阅读说明：本技术 一种电子元器件加工用固晶设备及其工作方法 (Die bonding equipment for processing electronic components and working method thereof ) 是由 蒋振荣 周海生 于 2020-06-24 设计创作，主要内容包括：本发明公开一种电子元器件加工用固晶设备及其工作方法,包括两个侧梁,侧梁顶部安装有三个支撑块,三个支撑块均固定于第一连接梁底部,第一连接梁顶部滑动设置有移动板,两个移动板分别固定于移动梁底部两侧,移动梁一侧滑动设置有移动架,移动架上滑动安装有升降板,两个侧梁分别设置于承载板两侧,承载板上安装有载料台,承载板上滑动设置有上料台。本发明的点胶头以及吸附板安装在移动架上,点胶头和吸附板可以同时进行三轴方向的调节,使得整个固晶设备的结构更加简单,调节更加方便,该固晶设备可以满足对PCB板各位置的点胶以及固晶工作,同时方便将固晶后的PCB板送至下一工位。(The invention discloses a die bonding device for processing electronic components and a working method thereof. The dispensing head and the adsorption plate are arranged on the movable frame, and the dispensing head and the adsorption plate can be adjusted in three-axis directions simultaneously, so that the whole die bonding equipment is simpler in structure and more convenient to adjust, the die bonding equipment can meet the dispensing and die bonding work of each position of a PCB, and the die-bonded PCB can be conveniently conveyed to the next station.)

1. The utility model provides an electronic components processing is with solid brilliant equipment, its characterized in that, includes two curb girders (1), three supporting shoe (2) are installed at curb girder (1) top, and three supporting shoe (2) all are fixed in first tie beam (3) bottom, first tie beam (3) top slides and is provided with movable plate (7), and two movable plates (7) are fixed in respectively and move roof beam (9) bottom both sides, it is provided with removal frame (13) to move roof beam (9) one side slide, slidable mounting has lifter plate (15) on removal frame (13), and two curb girders (1) set up respectively in loading board (22) both sides, install material loading platform (23) on loading board (22), the sliding is provided with material loading platform (24) on loading board (22).

2. The die bonding equipment for processing the electronic components as claimed in claim 1, wherein a first motor (4) is mounted on one side of the first connecting beam (3), an output shaft of the first motor (4) is connected with a first lead screw (5), a first connecting block (6) is rotatably arranged on the outer peripheral surface of the first lead screw (5), the first connecting block (6) is mounted on the lower surface of a moving plate (7), a sliding block is mounted on the lower surface of the moving plate (7), a sliding rail is mounted at the top of the first connecting beam (3), and the moving plate (7) is slidably connected with the sliding rail on the first connecting beam (3) through the sliding block.

3. The die bonding equipment for processing the electronic components as claimed in claim 1, wherein a second motor (10) is installed on one side of the top of the movable beam (9), an output shaft of the second motor (10) is connected with a second lead screw (11), a second connecting block (12) is rotatably arranged on the outer peripheral surface of the second lead screw (11), the second connecting block (12) is fixed on a movable frame (13), two sliding rails are installed on one side of the movable beam (9), two sliding blocks are installed on the movable frame (13), and the movable frame (13) is slidably connected with the sliding rails on the movable beam (9) through the sliding blocks.

4. The die bonding equipment for processing the electronic components as claimed in claim 1, wherein a third motor (14) is mounted at the top of the moving frame (13), an output shaft of the third motor (14) is connected with a third screw rod (16), a third connecting block (17) is rotatably arranged on the outer peripheral surface of the third screw rod (16), the third connecting block (17) is mounted on a lifting plate (15), four sliding blocks are mounted at two ends of one side of the lifting plate (15), two sliding rails are mounted on the moving frame (13), and the four sliding blocks on the lifting plate (15) are respectively connected with the two sliding rails on the moving frame (13) in a sliding manner.

5. The die bonding equipment for processing the electronic components as claimed in claim 1, wherein two slide rails are mounted on the bearing plate (22), four slide blocks are mounted at the bottom of the feeding table (24), the feeding table (24) is slidably connected with the two slide rails on the bearing plate (22) through the four slide blocks, and the feeding table (23) is arranged on one side of the feeding table (24).

