半导体模块 (Semiconductor module ) 是由 塩原真由美 于 2019-06-24 设计创作，主要内容包括：能够小型化且能够增大通电能力。半导体模块具备输入输出端子,所述输入输出端子与半导体元件的主电极电连接,从树脂壳体起与树脂壳体的正面垂直地延伸,其压入部(160)呈平板状,在压入部(160)的通电部(162)的至少一个平板面具备具有弹性的弹性部(163a、163b)。这样,由于输入输出端子具备呈平板状且在平板面具有弹性的弹性部(163a、163b),所以与例如在侧面方向具有弹性的控制端子相比,能够实现大电流的通电。另外,由于输入输出端子通过压入而容易且可靠地与印刷基板(100)连接,所以无需用于连接的空间。(The size can be reduced and the current carrying capacity can be increased. The semiconductor module is provided with input/output terminals electrically connected to main electrodes of the semiconductor elements, extending perpendicularly from the resin case to the front surface of the resin case, and having press-fitting portions (160) in the shape of a flat plate, and elastic portions (163a, 163b) having elasticity on at least one flat plate surface of a current-carrying portion (162) of the press-fitting portion (160). Since the input/output terminal has the elastic portions (163a, 163b) having a flat plate shape and elasticity on the flat surface, it is possible to conduct a large current compared to, for example, a control terminal having elasticity in the side surface direction. In addition, the input/output terminal is easily and reliably connected to the printed circuit board (100) by press-fitting, so that a space for connection is not required.)

1. A semiconductor module, comprising:

a semiconductor element;

a frame body that houses the semiconductor element;

a 1 st connection terminal electrically connected to a control electrode of the semiconductor element and extending from the frame body; and

and a 2 nd connection terminal electrically connected to a main electrode of the semiconductor device and extending from the housing, wherein a press-fitting portion of the 2 nd connection terminal is flat, and at least one flat surface of the press-fitting portion has an elastic portion having elasticity.

2. The semiconductor module according to claim 1, wherein at least one of the flat plate surfaces of the holding region in which the 2 nd connection terminal is held at the time of press-fitting has a groove adjacent to a root side of the elastic portion.

3. The semiconductor module according to claim 1, wherein the elastic portion of the 2 nd connection terminal is formed to protrude with respect to the flat plate surface in a holding region where it is held at the time of press-fitting.

4. The semiconductor module according to claim 1, wherein the elastic portion provided in the 2 nd connection terminal protrudes from the flat surface so as to be adjacent to a front end side of a holding region held at the time of press-fitting,

the 2 nd connecting terminal includes a clamping portion adjacent to a root portion side of the holding region and protruding from the flat plate surface.

5. The semiconductor module according to any one of claims 1 to 4, wherein the frame body is box-shaped,

the 2 nd connecting terminals are respectively arranged on at least 2 opposite sides of the edge part of the front surface of the frame body.

6. A semiconductor module, comprising:

a semiconductor element;

a frame body that houses the semiconductor element;

a 1 st connection terminal electrically connected to a control electrode of the semiconductor element and extending from the frame body; and

and a 2 nd connection terminal electrically connected to a main electrode of the semiconductor element and extending from the housing, wherein a press-fitting portion of the 2 nd connection terminal is flat, and a plurality of projections are formed in a holding region of at least one flat surface of the press-fitting portion, the holding region being held during press-fitting.

7. The semiconductor module according to claim 6, wherein the convex portion is formed in the holding region in parallel with or perpendicular to a press-fitting direction, and the holding region is formed in a zigzag shape.

Technical Field

The present invention relates to a semiconductor module.

Background

The Semiconductor module includes Semiconductor elements such as an IGBT (Insulated Gate Bipolar Transistor) and a power MOSFET (Metal Oxide Semiconductor Field Effect Transistor). Such a semiconductor module includes a ceramic circuit board, a semiconductor element disposed on the ceramic circuit board, a pin-shaped control terminal electrically connected to a control electrode of the semiconductor element, and a pin-shaped input/output terminal electrically connected to a main electrode of the semiconductor element. The ceramic circuit board and the semiconductor element are packaged by a packaging member, and external terminals including control terminals and input/output terminals extend from the front surface of the semiconductor module in the vertical direction.

The semiconductor module is mounted on, for example, an inverter device, and its external terminal is fitted into an opening formed in a printed board of the inverter device. Thereby, the external terminal is electrically connected to the wiring in the printed board. As described above, a semiconductor device including a semiconductor Module and a printed circuit board connected thereto is used for applications such as motor operation control as an IPM (Intelligent Power Module) (see, for example, patent document 1).

Disclosure of Invention

Technical problem

In the semiconductor device, a large current flows through the input/output terminal. Therefore, in order to allow a large current to flow, the input/output terminals need to maintain a predetermined number of terminals. Therefore, the number of terminals of the input/output terminal cannot be reduced, and a corresponding space is required. Therefore, there is a problem that miniaturization of the semiconductor module (and the semiconductor device) is difficult.

The present invention has been made in view of such circumstances, and an object thereof is to provide a semiconductor module which can flow a large current and can be miniaturized.

Technical scheme

According to an aspect of the present invention, there is provided a semiconductor module including: a semiconductor element; a frame body which houses the semiconductor element; a 1 st connection terminal electrically connected to a control electrode of the semiconductor element and extending from the housing; and a 2 nd connection terminal electrically connected to a main electrode of the semiconductor device and extending from the housing, wherein a press-fitting portion of the 2 nd connection terminal is flat, and at least one flat surface of the press-fitting portion has an elastic portion having elasticity.

In addition, according to an aspect of the present invention, there is provided a semiconductor module including: a semiconductor element; a frame body which houses the semiconductor element; a 1 st connection terminal electrically connected to a control electrode of the semiconductor element and extending from the housing; and a 2 nd connecting terminal electrically connected to a main electrode of the semiconductor element and extending from the housing, wherein a press-fitting portion of the 2 nd connecting terminal is flat, and a plurality of projections are formed in a holding region of at least one flat surface of the press-fitting portion, the holding region being held during press-fitting.

Effects of the invention

According to the disclosed technology, the size can be reduced and the current carrying capacity can be increased.

The above and other objects, features and advantages of the present invention will become apparent from the accompanying drawings and the related description which illustrate preferred embodiments of the invention by way of example.

Drawings

Fig. 1 is a plan view of a semiconductor module according to embodiment 1.

Fig. 2 is a side view of the semiconductor module of embodiment 1.

Fig. 3 is a sectional view of a main part of the semiconductor module according to embodiment 1.

Fig. 4 is a diagram showing an example of a press-fitting portion of a control terminal of the semiconductor module according to embodiment 1.

Fig. 5 is a plan view of the semiconductor device according to embodiment 1.

Fig. 6 is a side view of the semiconductor device according to embodiment 1.

Fig. 7 is a diagram showing a press-fitting portion of an input/output terminal of the semiconductor module according to embodiment 1.

Fig. 8 is a diagram showing connection between the press-fit portion of the input/output terminal of the semiconductor module and the printed circuit board according to embodiment 1.

Fig. 9 is a diagram showing a press-fitting portion of an input/output terminal of the semiconductor module according to embodiment 2.

Fig. 10 is a diagram showing connection between the press-fit portion of the input/output terminal of the semiconductor module according to embodiment 2 and the printed circuit board.

Fig. 11 is a diagram showing a press-fitting portion of an input/output terminal of the semiconductor module according to embodiment 3.

Fig. 12 is a diagram showing connection between the press-fit portion of the input/output terminal of the semiconductor module according to embodiment 3 and the printed circuit board.

Fig. 13 is a diagram showing a press-fitting portion of an input/output terminal of the semiconductor module according to embodiment 4.

Fig. 14 is a diagram showing connection between the press-fit portion of the input/output terminal of the semiconductor module according to embodiment 4 and the printed circuit board.

Fig. 15 is a diagram showing a press-fitting portion of an input/output terminal of the semiconductor module according to embodiment 5.

Fig. 16 is a diagram showing connection between the press-fit portion of the input/output terminal of the semiconductor module according to embodiment 5 and the printed circuit board.

Fig. 17 is a diagram showing a press-fitting portion of an input/output terminal of the semiconductor module according to embodiment 6.

Fig. 18 is a diagram showing connection between the press-fit portion of the input/output terminal of the semiconductor module according to embodiment 6 and the printed circuit board.

Fig. 19 is a diagram showing a press-fitting portion of an input/output terminal of the semiconductor module according to embodiment 7.

Fig. 20 is a diagram showing connection between the press-fit portion of the input/output terminal of the semiconductor module according to embodiment 7 and the printed circuit board.

Fig. 21 is a diagram showing a press-fitting portion of an input/output terminal of the semiconductor module according to embodiment 8.

Fig. 22 is a diagram showing connection between the press-fit portion of the input/output terminal of the semiconductor module according to embodiment 8 and the printed circuit board.

