阅读说明：本技术 电路板组件、电子设备、电路板组件的加工方法 (Circuit board assembly, electronic device and processing method of circuit board assembly ) 是由 朱福建 丁海幸 陶媛 于 2020-04-27 设计创作，主要内容包括：本申请提供了一种电路板组件,包括：设置有台阶孔和/或台阶部的第一电路板,其中,台阶孔包括第一孔、第二孔以及连接在第一孔与第二孔之间的第一台阶面,台阶部包括第五台阶面、第六台阶面,第五台阶面与第六台阶面间隔设置且位于电路板的同侧,第一台阶面、第五台阶面、第六台阶面均相对于第一电路板的第一方向垂直设置；还包括设置在第一台阶面、第五台阶面或第六台阶面上的第二电路板。本申请还提供一种加工电路板的方法。本申请提供的电路板组件和加工电路板的方法可以缩小电路板组件在电子设备内的占用空间、提升电路板组件的强度。(The application provides a circuit board assembly, includes: the first circuit board is provided with a step hole and/or a step part, wherein the step hole comprises a first hole, a second hole and a first step surface connected between the first hole and the second hole, the step part comprises a fifth step surface and a sixth step surface, the fifth step surface and the sixth step surface are arranged at intervals and are positioned on the same side of the circuit board, and the first step surface, the fifth step surface and the sixth step surface are all vertically arranged relative to the first direction of the first circuit board; the second circuit board is arranged on the first step surface, the fifth step surface or the sixth step surface. The application also provides a method for processing the circuit board. The circuit board assembly and the method for processing the circuit board can reduce the occupied space of the circuit board assembly in the electronic equipment and improve the strength of the circuit board assembly.)

1. A circuit board assembly, comprising:

a frame plate including a stepped hole including a first hole, a second hole, and a first stepped surface connected between the first hole and the second hole, the first stepped surface being vertically disposed with respect to a first direction of the frame plate;

and a first inner side circuit board disposed on the first step surface and electrically connected to the frame plate.

2. The circuit board assembly of claim 1, wherein the stepped bore further comprises:

a third hole, and a second step surface connected between the second hole and the third hole, the second step surface being vertically disposed with respect to the first direction of the frame plate;

the circuit board assembly further includes:

and the second inner side circuit board is arranged on the second step surface and is electrically connected with the frame plate.

3. The circuit board assembly of claim 2,

a projected area of the second hole on the first step surface is located within a projected area of the first hole on the first step surface, and a projected area of the third hole on the second step surface is located within a projected area of the second hole on the second step surface; alternatively, the first and second electrodes may be,

a projected area of the second hole on the first step surface is located within a projected area of the first hole on the first step surface, and a projected area of the second hole on the second step surface is located within a projected area of the third hole on the second step surface; alternatively, the first and second electrodes may be,

the first hole is in the projection region on the first step face is located the second hole is in within the projection region on the first step face, the third hole is in the projection region on the second step face is located the second hole is within the projection region on the second step face.

4. A circuit board assembly according to claim 2 or 3, further comprising:

a first outer circuit board disposed on a first horizontal plane of the frame plate, the first horizontal plane being disposed vertically with respect to the first direction;

a second outer circuit board disposed on a second horizontal plane of the frame plate, the second horizontal plane being vertically disposed with respect to the first direction;

the first inner side circuit board and the first outer side circuit board are both application processor AP boards, the second inner side circuit board and the second outer side circuit board are both radio frequency RF boards, or,

the first inner side circuit board and the second outer side circuit board are both AP boards, and the first outer side circuit board and the second inner side circuit board are both RF boards.

5. The circuit board assembly according to any one of claims 1 to 4, wherein the first inner circuit board is disposed in parallel or perpendicular with respect to the first direction of the frame plate.

6. The circuit board assembly of any of claims 1-5, wherein the frame plate further comprises:

first connecting lines are arranged in parallel with respect to a first direction of the frame plate, the first connecting lines are connected with the first step surface, and the first inner side circuit board is electrically connected with the frame plate through the first connecting lines.

7. The circuit board assembly of claim 6, wherein the material of the first connecting lines comprises at least one of: copper, aluminum, gold, silver, graphite.

8. The circuit board assembly of any one of claims 1 to 7, wherein the frame plate further comprises:

a first longitudinal line disposed in parallel with respect to a first direction of the frame plate;

and the first inner side bonding pad is arranged on the first step surface and is connected with the first longitudinal circuit, and the first inner side circuit board is electrically connected with the frame plate through the first inner side bonding pad and the first longitudinal circuit.

9. The circuit board assembly of claim 8, wherein the first inboard pad comprises a functional pad and a non-functional pad.

10. The circuit board assembly of claim 9, wherein the non-functional pads are wrapped around the functional pads.

11. A circuit board assembly according to any of claims 8 to 10, wherein the first inner side pad comprises a ground pad.

12. The circuit board assembly of claim 11, wherein the ground pad is located on a side of the frame plate.

13. The circuit board assembly of any one of claims 1 to 12, wherein the frame plate further comprises:

at least one first via hole disposed in parallel with respect to a first direction of the frame plate;

a plurality of first horizontal lines that the interval set up, first horizontal line for the first direction of frame board sets up perpendicularly, and adjacent two first horizontal line passes through first via hole links to each other, a plurality of first horizontal lines are including setting up circuit on the first step face, first inboard circuit board passes through a plurality of first horizontal lines, at least one first via hole with the frame board is connected electrically.

14. The circuit board assembly of claim 1, wherein the frame plate further comprises at least one of:

a first connecting line for connecting the first and second terminals,

a first longitudinal line, a first inner pad, and,

at least one first via hole, a plurality of first transverse lines arranged at intervals,

wherein the first connecting lines are arranged in parallel with respect to a first direction of the frame plate, the first connecting lines are connected to the first step surface, and the first inner side circuit board is electrically connected to the frame plate through the first connecting lines;

the first longitudinal lines are arranged in parallel relative to a first direction of the frame plate, the first inner side bonding pads are arranged on the first step surface and connected with the first longitudinal lines, the first inner side circuit board is electrically connected with the frame plate through the first inner side bonding pads and the first longitudinal lines, the first inner side bonding pads comprise functional bonding pads and non-functional bonding pads, and the non-functional bonding pads are arranged around the functional bonding pads in a surrounding mode;

wherein the first via holes are arranged in parallel with respect to a first direction of the frame plate, the first lateral lines are arranged perpendicularly with respect to the first direction of the frame plate, adjacent two of the first lateral lines are connected through the first via holes, the plurality of first lateral lines include lines arranged on the first step surface, and the first inner circuit board is electrically connected to the frame plate through the plurality of first lateral lines, the at least one first via hole;

the stepped bore further includes:

a third hole, and a second step surface connected between the second hole and the third hole, the second step surface being disposed perpendicularly with respect to the first direction of the frame plate, a projected area of the second hole on the first step surface being located within a projected area of the first hole on the first step surface, a projected area of the second hole on the second step surface being located within a projected area of the third hole on the second step surface;

the circuit board assembly further includes:

a second inner side circuit board provided on the second step surface and electrically connected to the frame plate;

a first outer circuit board disposed on a first horizontal surface of the frame plate and electrically connected to the frame plate, one end of the first hole being connected to the first horizontal surface;

a second outer circuit board disposed on a second horizontal plane of the frame plate and electrically connected to the frame plate, one end of the third hole being connected to the second horizontal plane;

a plurality of electronic components disposed on any one of the first inner circuit board, the second inner circuit board, the first outer circuit board, and the second outer circuit board.

15. An electronic device comprising a circuit board assembly according to any one of claims 1 to 14.

16. A method of processing a circuit board assembly, comprising:

pressing a plurality of connection lines into an insulating material such that the plurality of connection lines penetrate the insulating material, the connection lines being arranged in parallel with respect to a first direction of the circuit board assembly;

cutting off a portion of the insulating material, and cutting off a portion of the connection lines among the plurality of connection lines to obtain a frame plate having a stepped hole, the stepped hole including a first hole, a second hole, and a first stepped surface connected between the first hole and the second hole, the first stepped surface being disposed perpendicularly with respect to a first direction of the frame plate, the connection lines remaining after the cutting off being connected to the first stepped surface;

and welding a first inner side circuit board on the first step surface to obtain the circuit board assembly.

17. The machining method according to claim 16, wherein the stepped hole further includes a third hole and a second stepped surface connected between the second hole and the third hole, the second stepped surface being vertically disposed with respect to the first direction of the frame plate, the machining method further comprising:

and welding a second inner side circuit board on the second step surface.

18. The machining method according to claim 17, wherein a projected area of the second hole on the first step surface is located within a projected area of the first hole on the first step surface, and a projected area of the second hole on the second step surface is located within a projected area of the third hole on the second step surface.

19. The processing method according to any one of claims 16 to 18, wherein before said soldering the first inner circuit board on the first step face, the processing method further comprises:

arranging a first inner side bonding pad on the first step surface, wherein the first inner side bonding pad is connected with the connecting wire which is left after being cut off;

the soldering of the first inner side circuit board on the first step surface includes:

and welding the first inner side circuit board on the first step surface through a first inner side welding disc on the first step surface, wherein the first inner side welding disc comprises a functional welding disc and a non-functional welding disc.

20. The process of claim 19 wherein said nonfunctional pad is wrapped around said functional pad.

21. The process of claim 19 or 20, wherein the first inner pad comprises a ground pad.

22. The process of claim 21, wherein the ground pad is located on a side of the frame plate.

23. The machining method according to claim 17 or 18, further comprising:

soldering a first outer circuit board on a first horizontal plane of the frame plate, the first horizontal plane being vertically disposed with respect to the first direction;

soldering a second outer circuit board on a second horizontal plane of the frame plate, the second horizontal plane being vertically disposed with respect to the first direction; wherein the content of the first and second substances,

the first inner side circuit board and the first outer side circuit board are both application processor AP boards, the second inner side circuit board and the second outer side circuit board are both radio frequency RF boards, or,

the first inner side circuit board and the second outer side circuit board are both AP boards, and the first outer side circuit board and the second inner side circuit board are both RF boards.

24. The process of any one of claims 16 to 23, wherein the material of the connecting wire comprises at least one of: copper, aluminum, gold, silver, graphite.

25. A method of processing a circuit board assembly, comprising:

obtaining a first processing raw material, wherein the first processing raw material comprises a first insulating material and a first conducting layer, and the first conducting layer is positioned on one side of the first insulating material;

removing part of the first conductive layer to form a first longitudinal line;

obtaining a second processing raw material, and bonding the second processing raw material on the first longitudinal line, wherein the second processing raw material comprises a second insulating material and a second conducting layer, and the second insulating material is positioned between the first longitudinal line and the second conducting layer;

removing part of the second conductive layer to form a second longitudinal circuit;

cutting off a portion of the second insulating material and a portion of the second longitudinal wiring to obtain a frame plate having a stepped hole, the stepped hole including a first hole, a second hole, and a first stepped surface connected between the first hole and the second hole, the first stepped surface being disposed perpendicularly with respect to a first direction of the frame plate, the second longitudinal wiring remaining after the cutting off being connected to the first stepped surface;

and welding a first inner side circuit board on the first step surface to obtain the circuit board assembly.

26. The processing method according to claim 25, wherein the stepped hole further includes a third hole and a second stepped surface connected between the second hole and the third hole, the second stepped surface being vertically arranged with respect to the first direction of the frame plate, the second longitudinal line remaining after the cutting being connected to the second stepped surface, the processing method further comprising:

and welding a second inner side circuit board on the second step surface.

27. The machining method according to claim 26, wherein a projected area of the second hole on the first step surface is located within a projected area of the first hole on the first step surface, and a projected area of the second hole on the second step surface is located within a projected area of the third hole on the second step surface.

28. The processing method according to any one of claims 25 to 27, wherein before said soldering the first inner circuit board on the first step face, the processing method further comprises:

arranging a first inner side bonding pad on the first step surface, wherein the first inner side bonding pad is connected with the second longitudinal line;

the soldering of the first inner side circuit board on the first step surface includes:

and welding the first inner side circuit board on the first step surface through a first inner side welding disc on the first step surface, wherein the first inner side welding disc comprises a functional welding disc and a non-functional welding disc.

29. The process of claim 28 wherein said nonfunctional bonding pad is wrapped around said functional bonding pad.

30. The process of claim 28 or 29, wherein said first inner pad further comprises a ground pad.

31. The process of claim 30, wherein the ground pad is located on a side of the frame plate.

32. The machining method according to claim 26 or 27, further comprising:

soldering a first outer circuit board on a first horizontal plane of the frame plate, the first horizontal plane being vertically disposed with respect to the first direction;

soldering a second outer circuit board on a second horizontal plane of the frame plate, the second horizontal plane being vertically disposed with respect to the first direction; wherein the content of the first and second substances,

the first inner side circuit board and the first outer side circuit board are both application processor AP boards, the second inner side circuit board and the second outer side circuit board are both radio frequency RF boards, or,

the first inner side circuit board and the second outer side circuit board are both AP boards, and the first outer side circuit board and the second inner side circuit board are both RF boards.

33. A method of processing a circuit board assembly, comprising:

obtaining a first processing raw material, wherein the first processing raw material comprises a first insulating material, a first conducting layer and a second conducting layer, and the first conducting layer and the second conducting layer are respectively positioned on two sides of the first insulating material;

processing a plurality of via holes between the first conductive layer and the second conductive layer;

removing part of the first conductive layer and part of the second conductive layer to form a first circuit and a second circuit on two sides of the first insulating material respectively;

obtaining a second processing raw material, and bonding the second processing raw material on the first circuit, wherein the second processing raw material comprises a second insulating material and a third conducting layer, and the second insulating material is positioned between the first circuit and the third conducting layer;

processing a plurality of via holes between the first line and the third conductive layer;

removing part of the third conductive layer to form a third line on one side of the second insulating layer, which is far away from the first line;

cutting off a part of the second insulating material and a part of the third line to obtain a frame plate having a stepped hole, the stepped hole including a first hole, a second hole, and a first stepped surface connected between the first hole and the second hole, the first stepped surface being vertically arranged with respect to a first direction of the frame plate, the first line being located on a plane where the first stepped surface is located;

and welding a first inner side circuit board on the first step surface to obtain the circuit board assembly.

34. The method of machining as claimed in claim 33, further comprising:

obtaining a third processing raw material, and bonding the third processing raw material on the second circuit, wherein the third processing raw material comprises a third insulating material and a fourth conducting layer, and the third insulating material is positioned between the second circuit and the fourth conducting layer;

processing a plurality of via holes between the second line and the fourth conductive layer;

removing part of the fourth conductive layer to form a fourth circuit on the fourth conductive layer;

the cutting away a portion of the second insulating material and a portion of the third line includes:

cutting off a part of the second insulating material, a part of the third wire, a part of the third insulating material, and a part of the fourth wire, wherein the stepped hole further includes a third hole and a second stepped surface connected between the second hole and the third hole, the second stepped surface is disposed perpendicularly with respect to the first direction of the frame plate, and the second wire is located on a plane where the second stepped surface is located; the processing method further comprises the following steps:

and welding a second inner side circuit board on the second step surface.

35. The machining method according to claim 34, wherein a projected area of the second hole on the first step surface is located within a projected area of the first hole on the first step surface, and a projected area of the second hole on the second step surface is located within a projected area of the third hole on the second step surface.

36. The processing method according to any one of claims 33 to 35, wherein before said soldering the first inner circuit board on the first step face, the processing method further comprises:

arranging a first inner side bonding pad on the first step surface, wherein the first inner side bonding pad is connected with the first circuit;

the soldering of the first inner side circuit board on the first step surface includes:

and welding the first inner side circuit board on the first step surface through a first inner side welding disc on the first step surface, wherein the first inner side welding disc comprises a functional welding disc and a non-functional welding disc.

37. The process of claim 36 wherein said nonfunctional pad is wrapped around said functional pad.

38. The process of claim 36 or 37, wherein said first inner pad comprises a ground pad.

39. The process of claim 38, wherein the ground pad is located on a side of the frame plate.

40. The machining method according to claim 34 or 35, further comprising:

soldering a first outer circuit board on a first horizontal plane of the frame plate, the first horizontal plane being vertically disposed with respect to the first direction;

soldering a second outer circuit board on a second horizontal plane of the frame plate, the second horizontal plane being vertically disposed with respect to the first direction; wherein the content of the first and second substances,

the first inner side circuit board and the first outer side circuit board are both application processor AP boards, the second inner side circuit board and the second outer side circuit board are both radio frequency RF boards, or,

the first inner side circuit board and the second outer side circuit board are both AP boards, and the first outer side circuit board and the second inner side circuit board are both RF boards.

