阅读说明：本技术 一种晶圆烘干装置 (Wafer drying device ) 是由 田英干 于 2020-05-25 设计创作，主要内容包括：本发明公开了一种晶圆烘干装置,包括箱体,箱体内设置有放置晶圆的支撑架,所述箱体内还设置有顶面风干机构和底面风干机构,顶面风干机构和底面风干机构分别位于支撑架的上下两侧,所述顶面风干机构包括若干风干单元,若干风干单元沿圆周均匀分布,所述风干单元包括转轴和喷头,所述转轴平行于支撑架表面,所述喷头与转轴转动连接,喷头连接有气管,喷头连接有驱动其转动的驱动机构,底面风干机构与顶面风干机构结构相同,本发明在烘箱内直接加热,结合向晶圆表面吹热气对晶圆实现快速的烘干,提高烘干效率。(The invention discloses a wafer drying device, which comprises a box body, wherein a supporting frame for placing a wafer is arranged in the box body, a top surface air drying mechanism and a bottom surface air drying mechanism are also arranged in the box body, the top surface air drying mechanism and the bottom surface air drying mechanism are respectively positioned at the upper side and the lower side of the supporting frame, the top surface air drying mechanism comprises a plurality of air drying units, the plurality of air drying units are uniformly distributed along the circumference, each air drying unit comprises a rotating shaft and a spray head, the rotating shaft is parallel to the surface of the supporting frame, the spray head is rotatably connected with the rotating shaft, the spray head is connected with an air pipe, the spray head is connected with a driving mechanism for driving the spray head to rotate, and the bottom surface air drying mechanism and the top surface air drying.)

1. The utility model provides a wafer drying device, includes the box, is provided with the support frame of placing the wafer in the box, its characterized in that: still be provided with top surface air-dry mechanism and bottom surface air-dry mechanism in the box, top surface air-dry mechanism and bottom surface air-dry mechanism are located the upper and lower both sides of support frame respectively, top surface air-dry mechanism includes a plurality of units that air-dry, and a plurality of units along circumference evenly distributed that air-dry, air-dry the unit and include pivot and shower nozzle, the pivot is on a parallel with the support frame surface, the shower nozzle rotates with the pivot to be connected, and the shower nozzle is connected with the trachea, and the shower nozzle is connected with its pivoted actuating mechanism of drive, and bottom surface.

2. The wafer drying apparatus of claim 1, wherein: the support frame includes a plurality of supporting legs, and all supporting legs are along circumference evenly distributed.

3. The wafer drying apparatus of claim 2, wherein: the support frame includes annular first support frame and annular second support frame, first support frame and/or second support frame are connected with elevating system, the supporting leg of first support frame and second support frame staggers each other on the horizontal plane and arranges.

4. The wafer drying apparatus of claim 3, wherein: the diameter of the circle where the second support frame is located is smaller than that of the circle where the first support frame is located.

5. The wafer drying apparatus of claim 4, wherein: the lifting mechanism comprises a lifting cylinder.

6. The wafer drying apparatus of claim 5, wherein: the first support frame and the second support frame are both connected with a driving motor, and the driving motor enables the first support frame and the second support frame to rotate circumferentially.

7. The wafer drying apparatus of claim 6, wherein: the supporting legs are provided with air suction holes, and the air suction holes are connected with a suction fan.

8. The wafer drying apparatus of claim 1, wherein: and a part of the spraying coverage range of the spray heads of two adjacent air drying units is mutually overlapped.

9. The wafer drying apparatus of claim 1, wherein: the driving mechanism comprises a driving rod, and bevel gears are arranged between the driving rod and the spray head.

Technical Field

The invention belongs to the field of production and treatment equipment of wafers, and particularly relates to a wafer drying device.

Background

With the continuous reduction of critical dimensions in Integrated Circuit (IC) fabrication, the surface of a silicon wafer must be clean before entering each process, and multiple cleaning steps are repeated to remove contaminants such as particles, organic matters, metals, and native oxide layers on the surface of the silicon wafer, wherein the cleaning times depend on the complexity of wafer design and the number of layers of interconnects. At present, wet chemical cleaning is the main cleaning technique in semiconductor IC industry, and mainly uses solution, acid-base, surfactant, water and their mixture to achieve a certain functional requirement or remove the contaminants on the wafer surface by corrosion, dissolution, chemical reaction, etc.

The wafer is dried in the oven until the wafer is dried, so that the drying efficiency is low and the drying effect on the wafer supporting position is poor.

Disclosure of Invention

Aiming at the defects of the prior art, the invention provides a method for drying a wafer by directly heating the wafer in an oven and blowing hot air to the surface of the wafer, so that the wafer is quickly dried, and the drying efficiency is improved.