Description of the symbols

10: semiconductor module

20: ceramic circuit board

21: insulating board

22: metal plate

23a to 23 d: circuit pattern

30a to 30 b: semiconductor device with a plurality of semiconductor chips

40: heat radiation plate

50: control terminal (1 st connecting terminal)

60: input/output terminal (2 nd connecting terminal)

70a to 70 b: bonding wire

80: resin case (frame)

81: opening part

82a to 82 d: side wall part

90: packaging component

100: printed circuit board

110: base body part

111: control opening part

112: input/output opening part

150. 160, 260, 360, 460, 560, 660, 760, 860: pressing-in part

152. 162, 262a to 262b, 362a to 362b, 462a to 462b, 562, 662, 762, 862: conducting part

153a to 153b, 163a to 163b, 263a to 263b, 363a to 363b, 463a to 463b, 563a to 563b, 663a to 663b, 763a to 763b, and 863a to 863 b: elastic part

164a to 164b, 264a to 264b, 364a to 364b, 464a to 464b, 564a to 564b, 664, 764, 864: holding area

200: semiconductor device with a plurality of semiconductor chips

261a, 361a, 461 a: 1 st pressing part

261b, 361b, 461 b: 2 nd press-in member

365 a-365 b, 465 a-465 b, 565: insertion part

466a to 466 b: clamping part

Detailed Description

[ embodiment 1 ]

Hereinafter, a semiconductor module according to embodiment 1 will be described with reference to fig. 1 and 2.

Fig. 1 is a plan view of a semiconductor module according to embodiment 1, and fig. 2 is a side view of the semiconductor module according to embodiment 1. Fig. 2 (a) is a view of the semiconductor module 10 of fig. 1 as viewed from the lower side of fig. 1, and fig. 2 (B) is a view of the semiconductor module 10 of fig. 1 as viewed from the left side of fig. 1.

The semiconductor module 10 includes: a resin case 80 (frame) in which semiconductor elements are housed and which is rectangular in a plan view, a sealing member 90 which seals the inside of the resin case 80, and a heat sink 40 provided on the back surface of the resin case 80. In addition, input/output terminals 60 (2 nd connection terminals) extending perpendicularly from the front surfaces of the side wall portions 82a and 82b on the opposing short sides of the resin case 80 are provided, respectively. Similarly, control terminals 50 (1 st connection terminals) extending vertically from the front surfaces of the opposing long side wall portions 82c and 82d of the resin case 80 are provided, respectively. In the resin case 80, the surface on the side where the input/output terminal 60 and the control terminal 50 extend is referred to as a front surface, the surface on the side where the heat dissipation plate 40 extends is referred to as a rear surface, and the surface connecting the front surface and the rear surface is referred to as a side surface. The number of terminals of the input/output terminal 60 and the control terminal 50 shown in fig. 1 and 2 is an example, and is not limited to these. The details of the input/output terminal 60 and the control terminal 50 will be described later. The input/output terminal 60 shown in fig. 1 and 2 is simplified and a detailed shape to be described later is omitted.

Next, the internal structure of the semiconductor module 10 will be described with reference to fig. 3. Fig. 3 is a sectional view of a main part of the semiconductor module according to embodiment 1. Fig. 3 (a) shows a cross-sectional view taken along a one-dot chain line X1-X1 in fig. 1, and fig. 3 (B) shows a cross-sectional view taken along a one-dot chain line X2-X2 in fig. 1.

As shown in fig. 3, the semiconductor module 10 includes a ceramic circuit board 20 and semiconductor elements 30a and 30b provided on the front surface of the ceramic circuit board 20. The number of the ceramic circuit board 20 and the semiconductor elements 30a and 30b is an example, and is not limited to the case of fig. 3. The ceramic circuit board 20 is disposed on the heat sink 40 via solder (not shown). Heat sink 40 is joined to opening 81 of resin case 80 with an adhesive (not shown) from the back surface side (lower side in fig. 3) of resin case 80. Thereby, the ceramic circuit board 20 and the semiconductor elements 30a and 30b are surrounded by the resin case 80.

In addition, the resin case 80 includes the control terminal 50 and the input-output terminal 60 and is molded. For example, as shown in fig. 3a, one end of the control terminal 50 provided in the resin case 80 surrounding the ceramic circuit board 20 and the semiconductor element 30a is electrically connected to the ceramic circuit board 20, and the other end (press-fitting portion) extends perpendicularly from the front surface of the side wall portion 82 d. The control terminal 50 is electrically connected to the control electrode of the semiconductor element 30a via the ceramic circuit board 20 and the bonding wire 70 a. The other control terminals 50 are also configured similarly. As shown in fig. 3B, for example, one end of the input/output terminal 60 provided in the resin case 80 surrounding the ceramic circuit board 20 and the semiconductor element 30B is electrically connected to the ceramic circuit board 20, and the other end (press-fitting portion) extends perpendicularly from the front surface of the side wall portion 82B. The input/output terminal 60 is electrically connected to the main electrode of the semiconductor element 30b via the ceramic circuit board 20 and the bonding wire 70 b. The other input/output terminals 60 are similarly configured. The ceramic circuit board 20, the semiconductor elements 30a and 30b, the bonding wires 70a and 70b, the control terminal 50, and the input/output terminal 60 accommodated in the resin case 80 are encapsulated by the encapsulating member 90.

The semiconductor elements 30a and 30b include switching elements such as IGBTs and power MOSFETs, for example. The semiconductor elements 30a and 30b are made of silicon or silicon carbide. Such semiconductor elements 30a and 30b include, for example, an input electrode (drain or collector) as a main electrode on the back surface, and a control electrode (gate) and an output electrode (source or emitter) as a main electrode on the front surface. The semiconductor elements 30a and 30b include diodes such as SBD (Schottky Barrier Diode) and FWD (Free Wheeling Diode) as necessary. Such semiconductor elements 30a and 30b include output electrodes (cathode electrodes) as main electrodes on the back surfaces thereof and input electrodes (anode electrodes) as main electrodes on the front surfaces thereof. The semiconductor elements 30a and 30b may include RC (Reverse-conducting) -IGBTs. In the present embodiment, a case where only the semiconductor elements 30a and 30b are included will be described as an example. But is not limited thereto, and electronic components may be provided as needed. The electronic component is, for example, a resistor, a thermistor, a capacitor, a surge absorber, or the like.

The ceramic circuit board 20 includes an insulating plate 21 and a metal plate 22 formed on the back surface of the insulating plate 21. The ceramic circuit board 20 has circuit patterns 23a to 23d formed on the front surface of the insulating plate 21. The insulating plate 21 is made of high thermal conductivity ceramics such as alumina, aluminum nitride, and silicon nitride having excellent thermal conductivity. The metal plate 22 is made of a metal having excellent thermal conductivity, such as aluminum, iron, silver, copper, or an alloy containing at least one of these metals. The circuit patterns 23a to 23d are made of metal having excellent conductivity, such as copper or copper alloy. Further, semiconductor elements 30a and 30b are disposed on the circuit patterns 23a and 23c, respectively, with solder (not shown). In the case of fig. 3 (a), the circuit pattern 23b is electrically connected to the control electrode of the semiconductor element 30a via the bonding wire 70 a. In the case of fig. 3 (B), the circuit pattern 23d is electrically connected to the output electrode of the semiconductor element 30B via the bonding wire 70B and the circuit pattern 23 c. The number and shape of the circuit patterns 23a to 23d are an example, and other numbers and shapes are possible. The thickness of the circuit patterns 23a to 23d is, for example, 0.1mm or more and 1mm or less.

As the ceramic circuit board 20 having such a configuration, for example, a DCB (Direct copper bonding) board or an AMB (Active Metal soldered) board can be used. The ceramic circuit board 20 can conduct heat generated in the semiconductor elements 30a and 30b to the heat sink 40 side through the circuit patterns 23a and 23c, the insulating plate 21, and the metal plate 22.

The heat sink 40 is made of, for example, aluminum, iron, silver, copper, or an alloy containing at least one of these, which has excellent thermal conductivity. In addition, in order to improve corrosion resistance, a material such as nickel may be formed on the surface of the heat sink 40 by plating or the like, for example. Specifically, in addition to nickel, there are nickel-phosphorus alloys, nickel-boron alloys, and the like. A cooler (not shown) may be mounted on the back surface side of the heat sink 40 via solder, silver solder, or the like to improve heat dissipation. The cooler in this case is made of, for example, aluminum, iron, silver, copper, or an alloy containing at least one of these, which has excellent thermal conductivity. Further, as the cooler, a radiator composed of a plurality of fins, a cooling device using water cooling, or the like can be applied. The heat radiation plate 40 may be integrally formed with such a cooler. In this case, the material is made of aluminum, iron, silver, copper, or an alloy containing at least one of these, which has excellent thermal conductivity. In order to improve corrosion resistance, a material such as nickel may be formed on the surface of the heat sink 40 integrated with the cooler by plating or the like, for example. Specifically, in addition to nickel, there are nickel-phosphorus alloys, nickel-boron alloys, and the like.