41. A method of processing an electronic device, comprising:

performing the method of processing a circuit board assembly of claims 16 to 40;

the resulting circuit board assembly is mounted within a housing of the electronic device.

Technical Field

The present disclosure relates to the field of electronic devices, and more particularly, to a circuit board assembly, an electronic device, and a method for manufacturing the circuit board assembly.

Background

The electronic device may include a circuit board assembly (PCBA) for holding an electronic component. The circuit board assembly may include a plurality of Printed Circuit Boards (PCBs). Each PCB may carry electronic components or other PCBs so that the PCBs may provide power to the electronic components. As electronic devices are required to implement more and more functions, more and more electronic components are arranged inside the electronic devices. Accordingly, the circuit board assembly occupies a larger and larger space within the electronic device. This is contrary to the trend of electronic devices to be thinner and lighter. Therefore, there is a need to optimize the structure of the circuit board assembly to reduce the occupied space of the circuit board assembly.

Disclosure of Invention

The application provides a circuit board assembly, electronic equipment and a processing method of the circuit board assembly, and aims to reduce the occupied space of the circuit board assembly in the electronic equipment.

In a first aspect, a circuit board assembly is provided, comprising: a frame plate including a stepped hole including a first hole, a second hole, and a first stepped surface connected between the first hole and the second hole, the first stepped surface being vertically disposed with respect to a first direction of the frame plate; and a first inner side circuit board disposed on the first step surface and electrically connected to the frame plate.

In the present application, the stepped bore may be a receiving cavity for receiving a circuit board and/or an electronic component.

In the present application, the cross-sectional shape of the first hole may be different from the cross-sectional shape of the second hole, or the cross-sectional size of the first hole may be different from the cross-sectional size of the second hole, wherein the cross-section of the hole is a cross-section perpendicular to the height of the hole.

In this application, the inner circuit board may be understood as a circuit board located inside the stepped hole.

In the application, the step surface on the frame plate can be used for placing the circuit board and the electronic element, so that more electronic elements can be accommodated in the step hole of the frame plate, the assembly compactness of the circuit board and the electronic element is improved, and the occupied space of a circuit board assembly is favorably reduced. Also, a relatively small circuit board assembly may provide space for other electronic components. In addition, a plurality of circuit boards are fixed on the frame plate, so that the circuit boards are not easy to misplace, and the overall strength of the circuit board assembly is improved.

With reference to the first aspect, in certain implementations of the first aspect, the stepped bore further includes: a third hole, and a second step surface connected between the second hole and the third hole, the second step surface being vertically disposed with respect to the first direction of the frame plate; the circuit board assembly further includes: and the second inner side circuit board is arranged on the second step surface and is electrically connected with the frame plate.

In the application, more step surfaces are arranged in the step holes, so that more electronic elements can be accommodated in the step holes, the assembly compactness of the circuit board and the electronic elements is improved, and the occupied space of a circuit board assembly is favorably reduced.

With reference to the first aspect, in certain implementations of the first aspect, a projected area of the second hole on the first step surface is located within a projected area of the first hole on the first step surface, and a projected area of the third hole on the second step surface is located within a projected area of the second hole on the second step surface; or a projected area of the second hole on the first step surface is located within a projected area of the first hole on the first step surface, and a projected area of the second hole on the second step surface is located within a projected area of the third hole on the second step surface; or, a projection area of the first hole on the first step surface is located within a projection area of the second hole on the first step surface, and a projection area of the third hole on the second step surface is located within a projection area of the second hole on the second step surface.

In the application, different structures of the stepped holes can realize different electric connection modes, and a relatively flexible wiring scheme is provided.

With reference to the first aspect, in certain implementations of the first aspect, the circuit board assembly further includes: a first outer circuit board disposed on a first horizontal plane of the frame plate, the first horizontal plane being disposed vertically with respect to the first direction; a second outer circuit board disposed on a second horizontal plane of the frame plate, the second horizontal plane being vertically disposed with respect to the first direction; the first inner side circuit board and the first outer side circuit board are both application processor AP boards, the second inner side circuit board and the second outer side circuit board are both radio frequency RF boards, or the first inner side circuit board and the second outer side circuit board are both AP boards, and the first outer side circuit board and the second inner side circuit board are both RF boards.

In the application, the circuit boards can have different functions, and the circuit boards with different functions can also have various electrical connection modes, so that a relatively flexible wiring scheme is provided.

With reference to the first aspect, in certain implementations of the first aspect, the first inner circuit board is disposed in parallel or perpendicular with respect to the first direction of the frame board.

In the present application, the circuit board is disposed on the frame plate in various ways, so that the circuit board assembly is relatively easily adaptable to various types of electronic devices or other components inside the electronic devices.

With reference to the first aspect, in certain implementations of the first aspect, the frame plate further includes: and the first connecting line is arranged in parallel relative to the first direction of the frame plate, the first connecting line is connected with the first step surface, and the first inner side circuit board is electrically connected with the frame plate through the first connecting line.

In one example, a connecting line may refer to a linear material used for connection (e.g., electrical connection).

In the present application, the electrical connection between the first inner side circuit board and the frame plate may be achieved by the first connection lines, and the first inner side circuit board may be further electrically connected to other circuit boards by the frame plate. The connecting wire can reflect the wiring mode in the frame plate more directly perceivedly, can install other circuit boards on the frame plate according to the position of connecting wire, is favorable to reducing the equipment degree of difficulty of circuit board subassembly.

With reference to the first aspect, in certain implementations of the first aspect, the material of the first connection line includes at least one of: copper, aluminum, gold, silver, graphite.

In the application, different electrical connection effects can be realized due to different materials of the first connecting wires, and a relatively flexible wiring scheme is provided.

With reference to the first aspect, in certain implementations of the first aspect, the frame plate further includes: a first longitudinal line disposed in parallel with respect to a first direction of the frame plate; and the first inner side bonding pad is arranged on the first step surface and is connected with the first longitudinal circuit, and the first inner side circuit board is electrically connected with the frame plate through the first inner side bonding pad and the first longitudinal circuit.

In this application, "longitudinal" may be understood as a first direction of the circuit board. The longitudinal lines may be arranged in a first direction (approximately) parallel to the circuit board.

In the present application, the inside land may be understood as a land located inside the stepped hole of the frame plate. In the present application, the outer-side pad may be understood as a pad located outside the stepped hole of the frame plate.

In the application, the first inner side circuit board and the frame plate can be electrically connected through the first inner side bonding pad and the first longitudinal line, and then the first inner side circuit board can be electrically connected with other circuit boards through the frame plate. Because the occupation space of the longitudinal circuit in the frame plate is relatively small, a plurality of longitudinal circuits can be arranged in the frame plate, and the relatively complex electric connection mode is favorably realized.

With reference to the first aspect, in certain implementations of the first aspect, the first inboard pad includes a functional pad and a non-functional pad.

In the application, the type and the function of the bonding pad are different, and different electric connection effects can be realized.

With reference to the first aspect, in certain implementations of the first aspect, the non-functional pad surrounds the functional pad.

In the present application, the position of the non-functional pad is appropriately set, which is advantageous for achieving a relatively stable mechanical fixing effect.

With reference to the first aspect, in certain implementations of the first aspect, the first inner side pad includes a ground pad.

In the application, the type and the function of the bonding pad are different, and different electric connection effects can be realized.

With reference to the first aspect, in certain implementations of the first aspect, the ground pad is located at a side of the frame plate.

In the present application, the position of the ground pad is appropriately set, which is advantageous for achieving a relatively effective signal shielding effect.

With reference to the first aspect, in certain implementations of the first aspect, the frame plate further includes: at least one first via hole provided in parallel with respect to a first direction of the frame plate; a plurality of first horizontal lines that the interval set up, first horizontal line for the first direction of frame board sets up perpendicularly, and adjacent two first horizontal line passes through first via hole links to each other, a plurality of first horizontal lines are including setting up circuit on the first step face, first inboard circuit board passes through a plurality of first horizontal lines, at least one first via hole with the frame board is connected electrically.

In the present application, "lateral" may be understood as a direction parallel to the horizontal plane of the circuit board (i.e. perpendicular to the first direction of the circuit board). Thus, the transverse wires are arranged in a direction (approximately) parallel to the horizontal plane of the circuit board.

In the present application, the electrical connection between the first inner side circuit board and the frame plate may be achieved through the first transverse wiring and the first via hole, and the first inner side circuit board may be electrically connected with other circuit boards through the frame plate. The internal structure of the frame plate is similar to that of a common circuit board, and therefore circuits in the frame plate can be conveniently distributed.

With reference to the first aspect, in certain implementations of the first aspect, the frame plate further includes at least one of: the first inner side circuit board is electrically connected with the frame plate through the first connecting line; the first longitudinal lines are arranged in parallel relative to a first direction of the frame plate, the first inner side bonding pads are arranged on the first step surface and connected with the first longitudinal lines, the first inner side circuit board is electrically connected with the frame plate through the first inner side bonding pads and the first longitudinal lines, the first inner side bonding pads comprise functional bonding pads and non-functional bonding pads, and the non-functional bonding pads are arranged around the functional bonding pads in a surrounding mode; wherein the first via holes are arranged in parallel with respect to a first direction of the frame plate, the first lateral lines are arranged perpendicularly with respect to the first direction of the frame plate, adjacent two of the first lateral lines are connected through the first via holes, the plurality of first lateral lines include lines arranged on the first step surface, and the first inner circuit board is electrically connected to the frame plate through the plurality of first lateral lines, the at least one first via hole; the stepped bore further includes: a third hole, and a second step surface connected between the second hole and the third hole, the second step surface being disposed perpendicularly with respect to the first direction of the frame plate, a projected area of the second hole on the first step surface being located within a projected area of the first hole on the first step surface, a projected area of the second hole on the second step surface being located within a projected area of the third hole on the second step surface; the circuit board assembly further includes: a second inner side circuit board provided on the second step surface and electrically connected to the frame plate; a first outer circuit board disposed on a first horizontal surface of the frame plate and electrically connected to the frame plate, one end of the first hole being connected to the first horizontal surface; a second outer circuit board disposed on a second horizontal plane of the frame plate and electrically connected to the frame plate, one end of the third hole being connected to the second horizontal plane; a plurality of electronic components disposed on any one of the first inner circuit board, the second inner circuit board, the first outer circuit board, and the second outer circuit board.

In the present application, the structure of the frame plate is arranged reasonably, so that the circuit board assembly can accommodate relatively more electronic components more easily. The circuit board assembly is easier to have a relatively small volume with a certain number of electronic components. A relatively small circuit board assembly may provide space for other electronic components. In one example, the volume of a circuit board assembly in the camera module is reduced, which is beneficial to increasing the zoom distance of a lens in the camera, and further can be beneficial to improving the shooting effect of the camera module; in addition, the installation of electronic components in the camera is facilitated.

In a second aspect, a circuit board assembly is provided, comprising: the first circuit board comprises a first step part, the first step part comprises a fifth step surface and a sixth step surface, the fifth step surface and the sixth step surface are positioned on the same side of the first circuit board, the fifth step surface and the sixth step surface are both vertically arranged relative to the first direction of the first circuit board, and the fifth step surface and the sixth step surface are arranged at intervals; the second circuit board is arranged on the fifth step surface and is electrically connected with the first circuit board; and the third circuit board is arranged on the sixth step surface and is electrically connected with the first circuit board.

In this application, through set up step portion on first circuit board, can the height of local attenuate first circuit board, under the prerequisite that reduces the material of first circuit board limitedly, can reduce the occupation space of circuit board components, promote circuit board, electronic component's equipment compactness. Thus, the circuit board assembly provided by the present application can be more easily adapted to a specially shaped device housing. Also, a relatively small circuit board assembly may provide space for other electronic components. In addition, a plurality of circuit boards are fixed on first circuit board for be difficult to take place the dislocation relatively between these a plurality of circuit boards, be favorable to promoting circuit board assembly's bulk strength.

With reference to the second aspect, in certain implementations of the second aspect, the first circuit board further includes: a second stepped portion, wherein the second stepped portion includes a seventh stepped surface and an eighth stepped surface, the seventh stepped surface and the eighth stepped surface are located on the same side of the first circuit board, the fifth stepped surface and the seventh stepped surface are respectively located on two sides of the first circuit board, the seventh stepped surface and the eighth stepped surface are both vertically arranged with respect to the first direction of the first circuit board, the seventh stepped surface and the eighth stepped surface are arranged at an interval, the fifth stepped surface and the seventh stepped surface are arranged oppositely, and the sixth stepped surface and the eighth stepped surface are arranged oppositely; the fourth circuit board is arranged on the seventh step surface and is electrically connected with the first circuit board; and the fifth circuit board is arranged on the eighth step surface and is electrically connected with the first circuit board.

In this application, through set up the step face that the quantity is more on first circuit board, consequently can hold more electronic component on the first circuit board, promoted circuit board, electronic component's equipment compactness, be favorable to reducing circuit board subassembly's occupation of space.

With reference to the second aspect, in some implementation manners of the second aspect, a plane where the sixth step surface is located and a plane where the eighth step surface is located are both located between the fifth step surface and the seventh step surface.

With reference to the second aspect, in certain implementation manners of the second aspect, the first circuit board further includes a third step portion and a fourth step portion, the third step portion includes a fifth step surface and a ninth step surface, the fourth step portion includes a seventh step portion and a tenth step portion, the fifth step surface and the ninth step surface are located on the same side of the first circuit board, the seventh step portion and the tenth step surface are located on the same side of the first circuit board, the ninth step surface and the tenth step surface are both vertically arranged with respect to the first direction of the first circuit board, the ninth step portion and the tenth step portion are arranged oppositely, a plane where the fifth step portion is located and a plane where the seventh step portion is located are both located between the sixth step surface and the eighth step surface, and a plane where the fifth step portion is located, The planes of the seventh step parts are located between the ninth step surface and the tenth step surface; or the plane where the sixth step surface is located and the plane where the eighth step surface is located are both located between the fifth step surface and the seventh step surface, and the plane where the ninth step surface is located and the plane where the tenth step surface is located are both located between the fifth step surface and the seventh step surface.

In the application, the structures and combination forms of the plurality of step parts are different, so that different electric connection modes can be realized, and the method is beneficial to providing a relatively flexible wiring scheme.

With reference to the second aspect, in certain implementations of the second aspect, the second circuit board is an AP board or an RF board.

In the application, the circuit boards can have different functions, and the circuit boards with different functions can also have various electrical connection modes, so that a relatively flexible wiring scheme is provided.

With reference to the second aspect, in certain implementations of the second aspect, the first circuit board is a frame board, and the frame board includes a receiving cavity for receiving an electronic component, and the receiving cavity is located on one side of the first stepped portion.

In the present application, since the frame plate includes the accommodating cavity for accommodating the electronic component, the first step portion is provided on the frame plate, the frame plates of various structural types can be obtained, and the occupied space of the circuit board assembly can be more flexibly reduced or optimized.

With reference to the second aspect, in certain implementations of the second aspect, the second circuit board is disposed parallel or perpendicular to the first direction of the frame plate, and the third circuit board is disposed parallel or perpendicular to the first direction of the frame plate.

In the present application, the circuit board is disposed on the first circuit board in a variety of ways, making the circuit board assembly relatively more easily adaptable to a variety of types of electronic devices or other components inside the electronic device.

With reference to the second aspect, in certain implementations of the second aspect, the first circuit board further includes: and the fourth connecting line is arranged in parallel relative to the first direction of the first circuit board, is connected with the fifth step surface, and is electrically connected with the first circuit board through the fourth connecting line.

In the present application, the second circuit board may be electrically connected to the first circuit board through the fourth connection line, and the second circuit board may be electrically connected to another circuit board (e.g., a third circuit board) through the first circuit board. The connecting wire can reflect the wiring mode in the first circuit board more intuitively, and other circuit boards can be installed on the first circuit board according to the position of the connecting wire, so that the assembly difficulty of the circuit board assembly is reduced.

With reference to the second aspect, in certain implementations of the second aspect, the material of the fourth connecting line includes at least one of: copper, aluminum, gold, silver, graphite.

