阅读说明：本技术 温度传感器 (Temperature sensor ) 是由 奥利弗·巴尔德 沃尔夫冈·格伦德曼 沃尔夫冈·沙茨 亚伯拉罕·科 于 2019-01-17 设计创作，主要内容包括：本发明涉及一种温度传感器(1),其具有：传感器元件(2)和包围传感器元件(2)的包覆件(4),其中,温度传感器(1)还具有环(5),所述环包围传感器元件(2)并且所述环由包覆件(4)覆盖。(The invention relates to a temperature sensor (1) comprising: a sensor element (2) and a cladding (4) surrounding the sensor element (2), wherein the temperature sensor (1) further has a ring (5) which surrounds the sensor element (2) and which is covered by the cladding (4).)

1. A temperature sensor (1) having:

a sensor element (2) and a covering (4) surrounding the sensor element (2),

wherein the temperature sensor (1) further has a ring (5) which surrounds the sensor element (2) and which is covered by the cladding (4).

2. Temperature sensor (1) according to the preceding claim,

wherein the temperature sensor (1) further has a housing (3), an

Wherein the sensor element (2), the ring (5) and the cladding (4) are arranged within the housing (3).

3. Temperature sensor (1) according to one of the preceding claims,

wherein the ring (5) has a higher thermal conductivity than the cladding (4).

4. Temperature sensor (1) according to one of the preceding claims,

wherein the ring (5) is of a ceramic material.

5. Temperature sensor (1) according to one of the claims 1 or 2,

wherein the ring (5) has a lower thermal conductivity than the cladding (4).

6. Temperature sensor (1) according to one of the claims 1, 2 or 5,

wherein the material of the ring (5) comprises plastic.

7. Temperature sensor (1) according to one of the preceding claims,

wherein the ring (5) is fastened to the sensor element (2) by means of the cladding (4).

8. Temperature sensor (1) according to one of the preceding claims,

wherein the ring (5) and the sensor element (2) are separate components.

9. Temperature sensor (1) according to one of the preceding claims,

wherein the ring (5) is plugged onto the sensor element (2).

10. Temperature sensor (1) according to one of the preceding claims,

wherein the loop (5) partially covers the feed lines (2b, 2c) of the sensor element (2).

11. Temperature sensor (1) according to one of the preceding claims,

wherein the sensor element (2) has a sensor head (2a) made of an NTC material, and

wherein the loop (5) covers contact positions (6) of the sensor head (2a) and the feed lines (2b, 2 c).

12. Temperature sensor (1) according to one of the preceding claims,

wherein the coating element (4) is made of a thermally conductive paste, or

Wherein the coating (4) has a thermally conductive potting compound.

13. Temperature sensor (1) according to one of the preceding claims,

wherein the temperature sensor (1) is a temperature probe for small devices in domestic appliances, in the automotive field or in heating technology.

14. Device with a temperature sensor (1) according to one of the preceding claims and a control unit connected to the temperature sensor (1).

15. The device according to the preceding claim,

wherein the response performance of the temperature sensor (1) is matched to the response performance of the control unit.

Technical Field

The present invention relates to a temperature sensor.

Background

Typically, the temperature sensor has a wired NTC resistor, which is connected to the housing via a thermally conductive potting compound or a thermally conductive paste. The material of the potting compound or the thermal paste must be selected such that it is not capable of conducting electricity. Such potting materials available on the market have limited thermal conductivity. The reaction time and thus the response performance of the temperature sensor is also limited due to the limited thermal conductivity. The response behavior of the temperature sensor can be determined in particular by its response time, i.e. the time that elapses until a temperature change or a resistance change is measured by the sensor.

Disclosure of Invention

It is an object of the present invention to provide an improved temperature sensor. For example, it should be possible to: the response behavior of the temperature sensor can be influenced in a desired manner.

A temperature sensor is proposed, which has a sensor element and a cladding surrounding the sensor element, wherein the temperature sensor further has a ring which surrounds the sensor element and is covered by the cladding.

The sensor element can be a wired NTC element. The sensor element can have a sensor head made of an NTC material and a power supply line connected to the sensor head, and a voltage can be applied to the sensor head via the power supply line.