The control terminal 50 and the input/output terminal 60 are made of copper, aluminum, iron, or an alloy containing at least one of these, which has excellent conductivity. In addition, in order to improve corrosion resistance, for example, nickel, gold, or an alloy containing at least one of these metals may be formed on the surfaces of the control terminal 50 and the input/output terminal 60 by plating or the like. The input/output terminal 60 is flat at least at a position (press-fitting portion) extending from the front surface of the resin case 80. The press-fitting portion of the input/output terminal 60 shown in fig. 1 to 3 is simply illustrated as being flat. A specific configuration of the press-fitting portion of the input/output terminal 60 will be described later.

The resin case 80 has a box shape with its periphery surrounded by side wall portions 82a to 82d, and forms an opening 81 for accommodating the ceramic circuit board 20 and the like in the central portion. The side wall portions 82a to 82b are provided with the input/output terminals 60, respectively, as described above. The side wall portions 82c to 82d are provided with the control terminals 50, respectively, as described above. Such a resin case 80 is formed by, for example, molding using a thermoplastic resin. Examples of the material of such a resin include polyphenylene sulfide (PPS), polybutylene terephthalate (PBT), polybutylene succinate (PBS), Polyamide (PA), and Acrylonitrile Butadiene Styrene (ABS).

The sealing member 90 is made of a thermosetting resin such as a maleimide-modified epoxy resin, a maleimide-modified phenol resin, or a maleimide resin. The sealing member 90 may be made of silicone gel. The bonding wires 70a and 70b used in the semiconductor module 10 are made of metal such as aluminum having excellent conductivity. Further, it is preferable that the diameters thereof are 100 μm or more and 1mm or less. Instead of the bonding wires 70a and 70b, a wiring member such as a lead frame or a strip-shaped conductive member may be used. In the present embodiment, a description is given of the semiconductor module 10 including the rectangular resin case 80 (frame) and the sealing member 90 for sealing the resin case 80 in a plan view. However, the frame may be configured to form the outer shape of the semiconductor module 10 and enclose the semiconductor elements 30a and 30b and the front surface of the ceramic circuit board 20. For example, the resin case 80 and the sealing member 90 may be an integral housing. Alternatively, the semiconductor elements 30a and 30b, the ceramic circuit board 20, and the like may be enclosed in the package member 90, and the press-fitting portions of the control terminal 50 and the input/output terminal 60 may be extended to form a housing (discrete type). Such a frame body is formed by, for example, molding using a thermosetting resin. As such a resin, there are epoxy resins mixed with inorganic fillers and the like.

Next, the press-fitting portion of the control terminal 50 provided in the semiconductor module 10 will be described with reference to fig. 4. Fig. 4 is a diagram showing an example of a press-fitting portion of a control terminal of the semiconductor module according to embodiment 1. Fig. 4 (a) is a view of the press-fitting portions 150 of the control terminals 50 of the semiconductor module 10 viewed from the side wall portions 82c and 82d, and fig. 4 (B) is a view of the press-fitting portions 150 of the control terminals 50 of the semiconductor module 10 viewed from the side wall portions 82a and 82B.

The press-fitting portion 150 of the control terminal 50 has a current-carrying portion 152 electrically connected to the control electrode of the semiconductor element 30a and elastic portions 153a and 153 b. The current-carrying portion 152 extends from the upper surface of the resin case 80 and is connected to the elastic portions 153a and 153 b. The press-fitting portion 150 of the control terminal 50 has a flat plate shape having a surface parallel to the paper surface of fig. 4 (a). The current-carrying portion 152 has a flat plate shape, and has a flat plate surface perpendicular to the thickness direction of the current-carrying portion 152 and a side surface parallel to the thickness direction of the current-carrying portion 152. The elastic portions 153a and 153b are formed integrally with the current-carrying portion 152, and are separated from each other in a substantially arch shape that is curved outward with respect to the vertical direction in fig. 4 (a). The elastic portions 153a and 153b have flat plate surfaces parallel to the arcuate surfaces of the elastic portions 153a and 153b and side surfaces perpendicular to the arcuate surfaces of the elastic portions 153a and 153 b. The elastic portions 153a and 153b have elasticity in the direction of the broken line arrow in fig. 4, with the connecting portion with the conducting portion 152 as a fulcrum. That is, the press-fitting portion 150 of the control terminal 50 has elasticity in the side surface direction. The widths and thicknesses of the current-carrying portions 152 and the elastic portions 153a and 153b of the control terminals 50 are appropriately selected according to the design specifications of the semiconductor module 10. Here, the width of the current-carrying portion 152 is, for example, 1mm or more and 5mm or less. The elastic portions 153a and 153b are bent in a substantially arch shape, and the width of the farthest portion is 1.0 times or more and 2.5 times or less the width of the current carrying portion 152. The thickness of the current-carrying portion 152 and the elastic portions 153a and 153b is 0.2 times or more and less than 1.0 times the width of the current-carrying portion 152.

Next, a semiconductor device configured by connecting the semiconductor module 10 to a printed circuit board will be described with reference to fig. 5 and 6. Fig. 5 is a plan view of the semiconductor device according to embodiment 1, and fig. 6 is a side view of the semiconductor device according to embodiment 1. In fig. 5, the semiconductor module 10 included in the semiconductor device 200 is shown by a broken line. Fig. 6 is a side view of the semiconductor device 200 shown in fig. 5 as viewed from the side wall portion 82d of the semiconductor module 10. The input/output terminal 60 shown in fig. 5 and 6 is simplified and a detailed shape to be described later is omitted.

The semiconductor device 200 includes a semiconductor module 10 and a printed circuit board 100 provided on the semiconductor module 10. The printed circuit board 100 includes a base portion 110 in which a control opening 111 and an input/output opening 112 are formed. The base portion 110 includes an insulating layer and a conductive layer provided on the front surface of the insulating layer and constituting a circuit pattern for realizing a predetermined wiring. The base body portion 110 has control openings 111 formed at positions corresponding to the control terminals 50 of the semiconductor module 10. The control opening 111 is internally plated with a conductive member such as copper or a copper alloy. Thereby, the control opening 111 is electrically connected to the circuit pattern through which the control signal is energized. The shape of the control opening 111 in plan view is preferably a square or a perfect circle. In the case of a square, the corner portions do not necessarily need to be right-angled, and may have a curvature.

The base portion 110 has input/output openings 112 formed at positions corresponding to the input/output terminals 60 of the semiconductor module 10. The input/output opening 112 is also internally plated with a conductive member such as copper or a copper alloy. Thereby, the input/output opening 112 is electrically connected to the circuit pattern through which the input/output signal is supplied. The input/output opening 112 is preferably rectangular in shape in plan view. In the case of a rectangle, the corner portion does not necessarily need to be a right angle, and may have a curvature. Further, electronic components (not shown) and connection terminals (not shown) electrically connected to the control opening 111 and the input/output opening 112 via a predetermined circuit pattern are arranged on the base portion 110 as necessary. The electronic component receives a control signal at a predetermined timing, and an external device is connected to the connection terminal to receive an input current or output an output current. The insulating layer of the base portion 110 is made of, for example, polyimide resin, epoxy resin, or the like. In addition, a glass fiber cloth made of glass fibers may be impregnated therein, depending on the case. The conductive layer is made of a metal having excellent conductivity, such as copper.

In such a printed circuit board 100, the control opening 111 and the input/output opening 112 are aligned with the control terminal 50 and the input/output terminal 60 of the semiconductor module 10. After the alignment, the printed board 100 is pressed toward the semiconductor module 10. As a result, as shown in fig. 5 and 6, the semiconductor device 200 is configured in which the control terminal 50 and the input/output terminal 60 of the semiconductor module 10 are press-fitted into the control opening 111 and the input/output opening 112, respectively. At this time, in the press-fitting portion 150 (fig. 4) of the control terminal 50, the elastic portions 153a and 153b are deformed inward so that the gap therebetween is narrowed and enters the control opening 111. Then, the elastic portions 153a and 153b are returned to their original positions by their elastic forces, and are maintained in contact with the control opening 111. Therefore, the conductive member formed inside the control opening 111 is connected to the side surfaces of the elastic portions 153a and 153b (fig. 4) of the control terminal 50. Thus, the circuit pattern of the printed circuit board 100 to which the control signal is applied is electrically connected to the control electrode of the semiconductor element 30a of the semiconductor module 10.

The input/output terminal 60 is also pressed into the input/output opening 112 to maintain contact. Therefore, details of the press-fitting portion of the input/output terminal 60 will be described below with reference to fig. 7. Fig. 7 is a diagram showing a press-fitting portion of an input/output terminal of the semiconductor module according to embodiment 1. Fig. 7 a is a view of the press-fitting portion 160 of the input/output terminal 60 included in the semiconductor module 10 viewed from the side wall portion 82a (or the side wall portion 82B) in fig. 1, and fig. 7B is a view of the press-fitting portion 160 of the input/output terminal 60 included in the semiconductor module 10 viewed from the side wall portion 82c (or the side wall portion 82d) in fig. 1.