6. A working method of die bonding equipment for processing electronic components is characterized by comprising the following steps:

the method comprises the following steps: placing a PCB on a feeding table (24), starting a first motor (4), driving a first screw rod (5) to rotate by an output shaft of the first motor (4), driving a movable plate (7) by the first screw rod (5) matching with a first connecting block (6), sliding the movable plate (7) along a slide rail at the top of a connecting beam (3) through a slider, driving the movable beam (9) to move by two movable plates (7), further driving a second cylinder (19) to move to the upper part of a material carrying table (23), starting a third motor (14), driving a third screw rod (16) to rotate by an output shaft of the third motor (14), driving a lifting plate (15) to move by the third screw rod (16) matching with a third connecting block (17), sliding the lifting plate (15) downwards along the slide rail on a moving frame (13) through the slider, and adsorbing an LED on the material carrying table (23) by a piston rod of the second cylinder (19) through an adsorbing plate (21);

step two: then an output shaft of a second motor (10) drives a second screw rod (11) to rotate, the second screw rod (11) is matched with a second connecting block (12) to drive a moving frame (13) to move, the moving frame (13) slides along a sliding rail on the side surface of a moving beam (9) through a sliding block, a dispensing head (20) is driven by a first air cylinder (18) to move to the position above a dispensing position of a PCB, a third motor (14) is started, an output shaft of the third motor (14) drives a third screw rod (16) to rotate, the third screw rod (16) is matched with a third connecting block (17) to drive a lifting plate (15) to move, the lifting plate (15) slides downwards along the sliding rail on the moving frame (13) through the sliding block, and a piston rod of the first air cylinder (18) dispenses the PCB through the dispensing head (20);

step three: then second motor (10) output shaft continues to rotate, removes adsorption plate (21) to the point through second cylinder (19) and glues position top, and adsorption plate (21) are fixed the LED on the PCB board, lasts above step, carries out solid brilliant to the PCB board, promotes material loading platform (24) behind the solid brilliant, and material loading platform (24) slide along the slide rail on loading board (22) through the slider, drive the PCB board and get into next station.

Technical Field

The invention relates to the technical field of electronic component processing, in particular to a die bonding device for processing an electronic component and a working method thereof.

Background

The electronic components are components of electronic elements and small machines and instruments, are usually composed of a plurality of parts and can be commonly used in similar products; it is a general name of electronic devices such as capacitor, transistor, balance spring and spiral spring.

Electronic components adds man-hour and need fix LED on the PCB board, and current solid brilliant equipment structure is complicated, and the point is glued head and adsorption plate and is separated work, and whole solid brilliant equipment's structure is big, and is not high to the solid brilliant efficiency of PCB board simultaneously.

Disclosure of Invention

The invention aims to provide die bonding equipment for processing electronic components and a working method thereof, and solves the following technical problems: by starting the first motor, the first motor output shaft drives the first screw rod to rotate, the first screw rod drives the movable plates by matching with the first connecting block, the movable plates slide along the slide rails at the tops of the connecting beams through the slide blocks, the two movable plates drive the movable beams to move so as to drive the second air cylinder to move above the material carrying table, the third motor is started, the third motor output shaft drives the third screw rod to rotate, the third screw rod drives the lifting plate to move by matching with the third connecting block, the lifting plate slides downwards along the slide rails on the movable frame through the slide blocks, the piston rod of the second air cylinder adsorbs the LED on the material carrying table through the adsorption plate, then the second motor output shaft drives the second screw rod to rotate, the second screw rod drives the movable frame to move by matching with the second connecting block, the movable frame slides along the slide rails on the side surfaces of the movable beams through the slide blocks, and further drives the dispensing head to move above the, the third motor output shaft drives the third screw rod to rotate, the third screw rod is matched with the third connecting block to drive the lifting plate to move, the lifting plate slides downwards along a slide rail on the moving frame through a slide block, a first air cylinder piston rod carries out glue dispensing on the PCB through a glue dispensing head, then the second motor output shaft continues to rotate, the adsorption plate is moved to the position above the glue dispensing position through a second air cylinder, the adsorption plate fixes the LED on the PCB, the steps are continued, crystal solidification is carried out on the PCB, the feeding table is pushed after the crystal solidification, the feeding table slides along the slide rail on the bearing plate through the slide block to drive the PCB to enter the next station, through the structure, the glue dispensing head and the adsorption plate of the crystal solidification equipment for processing the electronic components are arranged on the moving frame, the glue dispensing head and the adsorption plate can be adjusted in the three-axis directions simultaneously, so that the structure of the whole crystal solidification equipment is simpler and more convenient to adjust, and the crystal solidification equipment can meet the glue dispensing and crystal solidification work, meanwhile, the PCB after die bonding is conveniently conveyed to the next station.