The material of the cladding can be chosen such that it is not electrically conductive in order to avoid short-circuiting of the sensor element. The thermal conductivity of the material of the cladding affects the reaction rate of the temperature sensor. The encapsulation can be made of potting material or thermally conductive paste.

The ring surrounds the sensor element and is covered by a wrapper. The ring can have a thermal conductivity different from a thermal conductivity of the overmold. Thus, by appropriately selecting the material of the ring, the thermal conductivity of the elements surrounding the sensor element, i.e. the cladding, the ring and possibly the housing, can be adapted to the requirements of the system environment. By a suitable choice of the material of the ring, it is possible in particular to: increasing or decreasing the thermal conductivity of the material. Thus, the reaction speed of the temperature sensor can be adjusted by the ring, and the response performance can be improved. The limitation of the reaction rate of the temperature sensor described above, which is determined by the design, can be at least weakened by the ring provided in the encapsulation.

Furthermore, the ring can constitute an additional mechanical protection for the sensor element. The ring can protect the contact point, in particular mechanically, where the feed line is fastened to the sensor head. The ring can thereby prevent damage to the supply lines when the sensor element is mounted in the housing. Damage to the feed line can occur, for example, by buckling or compression of the feed line during installation. The loop can improve the dielectric strength of the temperature sensor since the loop can mechanically protect the feed line. Uncompressed or bent feed lines can be loaded with higher voltages.

The sensor element, the ring and the overmold can be disposed within the housing. The housing can be sleeve-shaped. The housing can be constructed of a metallic material. The housing can be a mechanical protection for the sensor element. The material of the housing can have a high thermal conductivity, so that changes in the ambient temperature can be quickly transmitted to the sensor element.

The sensor element can be connected to the housing via the encapsulation. The cover and the sensor element can be arranged in a housing. The sensor element can be fastened to the housing by means of a cladding.

The ring can have a higher thermal conductivity than the overmold. Accordingly, by providing the ring in the cover, the reaction speed of the temperature sensor can be increased relative to a temperature sensor without such a ring. A faster reaction speed can improve the measurement accuracy of the temperature sensor. Temperature sensors with a fast response speed are particularly well suited for combination with control units which likewise have a fast response speed and correspondingly have a short response behavior.

The ring can have a ceramic material or consist of a ceramic material. Ceramic materials have a high thermal conductivity and, correspondingly, can contribute to achieving a short reaction speed of the sensor. The ceramic material can be, for example, alumina or zirconia.

In an alternative embodiment, the ring has a lower thermal conductivity than the overmold. This makes it possible to achieve that the elements of the sensor surrounding the sensor element, i.e. the housing, the encapsulation and the ring, have a total thermal conductivity which is lower than the thermal conductivity of a temperature sensor without a corresponding ring. The reaction speed of the temperature sensor can thereby be slowed down, since temperature changes of the ambient temperature may be transmitted to the sensor element less quickly.

Slowing down the reaction speed of the temperature sensor is advantageous in applications in which the temperature sensor is combined with a control unit that also has a slow reaction speed. The reaction rates of the temperature sensor and the control unit should be as well as possible in phase with one another.

The material of the ring can have or consist of plastic, for example. Compared to common potting materials, plastics have a low thermal conductivity. Correspondingly, the response behavior of the temperature sensor can be slowed down by having a ring of plastic or being composed of plastic.

The ring can be fastened to the sensor element by means of a cladding. The ring and the sensor element can in particular be separate components. The ring can be plugged onto the sensor element when the temperature sensor is mounted. The ring is finally fastened to the sensor element merely by forming the encapsulation, for example from potting or thermal paste.

Since the ring and the sensor element can be two parts separated from each other, suitable rings can be selected in each case when mounting the temperature sensor, the material of which sets the reaction speed of the temperature sensor in a desired manner. It is possible to construct two temperature sensors, in which the same housing, the same cladding and the same sensor element are used and which differ from one another only in the material of the ring. Two such temperature sensors have different response properties. Correspondingly, temperature sensors that differ from one another can be manufactured, so that a very large number of manufacturing steps coincide. In this way, the temperature sensor can be manufactured in a very efficient manner.