The press-fit portion 160 of the input/output terminal 60 has a substantially flat plate shape. The press-fitting portion 160 includes a current-carrying portion 162 and elastic portions 163a and 163 b. The current-carrying portion 162 extends perpendicularly from the front surface of the resin case 80, and is connected to the elastic portions 163a and 163b at the distal end of the flat plate surface of the current-carrying portion 162. The current-carrying portion 162 includes holding regions 164a and 164b in regions adjacent to the elastic portions 163a and 163b at the root portions of the elastic portions 163a and 163 b. The holding regions 164a and 164b have grooves in the width direction on the flat plate surface. The elastic portions 163a and 163b are branched from the distal end of the current-carrying portion 162 in the thickness direction and extend along the distal end side of the press-fitting portion 160 so as to be separated therefrom. Therefore, the elastic portions 163a and 163b are larger than the holding regions 164a and 164b of the conducting portion 162 with respect to the interval between the outer flat plate surfaces. Note that, in the input/output terminal 60, the flat surface refers to a surface parallel to the paper surface in fig. 7 (a) and perpendicular to the thickness direction of the press-fitting portion 160. Note that, in the input/output terminal 60, the tip refers to a position away from the resin case 80 (upper side in fig. 7), and the root refers to a position close to the resin case 80 (lower side in fig. 7).

The press-fitting portion 160 of the input/output terminal 60 is obtained by processing a flat plate into a shape as shown in fig. 7. The width and thickness of the press-fitting portion 160 of the input/output terminal 60 are appropriately selected according to the design specifications of the semiconductor module 10. Here, the width of the press-fitting portion 160 is, for example, 5mm to 15 mm. The distance between the outer flat surfaces of the elastic portions 163a and 163b is greater than 0.1 times and less than 1.0 times the width of the press-fitting portion 160. The thickness of the groove portions of the holding regions 164a and 164b is, for example, 0.2 times or more and 0.9 times or less the distance between the outer flat surfaces of the elastic portions 163a and 163 b.

Next, the press-fitting of the input/output terminal 60 having the press-fitting portion 160 into the input/output opening 112 of the printed circuit board 100 will be described with reference to fig. 8. Fig. 8 is a diagram showing connection between the press-fit portion of the input/output terminal of the semiconductor module and the printed circuit board according to embodiment 1. Fig. 8 is a view of the printed circuit board 100 and the press-fit portion 160 of the input/output terminal 60 included in the semiconductor module 10 when viewed from the side wall portion 82c (or the side wall portion 82d) side of fig. 1. Fig. 8 (a) shows a case where the press-fitting portion 160 of the input/output terminal 60 is aligned with the input/output opening 112 of the printed circuit board 100. Fig. 8 (B) shows a case where the press-fitting portion 160 of the input/output terminal 60 is press-fitted into the input/output opening 112 of the printed circuit board 100.

First, the printed circuit board 100 is provided on the semiconductor module 10 such that the input/output openings 112 and the control openings 111 face the input/output terminals 60 and the control terminals 50 of the semiconductor module 10 (fig. 8 a). The printed circuit board 100 is moved from this state toward the semiconductor module 10, and the press-fitting portion 160 of the input/output terminal 60 is press-fitted into the input/output opening 112. At the time of press-fitting, the tip end portions of the elastic portions 163a and 163b of the press-fitting portion 160 of the input/output terminal 60 are deformed inward (the gap between the elastic portions 163a and 163b is narrowed) and enter the input/output opening 112. When the printed circuit board 100 is further pressed toward the semiconductor module 10, the input/output opening 112 passes over the elastic portions 163a and 163b and holds the holding regions 164a and 164 b. Then, the elastic portions 163a and 163b return to the original positions. In this way, the press-fitting portion 160 of the input/output terminal 60 is stably press-fitted into the input/output opening 112 of the printed circuit board 100, and the input/output terminal 60 is maintained in contact with the input/output opening 112 (fig. 8B). Therefore, the conductive member formed inside the input/output opening 112 is connected to the flat plate surfaces of the elastic portions 163a and 163b of the input/output terminal 60. Thus, the circuit pattern (no reference numeral) through which the input/output current (input current and output current) of the printed circuit board 100 is passed is electrically connected to the main electrodes of the semiconductor elements 30a and 30b of the semiconductor module 10.

In this way, the semiconductor module 10 includes the semiconductor elements 30a and 30b, the resin case 80 housing the semiconductor elements 30a and 30b, and the control terminal 50 electrically connected to the control electrodes of the semiconductor elements 30a and 30b and extending from the resin case 80. The semiconductor module 10 further includes an input/output terminal 60, the input/output terminal 60 being electrically connected to main electrodes of the semiconductor elements 30a and 30b, extending from the resin case 80, and having a flat plate-like press-fitting portion 160, and having elastic portions 163a and 163b on at least one flat plate surface of the current-carrying portion 162 of the press-fitting portion 160. In this way, the input/output terminal 60 includes elastic portions 163a and 163b having a flat plate shape and elasticity on the flat plate surface. Therefore, the input/output terminal 60 can be energized with a larger current than the control terminal 50 having elasticity in the side surface direction, for example. That is, it is not necessary to prepare a plurality of terminals. Further, the input/output terminal 60 can be easily and reliably connected to the printed circuit board 100 by press fitting. Therefore, compared to a pin-shaped external terminal joined by a joining member such as solder, a large amount of space for connection is not required. Therefore, the semiconductor module 10 can be miniaturized and the energization capability can be increased.

In addition, the semiconductor module 10 has a control terminal 50 and an input-output terminal 60. Therefore, a control signal of a small current can be input and output using the control terminal 50, and an input/output current of a large current can be input and output using the input/output terminal 60. Therefore, the number of terminals can be reduced as compared with the case where only the control terminal 50 is provided, and space saving can be achieved. In addition, as compared with the case where only the input/output terminal 60 is provided, a small-sized terminal can be used, and space can be saved. In addition, the force applied when the printed circuit board 100 is pressed can be reduced. Therefore, the printed circuit board 100 can be stably connected to the control terminal 50 and the input/output terminal 60 of the semiconductor module 10. Therefore, the semiconductor module 10 can be miniaturized and the energization capability can be increased. In the semiconductor module 10, the input/output terminals 60 are disposed on at least the facing side walls 82a and 82 b. Therefore, the printed circuit board 100 can be stably connected to the semiconductor module 10 without being biased toward any of the side wall portions 82a to 82 d. Therefore, the input/output terminals 60 are not limited to this, but are preferably arranged on 2 or more sides of the side wall portions 82a to 82 d.

[ 2 nd embodiment ]

Next, another press-fitting portion of the input/output terminal 60 will be described with reference to fig. 9. In embodiment 2, the input/output terminal 60 is applied to a semiconductor device 200 including the semiconductor module 10 and the printed circuit board 100 shown in fig. 1 to 6 of embodiment 1. Fig. 9 is a diagram showing a press-fitting portion of an input/output terminal of the semiconductor module according to embodiment 2. Fig. 9 a is a view of the press-fitting portion 260 of the input/output terminal 60 provided in the semiconductor module 10 viewed from the side wall portion 82a (or the side wall portion 82B) in fig. 1, and fig. 9B is a view of the press-fitting portion 260 of the input/output terminal 60 provided in the semiconductor module 10 viewed from the side wall portion 82c (or the side wall portion 82d) in fig. 1.

The press-fitting portion 260 of the input/output terminal 60 is formed by combining a 1 st press-fitting member 261a and a 2 nd press-fitting member 261b, which are substantially flat plates. The 1 st press-fitting member 261a and the 2 nd press-fitting member 261b include current-carrying portions 262a and 262b and elastic portions 263a and 263 b. The current-carrying portions 262a and 262b extend perpendicularly from the front surface of the resin case 80, and are connected to the elastic portions 263a and 263b at the tips of the flat plates of the current-carrying portions 262a and 262 b. The current-carrying portions 262a and 262b have portions separated in the thickness direction on the root side and have portions joined without separation on the tip side. The current-carrying portions 262a and 262b include holding regions 264a and 264b in regions adjacent to the elastic portions 263a and 263b at the base portions of the elastic portions 263a and 263 b. The holding regions 264a and 264b have grooves in the width direction on the flat plate surface. The grooves are formed by portions where the conducting portions 262a and 262b are not separated and joined in the thickness direction. The elastic portions 263a and 263b are branched from the leading ends of the current-carrying portions 262a and 262b in the thickness direction, and extend along the leading end side while being separated therefrom. Therefore, the elastic portions 263a and 263b are larger than the holding regions 264a and 264b of the conducting portions 262a and 262b with respect to the interval between the outer flat plate surfaces. The elastic portions 263a and 263b may have a taper at the tip end thereof, which is inclined inward.

The 1 st press-fitting member 261a and the 2 nd press-fitting member 261b are obtained by processing a flat plate into a shape as shown in fig. 9. The width and thickness of the press-fitting portion 260 of the input/output terminal 60 are appropriately selected according to the design specifications of the semiconductor module 10. Here, the width of the press-fitting portion 260 is, for example, 5mm to 15 mm. The distance between the outer flat surfaces of the elastic portions 263a and 263b is greater than 0.1 times and less than 1.0 times the width of the press-fitting portion 260. The thickness of the groove portions of the holding regions 264a and 264b is, for example, 0.2 to 0.9 times the distance between the outer flat surfaces of the elastic portions 263a and 263 b.