In the application, different electrical connection effects can be realized due to different materials of the first connecting wires, and a relatively flexible wiring scheme is provided.

With reference to the second aspect, in certain implementations of the second aspect, the first circuit board further includes: a fourth longitudinal line disposed in parallel with respect to the first direction of the first circuit board; and the second circuit board is electrically connected with the first circuit board through the first bonding pad and the fourth longitudinal line.

In this application, "longitudinal" may be understood as a first direction of the circuit board. The longitudinal lines may be arranged in a first direction (approximately) parallel to the circuit board.

In the present application, the inside land may be understood as a land located inside the stepped hole of the frame plate. In the present application, the outer-side pad may be understood as a pad located outside the stepped hole of the frame plate.

In the present application, the second circuit board may be electrically connected to the first circuit board through the first pad and the fourth longitudinal line, and then the second circuit board may be electrically connected to another circuit board (e.g., a third circuit board) through the first circuit board. Because the occupation space of the longitudinal lines in the first circuit board is relatively small, a plurality of longitudinal lines can be arranged in the first circuit board, and the relatively complex electric connection mode is favorably realized.

With reference to the second aspect, in certain implementations of the second aspect, the first pads include functional pads and non-functional pads.

In the application, the type and the function of the bonding pad are different, and different electric connection effects can be realized.

With reference to the second aspect, in certain implementations of the second aspect, the non-functional pad surrounds the functional pad.

In the present application, the position of the non-functional pad is appropriately set, which is advantageous for achieving a relatively stable mechanical fixing effect.

With reference to the second aspect, in certain implementations of the second aspect, the first pad includes a ground pad.

In the application, the type and the function of the bonding pad are different, and different electric connection effects can be realized.

With reference to the second aspect, in certain implementations of the second aspect, the ground pad is located on a side of the first circuit board.

In the present application, the position of the ground pad is appropriately set, which is advantageous for achieving a relatively effective signal shielding effect.

With reference to the second aspect, in certain implementations of the second aspect, the first circuit board further includes: at least one fourth via hole disposed in parallel with respect to a first direction of the first circuit board; the second circuit board is electrically connected with the first circuit board through the plurality of fourth transverse lines and the at least one fourth through hole.

In the present application, "lateral" may be understood as a direction parallel to the horizontal plane of the circuit board (i.e. perpendicular to the first direction of the circuit board). Thus, the transverse wires are arranged in a direction (approximately) parallel to the horizontal plane of the circuit board.

In the present application, the second circuit board may be electrically connected to the first circuit board through the fourth transverse line and the fourth via hole, and the second circuit board may be electrically connected to another circuit board (e.g., a third circuit board) through the first circuit board. The internal structure of the first circuit board is similar to that of a common circuit board, and therefore the circuit in the first circuit board can be conveniently distributed.

In a third aspect, an electronic device is provided, including a circuit board assembly and a housing, the circuit board assembly being disposed within the housing, the circuit board assembly including: a frame plate including a stepped hole including a first hole, a second hole, and a first stepped surface connected between the first hole and the second hole, the first stepped surface being vertically disposed with respect to a first direction of the frame plate; and a first inner side circuit board disposed on the first step surface and electrically connected to the frame plate.

With reference to the third aspect, in certain implementations of the third aspect, the stepped bore further includes: a third hole, and a second step surface connected between the second hole and the third hole, the second step surface being vertically disposed with respect to the first direction of the frame plate; the circuit board assembly further includes: and the second inner side circuit board is arranged on the second step surface and is electrically connected with the frame plate.

With reference to the third aspect, in certain implementations of the third aspect, a projected area of the second hole on the first step surface is located within a projected area of the first hole on the first step surface, and a projected area of the third hole on the second step surface is located within a projected area of the second hole on the second step surface; or a projected area of the second hole on the first step surface is located within a projected area of the first hole on the first step surface, and a projected area of the second hole on the second step surface is located within a projected area of the third hole on the second step surface; or, a projection area of the first hole on the first step surface is located within a projection area of the second hole on the first step surface, and a projection area of the third hole on the second step surface is located within a projection area of the second hole on the second step surface.

With reference to the third aspect, in certain implementations of the third aspect, the circuit board assembly further includes: a first outer circuit board disposed on a first horizontal plane of the frame plate, the first horizontal plane being disposed vertically with respect to the first direction; a second outer circuit board disposed on a second horizontal plane of the frame plate, the second horizontal plane being vertically disposed with respect to the first direction; the first inner side circuit board and the first outer side circuit board are both application processor AP boards, the second inner side circuit board and the second outer side circuit board are both radio frequency RF boards, or the first inner side circuit board and the second outer side circuit board are both AP boards, and the first outer side circuit board and the second inner side circuit board are both RF boards.

With reference to the third aspect, in certain implementations of the third aspect, the first inner circuit board is disposed parallel or perpendicular to the first direction of the frame plate.

With reference to the third aspect, in certain implementations of the third aspect, the frame plate further includes: and the first connecting line is arranged in parallel relative to the first direction of the frame plate, the first connecting line is connected with the first step surface, and the first inner side circuit board is electrically connected with the frame plate through the first connecting line.

With reference to the third aspect, in certain implementations of the third aspect, the material of the first connection line includes at least one of: copper, aluminum, gold, silver, graphite.

With reference to the third aspect, in certain implementations of the third aspect, the frame plate further includes: a first longitudinal line disposed in parallel with respect to a first direction of the frame plate; and the first inner side bonding pad is arranged on the first step surface and is connected with the first longitudinal circuit, and the first inner side circuit board is electrically connected with the frame plate through the first inner side bonding pad and the first longitudinal circuit.

With reference to the third aspect, in certain implementations of the third aspect, the first inner side pad includes a functional pad and a non-functional pad.

With reference to the third aspect, in certain implementations of the third aspect, the non-functional pad surrounds the functional pad.

With reference to the third aspect, in certain implementations of the third aspect, the first inner pad includes a ground pad.

With reference to the third aspect, in certain implementations of the third aspect, the ground pad is located on a side of the frame plate.

With reference to the third aspect, in certain implementations of the third aspect, the frame plate further includes: at least one first via hole provided in parallel with respect to a first direction of the frame plate; a plurality of first horizontal lines that the interval set up, first horizontal line for the first direction of frame board sets up perpendicularly, and adjacent two first horizontal line passes through first via hole links to each other, a plurality of first horizontal lines are including setting up circuit on the first step face, first inboard circuit board passes through a plurality of first horizontal lines, at least one first via hole with the frame board is connected electrically.

With reference to the third aspect, in certain implementations of the third aspect, the frame plate further includes at least one of: the first inner side circuit board is electrically connected with the frame plate through the first connecting line; the first longitudinal lines are arranged in parallel relative to a first direction of the frame plate, the first inner side bonding pads are arranged on the first step surface and connected with the first longitudinal lines, the first inner side circuit board is electrically connected with the frame plate through the first inner side bonding pads and the first longitudinal lines, the first inner side bonding pads comprise functional bonding pads and non-functional bonding pads, and the non-functional bonding pads are arranged around the functional bonding pads in a surrounding mode; wherein the first via holes are arranged in parallel with respect to a first direction of the frame plate, the first lateral lines are arranged perpendicularly with respect to the first direction of the frame plate, adjacent two of the first lateral lines are connected through the first via holes, the plurality of first lateral lines include lines arranged on the first step surface, and the first inner circuit board is electrically connected to the frame plate through the plurality of first lateral lines, the at least one first via hole; the stepped bore further includes: a third hole, and a second step surface connected between the second hole and the third hole, the second step surface being disposed perpendicularly with respect to the first direction of the frame plate, a projected area of the second hole on the first step surface being located within a projected area of the first hole on the first step surface, a projected area of the second hole on the second step surface being located within a projected area of the third hole on the second step surface; the circuit board assembly further includes: a second inner side circuit board provided on the second step surface and electrically connected to the frame plate; a first outer circuit board disposed on a first horizontal surface of the frame plate and electrically connected to the frame plate, one end of the first hole being connected to the first horizontal surface; a second outer circuit board disposed on a second horizontal plane of the frame plate and electrically connected to the frame plate, one end of the third hole being connected to the second horizontal plane; a plurality of electronic components disposed on any one of the first inner circuit board, the second inner circuit board, the first outer circuit board, and the second outer circuit board.

In a fourth aspect, an electronic device is provided, comprising a circuit board assembly and a housing, the circuit board assembly being disposed within the housing, the circuit board assembly comprising: the first circuit board comprises a first step part, the first step part comprises a fifth step surface and a sixth step surface, the fifth step surface and the sixth step surface are positioned on the same side of the first circuit board, the fifth step surface and the sixth step surface are both vertically arranged relative to the first direction of the first circuit board, and the fifth step surface and the sixth step surface are arranged at intervals; the second circuit board is arranged on the fifth step surface and is electrically connected with the first circuit board; and the third circuit board is arranged on the sixth step surface and is electrically connected with the first circuit board.

With reference to the fourth aspect, in some implementations of the fourth aspect, the first circuit board further includes: a second stepped portion, wherein the second stepped portion includes a seventh stepped surface and an eighth stepped surface, the seventh stepped surface and the eighth stepped surface are located on the same side of the first circuit board, the fifth stepped surface and the seventh stepped surface are respectively located on two sides of the first circuit board, the seventh stepped surface and the eighth stepped surface are both vertically arranged with respect to the first direction of the first circuit board, the seventh stepped surface and the eighth stepped surface are arranged at an interval, the fifth stepped surface and the seventh stepped surface are arranged oppositely, and the sixth stepped surface and the eighth stepped surface are arranged oppositely; the fourth circuit board is arranged on the seventh step surface and is electrically connected with the first circuit board; and the fifth circuit board is arranged on the eighth step surface and is electrically connected with the first circuit board.

With reference to the fourth aspect, in some implementation manners of the fourth aspect, a plane where the sixth step surface is located and a plane where the eighth step surface is located are both located between the fifth step surface and the seventh step surface.

With reference to the fourth aspect, in some implementation manners of the fourth aspect, the first circuit board further includes a third step portion and a fourth step portion, the third step portion includes a fifth step surface and a ninth step surface, the fourth step portion includes a seventh step portion and a tenth step portion, the fifth step surface and the ninth step surface are located on the same side of the first circuit board, the seventh step portion and the tenth step surface are located on the same side of the first circuit board, the ninth step surface and the tenth step surface are both vertically arranged with respect to the first direction of the first circuit board, the ninth step portion and the tenth step portion are arranged oppositely, a plane where the fifth step portion is located and a plane where the seventh step portion is located are both located between the sixth step surface and the eighth step surface, and a plane where the fifth step portion is located, The planes of the seventh step parts are located between the ninth step surface and the tenth step surface; or the plane where the sixth step surface is located and the plane where the eighth step surface is located are both located between the fifth step surface and the seventh step surface, and the plane where the ninth step surface is located and the plane where the tenth step surface is located are both located between the fifth step surface and the seventh step surface.

With reference to the fourth aspect, in certain implementations of the fourth aspect, the second circuit board is an AP board or an RF board.

With reference to the fourth aspect, in some implementations of the fourth aspect, the first circuit board is a frame board, and the frame board includes a receiving cavity for receiving an electronic component, and the receiving cavity is located at one side of the first stepped portion.

With reference to the fourth aspect, in certain implementations of the fourth aspect, the second circuit board is disposed parallel or perpendicular to the first direction of the frame plate, and the third circuit board is disposed parallel or perpendicular to the first direction of the frame plate.

With reference to the fourth aspect, in some implementations of the fourth aspect, the first circuit board further includes: and the fourth connecting line is arranged in parallel relative to the first direction of the first circuit board, is connected with the fifth step surface, and is electrically connected with the first circuit board through the fourth connecting line.

With reference to the fourth aspect, in certain implementations of the fourth aspect, the material of the fourth connecting line includes at least one of: copper, aluminum, gold, silver, graphite.

With reference to the fourth aspect, in some implementations of the fourth aspect, the first circuit board further includes: a fourth longitudinal line disposed in parallel with respect to the first direction of the first circuit board; and the second circuit board is electrically connected with the first circuit board through the first bonding pad and the fourth longitudinal line.

With reference to the fourth aspect, in certain implementations of the fourth aspect, the first pads include functional pads and non-functional pads.

With reference to the fourth aspect, in certain implementations of the fourth aspect, the non-functional pad surrounds the functional pad.

With reference to the fourth aspect, in certain implementations of the fourth aspect, the first pad includes a ground pad.

With reference to the fourth aspect, in certain implementations of the fourth aspect, the ground pad is located on a side of the first circuit board.

With reference to the fourth aspect, in some implementations of the fourth aspect, the first circuit board further includes: at least one fourth via hole disposed in parallel with respect to a first direction of the first circuit board; the second circuit board is electrically connected with the first circuit board through the plurality of fourth transverse lines and the at least one fourth through hole.

In a fifth aspect, a method for processing a circuit board assembly is provided, which includes: pressing a plurality of connection lines into an insulating material such that the plurality of connection lines penetrate the insulating material, the connection lines being arranged in parallel with respect to a first direction of the circuit board assembly; cutting off a portion of the insulating material and cutting off a portion of the connection lines among the plurality of connection lines to obtain a frame plate having a stepped hole including a first hole, a second hole, and a first stepped surface connected between the first hole and the second hole, the first stepped surface being disposed perpendicularly with respect to a first direction of the frame plate, the connection lines remaining after the cutting off being connected to the first stepped surface; and welding a first inner side circuit board on the first step surface to obtain the circuit board assembly.

In the application, the step surface on the frame plate can be used for placing the circuit board and the electronic element, so that more electronic elements can be accommodated in the step hole of the frame plate, the assembly compactness of the circuit board and the electronic element is improved, and the occupied space of a circuit board assembly is favorably reduced. The connecting wire can reflect the wiring mode in the frame plate more directly perceivedly, can be based on the position of connecting wire and install first inboard circuit board on the frame plate, is favorable to reducing the equipment degree of difficulty of circuit board assembly.

With reference to the fifth aspect, in certain implementations of the fifth aspect, the stepped hole further includes a third hole and a second stepped surface connected between the second hole and the third hole, the second stepped surface being vertically disposed with respect to the first direction of the frame plate, and the processing method further includes: and welding a second inner side circuit board on the second step surface.

In the application, more step surfaces are arranged in the step holes, so that more electronic elements can be accommodated in the step holes, the assembly compactness of the circuit board and the electronic elements is improved, and the occupied space of a circuit board assembly is favorably reduced.

With reference to the fifth aspect, in certain implementations of the fifth aspect, a projected area of the second hole on the first step surface is located within a projected area of the first hole on the first step surface, and a projected area of the second hole on the second step surface is located within a projected area of the third hole on the second step surface.

In the application, different structures of the stepped holes can realize different electric connection modes, and a relatively flexible wiring scheme is provided.

With reference to the fifth aspect, in certain implementations of the fifth aspect, before the soldering the first inner circuit board on the first step surface, the processing method further includes: arranging a first inner side bonding pad on the first step surface, wherein the first inner side bonding pad is connected with the connecting wire which is left after being cut off; the soldering of the first inner side circuit board on the first step surface includes: and welding the first inner side circuit board on the first step surface through a first inner side welding disc on the first step surface, wherein the first inner side welding disc comprises a functional welding disc and a non-functional welding disc.

In the application, the type and the function of the bonding pad are different, and different electric connection effects can be realized.

With reference to the fifth aspect, in certain implementations of the fifth aspect, the non-functional pad surrounds the functional pad.

In the present application, the position of the non-functional pad is appropriately set, which is advantageous for achieving a relatively stable mechanical fixing effect.

With reference to the fifth aspect, in certain implementations of the fifth aspect, the first inner pad includes a ground pad.

In the application, the type and the function of the bonding pad are different, and different electric connection effects can be realized.

With reference to the fifth aspect, in certain implementations of the fifth aspect, the ground pad is located at a side of the frame plate.

In the present application, the position of the ground pad is appropriately set, which is advantageous for achieving a relatively effective signal shielding effect.