The purpose of the invention can be realized by the following technical scheme:

the utility model provides an electronic components processing is with solid brilliant equipment, includes two curb girders, three supporting shoe is installed at the curb girder top, and three supporting shoe all is fixed in first connecting beam bottom, first connecting beam top slides and is provided with the movable plate, and two movable plates are fixed in removal roof beam bottom both sides respectively, removal roof beam one side slides and is provided with the removal frame, slidable mounting has the lifter plate on the removal frame, and two curb girders set up respectively in the loading board both sides, install the material loading platform on the loading board, it is provided with the material loading platform to slide on the loading board.

Further, a first motor is installed on one side of the first connecting beam, a first lead screw is connected to an output shaft of the first motor, a first connecting block is arranged on the outer peripheral surface of the first lead screw in a rotating mode, the first connecting block is installed on the lower surface of the movable plate, a sliding rail is installed at the top of the first connecting beam, and the movable plate is connected with the sliding rail on the first connecting beam through the sliding block in a sliding mode.

Further, a second motor is installed on one side of the top of the movable beam, a second lead screw is connected to an output shaft of the second motor, a second connecting block is arranged on the outer peripheral face of the second lead screw in a rotating mode, the second connecting block is fixed to the movable frame, two sliding rails are installed on one side of the movable beam, two sliding blocks are installed on the movable frame, and the movable frame is connected with the sliding rails on the movable beam in a sliding mode through the sliding blocks.

Further, a third motor is installed at the top of the moving frame, an output shaft of the third motor is connected with a third lead screw, a third connecting block is arranged on the outer peripheral surface of the third lead screw in a rotating mode, the third connecting block is installed on the lifting plate, four sliding blocks are installed at two ends of one side of the lifting plate, two sliding rails are installed on the moving frame, and the four sliding blocks on the lifting plate are respectively connected with the two sliding rails on the moving frame in a sliding mode.

Further, install two slide rails on the loading board, four sliders are installed to material loading platform bottom, the material loading platform is through two slide rails on four slider sliding connection loading boards, the material loading platform sets up in material loading platform one side.

Further, the working method of the die bonding equipment for processing the electronic components comprises the following steps:

the method comprises the following steps: placing a PCB on a loading table, starting a first motor, driving a first lead screw to rotate by an output shaft of the first motor, driving a movable plate by the first lead screw in cooperation with a first connecting block, driving the movable plate to slide along a slide rail at the top of a connecting beam by the movable plate, driving the movable beam to move by the two movable plates, further driving a second cylinder to move above a loading table, starting a third motor, driving a third lead screw to rotate by an output shaft of the third motor, driving a lifting plate to move by the third lead screw in cooperation with a third connecting block, driving the lifting plate to slide downwards along the slide rail on a movable frame by the lifting plate, and adsorbing an LED on the loading table by a piston rod of the second cylinder through an adsorption;

step two: then a second motor output shaft drives a second lead screw to rotate, the second lead screw is matched with a second connecting block to drive a moving frame to move, the moving frame slides along a slide rail on the side surface of a moving beam through a slide block, a dispensing head is driven to move to a position above a dispensing position of a PCB through a first air cylinder, a third motor is started, a third motor output shaft drives a third lead screw to rotate, the third lead screw is matched with a third connecting block to drive a lifting plate to move, the lifting plate slides downwards along the slide rail on the moving frame through the slide block, and a first air cylinder piston rod is used for dispensing the PCB through the dispensing head;

step three: then second motor output shaft continues to rotate, removes the adsorption plate to the point through the second cylinder and glues position top, and the adsorption plate is fixed LED on the PCB board, lasts above step, carries out solid brilliant to the PCB board, promotes the material loading platform behind the solid brilliant, and the material loading platform passes through the slider and slides along the slide rail on the loading board, drives the PCB board and gets into next station.

