阅读说明：本技术 一种晶圆传递装置及具有其的光阻涂布显影设备 (Wafer transfer device and photoresist coating and developing equipment with same ) 是由 许志雄 于 2020-06-18 设计创作，主要内容包括：本发明公开了一种晶圆传递装置,其利用第一机械臂传递处于高温状态的晶圆,利用第二机械臂传递处于冷却状态的晶圆,这样避免了同一个机械臂既传递处于高温状态的晶圆又传递处于冷却状态的晶圆,进而提高晶圆在各工艺步骤过程中的温度稳定性和均一性；同时减少了一个任务周期内单个机械臂运转的次数,从而延长了单个机械臂的使用期限,也即延长了整个晶圆传递装置的使用期限,提升了半导体生产的稳定性、效率及产品良率；将该晶圆传递装置运用到光阻涂布显影设备中,与光阻涂布显影设备的多层机架配合,多层机架上沿竖直方向设有冷却盘单元、热盘单元,对应第一机械臂和第二机械臂,配合作业,实现了设备整体的高契合度。(The invention discloses a wafer transfer device, which utilizes a first mechanical arm to transfer a wafer in a high-temperature state and utilizes a second mechanical arm to transfer a wafer in a cooling state, so that the condition that the same mechanical arm transfers the wafer in the high-temperature state and the wafer in the cooling state is avoided, and the temperature stability and the uniformity of the wafer in the process of each process step are further improved; meanwhile, the running times of a single mechanical arm in one task period are reduced, so that the service life of the single mechanical arm is prolonged, the service life of the whole wafer transfer device is prolonged, and the stability, the efficiency and the product yield of semiconductor production are improved; the wafer transfer device is applied to photoresist coating and developing equipment and matched with a multi-layer rack of the photoresist coating and developing equipment, a cooling disc unit and a hot disc unit are arranged on the multi-layer rack in the vertical direction and correspond to a first mechanical arm and a second mechanical arm, and high integrating degree of the whole equipment is realized through matching operation.)

1. A wafer transfer device comprises a transfer table body for transferring wafers, and is characterized in that: the wafer transfer platform is characterized in that a first mechanical arm and a second mechanical arm are arranged on the transfer platform body, the first mechanical arm is used for transferring wafers in a cooling state, and the second mechanical arm is used for transferring wafers in a high-temperature state.

2. The wafer transfer apparatus of claim 1, wherein: the wafer transfer platform is characterized in that a third mechanical arm is further arranged on the transfer platform body, the first mechanical arm, the second mechanical arm and the third mechanical arm are sequentially arranged in the vertical direction, and the third mechanical arm is used for transferring wafers in a high-temperature state.

3. The wafer transfer apparatus of claim 2, wherein: the transfer table body is provided with a first sliding groove, a second sliding groove and a third sliding groove which are respectively connected with the first mechanical arm, the second mechanical arm and the third mechanical arm in a sliding mode, so that the first mechanical arm, the second mechanical arm and the third mechanical arm can move in the horizontal direction.

4. A wafer transfer apparatus as claimed in claim 3, wherein: and a heat dissipation assembly is also clamped between the first mechanical arm and the second mechanical arm.

5. The wafer transfer apparatus of claim 4, wherein: the radiating assembly comprises a first radiating plate, a second radiating plate and a connecting frame, the first radiating plate, the connecting frame and the second radiating plate are sequentially connected in a stacked mode from top to bottom, and the connecting frame is hollow so that a cavity is formed between the first radiating plate and the second radiating plate.

6. A photoresist coating developing device comprises a cooling disc unit and a hot disc unit, and is characterized in that: further comprising the wafer transfer device of any of claims 1-5.

7. The resist coating and developing apparatus according to claim 6, wherein: still include a plurality of frames, the frame contains a plurality of cooling layers and a plurality of zone of heating of separating the setting, the cooling layer is equipped with the cooling plate unit, the zone of heating is equipped with the hot plate unit.

8. The resist coating and developing apparatus according to claim 7, wherein: the frame is equipped with cooling plate unit, first hot plate unit and second hot plate unit along vertical direction in proper order.

9. The resist coating and developing apparatus according to claim 7, wherein: the number of the machine frames is two, and the machine frames are symmetrically arranged on two sides of the wafer transfer device.

10. The resist coating and developing apparatus according to claim 6, wherein: the lifting and rotating device is positioned at the bottom of the wafer transfer device and can lift and rotate the wafer transfer device.