Next, the press-fitting of the input/output terminal 60 having the press-fitting portion 260 into the input/output opening 112 of the printed circuit board 100 will be described with reference to fig. 10. Fig. 10 is a diagram showing connection between the press-fit portion of the input/output terminal of the semiconductor module according to embodiment 2 and the printed circuit board. Fig. 10 is a view of the printed circuit board 100 and the press-fit portion 260 of the input/output terminal 60 included in the semiconductor module 10, as viewed from the side wall portion 82c (or the side wall portion 82d) in fig. 1. Fig. 10 (a) shows a case where the press-fitting portion 260 of the input/output terminal 60 is aligned with the input/output opening 112 of the printed circuit board 100. Fig. 10 (B) shows a case where the press-fitting portion 260 of the input/output terminal 60 is press-fitted into the input/output opening 112 of the printed circuit board 100. First, the printed circuit board 100 is provided on the semiconductor module 10 such that the input/output openings 112 and the control openings 111 face the input/output terminals 60 and the control terminals 50 of the semiconductor module 10 (fig. 10 a).

The printed circuit board 100 is moved from this state toward the semiconductor module 10, and the press-fitting portion 260 of the input/output terminal 60 is press-fitted into the input/output opening 112. When press-fitting, the tip end portions of the elastic portions 263a and 263b of the press-fitting portion 260 of the input/output terminal 60 are deformed inward (the gap between the elastic portions 263a and 263b is narrowed) and enter the input/output opening 112. When the printed circuit board 100 is further pressed toward the semiconductor module 10, the input/output opening 112 passes over the elastic portions 263a and 263b and holds the holding regions 264a and 264 b. Then, the elastic parts 263a and 263b return to the original positions. In this way, the press-fitting portion 260 of the input/output terminal 60 of the semiconductor module 10 is stably press-fitted into the input/output opening 112 of the printed circuit board 100, and the input/output terminal 60 is maintained in contact with the input/output opening 112 (fig. 10B). Therefore, the conductive members formed inside the input/output opening 112 are connected to the flat plate surfaces of the holding regions 264a and 264b of the input/output terminal 60. Thus, the circuit pattern (no reference numeral) of the printed circuit board 100 through which the input/output current flows is electrically connected to the main electrodes of the semiconductor elements 30a and 30b of the semiconductor module 10. Even the semiconductor module 10 including the input/output terminal 60 including the press-fitting portion 260 as described above has the same effect as that of embodiment 1, and therefore, can be downsized, can increase the current carrying capacity, and can be stably connected to the printed circuit board 100.

[ embodiment 3 ]

Next, another press-fitting portion of the input/output terminal 60 will be described with reference to fig. 11. In embodiment 3, the input/output terminal 60 is also applied to the semiconductor device 200 including the semiconductor module 10 and the printed circuit board 100 shown in fig. 1 to 6 of embodiment 1. Fig. 11 is a diagram showing a press-fitting portion of an input/output terminal of the semiconductor module according to embodiment 3. Fig. 11 a is a view of the press-fitting portion 360 of the input/output terminal 60 provided in the semiconductor module 10 viewed from the side wall portion 82a (or the side wall portion 82B) in fig. 1, and fig. 11B is a view of the press-fitting portion 360 of the input/output terminal 60 provided in the semiconductor module 10 viewed from the side wall portion 82c (or the side wall portion 82d) in fig. 1.

The press-fitting portion 360 of the input/output terminal 60 is formed by combining a 1 st press-fitting member 361a and a 2 nd press-fitting member 361b having a substantially flat plate shape. The 1 st press-fitting member 361a and the 2 nd press-fitting member 361b include conductive portions 362a and 362b, elastic portions 363a and 363b, and insertion portions 365a and 365 b. The current-carrying portions 362a and 362b extend perpendicularly from the front surface of the resin case 80 in an unseparated and coupled state, and are connected to the elastic portions 363a and 363b at the tips of the flat plate surfaces of the current-carrying portions 362a and 362 b. The elastic portions 363a and 363b are branched in the thickness direction from the distal ends of the current-carrying portions 362a and 362b, extend along the distal end side, and are connected to the insertion portions 365a and 365b at the distal ends. The elastic portions 363a and 363b are formed in holding regions 364a and 364b that hold the printed circuit board 100. The insertion portions 365a and 365b are in contact with each other in the thickness direction from the distal ends of the elastic portions 363a and 363b, and extend along the distal end side without being separated from each other. The interval between the outer flat surfaces is preferably larger in the elastic portions 363a and 363b than in the conducting portions 362a and 362b and the insertion portions 365a and 365 b. The 1 st press-fitting member 361a and the 2 nd press-fitting member 361b are formed by processing a flat plate into a shape as shown in fig. 11. The width and thickness of the press-fitting portion 360 of the input/output terminal 60 are appropriately selected according to the design specifications of the semiconductor module 10. Here, the width of the press-fitting portion 360 is, for example, 5mm or more and 15mm or less. The outer flat plate surfaces of the elastic portions 363a and 363b are spaced apart by 0.1 times and less than 1.0 times the width of the press-in portion 360.

Next, the press-fitting of the input/output terminal 60 having the press-fitting portion 360 into the input/output opening 112 of the printed circuit board 100 will be described with reference to fig. 12. Fig. 12 is a diagram showing connection between the press-fit portion of the input/output terminal of the semiconductor module according to embodiment 3 and the printed circuit board. Fig. 12 is a view of the printed circuit board 100 and the press-fit portion 360 of the input/output terminal 60 included in the semiconductor module 10, as viewed from the side wall portion 82c (or the side wall portion 82d) in fig. 1. Fig. 12 (a) shows a case where the press-fitting portion 360 of the input/output terminal 60 is aligned with the input/output opening 112 of the printed circuit board 100. Fig. 12 (B) shows a case where the press-fitting portion 360 of the input/output terminal 60 is press-fitted into the input/output opening 112 of the printed circuit board 100. First, the printed circuit board 100 is provided on the semiconductor module 10 such that the input/output openings 112 and the control openings 111 face the input/output terminals 60 and the control terminals 50 of the semiconductor module 10 (fig. 12 a).

The printed circuit board 100 is moved from this state toward the semiconductor module 10, and the input/output opening 112 is press-fitted into the press-fitting portion 360 of the input/output terminal 60. At the time of press-fitting, the input/output opening 112 of the press-fitting portion 360 of the input/output terminal 60 enters the insertion portions 365a and 365b and abuts against the elastic portions 363a and 363 b. When the printed circuit board 100 is further pressed toward the semiconductor module 10, the elastic portions 363a and 363b of the holding regions 364a and 364b are deformed inward by the input/output opening 112 to return to their original positions, and the input/output opening 112 reliably holds the elastic portions 363a and 363 b. In this way, the press-fitting portion 360 of the input/output terminal 60 of the semiconductor module 10 is stably press-fitted into the input/output opening 112 of the printed circuit board 100, and the input/output terminal 60 is maintained in contact with the input/output opening 112 (fig. 12B). Therefore, the conductive member formed in the input/output opening 112 is connected to the flat plate surfaces of the elastic portions 363a and 363b of the input/output terminal 60. Thus, the circuit pattern (no reference numeral) of the printed circuit board 100 through which the input/output current flows is electrically connected to the main electrodes of the semiconductor elements 30a and 30b of the semiconductor module 10. In the semiconductor module 10 including the input/output terminal 60 including the press-fitting portion 360, the same effects as those of embodiment 1 are obtained, so that the size can be reduced, the current carrying capacity can be increased, and the printed circuit board 100 can be stably connected.

[ 4 th embodiment ]

Next, another press-fitting portion of the input/output terminal 60 will be described with reference to fig. 13. In embodiment 4, the input/output terminal 60 is also applied to the semiconductor device 200 including the semiconductor module 10 and the printed circuit board 100 shown in fig. 1 to 6 of embodiment 1. Fig. 13 is a diagram showing a press-fitting portion of an input/output terminal of the semiconductor module according to embodiment 4. Fig. 13 a is a view of the press-fitting portion 460 of the input/output terminal 60 included in the semiconductor module 10 as viewed from the side wall portion 82a (or the side wall portion 82B) in fig. 1, and fig. 13B is a view of the press-fitting portion 460 of the input/output terminal 60 included in the semiconductor module 10 as viewed from the side wall portion 82c (or the side wall portion 82d) in fig. 1.

The press-fitting portion 460 of the input/output terminal 60 is formed by combining a 1 st press-fitting member 461a and a 2 nd press-fitting member 461b, which are substantially flat plates. The 1 st and 2 nd press-fitting members 461a and 461b include current-carrying portions 462a and 462b, elastic portions 463a and 463b, and insertion portions 465a and 465 b. The current-carrying portions 462a and 462b have holding regions 464a and 464b on the tip end sides, and have clamp portions 466a and 466b separated in the thickness direction on the root sides of the holding regions 464a and 464 b. The elastic portions 463a and 463b are branched in the thickness direction from the distal ends of the conducting portions 462a and 462b, extend along the distal end sides, and are connected to the insertion portions 465a and 465b at the distal ends. The insertion portions 465a, 465b contact in the thickness direction from the leading ends of the elastic portions 463a, 463b, and extend along the leading end sides in a state of being joined without being separated. Therefore, the elastic portions 463a and 463b and the clamping portions 466a and 466b are formed on the flat surface of the press-fitting portion 460 so as to protrude in the width direction. Thus, the holding areas 464a, 464b have grooves in the width direction on the flat plate surface.