The invention has the beneficial effects that:

the invention relates to a die bonding device for processing electronic components and a working method thereof, wherein a first motor is started, an output shaft of the first motor drives a first screw rod to rotate, the first screw rod is matched with a first connecting block to drive a movable plate, the movable plate slides along a slide rail at the top of the connecting beam through a slide block, two movable plates drive a movable beam to move so as to drive a second air cylinder to move above a material carrying table, a third motor is started, an output shaft of the third motor drives a third screw rod to rotate, the third screw rod is matched with a third connecting block to drive a lifting plate to move, the lifting plate slides downwards along the slide rail on a movable frame through the slide block, a piston rod of the second air cylinder adsorbs an LED on the material carrying table through an adsorption plate, then an output shaft of the second motor drives the second screw rod to rotate, the second screw rod is matched with the second connecting block to drive the movable frame to move, the movable frame slides along the slide rail on the side surface of the movable, the third motor is started, the output shaft of the third motor drives the third screw rod to rotate, the third screw rod is matched with the third connecting block to drive the lifting plate to move, the lifting plate slides downwards along a slide rail on the moving frame through the slide block, the piston rod of the first air cylinder carries out glue dispensing on the PCB through the glue dispensing head, then the output shaft of the second motor continues to rotate, the adsorption plate is moved to the position above the glue dispensing position through the second air cylinder, the adsorption plate fixes the LED on the PCB, the steps are continued, the PCB is subjected to die bonding, the feeding table is pushed after the die bonding, the feeding table slides along the slide rail on the bearing plate through the slide block to drive the PCB to enter the next station, through the structure, the glue dispensing head and the adsorption plate of the die bonding equipment for processing the electronic components are installed on the moving frame, and the glue dispensing head and the adsorption plate can simultaneously carry out adjustment in the three-axis directions, so that the structure of the, the die bonding equipment can meet the requirements of dispensing and die bonding of the PCB at each position, and meanwhile, the die-bonded PCB can be conveniently conveyed to the next station.

Drawings

The invention will be further described with reference to the accompanying drawings.

FIG. 1 is a schematic structural diagram of a die bonding apparatus for processing an electronic component according to the present invention;

FIG. 2 is a schematic view of the construction of the walking beam of the present invention;

FIG. 3 is a schematic view of the mounting of the first and second cylinders of the present invention;

FIG. 4 is a schematic structural view of a coupling beam of the present invention;

fig. 5 is a schematic structural view of the lifter plate of the present invention.

In the figure: 1. a side beam; 2. a support block; 3. a connecting beam; 4. a first motor; 5. a first lead screw; 6. a first connection block; 7. moving the plate; 9. a moving beam; 10. a second motor; 11. a second lead screw; 12. a second connecting block; 13. a movable frame; 14. a third motor; 15. a lifting plate; 16. a third screw rod; 17. a third connecting block; 18. a first cylinder; 19. a second cylinder; 20. dispensing a glue head; 21. an adsorption plate; 22. a carrier plate; 23. a material loading platform; 24. a feeding platform.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-5, the invention is a die bonding apparatus for processing an electronic component, comprising two side beams 1, three support blocks 2 are mounted on the top of the side beam 1, the three support blocks 2 are all fixed on the bottom of a first connecting beam 3, a moving plate 7 is slidably disposed on the top of the first connecting beam 3, the two moving plates 7 are respectively fixed on two sides of the bottom of a moving beam 9, a moving frame 13 is slidably disposed on one side of the moving beam 9, a lifting plate 15 is slidably mounted on the moving frame 13, the two side beams 1 are respectively disposed on two sides of a bearing plate 22, a material loading platform 23 is mounted on the bearing plate 22, and a material loading platform 24 is slidably disposed on the.