With reference to the fifth aspect, in certain implementations of the fifth aspect, the processing method further includes: soldering a first outer circuit board on a first horizontal plane of the frame plate, the first horizontal plane being vertically disposed with respect to the first direction; soldering a second outer circuit board on a second horizontal plane of the frame plate, the second horizontal plane being vertically disposed with respect to the first direction; the first inner side circuit board and the first outer side circuit board are both application processor AP boards, the second inner side circuit board and the second outer side circuit board are both radio frequency RF boards, or the first inner side circuit board and the second outer side circuit board are both AP boards, and the first outer side circuit board and the second inner side circuit board are both RF boards.

In the application, the circuit boards can have different functions, and the circuit boards with different functions can also have various electrical connection modes, so that a relatively flexible wiring scheme is provided.

With reference to the fifth aspect, in certain implementations of the fifth aspect, the material of the connecting line includes at least one of: copper, aluminum, gold, silver, graphite.

In the application, different electrical connection effects can be realized due to different materials of the first connecting wires, and a relatively flexible wiring scheme is provided.

In a sixth aspect, a method for processing a circuit board assembly is provided, which includes: pressing a plurality of connecting wires into an insulating material so that the plurality of connecting wires penetrate through the insulating material; cutting off part of the insulating material, and cutting off part of the connecting wires in the connecting wires to obtain a first circuit board with a first step part, wherein the first step part comprises a fifth step surface and a sixth step surface, the fifth step surface and the sixth step surface are positioned on the same side of the first circuit board, the fifth step surface and the sixth step surface are both vertically arranged relative to a first direction of the first circuit board, the fifth step surface and the sixth step surface are arranged at intervals, and the connecting wires are arranged in parallel relative to the first direction; and welding a second circuit board on the fifth step surface, and welding a third circuit board on the sixth step surface to obtain the circuit board assembly.

In this application, through set up step portion on first circuit board, can the height of local attenuate first circuit board, under the prerequisite that reduces the material of first circuit board limitedly, can reduce the occupation space of circuit board components, promote circuit board, electronic component's equipment compactness. The connecting wire can reflect the wiring mode in the first circuit board more directly perceivedly, can install other circuit boards on the first circuit board according to the position of connecting wire, is favorable to reducing the equipment degree of difficulty of circuit board assembly.

With reference to the sixth aspect, in certain implementations of the sixth aspect, before the soldering the second circuit board on the fifth step surface, the processing method further includes: arranging a first bonding pad on the fifth step surface, wherein the first bonding pad is connected with the connecting wire which is left after being cut off; the soldering of the second circuit board on the fifth step surface includes: and welding the second circuit board on the fifth step surface through a first welding disc on the fifth step surface, wherein the first welding disc comprises a functional welding disc and a non-functional welding disc.

In the application, the type and the function of the bonding pad are different, and different electric connection effects can be realized.

With reference to the sixth aspect, in certain implementations of the sixth aspect, the non-functional pad surrounds the functional pad.

In the present application, the position of the non-functional pad is appropriately set, which is advantageous for achieving a relatively stable mechanical fixing effect.

With reference to the sixth aspect, in certain implementations of the sixth aspect, the first pad further includes a ground pad.

In the application, the type and the function of the bonding pad are different, and different electric connection effects can be realized.

With reference to the sixth aspect, in certain implementations of the sixth aspect, the ground pad is located on a side of the first circuit board.

In the present application, the position of the ground pad is appropriately set, which is advantageous for achieving a relatively effective signal shielding effect.

With reference to the sixth aspect, in certain implementations of the sixth aspect, the second circuit board is an AP board or an RF board.

In the application, the circuit boards can have different functions, and the circuit boards with different functions can also have various electrical connection modes, so that a relatively flexible wiring scheme is provided.

With reference to the sixth aspect, in certain implementations of the sixth aspect, the material of the connection line includes at least one of: copper, aluminum, gold, silver, graphite.

In the application, different electrical connection effects can be realized due to different materials of the first connecting wires, and a relatively flexible wiring scheme is provided.

In a seventh aspect, a method for processing a circuit board assembly is provided, including: obtaining a first processing raw material, wherein the first processing raw material comprises a first insulating material and a first conducting layer, and the first conducting layer is positioned on one side of the first insulating material; removing part of the first conductive layer to form a first longitudinal line; obtaining a second processing raw material, and bonding the second processing raw material on the first longitudinal line, wherein the second processing raw material comprises a second insulating material and a second conducting layer, and the second insulating material is positioned between the first longitudinal line and the second conducting layer; removing part of the second conductive layer to form a second longitudinal circuit; cutting off a portion of the second insulating material and a portion of the second longitudinal wiring to obtain a frame plate having a stepped hole, the stepped hole including a first hole, a second hole, and a first stepped surface connected between the first hole and the second hole, the first stepped surface being disposed perpendicularly with respect to a first direction of the frame plate, the second longitudinal wiring remaining after the cutting off being connected to the first stepped surface; and welding a first inner side circuit board on the first step surface to obtain the circuit board assembly.

In the application, the step surface on the frame plate can be used for placing the circuit board and the electronic element, so that more electronic elements can be accommodated in the step hole of the frame plate, the assembly compactness of the circuit board and the electronic element is improved, and the occupied space of a circuit board assembly is favorably reduced. Because the occupation space of the longitudinal lines in the frame plate is relatively small, a plurality of longitudinal lines can be arranged in the frame plate, and the relatively complex electric connection mode is favorably realized.

With reference to the seventh aspect, in certain implementations of the seventh aspect, the stepped hole further includes a third hole and a second stepped surface connected between the second hole and the third hole, the second stepped surface is vertically disposed with respect to the first direction of the frame plate, and the second longitudinal line remaining after the cutting is connected to the second stepped surface, and the processing method further includes: and welding a second inner side circuit board on the second step surface.

In the application, more step surfaces are arranged in the step holes, so that more electronic elements can be accommodated in the step holes, the assembly compactness of the circuit board and the electronic elements is improved, and the occupied space of a circuit board assembly is favorably reduced.

With reference to the seventh aspect, in certain implementations of the seventh aspect, a projected area of the second hole on the first step surface is located within a projected area of the first hole on the first step surface, and a projected area of the second hole on the second step surface is located within a projected area of the third hole on the second step surface.

In the application, different structures of the stepped holes can realize different electric connection modes, and a relatively flexible wiring scheme is provided.

With reference to the seventh aspect, in certain implementations of the seventh aspect, before the soldering the first inner circuit board on the first step surface, the processing method further includes: arranging a first inner side bonding pad on the first step surface, wherein the first inner side bonding pad is connected with the second longitudinal line; the soldering of the first inner side circuit board on the first step surface includes: and welding the first inner side circuit board on the first step surface through a first inner side welding disc on the first step surface, wherein the first inner side welding disc comprises a functional welding disc and a non-functional welding disc.

In the application, the type and the function of the bonding pad are different, and different electric connection effects can be realized.

With reference to the seventh aspect, in certain implementations of the seventh aspect, the non-functional pad surrounds the functional pad.

In the present application, the position of the non-functional pad is appropriately set, which is advantageous for achieving a relatively stable mechanical fixing effect.

With reference to the seventh aspect, in certain implementations of the seventh aspect, the first inner pad further includes a ground pad.

In the application, the type and the function of the bonding pad are different, and different electric connection effects can be realized.

With reference to the seventh aspect, in certain implementations of the seventh aspect, the ground pad is located at a side of the frame plate.

In the present application, the position of the ground pad is appropriately set, which is advantageous for achieving a relatively effective signal shielding effect.

With reference to the seventh aspect, in certain implementations of the seventh aspect, the processing method further includes: soldering a first outer circuit board on a first horizontal plane of the frame plate, the first horizontal plane being vertically disposed with respect to the first direction; soldering a second outer circuit board on a second horizontal plane of the frame plate, the second horizontal plane being vertically disposed with respect to the first direction; the first inner side circuit board and the first outer side circuit board are both application processor AP boards, the second inner side circuit board and the second outer side circuit board are both radio frequency RF boards, or the first inner side circuit board and the second outer side circuit board are both AP boards, and the first outer side circuit board and the second inner side circuit board are both RF boards.

In the application, the circuit boards can have different functions, and the circuit boards with different functions can also have various electrical connection modes, so that a relatively flexible wiring scheme is provided.

In an eighth aspect, a method for processing a circuit board assembly is provided, which includes: obtaining a first processing raw material, wherein the first processing raw material comprises a first insulating material and a first conducting layer, and the first conducting layer is positioned on one side of the first insulating material; removing part of the first conductive layer to form a first longitudinal line; obtaining a second processing raw material, and bonding the second processing raw material on the first longitudinal line, wherein the second processing raw material comprises a second insulating material and a second conducting layer, and the second insulating material is positioned between the first longitudinal line and the second conducting layer; removing part of the second conductive layer to form a second longitudinal circuit; cutting off part of the second insulating material and part of the second longitudinal line to obtain a first circuit board with a first step part, wherein the first step part comprises a fifth step surface and a sixth step surface, the fifth step surface and the sixth step surface are positioned on the same side of the first circuit board, the fifth step surface and the sixth step surface are both vertically arranged relative to the first direction of the first circuit board, the fifth step surface and the sixth step surface are arranged at intervals, the first longitudinal line is connected with the fifth step surface, and the second longitudinal line left after cutting off is connected with the sixth step surface; and welding a second circuit board on the fifth step surface, and welding a third circuit board on the sixth step surface to obtain the circuit board assembly.

In this application, through set up step portion on first circuit board, can the height of local attenuate first circuit board, under the prerequisite that reduces the material of first circuit board limitedly, can reduce the occupation space of circuit board components, promote circuit board, electronic component's equipment compactness. Because the occupation space of the longitudinal lines in the first circuit board is relatively small, a plurality of longitudinal lines can be arranged in the first circuit board, and the relatively complex electric connection mode is favorably realized.

With reference to the eighth aspect, in some implementations of the eighth aspect, before the soldering the second circuit board on the fifth step surface and the soldering the third circuit board on the sixth step surface, the processing method further includes: arranging a first bonding pad on the fifth step surface, wherein the first bonding pad is connected with the first longitudinal line; arranging a second bonding pad on the sixth step surface, wherein the second bonding pad is connected with the second longitudinal line; welding the second circuit board on the fifth step surface and welding the third circuit board on the sixth step surface, includes: and welding the second circuit board on the fifth step surface through the first welding pad, and welding the third circuit board on the sixth step surface through the second welding pad, wherein the first welding pad comprises a first functional welding pad and a first non-functional welding pad, and the second welding pad comprises a second functional welding pad and a second non-functional welding pad.

In the present application, providing the lands on the fifth step surface and the sixth step surface can facilitate providing other circuit boards on the frame plate. The first bonding pad of the fifth step surface corresponds to the first longitudinal line, and the second bonding pad of the sixth step surface corresponds to the second longitudinal line, so that the trend of the longitudinal line in the first circuit board can be conveniently identified from the surface of the first circuit board. The type and the function of the bonding pad are different, and different electric connection effects can be realized.

With reference to the eighth aspect, in certain implementations of the eighth aspect, the first non-functional pad surrounds the first functional pad.

In the present application, the position of the non-functional pad is appropriately set, which is advantageous for achieving a relatively stable mechanical fixing effect.

With reference to the eighth aspect, in some implementations of the eighth aspect, the first pad further includes a ground pad.

In the application, the type and the function of the bonding pad are different, and different electric connection effects can be realized.

With reference to the eighth aspect, in some implementations of the eighth aspect, the ground pad is located on a side of the first circuit board.

In the present application, the position of the ground pad is appropriately set, which is advantageous for achieving a relatively effective signal shielding effect.

With reference to the eighth aspect, in certain implementations of the eighth aspect, the second circuit board is an AP board or an RF board.

In the application, the circuit boards can have different functions, and the circuit boards with different functions can also have various electrical connection modes, so that a relatively flexible wiring scheme is provided.

In a ninth aspect, a method for processing a circuit board assembly is provided, which includes: obtaining a first processing raw material, wherein the first processing raw material comprises a first insulating material, a first conducting layer and a second conducting layer, and the first conducting layer and the second conducting layer are respectively positioned on two sides of the first insulating material; processing a plurality of via holes between the first conductive layer and the second conductive layer; removing part of the first conductive layer and part of the second conductive layer to form a first circuit and a second circuit on two sides of the first insulating material respectively; obtaining a second processing raw material, and bonding the second processing raw material on the first circuit, wherein the second processing raw material comprises a second insulating material and a third conducting layer, and the second insulating material is positioned between the first circuit and the third conducting layer; processing a plurality of via holes between the first line and the third conductive layer; removing part of the third conductive layer to form a third line on one side of the second insulating layer far away from the first line; cutting off a part of the second insulating material and a part of the third line to obtain a frame plate having a stepped hole, the stepped hole including a first hole, a second hole, and a first stepped surface connected between the first hole and the second hole, the first stepped surface being vertically arranged with respect to a first direction of the frame plate, the first line being located on a plane where the first stepped surface is located; and welding a first inner side circuit board on the first step surface to obtain the circuit board assembly.

In the application, the step surface on the frame plate can be used for placing the circuit board and the electronic element, so that more electronic elements can be accommodated in the step hole of the frame plate, the assembly compactness of the circuit board and the electronic element is improved, and the occupied space of a circuit board assembly is favorably reduced. The internal structure of the frame plate is similar to that of a common circuit board, and the circuit in the frame plate is convenient to arrange.

With reference to the ninth aspect, in certain implementations of the ninth aspect, the processing method further includes: obtaining a third processing raw material, and bonding the third processing raw material on the second circuit, wherein the third processing raw material comprises a third insulating material and a fourth conducting layer, and the third insulating material is positioned between the second circuit and the fourth conducting layer; processing a plurality of via holes between the second line and the fourth conductive layer; removing part of the fourth conductive layer to form a fourth circuit on the fourth conductive layer; the cutting away a portion of the second insulating material and a portion of the third line includes: cutting out a portion of the second insulating material, a portion of the third wire, a portion of the third insulating material, and a portion of the fourth wire, wherein the stepped hole further includes a third hole and a second stepped surface connected between the second hole and the third hole, the second stepped surface being disposed perpendicularly with respect to the first direction of the frame plate, the second wire being located on a plane on which the second stepped surface is located; the processing method further comprises the following steps: and welding a second inner side circuit board on the second step surface.

In the application, more step surfaces are arranged in the step holes, so that more electronic elements can be accommodated in the step holes, the assembly compactness of the circuit board and the electronic elements is improved, and the occupied space of a circuit board assembly is favorably reduced.

With reference to the ninth aspect, in certain implementations of the ninth aspect, a projected area of the second hole on the first step surface is located within a projected area of the first hole on the first step surface, and a projected area of the second hole on the second step surface is located within a projected area of the third hole on the second step surface.

In the application, different structures of the stepped holes can realize different electric connection modes, and a relatively flexible wiring scheme is provided.

With reference to the ninth aspect, in certain implementations of the ninth aspect, before the soldering the first inner circuit board on the first step face, the processing method further includes: arranging a first inner side bonding pad on the first step surface, wherein the first inner side bonding pad is connected with the first circuit; the soldering of the first inner side circuit board on the first step surface includes: and welding the first inner side circuit board on the first step surface through a first inner side welding disc on the first step surface, wherein the first inner side welding disc comprises a functional welding disc and a non-functional welding disc.

In the application, the type and the function of the bonding pad are different, and different electric connection effects can be realized.

With reference to the ninth aspect, in certain implementations of the ninth aspect, the non-functional pad surrounds the functional pad.

In the present application, the position of the non-functional pad is appropriately set, which is advantageous for achieving a relatively stable mechanical fixing effect.

With reference to the ninth aspect, in some implementations of the ninth aspect, the first inner side pad includes a ground pad.

In the application, the type and the function of the bonding pad are different, and different electric connection effects can be realized.

With reference to the ninth aspect, in certain implementations of the ninth aspect, the ground pad is located at a side of the frame plate.

In the present application, the position of the ground pad is appropriately set, which is advantageous for achieving a relatively effective signal shielding effect.

With reference to the ninth aspect, in certain implementations of the ninth aspect, the processing method further includes: soldering a first outer circuit board on a first horizontal plane of the frame plate, the first horizontal plane being vertically disposed with respect to the first direction; soldering a second outer circuit board on a second horizontal plane of the frame plate, the second horizontal plane being vertically disposed with respect to the first direction; the first inner side circuit board and the first outer side circuit board are both application processor AP boards, the second inner side circuit board and the second outer side circuit board are both radio frequency RF boards, or the first inner side circuit board and the second outer side circuit board are both AP boards, and the first outer side circuit board and the second inner side circuit board are both RF boards.