The loop can partially cover the feed line of the sensor element. The ring can cover in particular the contact position of the sensor element with the supply line. The sensor element can be a wired NTC resistor. The sensor element can have elongated metal lines as supply lines, wherein there is a risk of damage to these supply lines during the production process. The ring can additionally protect the power supply line from mechanical damage, for example by bending or compression.

The cover can be made of a thermally conductive paste. Alternatively, the encapsulation can have a thermally conductive potting compound.

The temperature sensor can be a temperature sensor for small devices in the household appliance, automotive sector or heating technology.

According to another aspect, the invention relates to a device having a temperature sensor and a control unit connected to the temperature sensor. The temperature sensor can in particular be the temperature sensor described above.

The control unit can, for example, control the regulating circuit. The temperature determined by the temperature sensor can be taken into account as an input variable of the control unit. The control unit can in particular emit a control signal related to the temperature sought by the temperature sensor.

If the variables of the regulating circuit are changed by the control unit, the temperature may vary accordingly. The temperature change can again be ascertained by the temperature sensor and transmitted to the control unit. In this way, the control unit can be configured for permanently regulating the temperature and setting the temperature in a desired manner. For optimum cooperation between the temperature sensor and the control unit, it is necessary here for the temperature sensor and the control unit to have as identical a response behavior as possible. Thus, the response performance of the temperature sensor can be matched to the response performance of the control unit. The adjustment of the response behavior of the temperature sensor can be achieved in particular by a suitable choice of the material of the ring.

Drawings

Preferred embodiments of the present invention are described hereinafter with reference to the accompanying drawings.

Fig. 1 shows a cross section through a temperature sensor.

Fig. 2 shows a perspective view of the temperature sensor.

Detailed Description

Fig. 1 shows a cross section through a temperature sensor 1. The temperature sensor 1 has a sensor element 2. The sensor element 2 relates to an NTC element. And more particularly to wired NTC elements. The sensor element 2 has a sensor head 2a made of NTC material and power supply lines 2b, 2 c. The power supply lines 2b, 2c are elongated metal lines. The sensor head 2a is connected to two supply lines 2b, 2c via which a voltage can be applied to the sensor head 2 a.

The sensor element 2 is arranged in a housing 3. The housing 3 is sleeve-shaped. The housing 3 has a metal material. The metal material of the housing 3 has a high thermal conductivity and is correspondingly well suited for use in the temperature sensor 1. However, the material of the housing 3 is also electrically conductive, so that contact between the sensor element 2 and the housing 3 must be prevented in order to be able to achieve a high electrical resistance of the sensor element 2 and to avoid short circuits.

The housing 3 has a front end portion 3a and a rear end portion 3b opposed to the front end portion. The housing 3 is closed at its front end 3 a. The sensor head 2a is disposed within the housing 3 and near the front end 3a of the housing 3. The power feeding lines 2b, 2c extend from the rear end portion 3b of the housing.

Furthermore, the temperature sensor 1 has a cladding 4 which surrounds the sensor element 2. The cover 4 is disposed within the housing 3. The covering 4 surrounds in particular the sensor head 2a and a part of the supply lines 2b, 2c which is fastened directly on the sensor head 2 a. The rear parts of the power supply lines 2b, 2c pointing away from the sensor head 2a are not surrounded by the cladding 4.

The encapsulation 4 can be a potting compound or a thermal paste.

The sensor element 2 and the cover 4 are arranged in the housing 3. The sensor element 2 is connected to the housing 3 via a cover 4 and is fastened in the housing 3. The material of the covering 4 is not electrically conductive in order to prevent short-circuiting of the sensor element 2. The material of the covering 4 should have a high thermal conductivity in order to be able to transmit temperature changes to the sensor element 2 well.

Furthermore, the temperature sensor 1 has a ring 5 surrounding the sensor element 2. The loop 5 surrounds in particular a contact location 6 at which the supply lines 2b, 2c are fastened to the sensor head 2 a. The loop 5 partly overlaps the sensor head 2 a.