Specifically, a first motor 4 is installed on one side of the first connecting beam 3, an output shaft of the first motor 4 is connected with a first lead screw 5, a first connecting block 6 is arranged on the outer peripheral surface of the first lead screw 5 in a rotating mode, the first connecting block 6 is installed on the lower surface of the movable plate 7, a sliding block is installed on the lower surface of the movable plate 7, a sliding rail is installed at the top of the first connecting beam 3, and the movable plate 7 is connected with the sliding rail on the first connecting beam 3 in a sliding mode through the sliding. A second motor 10 is installed on one side of the top of the movable beam 9, an output shaft of the second motor 10 is connected with a second lead screw 11, a second connecting block 12 is arranged on the outer peripheral face of the second lead screw 11 in a rotating mode, the second connecting block 12 is fixed on a movable frame 13, two sliding rails are installed on one side of the movable beam 9, two sliding blocks are installed on the movable frame 13, and the movable frame 13 is connected with the sliding rails on the movable beam 9 in a sliding mode through the sliding blocks. The third motor 14 is installed at the top of the movable frame 13, an output shaft of the third motor 14 is connected with a third screw rod 16, a third connecting block 17 is rotatably arranged on the outer peripheral surface of the third screw rod 16, the third connecting block 17 is installed on the lifting plate 15, four sliding blocks are installed at two ends of one side of the lifting plate 15, two sliding rails are installed on the movable frame 13, and the four sliding blocks on the lifting plate 15 are respectively connected with the two sliding rails on the movable frame 13 in a sliding manner. Two slide rails are mounted on the bearing plate 22, four slide blocks are mounted at the bottom of the feeding table 24, the feeding table 24 is connected with the two slide rails on the bearing plate 22 in a sliding mode through the four slide blocks, and the material carrying table 23 is arranged on one side of the feeding table 24.

Referring to fig. 1 to 5, the working process of the die bonding apparatus for processing an electronic component according to the present embodiment is as follows:

the method comprises the following steps: placing the PCB on a loading table 24, starting a first motor 4, driving a first screw rod 5 to rotate by an output shaft of the first motor 4, driving a moving plate 7 by the first screw rod 5 matching with a first connecting block 6, driving the moving plate 7 to slide along a slide rail at the top of a connecting beam 3 through a slider, driving a moving beam 9 to move by two moving plates 7, further driving a second cylinder 19 to move above a loading table 23, starting a third motor 14, driving a third screw rod 16 to rotate by an output shaft of the third motor 14, driving a lifting plate 15 to move by the third screw rod 16 matching with a third connecting block 17, driving the lifting plate 15 to slide downwards along the slide rail on a moving frame 13 through the slider, and adsorbing an LED on the loading table 23 by a piston rod of the second cylinder 19 through an adsorption plate 21;

step two: then, an output shaft of a second motor 10 drives a second screw rod 11 to rotate, the second screw rod 11 is matched with a second connecting block 12 to drive a moving frame 13 to move, the moving frame 13 slides along a sliding rail on the side surface of a moving beam 9 through a sliding block, a dispensing head 20 is further driven by a first air cylinder 18 to move above a dispensing position of a PCB, a third motor 14 is started, an output shaft of the third motor 14 drives a third screw rod 16 to rotate, the third screw rod 16 is matched with a third connecting block 17 to drive a lifting plate 15 to move, the lifting plate 15 slides downwards along the sliding rail on the moving frame 13 through the sliding block, and a piston rod of the first air cylinder 18 is used for dispensing the PCB through the dispensing head 20;

step three: then the output shaft of second motor 10 continues to rotate, moves adsorption plate 21 to the point through second cylinder 19 and glues position top, and adsorption plate 21 fixes the LED on the PCB board, lasts above step, and solid brilliant to the PCB board promotes material loading platform 24 behind the solid brilliant, and material loading platform 24 passes through the slider and slides along the slide rail on loading board 22, drives the PCB board and gets into next station.

The foregoing is merely exemplary and illustrative of the present invention and various modifications, additions and substitutions may be made by those skilled in the art to the specific embodiments described without departing from the scope of the invention as defined in the following claims.