In the application, the circuit boards can have different functions, and the circuit boards with different functions can also have various electrical connection modes, so that a relatively flexible wiring scheme is provided.

In a tenth aspect, there is provided a method for processing a circuit board assembly, including: obtaining a first processing raw material, wherein the first processing raw material comprises a first insulating material, a first conducting layer and a second conducting layer, and the first conducting layer and the second conducting layer are respectively positioned on two sides of the first insulating material; processing a plurality of via holes between the first conductive layer and the second conductive layer; removing part of the first conductive layer and part of the second conductive layer to form a first circuit and a second circuit on two sides of the first insulating material respectively; obtaining a second processing raw material, and bonding the second processing raw material on the first circuit, wherein the second processing raw material comprises a second insulating material and a third conducting layer, and the second insulating material is positioned between the first circuit and the third conducting layer; processing a plurality of via holes between the first line and the third conductive layer; removing part of the third conductive layer to form a third line on one side of the second insulating layer, which is far away from the first line; cutting off part of the second insulating material and part of the third line to obtain a first circuit board with a first step part, wherein the first step part comprises a fifth step surface and a sixth step surface, the fifth step surface and the sixth step surface are positioned on the same side of the first circuit board, the fifth step surface and the sixth step surface are both vertically arranged relative to the first direction of the first circuit board, the fifth step surface and the sixth step surface are arranged at intervals, the third line remained after cutting off is positioned on the plane of the fifth step surface, and the first line is positioned on the plane of the sixth step surface; and welding a second circuit board on the fifth step surface, and welding a third circuit board on the sixth step surface to obtain the circuit board assembly.

In this application, through set up step portion on first circuit board, can the height of local attenuate first circuit board, under the prerequisite that reduces the material of first circuit board limitedly, can reduce the occupation space of circuit board components, promote circuit board, electronic component's equipment compactness. The internal structure of the first circuit board is similar to that of a common circuit board, and therefore the circuit in the first circuit board can be conveniently distributed.

With reference to the tenth aspect, in certain implementations of the tenth aspect, before the soldering the second circuit board on the fifth step surface, the processing method further includes: arranging a first bonding pad on the fifth step surface, wherein the first bonding pad is connected with the third circuit; the soldering of the second circuit board on the fifth step surface includes: and welding the second circuit board on the fifth step surface through a first welding disc on the fifth step surface, wherein the first welding disc comprises a functional welding disc and a non-functional welding disc.

In the application, the type and the function of the bonding pad are different, and different electric connection effects can be realized.

With reference to the tenth aspect, in certain implementations of the tenth aspect, the non-functional pad surrounds the functional pad.

In the present application, the position of the non-functional pad is appropriately set, which is advantageous for achieving a relatively stable mechanical fixing effect.

With reference to the tenth aspect, in certain implementations of the tenth aspect, the first pad further includes a ground pad.

In the application, the type and the function of the bonding pad are different, and different electric connection effects can be realized.

With reference to the tenth aspect, in certain implementations of the tenth aspect, the ground pad is located on a side of the first circuit board.

In the present application, the position of the ground pad is appropriately set, which is advantageous for achieving a relatively effective signal shielding effect.

With reference to the tenth aspect, in certain implementations of the tenth aspect, the second circuit board is an AP board or an RF board.

In the application, the circuit boards can have different functions, and the circuit boards with different functions can also have various electrical connection modes, so that a relatively flexible wiring scheme is provided.

In an eleventh aspect, a method for processing an electronic device is provided, including: pressing a plurality of connection lines into an insulating material such that the plurality of connection lines penetrate the insulating material, the connection lines being arranged in parallel with respect to a first direction of the circuit board assembly; cutting off a portion of the insulating material and cutting off a portion of the connection lines among the plurality of connection lines to obtain a frame plate having a stepped hole including a first hole, a second hole, and a first stepped surface connected between the first hole and the second hole, the first stepped surface being disposed perpendicularly with respect to a first direction of the frame plate, the connection lines remaining after the cutting off being connected to the first stepped surface; welding a first inner side circuit board on the first step surface to obtain a circuit board assembly; and mounting the circuit board assembly in a shell to obtain the electronic equipment.

With reference to the eleventh aspect, in certain implementations of the eleventh aspect, the stepped hole further includes a third hole and a second stepped surface connected between the second hole and the third hole, the second stepped surface being vertically disposed with respect to the first direction of the frame plate, and the processing method further includes: and welding a second inner side circuit board on the second step surface.

With reference to the eleventh aspect, in certain implementations of the eleventh aspect, a projected area of the second hole on the first step surface is located within a projected area of the first hole on the first step surface, and a projected area of the second hole on the second step surface is located within a projected area of the third hole on the second step surface.

With reference to the eleventh aspect, in certain implementations of the eleventh aspect, before the soldering the first inner circuit board on the first step face, the processing method further includes: arranging a first inner side bonding pad on the first step surface, wherein the first inner side bonding pad is connected with the connecting wire which is left after being cut off; the soldering of the first inner side circuit board on the first step surface includes: and welding the first inner side circuit board on the first step surface through a first inner side welding disc on the first step surface, wherein the first inner side welding disc comprises a functional welding disc and a non-functional welding disc.

With reference to the eleventh aspect, in certain implementations of the eleventh aspect, the non-functional pad surrounds the functional pad.

With reference to the eleventh aspect, in certain implementations of the eleventh aspect, the first inner pad includes a ground pad.

With reference to the eleventh aspect, in certain implementations of the eleventh aspect, the ground pad is located at a side of the frame plate.

With reference to the eleventh aspect, in certain implementations of the eleventh aspect, the processing method further includes: soldering a first outer circuit board on a first horizontal plane of the frame plate, the first horizontal plane being vertically disposed with respect to the first direction; soldering a second outer circuit board on a second horizontal plane of the frame plate, the second horizontal plane being vertically disposed with respect to the first direction; the first inner side circuit board and the first outer side circuit board are both application processor AP boards, the second inner side circuit board and the second outer side circuit board are both radio frequency RF boards, or the first inner side circuit board and the second outer side circuit board are both AP boards, and the first outer side circuit board and the second inner side circuit board are both RF boards.

With reference to the eleventh aspect, in certain implementations of the eleventh aspect, the material of the connecting line includes at least one of: copper, aluminum, gold, silver, graphite.

In a twelfth aspect, a method for processing an electronic device is provided, including: pressing a plurality of connecting wires into an insulating material so that the plurality of connecting wires penetrate through the insulating material; cutting off part of the insulating material, and cutting off part of the connecting wires in the connecting wires to obtain a first circuit board with a first step part, wherein the first step part comprises a fifth step surface and a sixth step surface, the fifth step surface and the sixth step surface are positioned on the same side of the first circuit board, the fifth step surface and the sixth step surface are both vertically arranged relative to a first direction of the first circuit board, the fifth step surface and the sixth step surface are arranged at intervals, and the connecting wires are arranged in parallel relative to the first direction; welding a second circuit board on the fifth step surface, and welding a third circuit board on the sixth step surface to obtain a circuit board assembly; and mounting the circuit board assembly in a shell to obtain the electronic equipment.

With reference to the twelfth aspect, in certain implementations of the twelfth aspect, before the soldering the second circuit board on the fifth step surface, the processing method further includes: arranging a first bonding pad on the fifth step surface, wherein the first bonding pad is connected with the connecting wire which is left after being cut off; the soldering of the second circuit board on the fifth step surface includes: and welding the second circuit board on the fifth step surface through a first welding disc on the fifth step surface, wherein the first welding disc comprises a functional welding disc and a non-functional welding disc.

With reference to the twelfth aspect, in certain implementations of the twelfth aspect, the non-functional pad surrounds the functional pad.

With reference to the twelfth aspect, in certain implementations of the twelfth aspect, the first pad further includes a ground pad.

With reference to the twelfth aspect, in certain implementations of the twelfth aspect, the ground pad is located at a side of the first circuit board.

With reference to the twelfth aspect, in certain implementations of the twelfth aspect, the second circuit board is an AP board or an RF board.

With reference to the twelfth aspect, in certain implementations of the twelfth aspect, the material of the connecting line includes at least one of: copper, aluminum, gold, silver, graphite.

In a thirteenth aspect, a method for processing an electronic device is provided, including: obtaining a first processing raw material, wherein the first processing raw material comprises a first insulating material and a first conducting layer, and the first conducting layer is positioned on one side of the first insulating material; removing part of the first conductive layer to form a first longitudinal line; obtaining a second processing raw material, and bonding the second processing raw material on the first longitudinal line, wherein the second processing raw material comprises a second insulating material and a second conducting layer, and the second insulating material is positioned between the first longitudinal line and the second conducting layer; removing part of the second conductive layer to form a second longitudinal circuit; cutting off a portion of the second insulating material and a portion of the second longitudinal wiring to obtain a frame plate having a stepped hole, the stepped hole including a first hole, a second hole, and a first stepped surface connected between the first hole and the second hole, the first stepped surface being disposed perpendicularly with respect to a first direction of the frame plate, the second longitudinal wiring remaining after the cutting off being connected to the first stepped surface; welding a first inner side circuit board on the first step surface to obtain a circuit board assembly; and mounting the circuit board assembly in a shell to obtain the electronic equipment.

With reference to the thirteenth aspect, in certain implementations of the thirteenth aspect, the stepped hole further includes a third hole and a second stepped surface connected between the second hole and the third hole, the second stepped surface is vertically disposed with respect to the first direction of the frame plate, and the second longitudinal line remaining after the cutting is connected to the second stepped surface, and the processing method further includes: and welding a second inner side circuit board on the second step surface.

With reference to the thirteenth aspect, in certain implementations of the thirteenth aspect, a projected area of the second hole on the first step surface is located within a projected area of the first hole on the first step surface, and a projected area of the second hole on the second step surface is located within a projected area of the third hole on the second step surface.

With reference to the thirteenth aspect, in certain implementations of the thirteenth aspect, before the soldering the first inner circuit board on the first step face, the processing method further includes: arranging a first inner side bonding pad on the first step surface, wherein the first inner side bonding pad is connected with the second longitudinal line; the soldering of the first inner side circuit board on the first step surface includes: and welding the first inner side circuit board on the first step surface through a first inner side welding disc on the first step surface, wherein the first inner side welding disc comprises a functional welding disc and a non-functional welding disc.

With reference to the thirteenth aspect, in certain implementations of the thirteenth aspect, the non-functional pad surrounds the functional pad.

With reference to the thirteenth aspect, in certain implementations of the thirteenth aspect, the first inboard pad further includes a ground pad.

With reference to the thirteenth aspect, in certain implementations of the thirteenth aspect, the ground pad is located at a side of the frame plate.

With reference to the thirteenth aspect, in certain implementations of the thirteenth aspect, the processing method further includes: soldering a first outer circuit board on a first horizontal plane of the frame plate, the first horizontal plane being vertically disposed with respect to the first direction; soldering a second outer circuit board on a second horizontal plane of the frame plate, the second horizontal plane being vertically disposed with respect to the first direction; the first inner side circuit board and the first outer side circuit board are both application processor AP boards, the second inner side circuit board and the second outer side circuit board are both radio frequency RF boards, or the first inner side circuit board and the second outer side circuit board are both AP boards, and the first outer side circuit board and the second inner side circuit board are both RF boards.

In a fourteenth aspect, a method for processing an electronic device is provided, including: obtaining a first processing raw material, wherein the first processing raw material comprises a first insulating material and a first conducting layer, and the first conducting layer is positioned on one side of the first insulating material; removing part of the first conductive layer to form a first longitudinal line; obtaining a second processing raw material, and bonding the second processing raw material on the first longitudinal line, wherein the second processing raw material comprises a second insulating material and a second conducting layer, and the second insulating material is positioned between the first longitudinal line and the second conducting layer; removing part of the second conductive layer to form a second longitudinal circuit; cutting off part of the second insulating material and part of the second longitudinal line to obtain a first circuit board with a first step part, wherein the first step part comprises a fifth step surface and a sixth step surface, the fifth step surface and the sixth step surface are positioned on the same side of the first circuit board, the fifth step surface and the sixth step surface are both vertically arranged relative to the first direction of the first circuit board, the fifth step surface and the sixth step surface are arranged at intervals, the first longitudinal line is connected with the fifth step surface, and the second longitudinal line left after cutting off is connected with the sixth step surface; welding a second circuit board on the fifth step surface, and welding a third circuit board on the sixth step surface to obtain a circuit board assembly; and mounting the circuit board assembly in a shell to obtain the electronic equipment.

With reference to the fourteenth aspect, in some implementations of the fourteenth aspect, before the soldering the second circuit board on the fifth step surface and the soldering the third circuit board on the sixth step surface, the processing method further includes: arranging a first bonding pad on the fifth step surface, wherein the first bonding pad is connected with the first longitudinal line; arranging a second bonding pad on the sixth step surface, wherein the second bonding pad is connected with the second longitudinal line; welding the second circuit board on the fifth step surface and welding the third circuit board on the sixth step surface, includes: and the second circuit board is welded on the fifth step surface through the first welding pad, the third circuit board is welded on the sixth step surface through the second welding pad, the first welding pad comprises a first functional welding pad and a first non-functional welding pad, and the second welding pad comprises a second functional welding pad and a second non-functional welding pad.

With reference to the fourteenth aspect, in certain implementations of the fourteenth aspect, the first non-functional pad surrounds the first functional pad.

With reference to the fourteenth aspect, in certain implementations of the fourteenth aspect, the first pad further includes a ground pad.

With reference to the fourteenth aspect, in certain implementations of the fourteenth aspect, the ground pad is located at a side of the first circuit board.

With reference to the fourteenth aspect, in certain implementations of the fourteenth aspect, the second circuit board is an AP board or an RF board.

In a fifteenth aspect, a method for processing an electronic device is provided, including: obtaining a first processing raw material, wherein the first processing raw material comprises a first insulating material, a first conducting layer and a second conducting layer, and the first conducting layer and the second conducting layer are respectively positioned on two sides of the first insulating material; processing a plurality of via holes between the first conductive layer and the second conductive layer; removing part of the first conductive layer and part of the second conductive layer to form a first circuit and a second circuit on two sides of the first insulating material respectively; obtaining a second processing raw material, and bonding the second processing raw material on the first circuit, wherein the second processing raw material comprises a second insulating material and a third conducting layer, and the second insulating material is positioned between the first circuit and the third conducting layer; processing a plurality of via holes between the first line and the third conductive layer; removing part of the third conductive layer to form a third line on one side of the second insulating layer far away from the first line; cutting off a part of the second insulating material and a part of the third line to obtain a frame plate having a stepped hole, the stepped hole including a first hole, a second hole, and a first stepped surface connected between the first hole and the second hole, the first stepped surface being vertically arranged with respect to a first direction of the frame plate, the first line being located on a plane where the first stepped surface is located; welding a first inner side circuit board on the first step surface to obtain a circuit board assembly; and mounting the circuit board assembly in a shell to obtain the electronic equipment.

With reference to the fifteenth aspect, in certain implementations of the fifteenth aspect, the processing method further includes: obtaining a third processing raw material, and bonding the third processing raw material on the second circuit, wherein the third processing raw material comprises a third insulating material and a fourth conducting layer, and the third insulating material is positioned between the second circuit and the fourth conducting layer; processing a plurality of via holes between the second line and the fourth conductive layer; removing part of the fourth conductive layer to form a fourth circuit on the fourth conductive layer; the cutting away a portion of the second insulating material and a portion of the third line includes: cutting off a portion of the second insulating material, a portion of the third wire, a portion of the third insulating material, and a portion of the fourth wire, wherein the stepped hole further includes a third hole and a second step surface connected between the second hole and the third hole, the second step surface being disposed perpendicularly with respect to the first direction of the frame plate, and the second wire being located on a plane on which the second step surface is located; the processing method further comprises the following steps: and welding a second inner side circuit board on the second step surface.

With reference to the fifteenth aspect, in certain implementations of the fifteenth aspect, a projected area of the second hole on the first step surface is located within a projected area of the first hole on the first step surface, and a projected area of the second hole on the second step surface is located within a projected area of the third hole on the second step surface.