The 1 st press-fitting member 461a and the 2 nd press-fitting member 461b are formed by processing a flat plate having a predetermined width into a shape as shown in fig. 13. The width and thickness of the press-fitting portion 460 of the input/output terminal 60 are appropriately selected according to the design specifications of the semiconductor module 10. Here, the width of the press-fitting portion 460 is, for example, 5mm to 15 mm. The interval between the outer flat surfaces of the elastic portions 463a and 463b is greater than 0.1 times and less than 1.0 times the width of the press-fitting portion 460. The thickness of the groove portions of the holding regions 464a, 464b is, for example, 0.2 times or more and 0.9 times or less the interval between the outer flat plate surfaces of the elastic portions 463a, 463 b. The distance between the outer flat surfaces of the clamping portions 466a and 466b is greater than 0.1 times and less than 1.0 times the width of the press-fitting portion 260.

Next, the press-fitting of the input/output terminal 60 having the press-fitting portion 460 into the input/output opening 112 of the printed circuit board 100 will be described with reference to fig. 14. Fig. 14 is a diagram showing connection between the press-fit portion of the input/output terminal of the semiconductor module according to embodiment 4 and the printed circuit board. Fig. 14 is a view when the printed circuit board 100 and the press-fitting portion 460 of the input/output terminal 60 provided in the semiconductor module 10 are connected, as viewed from the side wall portion 82c (or the side wall portion 82d) in fig. 1. Fig. 14 (a) shows a case where the press-fitting portion 460 of the input/output terminal 60 is aligned with the input/output opening 112 of the printed circuit board 100. Fig. 14 (B) shows a case where the press-fitting portion 460 of the input/output terminal 60 is press-fitted into the input/output opening 112 of the printed circuit board 100. First, the printed circuit board 100 is provided on the semiconductor module 10 such that the input/output terminals 60 and the control terminals 50 of the semiconductor module 10 face the input/output openings 112 and the control openings 111 (fig. 14 a).

The printed circuit board 100 is moved from this state toward the semiconductor module 10, and the input/output opening 112 is press-fitted into the press-fitting portion 460 of the input/output terminal 60. At the time of press-fitting, the input/output opening 112 of the press-fitting portion 460 of the input/output terminal 60 enters the insertion portions 465a and 465b and comes into contact with the elastic portions 463a and 463 b. When the printed circuit board 100 is further pressed toward the semiconductor module 10, the elastic portions 463a and 463b are deformed inward through the input/output opening 112, and the input/output opening 112 passes over the elastic portions 463a and 463 b. Then, the elastic portions 463a and 463b return to the original positions, and the printed circuit board 100 stops at the clamping portions 466a and 466 b. The printed substrate 100 is sandwiched by the elastic portions 463a, 463b and the sandwiching portions 466a, 466b at the positions of the holding areas 464a, 464 b. In this way, the press-fitting portion 460 of the input/output terminal 60 of the semiconductor module 10 is stably pressed into the input/output opening 112 of the printed circuit board 100, and the input/output terminal 60 is maintained in contact with the input/output opening 112 (fig. 14B). Therefore, the conductive members formed in the input/output opening 112 are connected to the flat plate surfaces of the holding regions 464a, 464b of the input/output terminal 60. Thus, the circuit pattern (no reference numeral) of the printed circuit board 100 through which the input/output current flows is electrically connected to the main electrodes of the semiconductor elements 30a and 30b of the semiconductor module 10. In the semiconductor module 10 including the input/output terminal 60 including the press-fitting portion 460, the same effects as those of embodiment 1 are obtained, so that the size can be reduced, the current carrying capacity can be increased, and the printed circuit board 100 can be stably connected.

[ 5 th embodiment ]

Next, another press-fitting portion of the input/output terminal 60 will be described with reference to fig. 15. In embodiment 5, the input/output terminal 60 is applied to a semiconductor device 200 including the semiconductor module 10 and the printed circuit board 100 shown in fig. 1 to 6 of embodiment 1. Fig. 15 is a diagram showing a press-fitting portion of an input/output terminal of the semiconductor module according to embodiment 5. Fig. 15 a is a view of the press-fitting portion 560 of the input/output terminal 60 included in the semiconductor module 10 from the side wall portion 82a (or the side wall portion 82B) in fig. 1, and fig. 15B is a view of the press-fitting portion 560 of the input/output terminal 60 included in the semiconductor module 10 from the side wall portion 82c (or the side wall portion 82d) in fig. 1.

The press-fit portion 560 of the input/output terminal 60 has a substantially flat plate shape. The press-fitting portion 560 includes a current-carrying portion 562, elastic portions 563a and 563b, and an insertion portion 565. Energizing portion 562 extends perpendicularly from the front surface of resin case 80, and is connected at the tip to elastic portions 563a and 563 b. The elastic portions 563a and 563b are connected to the insertion portion 565 at the distal ends thereof. The insertion portion 565 may have a taper at the front end. The conducting portion 562 includes holding regions 564a and 564b in regions adjacent to the elastic portions 563a and 563 b. The holding regions 564a and 564b have a groove in the width direction on the flat surface. The elastic portions 563a and 563b have projections on the plate surfaces. The protrusion may be in the form of a blade protruding obliquely downward from the flat plate surface, and may be formed on the flat plate surface in the width direction. The thickness of the elastic portions 563a, 563b including the protruding portions is larger than that of the holding regions 564a, 564 b. The thickness of the conducting portion 562 is larger than the thickness of the holding regions 564a and 564 b. The press-fitting portion 560 is formed by processing a flat plate having a predetermined width into a shape as shown in fig. 15. In particular, the elastic portions 563a and 563b are formed by punching the flat surface of the insertion portion 565. The width and thickness of the press-fitting portion 560 of the input/output terminal 60 are appropriately selected according to the design specifications of the semiconductor module 10. Here, the width of the press-fitting portion 560 is, for example, 5mm or more and 15mm or less. The thickness of the elastic portions 563a and 563b including the protruding portion is larger than 0.1 times and smaller than 1.0 times the width of the press-fitting portion 560. The thickness of the holding regions 564a, 564b at the groove portions is, for example, 0.2 times or more and 0.9 times or less the thickness of the elastic portions 563a, 563b including the protrusion portions.

Next, the press-fitting of the input/output terminal 60 having the press-fitting portion 560 into the input/output opening 112 of the printed circuit board 100 will be described with reference to fig. 16. Fig. 16 is a diagram showing connection between the press-fit portion of the input/output terminal of the semiconductor module according to embodiment 5 and the printed circuit board. Fig. 16 is a view of the printed circuit board 100 and the press-fit portion 560 of the input/output terminal 60 of the semiconductor module 10 when viewed from the side wall portion 82c (or the side wall portion 82d) in fig. 1. Fig. 16 (a) shows a case where the press-fitting portion 560 of the input/output terminal 60 is aligned with the input/output opening 112 of the printed circuit board 100. Fig. 16 (B) shows a case where the press-fitting portion 560 of the input/output terminal 60 is press-fitted into the input/output opening 112 of the printed circuit board 100. First, the printed circuit board 100 is provided on the semiconductor module 10 such that the input/output openings 112 and the control openings 111 face the input/output terminals 60 and the control terminals 50 of the semiconductor module 10 (fig. 16 a).

The printed circuit board 100 is moved from this state toward the semiconductor module 10, and the press-fitting portion 560 of the input/output terminal 60 is press-fitted into the input/output opening 112. During press-fitting, the insertion portion 565 of the press-fitting portion 560 of the input/output terminal 60 enters the input/output opening 112 and comes into contact with the elastic portions 563a and 563 b. When the printed circuit board 100 is further pressed toward the semiconductor module 10, the elastic portions 563a and 563b are pressed from the input/output opening 112 and deformed inward (the flat surface side of the insertion portion 565), and the input/output opening 112 passes over the elastic portions 563a and 563 b. Then, the elastic portions 563a and 563b return to the original positions, and the printed board 100 stops at the current-carrying portion 562. The printed substrate 100 is sandwiched by the elastic portions 563a and 563b and the energized portion 562 at the positions of the holding regions 564a and 564 b. In this way, the press-fitting portion 560 of the input/output terminal 60 of the semiconductor module 10 is stably press-fitted into the input/output opening 112 of the printed circuit board 100, and the input/output terminal 60 is maintained in contact with the input/output opening 112 (fig. 16B). Therefore, the conductive members formed inside the input/output opening 112 are connected to the flat plate surfaces of the holding regions 564a and 564b of the input/output terminal 60. Thereby, the circuit pattern of the printed circuit board 100 through which the input/output current flows is electrically connected to the main electrodes of the semiconductor elements 30a and 30b of the semiconductor module 10. In the semiconductor module 10 including the input/output terminal 60 including the press-fitting portion 560, the same effects as those of embodiment 1 are obtained, so that the size can be reduced, the current carrying capacity can be increased, and the printed circuit board 100 can be stably connected.