In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a wafer drying device, includes the box, is provided with the support frame of placing the wafer in the box, still be provided with top surface air-dry mechanism and bottom surface air-dry mechanism in the box, top surface air-dry mechanism and bottom surface air-dry mechanism are located the upper and lower both sides of support frame respectively, top surface air-dry mechanism includes a plurality of air-dry units, and a plurality of air-dry units are along circumference evenly distributed, air-dry the unit and include pivot and shower nozzle, the pivot is on a parallel with the support frame surface, the shower nozzle rotates with the pivot to be connected, and the shower nozzle is connected with the trachea, and the shower nozzle is connected with.

Further the support frame includes a plurality of supporting legs, and all supporting legs are along circumference evenly distributed.

The support frame comprises a first annular support frame and a second annular support frame, the first support frame and/or the second support frame are/is connected with a lifting mechanism, and the support legs of the first support frame and the second support frame are arranged on the horizontal plane in a staggered mode.

Furthermore, the diameter of the circle where the second support frame is located is smaller than that of the circle where the first support frame is located.

Further the lifting mechanism comprises a lifting cylinder.

Furthermore, the first support frame and the second support frame are both connected with a driving motor, and the driving motor enables the first support frame and the second support frame to rotate circumferentially.

Furthermore, an air suction hole is formed in the supporting leg and connected with a suction fan.

And a part of the spray coverage of the spray heads of the two further air drying units is mutually overlapped.

Further the driving mechanism comprises a driving rod, and bevel gears are arranged between the driving rod and the spray head.

Compared with the prior art, the invention has the beneficial effects that: the wafer is arranged in the box body, the box body is integrally heated to dry the wafer, and meanwhile, the rotatable spray head of the air drying unit is utilized to blow hot air to the surface of the wafer back and forth, so that the drying efficiency of the surface of the wafer is accelerated; through the first supporting frame and the second supporting frame which can be lifted, the first supporting frame and the second supporting frame alternately support the surface of the wafer, so that all parts of the lower surface of the wafer can be quickly dried.

Drawings

FIG. 1 is a schematic structural diagram of a wafer drying apparatus according to the present invention;

FIG. 2 is a schematic view of the arrangement of the wafer and the top and bottom seasoning mechanisms;

FIG. 3 is a schematic view of the position distribution of the first and second supports when supported on the wafer;

FIG. 4 is a schematic view of the structure of the nozzle cooperating with the driving mechanism;

FIG. 5 is a schematic view of the structure of the rotary sprayer;

FIG. 6 is a schematic view of two adjacent nozzles overlapping in spray coverage;

fig. 7 is a perspective view of the top seasoning mechanism.

Reference numerals: 1. a box body; 21. a top surface air drying mechanism; 22. a bottom air drying mechanism; 31. a first support frame; 32. a second support frame; 4. a wafer; 211. a spray head; 212. a rotating shaft; 51. a drive rod; 52. umbrella teeth.

Detailed Description

In the description of the present invention, it should be noted that, for the terms of orientation, such as "central", "lateral (X)", "longitudinal (Y)", "vertical (Z)", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicate that the orientation and positional relationship are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and should not be construed as limiting the specific scope of the present invention.

Furthermore, if the terms "first" and "second" are used for descriptive purposes only, they are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features. Thus, a definition of "a first" or "a second" feature may explicitly or implicitly include one or more of the features, and in the description of the invention, "a number" or "a number" means two or more unless explicitly specified otherwise.

The utility model provides a wafer drying device, includes box 1, is provided with the support frame of placing wafer 4 in the box 1, still be provided with top surface air-drying mechanism 21 and bottom surface air-drying mechanism 22 in the box 1, top surface air-drying mechanism 21 and bottom surface air-drying mechanism 22 are located the upper and lower both sides of support frame respectively, top surface air-drying mechanism 21 includes a plurality of units that air-dry, and a plurality of units that air-dry are along circumference evenly distributed, air-dry the unit and include pivot 212 and shower nozzle 211, pivot 212 is on a parallel with the support frame surface, shower nozzle 211 rotates with pivot 212 to be connected, and shower nozzle 211 is connected with the trachea, and shower nozzle 211 is connected with its pivoted actuating mechanism of drive, and.

During the stoving, wafer 4 is put on the support frame, wafer 4 is dried in the heating of box 1, simultaneously, let in high temperature nitrogen gas to shower nozzle 211 through the trachea, high temperature nitrogen gas is blown to the surface of wafer 4 by shower nozzle 211 blowout, as shown in fig. 5, utilize actuating mechanism to make the reciprocating along a of shower nozzle 211 move in this embodiment, that is shower nozzle 211 sprays the direction at wafer 4 center to the 4 marginal reciprocating circulations of wafer, all shower nozzles 211 do this motion, even make high temperature nitrogen gas cover the upper and lower surface of wafer 4 completely, on the basis of high temperature in box 1, through direct to wafer 4 surface scanning formula spray high temperature nitrogen gas, drying efficiency is higher, and can clear away the pollution particulate matter that exists on wafer 4 surface.