With reference to the fifteenth aspect, in certain implementations of the fifteenth aspect, before the soldering the first inner circuit board on the first step surface, the processing method further includes: arranging a first inner side bonding pad on the first step surface, wherein the first inner side bonding pad is connected with the first circuit; the soldering of the first inner side circuit board on the first step surface includes: and welding the first inner side circuit board on the first step surface through a first inner side welding disc on the first step surface, wherein the first inner side welding disc comprises a functional welding disc and a non-functional welding disc.

With reference to the fifteenth aspect, in certain implementations of the fifteenth aspect, the non-functional pad surrounds the functional pad.

With reference to the fifteenth aspect, in certain implementations of the fifteenth aspect, the first inner side pad includes a ground pad.

With reference to the fifteenth aspect, in certain implementations of the fifteenth aspect, the ground pad is located on a side of the frame plate.

With reference to the fifteenth aspect, in certain implementations of the fifteenth aspect, the processing method further includes: soldering a first outer circuit board on a first horizontal plane of the frame plate, the first horizontal plane being vertically disposed with respect to the first direction; soldering a second outer circuit board on a second horizontal plane of the frame plate, the second horizontal plane being vertically disposed with respect to the first direction; the first inner side circuit board and the first outer side circuit board are both application processor AP boards, the second inner side circuit board and the second outer side circuit board are both radio frequency RF boards, or the first inner side circuit board and the second outer side circuit board are both AP boards, and the first outer side circuit board and the second inner side circuit board are both RF boards.

In a sixteenth aspect, a method for processing an electronic device is provided, including: obtaining a first processing raw material, wherein the first processing raw material comprises a first insulating material, a first conducting layer and a second conducting layer, and the first conducting layer and the second conducting layer are respectively positioned on two sides of the first insulating material; processing a plurality of via holes between the first conductive layer and the second conductive layer; removing part of the first conductive layer and part of the second conductive layer to form a first circuit and a second circuit on two sides of the first insulating material respectively; obtaining a second processing raw material, and bonding the second processing raw material on the first circuit, wherein the second processing raw material comprises a second insulating material and a third conducting layer, and the second insulating material is positioned between the first circuit and the third conducting layer; processing a plurality of via holes between the first line and the third conductive layer; removing part of the third conductive layer to form a third line on one side of the second insulating layer, which is far away from the first line; cutting off part of the second insulating material and part of the third line to obtain a first circuit board with a first step part, wherein the first step part comprises a fifth step surface and a sixth step surface, the fifth step surface and the sixth step surface are positioned on the same side of the first circuit board, the fifth step surface and the sixth step surface are both vertically arranged relative to the first direction of the first circuit board, the fifth step surface and the sixth step surface are arranged at intervals, the third line remained after cutting off is positioned on the plane of the fifth step surface, and the first line is positioned on the plane of the sixth step surface; welding a second circuit board on the fifth step surface, and welding a third circuit board on the sixth step surface to obtain a circuit board assembly; and mounting the circuit board assembly in a shell to obtain the electronic equipment.

With reference to the sixteenth aspect, in certain implementations of the sixteenth aspect, before the soldering the second circuit board on the fifth step surface, the processing method further includes: arranging a first bonding pad on the fifth step surface, wherein the first bonding pad is connected with the third circuit; the soldering of the second circuit board on the fifth step surface includes: and welding the second circuit board on the fifth step surface through a first welding disc on the fifth step surface, wherein the first welding disc comprises a functional welding disc and a non-functional welding disc.

With reference to the sixteenth aspect, in certain implementations of the sixteenth aspect, the non-functional pad surrounds the functional pad.

With reference to the sixteenth aspect, in certain implementations of the sixteenth aspect, the first pad further includes a ground pad.

With reference to the sixteenth aspect, in certain implementations of the sixteenth aspect, the ground pad is located at a side of the first circuit board.

With reference to the sixteenth aspect, in certain implementations of the sixteenth aspect, the second circuit board is an AP board or an RF board.

Drawings

Fig. 1 is a schematic configuration diagram of an electronic apparatus.

Fig. 2 is a schematic structural view of a circuit board assembly.

Fig. 3 is a schematic structural view of another circuit board assembly.

Fig. 4 is a schematic structural diagram of a circuit board assembly provided in an embodiment of the present application.

Fig. 5 is a schematic structural diagram of a frame plate according to an embodiment of the present application.

Fig. 6 is a schematic structural diagram of a pad provided in an embodiment of the present application.

Fig. 7 is a schematic structural diagram of a pad provided in an embodiment of the present application.

Fig. 8 is a schematic structural diagram of a frame plate according to an embodiment of the present application.

Fig. 9 is a schematic flow chart of processing a frame plate according to an embodiment of the present application.

Fig. 10 is a schematic structural diagram of a frame plate according to an embodiment of the present application.

Fig. 11 is a schematic flow chart of processing a frame plate according to an embodiment of the present application.

Fig. 12 is a schematic structural diagram of a frame plate according to an embodiment of the present application.

Fig. 13 is a schematic flow chart of processing a frame plate according to an embodiment of the present application.

Fig. 14 is a schematic structural diagram of a circuit board assembly provided in an embodiment of the present application.

Fig. 15 is a schematic structural diagram of a frame plate according to an embodiment of the present application.

Fig. 16 is a schematic structural diagram of a frame plate according to an embodiment of the present application.

Fig. 17 is a schematic structural diagram of a circuit board assembly provided in an embodiment of the present application.

Fig. 18 is a schematic structural diagram of a frame plate according to an embodiment of the present application.

Fig. 19 is a schematic structural diagram of a circuit board assembly provided in an embodiment of the present application.

Fig. 20 is a schematic structural diagram of a circuit board assembly provided in an embodiment of the present application.

Fig. 21 is a schematic structural diagram of a circuit board assembly provided in an embodiment of the present application.

Fig. 22 is a schematic structural diagram of a circuit board assembly provided in an embodiment of the present application.

Fig. 23 is a schematic structural view of a frame plate provided in an embodiment of the present application.

Fig. 24 is a schematic structural view of a frame plate provided in an embodiment of the present application.

Fig. 25 is a schematic structural diagram of a circuit board assembly provided in an embodiment of the present application.

Fig. 26 is a schematic structural diagram of a frame plate according to an embodiment of the present application.

Fig. 27 is a schematic structural diagram of a frame plate according to an embodiment of the present application.

Fig. 28 is a schematic structural diagram of a circuit board assembly provided in an embodiment of the present application.

Fig. 29 is a schematic structural diagram of a circuit board assembly provided in an embodiment of the present application.

Fig. 30 is a schematic structural diagram of a circuit board assembly provided in an embodiment of the present application.

Fig. 31 is a schematic structural diagram of a circuit board assembly provided in an embodiment of the present application.

Fig. 32 is a schematic structural diagram of a circuit board assembly provided in an embodiment of the present application.

Fig. 33 is a schematic structural diagram of a circuit board assembly provided in an embodiment of the present application.

Fig. 34 is a schematic structural diagram of a circuit board assembly provided in an embodiment of the present application.

Detailed Description

The technical solution in the present application will be described below with reference to the accompanying drawings.

Fig. 1 is a schematic structural diagram of an electronic device 100 according to an embodiment of the present disclosure.

The electronic device 100 may be a mobile phone, a tablet computer, an e-reader, a notebook computer, a digital camera, a vehicle-mounted device, or a wearable device. The electronic device 100 may also be a base station, an automobile, an aerial instrument, a router, a smart speaker, an unmanned aerial vehicle, etc. The embodiment shown in fig. 1 is described by taking the electronic device 100 as a mobile phone.

The electronic device 100 includes a housing 10, a display screen 20, and a circuit board assembly 30. The display screen 20 and the circuit board assembly 30 are mounted on the housing 10. Specifically, the housing 10 includes a bezel and a rear cover. The frame encircles in the periphery of display screen 20 and encircles the periphery of back lid, and display screen 20 sets up with the back lid interval. The cavity formed between the display screen 20, the bezel, and the back cover is used to house the circuit board assembly 30. The electronic device 100 further includes a power supply 40 for supplying power to the circuit board assembly 30. The power source 40 may be, for example, a lithium ion battery.

Circuit board assembly 30 may include a plurality of circuit boards and a plurality of electronic components electrically connected to the circuit boards.

The circuit board may be a Printed Circuit Board (PCB), a flexible circuit board, an integrated circuit (or chip). The circuit board may be a single-sided board or a double-sided board according to the number of electronic components carried on the circuit board, where the single-sided board may refer to a circuit board carrying electronic components on a single side, and the double-sided board may refer to a circuit board carrying electronic components on both sides. Depending on the type of electronic components carried on the circuit board, the circuit board may be a Radio Frequency (RF) board, an Application Processor (AP) board. The RF board may be used to carry a Radio Frequency (RF) chip, a Radio Frequency Power Amplifier (RFPA), a wireless fidelity (WIFI) chip, and the like. The AP board may be used, for example, to carry System On Chip (SOC) elements, Double Data Rate (DDR) memory, power management chip (PMU), auxiliary PMU, and the like.

The circuit board may also be replaced with electronic components such as connectors, electronic transformers, relays, laser devices, packaged devices, biometric identification modules, processors, memory (e.g., DDR memory), power modules, and the like. The electronic components may also include, for example, SOC components, a main PMU, RF ICs, RF PAs, WIFI chips, auxiliary PMUs, and so on. The electronic component may be a single electronic component, or may be obtained by stacking. As shown in fig. 2, the SOC device 212 and the DDR memory 211 may be stacked to form a package on package (PoP) device 218. The SOC element 212 and the DDR memory 211 may be provided separately.

The circuit board may also be a combination of the above devices. For example, the circuit board may include a PCB and a processor, etc.

The plurality of circuit boards may be fixed by solder. The solder may be used for mechanical and/or electrical connection, and the shape of the solder may be spherical, polyhedral, ellipsoidal, truncated-cone, chamfered, bar-shaped, or the like.

The following description will take the circuit board as an example.

Fig. 2 shows a schematic structural diagram of a circuit board assembly in some embodiments. The circuit board assembly 200 may be one example of the circuit board assembly 30 of the electronic device 100 shown in fig. 1. The circuit board assembly 200 may be, for example, a chip, a processor, or the like.

The circuit board assembly 200 may include a plurality of PCBs and a plurality of electronic components 210 electrically connected to the PCBs. The plurality of PCBs may include a PCB 201, a PCB 202, and a PCB203 stacked in sequence.

As shown in fig. 2, an electronic component 210 may be disposed on a side of the PCB 201 remote from the PCB 202. An electronic component 210 may be provided on a side of the PCB203 remote from the PCB 202. In practice, both sides of the PCB 201 and both sides of the PCB203 may be provided with electronic components 210, and fig. 2 is only an example. Additionally, the PCB 202 may include a receiving cavity 220 for receiving the electronic component 210. The electronic component 210 in the receiving cavity 220 may be fixed on the PCB 201 or/and the PCB 203. The power supply 40 in fig. 1 may be used to power the PCB 201, the PCB 202, the PCB203, and/or the electronic component 210.

Fig. 2 shows an arrangement of electronic components 210. The electronic component 210 secured to the side of the PCB 201 remote from the PCB 202 may include a POP element 218. The electronic component 210 fixed on the side of the PCB203 remote from the PCB 202 may include an RF IC 213, an RF PA 214, and a WIFI chip 215. The electrical components 210 disposed within the cavity 220 may include, for example, a primary PMU 216 and a secondary PMU 217. The present application does not limit the specific arrangement of electronic components 210 within circuit board assembly 200.

As shown in fig. 2, since the circuit board assembly 200 has a relatively small number of circuit boards, the circuit board assembly 200 has a relatively small height (Z direction) and the lateral (X-Y direction) dimension of the circuit board assembly 200 is relatively large in the case where the number of electronic components to be arranged is fixed. This type of arrangement can be selected in the case where, for example, the electronic device is thin but the screen is large. It should be noted that, alternatively, an electronic component may be disposed on a side of the PCB203 close to the side 202.

Fig. 3 shows a schematic structural diagram of a circuit board assembly in some embodiments. The circuit board assembly 300 may be one example of the circuit board assembly 30 of the electronic device 100 shown in fig. 1.

The circuit board assembly 300 may include a plurality of PCBs 301, 302, 303, 304, 305 stacked in sequence.

Any of PCBs 301, 302, 303, 304, 305 may be used to carry electronic components 310. As shown in fig. 3, an electronic component 310 may be provided on a side of the PCB 301 remote from the PCB 302. An electronic component 310 may be provided on a side of the PCB305 remote from the PCB 304. In practice, both sides of the PCB 301, both sides of the PCB305 may be provided with electronic components 310, fig. 3 being only an example. The PCB 302 may include a receiving cavity 321 for receiving the electronic component 310. The electronic component 310 in the receiving cavity 321 may be fixed on the PCB 301 or the PCB 303. PCB304 may include a receiving cavity 322 for receiving electronic component 310. The electronic component 310 in the receiving cavity 322 may be fixed on the PCB 303 or the PCB 305. The power supply in fig. 1 may be used to power PCB 301, PCB 302, PCB 303, PCB304, PCB305, and/or electronic component 310.

The arrangement of the electronic components has been explained in the example shown in fig. 2, and a detailed description thereof is omitted here. The present application does not limit the specific arrangement of the electronic components 310 within the circuit board assembly 300.

Since the circuit board assembly 300 has a relatively large number of circuit boards, the circuit board assembly 300 has a relatively small lateral direction (X-Y direction), and the height (Z direction) of the circuit board assembly 300 is relatively large. For example, if the electronic device has a relatively large space in the thickness direction but a relatively small screen, the circuit board assembly may be provided by the scheme shown in fig. 3. It should be noted that, in the accommodating chamber 321 and the accommodating chamber 322, a scheme of disposing a single-layer electronic component is exemplarily shown. In addition, an electronic component may be disposed on a surface of the PCB 301 close to the surface 303, and/or an electronic component may be disposed on a surface of the PCB305 close to the surface 303 (similar to the embodiment shown in fig. 4, the electronic components are disposed on both sides of the circuit board 404, and the embodiment shown in fig. 4 will be described in detail below, and thus no further description is needed here). In summary, if the electronic components are bulky and large in number, the occupied space of the circuit board assembly is large (i.e., the dimension in the X, Y and/or Z direction is large). Therefore, the structure of the circuit board assembly can be optimized to reduce the occupied space of the circuit board assembly.

Fig. 4 is a schematic structural diagram of a circuit board assembly according to an embodiment of the present application. Circuit board assembly 400 may be one example of circuit board assembly 30 of electronic device 100 shown in fig. 1.

The circuit board assembly 400 may include a frame plate 403. The frame plate 403 may include a stepped bore 420 for receiving a circuit board and/or electronic components 430. As shown in fig. 4, the stepped bore 420 may include a first stepped surface 413 disposed in parallel with respect to an X-Y plane. The stepped bore 420 may include a first bore 421 and a second bore 422. The cross-sectional shape of the first hole 421 is different from the cross-sectional shape of the second hole 422, or the cross-sectional dimension of the first hole 421 is different from the cross-sectional dimension of the second hole 422, wherein the cross-sectional shape of the hole is a shape intersecting the hole through a plane perpendicular to the height of the hole, so that a contour line of the hole wall can be obtained, and the contour line can enclose a figure which is the cross-sectional shape of the hole. The first step surface 413 is connected between the first hole 421 and the second hole 422. An end of the first hole 421 distant from the first step surface 413 may be disposed near the first horizontal surface 411 of the frame plate 403. For example, an end of the first hole 421 remote from the first step surface 413 may be connected to the first horizontal surface 411 of the frame plate 403. An end of the second hole 422 distant from the first step face 413 may be disposed near the second horizontal plane 412 of the frame plate 403. For example, an end of the second hole 422 remote from the first step face 413 may be connected to the second horizontal surface 412 of the frame plate 403. Wherein the horizontal plane of the frame plate 403 may be the outer surface parallel to the X-Y plane. In addition, the present application defines that the first direction of the frame plate 403 may be parallel to the Z direction. A direction extending from the first outer circuit board 401 to the second outer circuit board 402 may be parallel to the first direction of the frame plate 403 and may be perpendicular to the horizontal plane of the frame plate 403. In one example, the first direction may be a direction perpendicular to a display screen of the electronic device. The first direction may also be referred to as a height direction or a thickness direction of the circuit board.