[ 6 th embodiment ]

Next, another press-fitting portion of the input/output terminal 60 will be described with reference to fig. 17. In embodiment 6, the input/output terminal 60 is applied to a semiconductor device 200 including the semiconductor module 10 and the printed circuit board 100 shown in fig. 1 to 6 of embodiment 1. Fig. 17 is a diagram showing a press-fitting portion of an input/output terminal of the semiconductor module according to embodiment 6. Fig. 17 (a) shows a view of the press-fitting portion 660 of the input/output terminal 60 of the semiconductor module 10 viewed from the side wall portion 82a (or the side wall portion 82B) of fig. 1, and fig. 17 (B) shows a cross-sectional view taken along the dashed-dotted line X-X in fig. 17 (a).

As shown in fig. 17, the press-fitting portion 660 of the input/output terminal 60 is formed in a flat plate shape and includes a current-carrying portion 662. A plurality of convex elastic portions 663a and 663b are formed on the flat surface of the current-carrying portion 662 in a staggered manner in parallel with the vertical direction of fig. 17 (the press-fitting direction of the press-fitting portion 660). That is, the holding region 664 for holding the printed board 100 is formed in a zigzag shape on the flat surface of the conducting portion 662, perpendicular to the press-fitting direction of the press-fitting portion 660 (fig. 17B). The number of the elastic portions 663a and 663b (here, 3 and 2 elastic portions 663a and 663b, respectively) is an example, and is not limited thereto. Such a press-fitting portion 660 is obtained by processing a flat plate having a predetermined width into a shape as shown in fig. 17. In particular, the elastic portions 663a and 663b are formed by punching the flat plate surfaces of the current carrying portions 662. The width and thickness of the press-fitting portion 660 of the input/output terminal 60 are appropriately selected according to the design specifications of the semiconductor module 10. Here, the width of the press-fitting portion 660 is, for example, 5mm to 10mm, and the thickness of the conducting portion 662 of the press-fitting portion 660 is, for example, greater than 0.1 times and less than 1.0 times the width of the press-fitting portion 660. The outer sides of the elastic portions 663a and 663b protrude from the flat plate surface of the current carrying portion 662.

Next, the press-fitting of the input/output terminal 60 having the press-fitting portion 660 into the input/output opening 112 of the printed circuit board 100 will be described with reference to fig. 18. Fig. 18 is a diagram showing connection between the press-fit portion of the input/output terminal of the semiconductor module according to embodiment 6 and the printed circuit board. Fig. 18 (a) shows a case where the input/output terminal 60 of the printed circuit board 100 is viewed from the side wall portion 82a (or the side wall portion 82b) in fig. 1. Fig. 18 (B) shows a cross-sectional view at the one-dot chain line X-X in fig. 18 (a). First, the printed circuit board 100 is provided on the semiconductor module 10 so that the input/output openings 112 and the control openings 111 correspond to the input/output terminals 60 and the control terminals 50 of the semiconductor module 10.

The printed circuit board 100 is moved from this state toward the semiconductor module 10, and the input/output opening 112 is press-fitted into the press-fitting portion 660 of the input/output terminal 60 (fig. 18 a). At the time of press-fitting, the input/output opening 112 of the press-fitting portion 660 of the input/output terminal 60 enters the current-carrying portion 662, and the elastic portions 663a and 663b are deformed inward (toward the flat surface side of the current-carrying portion 662) through the input/output opening 112. That is, since the holding region 664 has a zigzag shape perpendicular to the pushing direction, the input/output opening 112 contacts the elastic portions 663a and 663 b. In this way, the press-fitting portion 660 of the input/output terminal 60 of the semiconductor module 10 is stably press-fitted into the input/output opening 112 of the printed circuit board 100, and the input/output terminal 60 is maintained in contact with the input/output opening 112 (fig. 18B). Therefore, the conductive member formed in the input/output opening 112 is connected to the flat plate surfaces of the elastic portions 663a and 663b of the input/output terminal 60. Thus, the circuit pattern (no reference numeral) of the printed circuit board 100 through which the input/output current flows is electrically connected to the main electrodes of the semiconductor elements 30a and 30b of the semiconductor module 10.

In this way, the semiconductor module 10 includes the semiconductor elements 30a and 30b, the resin case 80 housing the semiconductor elements 30a and 30b, and the control terminal 50 electrically connected to the control electrodes of the semiconductor elements 30a and 30b and extending from the resin case 80. The semiconductor module 10 further includes an input/output terminal 60, the input/output terminal 60 being electrically connected to main electrodes of the semiconductor elements 30a and 30b, extending from the resin case 80, having a flat plate-like press-fitting portion 160, and having a plurality of elastic convex elastic portions 663a and 663b formed in a holding region 664 of at least one flat plate surface of the current-carrying portion 162 of the press-fitting portion 160, the holding region being held during press-fitting. In this way, the input/output terminal 60 includes elastic portions 663a and 663b having a flat plate shape and elasticity on the flat plate surface. Therefore, the input/output terminal 60 can be energized with a larger current than the control terminal 50 having elasticity in the side surface direction, for example. That is, it is not necessary to prepare a plurality of terminals. Further, the input/output terminal 60 can be easily and reliably connected to the printed circuit board 100 by press fitting. Therefore, compared to a pin-shaped external terminal joined by a joining member such as solder, a large amount of space for connection is not required. Therefore, the semiconductor module 10 can be miniaturized and the energization capability can be increased.

In addition, the semiconductor module 10 has a control terminal 50 and an input-output terminal 60. Therefore, a control signal of a small current can be input and output using the control terminal 50, and an input/output current of a large current can be input and output using the input/output terminal 60. Therefore, the number of terminals can be reduced as compared with the case where only the control terminal 50 is provided, and space can be saved. In addition, as compared with the case where only the input/output terminal 60 is provided, a small-sized terminal can be used, and space can be saved. In addition, the force at the time of press-fitting the printed board 100 can be reduced. Therefore, the printed substrate 100 can be stably connected to the control terminal 50 and the input-output terminal 60 of the semiconductor module 10. Therefore, the semiconductor module 10 can be miniaturized and the current carrying capability can be increased. In the semiconductor module 10, the input/output terminals 60 are disposed on at least the facing side walls 82a and 82 b. Therefore, the printed circuit board 100 can be stably connected to the semiconductor module 10 without deflecting the printed circuit board 100 toward any of the side wall portions 82a to 82 d. Therefore, the input/output terminal 60 is not limited to this, and is preferably disposed on 2 or more sides of the side wall portions 82a to 82 d.

[ 7 th embodiment ]

Next, another press-fitting portion of the input/output terminal 60 will be described with reference to fig. 19. In embodiment 7, the input/output terminal 60 is applied to a semiconductor device 200 including the semiconductor module 10 and the printed circuit board 100 shown in fig. 1 to 6 of embodiment 1. Fig. 19 is a diagram showing a press-fitting portion of an input/output terminal of the semiconductor module according to embodiment 7. Fig. 19 a is a view of the press-fitting portion 760 of the input/output terminal 60 of the semiconductor module 10 viewed from the side wall portion 82a (or the side wall portion 82B) of fig. 1, and fig. 19B is a cross-sectional view taken along the dashed-dotted line X-X in fig. 19 a.

As shown in fig. 19, the press-fitting portion 760 of the input/output terminal 60 is formed in a flat plate shape and includes a current-carrying portion 762. A plurality of convex elastic portions 763a and 763b are formed on the flat surface of the current-carrying portion 762 at positions facing the current-carrying portion 762 in parallel to the vertical direction in fig. 19. That is, on the flat surface of the conducting part 762, a holding region 764 for holding the printed board 100 is formed to have an uneven shape (fig. 19B) perpendicular to the press-fitting direction of the press-fitting part 760. The number of the elastic portions 763a and 763b (2 in this example) is one example, and is not limited to this. Such a press-fitting portion 760 is obtained by processing a flat plate having a predetermined width into a shape as shown in fig. 19. In particular, the elastic portions 763a and 763b are formed by punching the flat plate surfaces of the energizing portion 762. The width and thickness of the press-fitting portion 760 of the input/output terminal 60 are appropriately selected according to the design specifications of the semiconductor module 10. Here, the width of the press-fitting portion 760 is, for example, 5mm to 15mm, and the thickness of the conducting portion 762 of the press-fitting portion 760 is, for example, 0.1 times to less than 1.0 times the width of the press-fitting portion 760. The outer sides of the elastic portions 763a and 763b protrude from the flat plate surface of the energizing portion 762.