The material of the ring 5 influences the thermal conductivity of the temperature sensor 1. The reaction speed of the temperature sensor 1 is directly related to the thermal conductivity of the temperature sensor 1. If the housing 3, the covering 4 and the ring 5 have a high overall thermal conductivity, temperature changes can be transmitted very quickly to the sensor element 2 and a short response speed of the temperature sensor 1 results. The thermal conductivity produced by the unit consisting of the housing 3, the cladding 4 and the ring 5 is referred to herein as the "total thermal conductivity", which is determined by the thermal conductivities and the amounts of materials of the housing 3, the cladding 4 and the ring 5.

Conversely, if the unit formed by the housing 3, the covering 4 and the ring 5 has a low overall thermal conductivity, a slow response speed of the temperature sensor 1 results, since temperature changes cannot be transmitted to the sensor element 2 quickly. By a suitable choice of the material of the ring, it is therefore possible to set the reaction speed of the temperature sensor 1 in a desired manner.

The ring 5 can be made of a ceramic material, for example, which has a higher thermal conductivity than the cladding 4. This can increase the reaction rate of the temperature sensor 1 compared to a temperature sensor without such a ring. The thermal conductivity of the ceramic material can be, for example, in the range of 3W/mK to 40W/mK. The ceramic material can be, for example, alumina, zirconia or other ceramic materials.

Alternatively, the ring 5 can be composed of a material having a lower thermal conductivity than the thermal conductivity of the cladding 4. This can slow down the reaction speed of the temperature sensor 1 compared to a temperature sensor without such a ring 5. The material of the ring 5 can, for example, comprise plastic. The thermal conductivity of the material of the ring 5 can be, for example, between 0.15W/mK and 0.5W/mK.

In addition to adjusting the reaction speed of the temperature sensor 1 in a desired manner, the loop 5 can also improve the dielectric strength of the temperature sensor 1. When the sensor element 2 is installed in the casing 4, there is a risk of damage to the sensor element 2. In particular, if the sensor element 2 is introduced too deeply into the sleeve-shaped housing 3 filled with the material for the covering 4, the supply lines 2b, 2c may be compressed or bent. This can limit the loading of the power supply lines 2b, 2c when a high voltage is applied. If the feed lines 2b, 2c are bent or compressed during installation, so that they come into contact with the inside of the housing 3, a short circuit may result.

In order to prevent the electrical supply lines 2b, 2c from being damaged mechanically when the sensor element 2 is installed in the housing 3, the ring 5 can be plugged onto the sensor element 2 before the sensor element 2 is installed in the housing. The loop 5 covers in particular the contact points 6 of the supply lines 2b, 2c with the sensor head 2 a. Correspondingly, the ring 5 protects the mechanically weak points of the sensor element 2. The loop can prevent bending or compression of the power feed lines 2b, 2c when the sensor element 2 is mounted in the housing 3 filled with the material of the covering 4. Thus, the ring 5 can ensure: the sensor element 2 can be subjected to high voltages and the dielectric strength of the temperature sensor 1 can be improved in the manner described.

The manufacturing method of the temperature sensor 1 is described below:

the coating means 4 can be introduced into the housing 3 as a liquid or pasty material. Subsequently, the sensor element 2, which has been plugged onto the ring 5, is introduced into the housing 3. The ring 5 is held by friction at the sensor element 2. At this point in time, the ring 5 is non-detachably fastened to the sensor element 2.

The sensor element 2 is introduced into the housing 3 to such an extent that at least the sensor head 2a and the ring 5 are completely covered by the material of the covering 4. The material of the covering 4 is then hardened.

Fig. 2 shows the temperature sensor 1 in a perspective view. The temperature sensor 1 relates to a temperature probe. At the end of the power supply lines 2b, 2c facing away from the sensor head 2a, a plug 7 is provided, via which the temperature sensor 1 can be connected, for example, to a control unit. The temperature sensor 1 can be used for small devices in the field of domestic appliances, automobiles or in heating technology.

By using the ring 5 surrounding the sensor element 2, as described hereinbefore, the reaction speed of the temperature sensor 1 can be set in a desired manner. In particular, the reaction speed can be set such that it is adapted to the reaction speed of the control unit. The control unit can be related to the control of the regulating circuit.

Reference numerals

1 temperature sensor

2 sensor element

2a sensor head

2b feeder line

2c feeder

3 case

3a front end portion

3b rear end portion

4 cladding part

5 Ring

6 contact position

7 plug