The circuit board assembly 400 may further include a first outer circuit board 401, a first inner circuit board 404, and a second outer circuit board 402. The stepped hole 420 belongs to a receiving cavity for receiving a circuit board and/or an electronic component 430. In the present application, the outer circuit board may be understood as a circuit board located outside the housing cavity of the frame plate 403, and the inner circuit board may be understood as a circuit board located inside the housing cavity of the frame plate 403. The first outer circuit board 401, the first inner circuit board 404 and the second outer circuit board 402 are disposed at intervals. The first outer circuit board 401 may be fixed on the first horizontal plane 411 of the frame plate 403. For example, as shown in fig. 5, a first outer pad 441 is disposed on the first horizontal plane 411. It is therefore possible to fix the first outer circuit board 401 on the first horizontal plane 411 through the first outer land 441, and to achieve electrical connection between the first outer circuit board 401 and the frame plate 403. In the present application, the outer pads may be understood as pads located outside the housing cavities of the frame plate 403. The first inner circuit board 404 may be fixed on the first step face 413 of the frame plate 403. For example, as shown in fig. 5, the first step surface 413 is provided with a first inner land 442. The first inner circuit board 404 can be fixed to the first step face 413 by the first inner land 442, and electrical connection between the first inner circuit board 404 and the frame plate 403 is achieved. In the present application, the inner pad may be understood as a pad located inside the housing cavity of the frame plate 403. The second outside circuit board 402 may be fixed on the second horizontal plane 412 of the frame plate 403. While the first outer circuit board 401 is fixed to the frame plate 403 in the above-mentioned example, the fixing manner of the second outer circuit board 402 to the frame plate 403 may refer to the first outer circuit board 401, and thus, a detailed description thereof is not necessary.

Circuit board assembly 400 may also include electronic components 430 disposed on first outer circuit board 401, first inner circuit board 404, or second outer circuit board 402. The electronic components 430 may be disposed on a horizontal plane of the circuit board, wherein the horizontal plane of the circuit board is disposed parallel with respect to the X-Y plane, as shown in fig. 4. The electronic component 430 may be fixed on either side of the first outer circuit board 401, the second outer circuit board 402, or the first inner circuit board 404.

In the embodiment of the application, more electronic elements can be accommodated in the step hole of the frame plate, and the step surface on the frame plate can be used for placing a circuit board to form the matching of the circuit board and the frame plate, so that the assembly compactness of the circuit board and the electronic elements is improved, and the occupied space of a circuit board assembly is favorably reduced. In other words, it is advantageous to reduce the space occupied by the circuit board assembly in the direction X, Y, Z. Thus, a relatively small circuit board assembly may provide space for other electronic components. In one example, the volume of a circuit board assembly in the camera module is reduced, which is beneficial to increasing the zoom distance of a lens in the camera, and further can be beneficial to improving the shooting effect of the camera module; in addition, the installation of electronic components in the camera is facilitated.

In the embodiment of the present application, at least three circuit boards are solder-fixed to a plurality of positions on the frame plate. In other words, the at least three circuit boards are bound by one frame plate. Because the frame plate is difficult to warp relatively itself, consequently be difficult to take place the dislocation relatively between this at least three circuit board, be favorable to promoting circuit board assembly's bulk strength.

A bonding pad provided by an embodiment of the present application is illustrated by fig. 6.

The pads shown in fig. 6 may be disposed on, for example, a first horizontal surface 411, a first step surface 413, and a second horizontal surface 412 as shown in fig. 4.

When the pad shown in fig. 6 is located at the first horizontal plane 411, the pad may be a first outer pad 441. That is, when the pads shown in fig. 6 are located at the first horizontal plane 411, the pads shown in fig. 6 may be used to solder-fix the first outer circuit board 401 to the frame plate 403.

When the land shown in fig. 6 is located on the first step face 413, the land may be a first inner side land 442. That is, when the land shown in fig. 6 is located on the first step face 413, the land shown in fig. 6 may be used to solder-fix the first inner circuit board 404 to the frame plate 403.

When the land shown in fig. 6 is located at the second level 412, the land may be used to solder-fix the second outside circuit board 402 to the frame plate 403.

The pads shown in fig. 6 may include a functional pad 601, a non-functional pad 602, and a ground pad 603.

It should be understood that fig. 6 is only one example of a pad provided by the embodiments of the present application. In one example, the pads in the embodiments of the present application may include only the functional pads 601. In one example, the pad in the embodiment of the present application may include a functional pad 601, and may further include at least one of a non-functional pad 602 and a ground pad 603.

The functional pads 601 can perform electrical connection and mechanical fixing. That is, if a plurality of components (components may be, for example, a circuit board, an electronic component) are connected through the functional pads 601, an electrical signal between the plurality of components may be transmitted through the functional pads 601.

The non-functional pads 602 may only serve a mechanical fastening function. That is, if a plurality of components are connected through the non-functional pad 602, an electrical signal between the plurality of components cannot be transmitted through the non-functional pad 602.

Ground pads 603 may be used to shield signals. That is, the ground pad 603 is used to reduce interference of an external signal with a component provided with the ground pad 603.

The functional pads 601, non-functional pads 602 may be located on the horizontal plane of the circuit board.

The functional pads 601 may be located relatively close to the center of the circuit board, for example. As shown in fig. 6, the functional pad 601 may surround the stepped hole of the frame plate.

Alternatively, the non-functional pads 602 may be located relatively close to the outer edge 604 of the circuit board, for example. The outer edge 604 may refer to a location on the circuit board that is away from the center of the circuit board. For example, the outer edge 604 of the circuit board is a distance from the center of the circuit board greater than a preset threshold of 1.

In one example, the non-functional pads 602 may be located within the corners formed by the outer edges 604. As shown in fig. 6, the outer edge of the circuit board may form a quadrangle, and the non-functional pads 602 may be located at four corners of the quadrangle. In the case where the outer edge of the circuit board may form a pentagon, the non-functional pads 602 may be located on five corners of the pentagon.

In one example, the non-functional pads 602 are disposed around the center of the circuit board. For example, in the case where the outer edge of the circuit board may form a circle, the non-functional pads 602 may be disposed around the center of the circle.

Optionally, the non-functional pads 602 may also be located relatively close to the inner edge 605 of the circuit board. The circuit board may include a through hole (e.g., stepped hole 420 in fig. 4).

In one example, the non-functional pads 602 may surround the outer perimeter of the functional pads 601 and the non-functional pads 602 may be located relatively close to the outer edge 604 of the circuit board, as shown in fig. 6.

In one example, the non-functional pads 602 may be located within the area surrounded by the functional pads 601 and the non-functional pads 602 may be located relatively close to the inner edge 605 of the circuit board. I.e., the functional pad 601 may surround the outer circumference of the non-functional pad 602.

In one example, the pads may include both non-functional pads 602 that surround the periphery of the functional pads 601 and non-functional pads 602 that are located within the area surrounded by the functional pads 601.

The ground pads 603 may be disposed on the side of the circuit board. The sides of the circuit board may be arranged vertically with respect to the horizontal plane of the circuit board. The sides of the circuit board may surround the circuit board.

Any of the pads may comprise a solder ball having a diameter of 0.1mm-0.5 mm. For example, the pads may include solder balls having a diameter of 0.25mm, 0.3 mm. It should be understood that the shape and size of the pad shown in fig. 6 are merely an example, and the embodiment of the present application may not limit the specific shape and specific size of the pad. In one example, the size of any two functional pads 601 may be the same or different. In one example, the size of the non-functional pads 602 may be larger, equal to, or smaller than the size of the functional pads 601. In one example, the size of any two non-functional pads 602 may be the same or different. In one example, the size of any two ground pads 603 may be the same or different. In one example, the size of the functional pads 601 may be larger, equal to, or smaller than the size of the ground pads 603. In one example, the size of the non-functional pads 602 may be larger, equal to, or smaller than the size of the ground pads 603.

It should be understood that the arrangement of the pads shown in fig. 6 is merely an example. As shown in fig. 6, the functional pad 601 may be provided with 2 turns. The functional pads 601 may be provided with a greater or lesser number of turns depending on the size of the circuit board. For example, the number of turns of the functional pad 601 may be increased to 3-20 turns, such as 5 turns, 8 turns, 10 turns, 15 turns, or 18 turns. The greater the number of turns of the functional pad 601, the greater the mechanical reliability of the functional pad is relatively, and it is also relatively easier to implement more complex electrical functions.

Fig. 7 shows a schematic cross-sectional view of functional pads 601, non-functional pads 602, and ground pads 603.

As shown in fig. 7, the functional pad 601 includes a first off-board horizontal solder 611, a second off-board horizontal solder 612, and a first on-board conductive material 621. The first off-board horizontal solder 611 and the second off-board horizontal solder 612 may be located on different horizontal planes of the circuit board, respectively, i.e., the first off-board horizontal solder 611 and the second off-board horizontal solder 612 are located on two sides of the circuit board, respectively. The first in-board conductive material 621 may be located within the circuit board and connected between the first and second out-of-board horizontal solders 611 and 612.

As shown in fig. 7, the non-functional pads 602 include a third off-board horizontal solder 613. The first off-board horizontal solder 611 may be located on the horizontal plane of the circuit board. That is, the non-functional pads 602 may not include an in-board conductive material. Alternatively, the non-functional pads 602 may not be electrically connected to conductive material within the circuit board.

As shown in fig. 7, the ground pad 603 includes a fourth off-board horizontal solder 614, a second in-board conductive material 622, and an off-board side solder 631. The fourth off-board horizontal solder 614 may be located on the horizontal plane of the circuit board. The board outer side solder 631 may wrap the sides of the circuit board; two ends of the board outer side solder 631 are respectively located on different horizontal planes of the circuit board, that is, two ends of the board outer side solder 631 are respectively located on two sides of the circuit board. A second in-board conductive material 622 may be located within the circuit board and connected between a fourth off-board horizontal solder 614, and an off-board side solder 631. That is, fourth off-board horizontal solder 614 may be connected to an end of off-board side solder 631 remote from fourth off-board horizontal solder 614 by second on-board conductive material 622.

Several possible configurations of the frame plate 403 and corresponding methods of manufacture are set forth in detail below with reference to fig. 8-13.

Fig. 8 is a schematic cross-sectional view of a frame plate 403.

The frame plate 403 may include at least one first connection line 651. Each of the first connecting lines 651 is disposed in parallel with respect to the first direction of the frame plate 403. As shown in fig. 8, each of the first connecting lines 651 is connected between the first step face 413 of the frame plate 403 and the second horizontal face 412 of the frame plate 403, so that the first inner side circuit board 404 can be electrically connected with the second outer side circuit board 402 through at least one of the first connecting lines 651 within the frame.

The framed panel 403 may also include at least one second connecting line 652. Each of the second connection lines 652 is arranged in parallel with respect to the first direction of the framed panel 403. As shown in fig. 8, each of the second connection lines 652 is connected between the first horizontal surface 411 of the framed panel 403 and the second horizontal surface 412 of the framed panel 403, so that the first outside circuit board 401 can be electrically connected to the second outside circuit board 402 through at least one of the second connection lines 652 in the framed panel 403.

In the embodiment of the present application, the material of the connection line may be a conductive material. For example, the material of the connection line may include copper, aluminum, gold, silver, graphite, and the like.

Optionally, the frame plate 403 may further include one or more transverse connection lines arranged perpendicularly with respect to the first direction of the frame plate 403. The transverse connection line may be used, for example, to achieve electrical connection between the first connection line 651 and the second connection line 652.

Fig. 9 is a schematic view of a process flow of the frame plate 403 shown in fig. 8.

701, as shown in fig. 9 (a), a processing material 711 of a circuit board is obtained.

The processing material 711 of the circuit board may be a material for manufacturing the circuit board. A common circuit board processing material 711 may include an insulating material, and two conductive layers 712 respectively disposed on both sides of the insulating material. The height of the insulating material (which is similar to the spacing between the two conductive layers 712) may be slightly greater than the height of the conductive layers 712.

702, as shown in fig. 9 (b), the conductive layer 712 on both sides of the insulating material is removed.

It is to be understood that if the processing material 711 of the obtained circuit board does not include the conductive layer 712, the subsequent steps may be directly performed.

703, as shown in fig. 9 (c) and (d), the plurality of connection lines 713 are pressed into the insulating material so that the plurality of connection lines 713 may penetrate through the insulating material.

704, as shown in (e) of fig. 9, a portion of the insulating material and a portion of the connection wire 713 are cut out to form a stepped hole 420, the stepped hole 420 including a first hole 421, a second hole 422, and a first stepped surface 413 connected between the first hole 421 and the second hole 422, the first stepped surface 413 being disposed in parallel with respect to the first horizontal surface 411 of the frame plate 403.

The connection line 713 remaining after the cutting may be the first connection line 651. Accordingly, the first inner circuit board 404 may be disposed on the first step face 413, thereby achieving electrical connection between the first inner circuit board 404 and the frame plate 403. The uncut connecting line 713 may be the second connecting line 652. Thus, the first outer circuit board 401 and the second outer circuit board 402 may be electrically connected through the frame plate 403.

The connecting lines can visually reflect the wiring mode in the frame plate 403, and other circuit boards can be mounted on the frame plate 403 according to the positions of the connecting lines, which is beneficial to reducing the assembly difficulty of circuit board components.

Fig. 10 is a schematic cross-sectional view of another frame plate 403.

The frame plate 403 may include at least one first longitudinal line 853, a first inner pad 442, and a second outer pad 443. "longitudinal" is to be understood as meaning the first direction (Z direction) of the circuit board. Thus, the longitudinal lines are arranged in a first direction (approximately) parallel to the circuit board. The first inner pad 442 is disposed on the first step face 413. The second outer pad 443 is disposed on the second horizontal plane 412. As shown in fig. 10, each of the first longitudinal lines 853 is connected between the first inner pad 442 and the second outer pad 443 so that the first inner circuit board 404 can be electrically connected with the second outer circuit board 402 through the first inner pad 442, at least one of the first longitudinal lines 853, and the second outer pad 443.

The frame plate 403 may further include at least one second longitudinal wire 854, a first outer pad 441, and a third outer pad 444. The first outer pad 441 is disposed on the first horizontal plane 411. The third outer pad 444 is disposed on the second horizontal surface 412. As shown in fig. 10, each of the second longitudinal wires 854 is connected between the first outer pad 441 and the third outer pad 444 so that the first outer circuit board 401 can be electrically connected with the second outer circuit board 402 through the first outer pad 441, at least one of the second longitudinal wires 854, and the third outer pad 444.

Optionally, the frame plate 403 may further include one or more transverse wires arranged perpendicularly with respect to the first direction of the frame plate 403. The transverse wires may be used, for example, to make an electrical connection between the first longitudinal wire 853 and the second longitudinal wire 854.

The vertical wires occupy a relatively small space in the frame plate 403 shown in fig. 10 as compared with the frame plate 403 shown in fig. 8, and therefore a plurality of vertical wires can be arranged in the frame plate 403, facilitating a relatively complicated electrical connection.

Fig. 11 is a schematic view of a process flow of the frame plate 403 shown in fig. 10.

901, as shown in fig. 11 (a), a first processing raw material 911 is obtained, and the first processing raw material 911 may include a first insulating material 912 and a first conductive layer 913, wherein the first conductive layer 913 is located on one side of the first insulating material 912.

The first processing material 911 may be a material used to manufacture a circuit board. The height of first insulating material 912 may be slightly greater than the height of first conductive layer 913.

902, as shown in fig. 11 (b), a portion of the first conductive layer 913 is removed to form second longitudinal wirings 854, the second longitudinal wirings 854 being connected between the first horizontal plane 411 of the frame plate 403 and the second horizontal plane 412 of the frame plate 403.

903, as shown in fig. 11 (c), obtaining a second processing raw material 921, and bonding the second processing raw material 921 to the processed first processing raw material 911, where the second processing raw material 921 may include a second insulating material 922 and a second conductive layer 923, the second conductive layer 923 is located on one side of the second insulating material 922, and the second insulating material 922 is located between the first longitudinal line 853 and the second conductive layer 923.

The second processing material 921 may be a material for manufacturing a circuit board. The height of the second insulating material 922 may be slightly greater than the height of the second conductive layer 923.

904, as shown in (d) of fig. 11, a portion of the second conductive layer 923 is removed to form a first longitudinal wiring 853, and one end of the first longitudinal wiring 853 is connected to the second horizontal plane 412 of the frame plate 403.