Next, the press-fitting of the input/output terminal 60 having the press-fitting portion 760 into the input/output opening 112 of the printed circuit board 100 will be described with reference to fig. 20. Fig. 20 is a diagram showing connection between the press-fit portion of the input/output terminal of the semiconductor module according to embodiment 7 and the printed circuit board. Fig. 20 (a) shows a case where the input/output terminal 60 connected to the printed circuit board 100 is viewed from the side wall portion 82a (or the side wall portion 82b) in fig. 1. Fig. 20 (B) shows a cross-sectional view at the one-dot chain line X-X in fig. 20 (a). First, the printed circuit board 100 is provided on the semiconductor module 10 so that the input/output openings 112 and the control openings 111 correspond to the input/output terminals 60 and the control terminals 50 of the semiconductor module 10.

The printed circuit board 100 is moved from this state toward the semiconductor module 10, and the input/output opening 112 is press-fitted into the press-fitting portion 760 of the input/output terminal 60 (fig. 20 a). At the time of press-fitting, the input/output opening 112 of the press-fitting portion 760 of the input/output terminal 60 enters the conducting portion 762, and the elastic portions 763a and 763b are deformed inward (toward the flat surface side of the conducting portion 762) through the input/output opening 112. That is, since the holding region 764 has an uneven shape perpendicular to the press-fitting direction, the input/output opening 112 contacts the elastic portions 763a and 763 b. In this way, the press-fitting portion 760 of the input/output terminal 60 of the semiconductor module 10 is stably press-fitted into the input/output opening 112 of the printed circuit board 100, and the input/output terminal 60 is maintained in contact with the input/output opening 112 (fig. 20B). Therefore, the conductive member formed inside the input/output opening 112 is connected to the flat surface of the elastic portions 763a and 763b of the input/output terminal 60. Thus, the circuit pattern (no reference numeral) of the printed circuit board 100 through which the input/output current flows is electrically connected to the main electrodes of the semiconductor elements 30a and 30b of the semiconductor module 10. In the semiconductor module 10 including the input/output terminal 60 including the press-fitting portion 760, the same effects as those of embodiment 6 are obtained, so that the size can be reduced, the current carrying capacity can be increased, and the printed circuit board 100 can be stably connected.

[ 8 th embodiment ]

Next, another press-fitting portion of the input/output terminal 60 will be described with reference to fig. 21. In embodiment 8, the input/output terminal 60 is applied to a semiconductor device 200 including the semiconductor module 10 and the printed circuit board 100 shown in fig. 1 to 6 of embodiment 1. Fig. 21 is a diagram showing a press-fitting portion of an input/output terminal of the semiconductor module according to embodiment 8. Fig. 21 (a) is a view of the press-fitting portion 860 of the input/output terminal 60 of the semiconductor module 10 viewed from the side wall portion 82a (or the side wall portion 82B) of fig. 1, and fig. 21 (B) is a cross-sectional view taken along the dashed-dotted line X-X in fig. 21 (a).

As shown in fig. 21, the press-fitting portion 860 of the input/output terminal 60 is formed in a flat plate shape and includes a conducting portion 862. Convex elastic portions 863a and 863b are formed on the flat plate surface of the conducting portion 862 so as to intersect with each other in the vertical direction (the press-fitting direction of the press-fitting portion 860) in fig. 21. That is, on the flat surface of the conducting portion 862, the holding region 864 held by the printed board 100 is formed in a zigzag shape in parallel to the press-fitting direction of the press-fitting portion 860 (fig. 21B). Note that the flat surface of the conducting portion 862 is a surface perpendicular to the thickness direction of the conducting portion 862. The number of the elastic members 863a and 863b (1 each here) is an example, and is not limited to this. Such a press-fitting portion 860 is obtained by processing a flat plate having a predetermined width into a shape as shown in fig. 21. In particular, the elastic portions 863a and 863b are formed by punching a flat surface of the energizing portion 862. The width and thickness of the press-fitting portion 860 of the input/output terminal 60 are appropriately selected according to the design specifications of the semiconductor module 10. Here, the width of the press-fitting section 860 is, for example, 5mm to 15mm, and the thickness of the conducting section 862 of the press-fitting section 860 is, for example, larger than 0.1 times and smaller than 1.0 times the width of the press-fitting section 860. The outer sides of the elastic portions 863a and 863b protrude from the flat plate surface of the conducting portion 862.

Next, the press-fitting of the input/output terminal 60 having such a press-fitting section 860 into the input/output opening 112 of the printed circuit board 100 will be described with reference to fig. 22. Fig. 22 is a diagram showing connection between the press-fit portion of the input/output terminal of the semiconductor module according to embodiment 8 and the printed circuit board. Fig. 22 (a) shows a case where the input/output terminal 60 connected to the printed circuit board 100 is viewed from the side wall portion 82a (or the side wall portion 82b) in fig. 1. Fig. 22 (B) shows a cross-sectional view at the one-dot chain line X-X in fig. 22 (a). First, the printed circuit board 100 is provided on the semiconductor module 10 so that the input/output openings 112 and the control openings 111 correspond to the input/output terminals 60 and the control terminals 50 of the semiconductor module 10.

The printed circuit board 100 is moved from this state toward the semiconductor module 10, and the input/output opening 112 is press-fitted into the press-fitting portion 860 of the input/output terminal 60 (fig. 22 a). At the time of press-fitting, the input/output opening 112 of the press-fitting portion 860 of the input/output terminal 60 enters the conducting portion 862, and the elastic portions 863a and 863b are deformed inward (the flat surface side of the conducting portion 862) through the input/output opening 112. That is, since the holding region 864 is formed in a zigzag shape parallel to the press-fitting direction, the input/output opening 112 is in contact with the elastic portions 863a and 863 b. In this way, the press-fitting portion 860 of the input/output terminal 60 of the semiconductor module 10 is stably press-fitted into the input/output opening 112 of the printed circuit board 100, and the input/output terminal 60 and the input/output opening 112 are maintained in contact with each other (fig. 22B). Therefore, the conductive members formed in the input/output opening 112 are connected to the flat surfaces of the elastic portions 863a and 863b of the input/output terminal 60. Thus, the circuit pattern (no reference numeral) of the printed circuit board 100 through which the input/output current flows is electrically connected to the main electrodes of the semiconductor elements 30a and 30b of the semiconductor module 10. In the semiconductor module 10 including the input/output terminal 60 including the press-fit portion 860, the same effects as those of embodiment 6 are obtained, so that the size can be reduced, the current carrying capacity can be increased, and the printed circuit board 100 can be stably connected.

The foregoing merely illustrates the principles of the invention. Further, it will be apparent to those skilled in the art that various modifications and variations can be made in the present invention, and the present invention is not limited to the exact configurations and application examples shown and described above, and all modifications and equivalents corresponding thereto are also considered to be within the scope of the present invention based on the appended claims and equivalents thereof.

The claims (modification according to treaty clause 19)

[ modified ] A semiconductor module, characterized by comprising:

a semiconductor element;

a frame body that houses the semiconductor element;

a 1 st connection terminal electrically connected to a control electrode of the semiconductor element and extending from the frame body; and

and a 2 nd connection terminal electrically connected to a main electrode of the semiconductor element and extending from the housing, wherein at least one flat plate surface of the 2 nd connection terminal, which is flat and has a press-in portion that is branched and separated in a thickness direction from a distal end portion, has an elastic portion having elasticity.

2. The semiconductor module according to claim 1, wherein at least one of the flat plate surfaces of the holding region in which the 2 nd connection terminal is held at the time of press-fitting has a groove adjacent to a root side of the elastic portion.

3. The semiconductor module according to claim 1, wherein the elastic portion of the 2 nd connection terminal is formed to protrude with respect to the flat plate surface in a holding region where it is held at the time of press-fitting.

4. The semiconductor module according to claim 1, wherein the elastic portion provided in the 2 nd connection terminal protrudes from the flat surface so as to be adjacent to a front end side of a holding region held at the time of press-fitting,

the 2 nd connecting terminal includes a clamping portion adjacent to a root portion side of the holding region and protruding from the flat plate surface.

5. The semiconductor module according to any one of claims 1 to 4, wherein the frame body is box-shaped,

the 2 nd connecting terminals are respectively arranged on at least 2 opposite sides of the edge part of the front surface of the frame body.

6. A semiconductor module, comprising:

a semiconductor element;

a frame body that houses the semiconductor element;

a 1 st connection terminal electrically connected to a control electrode of the semiconductor element and extending from the frame body; and

and a 2 nd connection terminal electrically connected to a main electrode of the semiconductor element and extending from the housing, wherein a press-fitting portion of the 2 nd connection terminal is flat, and a plurality of projections are formed in a holding region of at least one flat surface of the press-fitting portion, the holding region being held during press-fitting.

7. The semiconductor module according to claim 6, wherein the convex portion is formed in the holding region in parallel with or perpendicular to a press-fitting direction, and the holding region is formed in a zigzag shape.

The semiconductor module according to claim 1, wherein the plate-like 1 st press-fitting member and the plate-like 2 nd press-fitting member of the press-fitting portion overlap each other at a root portion of the press-fitting portion, and are branched and separated in a thickness direction between the tip portions from the root portion.

The semiconductor module according to claim 1, wherein the 1 st connection terminal includes an elastic portion having a flat plate shape and separated in a width direction.