The support frame preferred in the embodiment comprises a plurality of support legs, and all the support legs are uniformly distributed along the circumference, so that the contact area between the support legs and the wafer 4 is reduced.

The support frame preferably comprises an annular first support frame 31 and an annular second support frame 32, the first support frame 31 and/or the second support frame 32 is connected with a lifting mechanism, and support legs of the first support frame 31 and the second support frame 32 are arranged in a mutually staggered mode on a horizontal plane.

The support legs of all the first support frames 31 are fixedly connected through an annular frame, and the support legs of all the second support frames 32 are fixedly connected through another annular frame.

The diameter of the circle where the second support frame 32 is located is smaller than that of the circle where the first support frame 31 is located; and the diameter of the circle on which the bottom airing means 22 is preferably located is smaller than the diameter of the circle on which the second support frame 32 is located.

As shown in fig. 3, the support legs of the first support frame 31 and the second support frame 32 in the present embodiment are staggered in both the radial direction and the circumferential direction.

In this embodiment, for example, the first support frame 31 and the second support frame 32 are both connected to a lifting mechanism, and the lifting mechanism is a lifting cylinder.

As shown in fig. 1 and fig. 3, in this embodiment, the first supporting frame 31 is located at the outer circle, the second supporting frame 32 is located at the inner circle, when drying, first the first supporting frame 31 is lifted up by the lifting cylinder, the second supporting frame 32 is lowered down, so that the supporting legs of the first supporting frame 31 support the lower surface of the wafer 4, that is, the first supporting frame 31 supports the outer portion of the wafer 4, the shower head 211 sweeps and dries the surface of the wafer 4 in a scanning manner, and sweeps back and forth from the center to the edge, so that the position right above the supporting legs of the second supporting frame 32 is dried first, the end portion of the second supporting frame 32 is also dried, then the second supporting frame 32 is raised, the first supporting frame 31 is lowered down, so that the position where the first supporting frame 31 contacts the wafer 4 is exposed, the high-temperature nitrogen gas sprayed by the shower head 211 can directly sweep and dry the position, and at the end portion, certainly, the first support frame 31 may be lifted again, and the second support frame 32 is lowered to form an alternate support for the wafer 4, and the contact surface between the support legs and the wafer 4 is also swept and dried in an alternate manner, so that the wafer 4 can be quickly dried at any position on the surface.

The first support frame 31 and the second support frame 32 which are preferred in this embodiment are both connected with a driving motor, the driving motor enables the first support frame 31 and the second support frame 32 to rotate circumferentially, the first support frame 31 and the second support frame 32 can rotate by arranging the driving motor, when drying, the wafer 4 can be slowly rotated, and high-temperature nitrogen sprayed by the spray head 211 can be more uniformly blown on the surface of the wafer 4.

This embodiment is preferred be provided with the suction hole on the supporting leg, the suction hole is connected with the suction fan, starts through the suction fan, can make wafer 4 adsorb on the supporting leg, and is fixed more firm, can suitably increase the pressure that the nozzle sprays high temperature nitrogen gas.

In this embodiment, a part of the spraying coverage areas of the spray heads 211 of two adjacent air drying units overlap with each other, as shown in fig. 6, where a sector included angle formed by a range where the upper spray head 211 sprays and covers the edge of the wafer 4 is b1, a sector included angle formed by a range where the right adjacent spray head 211 sprays and covers the edge of the wafer 4 is b2, and the two sectors overlap with each other; meanwhile, the sector angle formed by the range that the upper nozzle 211 sprays and covers the center of the wafer 4 is c1, the sector angle formed by the range that the right adjacent nozzle 211 sprays and covers the center of the wafer 4 is c2, and a part of the two sectors are overlapped with each other, and the overlapped part on the wafer is shown as the shaded part in fig. 6.

The driving mechanism preferably includes a driving rod 51, and an umbrella gear 52 is disposed between the driving rod 51 and the nozzle 211, as shown in fig. 4, in this embodiment, the driving rod 51 is connected to a motor, and of course, other connecting rods and a speed reducing mechanism may be disposed between the driving rod 51 and the nozzle 211, the driving rod 51 is rotated by the motor, and the nozzle 211 is rotated by the umbrella gear 52, so that the nozzle 211 reciprocates, a reciprocating mechanism may be additionally disposed between the motor and the driving rod 51, so as to realize the alternate forward and reverse rotation of the driving rod 51.

The above description is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above embodiments, and all technical solutions belonging to the idea of the present invention belong to the protection scope of the present invention. It should be noted that modifications and embellishments within the scope of the invention may occur to those skilled in the art without departing from the principle of the invention, and are considered to be within the scope of the invention.