905, as shown in fig. 11 (e), a portion of the first insulating material 912 and a portion of the first longitudinal wiring 853 are cut out to form a stepped hole 420, the stepped hole 420 including a first hole 421, a second hole 422, and a first stepped surface 413 connected between the first hole 421 and the second hole 422, the first stepped surface 413 being disposed perpendicularly with respect to the first direction of the frame plate 403, and the first longitudinal wiring 853 remaining after the cut out being connected to the first stepped surface 413.

Accordingly, the first longitudinal line 853 remaining after the cutting is connected between the first step surface 413 and the second horizontal surface 412.

906, as shown in fig. 11 (f), wraps the first insulating material 912, the second insulating material 922, the first longitudinal lines 853, and the second longitudinal lines 854 around the third insulating material 931.

The third insulating material 931 may be, for example, ink. That is, the semi-finished product formed after step 905 may be immersed in the ink. The ink may encapsulate the first longitudinal lanes 853, 854, thereby reducing the exposed area of the first longitudinal lanes 853, 854.

907, as shown in fig. 11 (g), a portion of the third insulating material 931 is cut away such that both ends (i.e., one end near the first step surface 413 and one end near the second horizontal surface 412) of the first longitudinal line 853 are exposed, and both ends (i.e., one end near the first horizontal surface 411 and one end near the second horizontal surface 412) of the second longitudinal line 854 are exposed.

908, as shown in (h) of fig. 11, at least one first inner land 442 is provided on the first step surface 413, at least one first outer land 441 is provided on the first horizontal plane 411, at least one second outer land 443 (not shown in fig. 11) and at least one third outer land 444 (not shown in fig. 11) are provided on the second horizontal plane 412, and the first inner land 442 is connected to the exposed portion of the first longitudinal line 853. The first outer pads 441 are connected to exposed portions of the second longitudinal wires 854. The second outboard pad 443 is connected to the exposed portion of the first longitudinal line 853. The third outer pads 444 are connected to exposed portions of the second longitudinal lines 854.

Accordingly, the electrical connection between the first inner circuit board 404 and the second outer circuit board 402 may be achieved through the first inner pad 442 and the second outer pad 443; the electrical connection between the first outer circuit board 401 and the third outer circuit board may be achieved by the first outer pad 441 and the third outer pad 444.

Fig. 12 is a schematic cross-sectional view of still another frame plate 403.

The frame plate 403 may include a plurality of first lateral lines 1055 disposed at intervals, and at least one first via 1056. "lateral" is to be understood as a direction parallel to the horizontal plane (X-Y plane) of the circuit board. In one example, the lateral circuits may be arranged in parallel with respect to the X direction. In one example, the lateral circuits may be arranged in parallel with respect to the Y direction. In one example, the lateral circuits may be located on a horizontal plane disposed in parallel with respect to the frame plate, and both disposed obliquely with respect to the X, Y direction. Thus, the transverse wires are arranged in a direction (approximately) parallel to the horizontal plane of the circuit board. The plurality of first transverse lines 1055 and the at least one first via 1056 are used to electrically connect with the circuit board or the electronic component 430 disposed on the first step surface 413 and the second horizontal surface 412. Any one of the first via holes 1056 is arranged in parallel with respect to the first direction of the frame plate 403. Any one of the first via holes 1056 is connected between adjacent two of the first transverse lines 1055. The plurality of first transverse wires 1055 may include first transverse wires 1055 disposed on the first step surface 413 of the frame plate 403, and first transverse wires 1055 disposed on the second horizontal surface 412 of the frame plate 403. Accordingly, the first inner circuit board 404 may be electrically connected to the second outer circuit board 402 through the plurality of first transverse wires 1055 and the at least one first via 1056.

The frame plate 403 may further include a plurality of second transverse wires 1057 disposed at intervals, and at least one second via hole 1058. The plurality of second transverse lines 1057 and the at least one second via 1058 are used to electrically connect the circuit board or the electronic component 430 disposed on the first horizontal plane 411 and the second horizontal plane 412. Any one of the second via holes 1058 is arranged in parallel with respect to the first direction of the frame plate 403. Any one of the second via holes 1058 is connected between adjacent two of the second transverse wires 1057. The plurality of second transverse wires 1057 may include the second transverse wire 1057 disposed on the first horizontal surface 411 of the frame plate 403, and the second transverse wire 1057 disposed on the second horizontal surface 412 of the frame plate 403. Accordingly, the first outer circuit board 401 may be electrically connected with the second outer circuit board 402 through the plurality of second transverse wires 1057 and the at least one second via 1058.

The first transverse line 1055 provided on the first step face 413 may not be connected to any of the second transverse lines 1057 (as shown in fig. 12 (a)). Alternatively, the first transverse line 1055 provided on the first step face 413 may be connected to any one of the second transverse lines 1057 (as shown in fig. 12 (b)).

In fig. 12, the transverse lines may be arranged at intervals in a direction parallel to the horizontal plane (or X-Y plane) of the circuit board, and may also be arranged at intervals in a first direction (Z direction) parallel to the circuit board. By providing the transverse wiring on the target plane parallel to the horizontal plane of the circuit board, a plurality of via holes can be electrically connected together, the plurality of via holes being arranged at intervals in a direction parallel to the horizontal plane of the circuit board.

The internal structure of the frame plate 406 shown in fig. 12 is more similar to that of a general circuit board than the frame plate 403 shown in fig. 8 and 10, and facilitates layout of the wirings in the frame plate 403.

Fig. 13 is a schematic view of a process flow of the frame plate 403 shown in (a) of fig. 12. The processing flow of the frame plate 403 shown in fig. 12 (b) can refer to the embodiment shown in fig. 13, and thus, a detailed description thereof is not necessary.

At 1101, as shown in fig. 13 (a), a third processed material 1111 is obtained. The third processing material 1111 may include a fourth insulating material 1112, a third conductive layer 1113, and a fourth conductive layer 1114, wherein the third conductive layer 1113 and the fourth conductive layer 1114 are respectively located at two sides of the fourth insulating material 1112.

The third process material 1111 may be a material for manufacturing a circuit board. The height of the fourth insulating material 1112 can be slightly larger or much larger than the height of the third conductive layer 1113 and the fourth conductive layer 1114.

1102, as shown in fig. 13 (b), a plurality of via holes 1115 are formed between the third conductive layer 1113 and the fourth conductive layer 1114.

The via hole may be processed by, for example, drilling a hole in the via hole and plating a metal material on the wall of the hole.

1103, as shown in fig. 13 (c), part of the third conductive layer 1113 and part of the fourth conductive layer 1114 are removed.

The remaining third conductive layer 1113 may form a lateral wiring. The remaining fourth conductive layer 1114 may form a lateral line.

1104, as shown in fig. 13 (d), a fourth processing material 1121 is obtained, and the fourth processing material 1121 is bonded to the fourth conductive layer 1114. The fourth processing material 1121 may include a fifth insulating material 1122 and a fifth conductive layer 1123, the fifth conductive layer 1123 is located on one side of the fifth insulating material 1122, and the fifth insulating material 1122 is located between the fourth conductive layer 1114 and the fifth conductive layer 1123.

The height of the fifth insulating material 1122 may be slightly or much greater than the height of the fifth conductive layer 1123.

1105, as shown in fig. 13 (e), a plurality of via holes 1124 are formed between the fourth conductive layer 1114 and the fifth conductive layer 1123.

1106, as shown in (f) of fig. 13, a part of the fifth conductive layer 1123 is removed.

The remaining fifth conductive layer 1123 may form a lateral wiring.

1107, as shown in (g) of fig. 13, a part of the fifth insulating material 1122 and a part of the fifth conductive layer 1123 are cut out to form a step hole 420, the step hole 420 including a first hole 421, a second hole 422, and a first step face 413 connected between the first hole 421 and the second hole 422, the first step face 413 being disposed perpendicularly with respect to the first direction of the frame plate 403, the fourth conductive layer 1114 being disposed on a plane on which the first step face 413 is located.

The remaining conductive layer material (including the material remaining on the third conductive layer 1113, the fourth conductive layer 1114, and the fifth conductive layer 1123) is projected onto the plane of the first step surface 413 along the first direction of the circuit board. The conductive material of which the projected area at least partially intersects with the first step face 413 belongs to the first transverse wiring 1055; the conductive material of which the projected area is located outside the first step face 413 belongs to the second transverse wiring 1057. The remaining via holes (including the via hole 1115 between the third conductive layer 1113 and the fourth conductive layer 1114 and the via hole 1124 between the fourth conductive layer 1114 and the fifth conductive layer 1123) are projected on the plane of the first step face 413 along the first direction of the circuit board. The via hole with the projection area at least partially intersecting the first step surface 413 belongs to the first via hole 1056; the via hole having the projected area located outside the first step surface 413 belongs to the second via hole 1058.

Accordingly, the electrical connection between the first inner circuit board 404 and the second outer circuit board 402 can be achieved through the first transverse wire 1055 and the first via 1056. The electrical connection between the first and second outer circuit boards 401 and 402 can be achieved through the second transverse wiring 1057 and the second via 1058.

In the embodiment of the present application, the stepped surface on the frame plate 403 may be used to place the circuit board and the electronic component 430, so that more electronic components 430 may be accommodated in the stepped hole 420 of the frame plate 403, which improves the assembly compactness of the circuit board and the electronic component 430 and is beneficial to reducing the occupied space of the circuit board assembly 400. For example, the lateral (X, Y direction) footprint of the circuit board assembly 400 shown in fig. 4 is relatively smaller than the circuit board assembly 400 shown in fig. 2. For another example, the height (Z direction) of the circuit board assembly 400 shown in fig. 4 is relatively thinner than the circuit board assembly 400 shown in fig. 3.

Fig. 14 is a schematic structural diagram of a circuit board assembly according to an embodiment of the present application. Circuit board assembly 1200 may be one example of circuit board assembly 30 of electronic device 100 shown in fig. 1.

The circuit board assembly 1200 may include a frame plate 1203. The frame plate 1203 may include a stepped bore 1220 for receiving a circuit board and/or electronic components. As shown in fig. 14, the stepped bore 1220 may include a first stepped surface 1213 and a second stepped surface 1214 that are arranged in parallel with respect to the X-Y plane. Stepped bore 1220 may include first bore 1221, second bore 1222, and third bore 1223. First step surface 1213 connects between first bore 1221 and second bore 1222. Second step face 1214 is connected between second bore 1222 and third bore 1223. An end of the first bore 1221 distal from the first step surface 1213 may be connected to a first horizontal surface 1211 of the frame plate 1203. An end of the third hole 1223 remote from the second step face 1214 may be connected to the second horizontal face 1212 of the frame plate 1203. Here, the cross-sectional shape of the first hole 1221 is different from that of the second hole 1222, or the cross-sectional size of the first hole 1221 is different from that of the second hole 1222. The second hole 1222 has a sectional shape different from that of the third hole 1223, or the second hole 1222 has a sectional size different from that of the third hole 1223. The cross-section of the hole is perpendicular to the height of the hole. Alternatively, as shown in fig. 14, the projected area of the second hole 1222 on the first step surface 1213 is located within the projected area of the first hole 1221 on the first step surface 1213; the projected area of third hole 1223 on second step surface 1214 is located within the projected area of second hole 1222 on first step surface 1213.

Circuit board assembly 1200 may also include a first outer circuit board 1201, a first inner circuit board 1204, a second inner circuit board 1205, a second outer circuit board 1202. The first and second external circuit boards 1201, 1202 are located outside the stepped hole 1220. First inner circuit board 1204 and second inner circuit board 1205 are located within stepped bore 1220. As shown in fig. 15, the first outer circuit board 1201 can be fixed on the first horizontal plane 1211 and electrical connection between the first outer circuit board 1201 and the frame plate 1203 is achieved by the first outer pads 1241 on the first horizontal plane 1211. The first inner circuit board 1204 can be fixed on the first step surface 1213 by the first inner land 1242 on the first step surface 1213, and electrical connection between the first inner circuit board 1204 and the frame plate 1203 is achieved. The second inner circuit board 1205 can be fixed to the second stepped surface 1214 by the second inner pad 1245 on the second stepped surface 1214, and electrical connection between the second inner circuit board 1205 and the frame plate 1203 is achieved. The second external circuit board 1202 may be fixed to the second horizontal surface 1212 of the frame plate 1203 in a specific manner, which is not described herein again. First outer circuit board 1201, first inner circuit board 1204, second inner circuit board 1205, second outer circuit board 1202 are used to set electronic components.

In the embodiment of the present application, a projection area of a hole on a plane may refer to a projection pattern of a wall of the hole, which is obtained by projecting the wall of the hole on the plane along a direction parallel to a height of the hole, and an area surrounded by the projection pattern is the projection area. In the example shown in fig. 14, the projection area of the first hole 1221 on the first step surface 1213 may refer to an area surrounded by a pattern obtained by the intersection of the hole wall of the first hole 1221 and the first step surface 1213. In the example shown in fig. 14, the projected area of the second hole 1222 on the first step surface 1213 may refer to an area surrounded by a pattern obtained by the intersection of the hole wall of the second hole 1222 and the first step surface 1213. In the example shown in fig. 14, the projection area of the second hole 1222 on the second step surface 1214 may refer to an area surrounded by a pattern obtained by the intersection of the hole wall of the second hole 1222 and the second step surface 1214. In the example shown in fig. 14, the projection area of the third hole 1223 on the second step surface 1214 may refer to an area surrounded by a pattern in which the hole walls of the third hole 1223 intersect with the second step surface 1214.

The pads on the circuit board assembly 1200 shown in fig. 14 can refer to the pads shown in fig. 6 to 7, and thus, a detailed description thereof is not necessary.

The structure of the frame plate 1203 is explained in detail by fig. 16.

Fig. 16 (a) is a schematic sectional view of a frame plate 1203.

The frame plate 1203 may include at least one first connection line 1452. Each of the first connecting lines 1452 is disposed in parallel with respect to the first direction of the frame plate. Each first connection line 1452 is connected between the first step surface 1213 of the frame plate 1203 and the second horizontal surface 1212 of the frame plate 1203, so that the first inner circuit board 1204 may be electrically connected with the second outer circuit board 1202 through at least one first connection line 1452 within the frame.

The frame plate 1203 may also include at least one second connection line 1451. Each of the second connection lines 1451 is disposed in parallel with respect to the first direction of the framed panel. Each of the second connection lines 1451 is connected between the first horizontal surface 1211 of the frame plate 1203 and the second horizontal surface 1212 of the frame plate 1203, so that the first outer circuit board 1201 can be electrically connected to the second outer circuit board 1202 through at least one of the second connection lines 1451 in the frame plate 1203.

The frame plate 1203 may also include at least one third connection line 1453. Each of the third connecting lines 1453 is disposed in parallel with respect to the first direction of the framed panel. Each third connection line 1453 is connected between the second step face 1214 of the frame plate 1203 and the second horizontal face 1212 of the frame plate 1203 such that the second inner circuit board 1205 can be electrically connected with the second outer circuit board 1202 through at least one third connection line 1453 within the frame.

Optionally, the frame plate 1203 may further comprise one or more transverse connection lines arranged perpendicularly with respect to the first direction of the frame plate 1203. The lateral connection lines may be used, for example, to enable electrical connection between the first connection line 1452 and the second connection line 1451, and/or electrical connection between the first connection line 1452 and the third connection line 1453, and/or electrical connection between the second connection line 1451 and the third connection line 1453.

The specific processing manner of the frame plate 1203 shown in fig. 16 (a) can refer to the embodiment shown in fig. 9, and thus, a detailed description thereof is not necessary.

Fig. 16 (b) is a schematic sectional view of a frame plate 1203.

The frame plate 1203 may include at least one first longitudinal wire 1455, a first inner side pad 1242, a second outer side pad 1244. First inner pad 1242 is provided on first step face 1213. A second outboard pad 1244 is disposed on the second horizontal plane 1212. Each first longitudinal wire 1455 is connected between the first inner side bonding pad 1242 and the second outer side bonding pad 1244, so that the first inner side circuit board 1204 can be electrically connected with the second outer side circuit board 1202 through the first inner side bonding pad 1242, at least one first longitudinal wire 1455, and the second outer side bonding pad 1244.

The frame plate 1203 may also include at least one second longitudinal wire 1454, a first outer side pad 1241, and a third outer side pad 1243. The first outer pads 1241 are disposed on the first horizontal surface 1211. The third outer side pad 1243 is disposed on the second horizontal plane 1212. Each second longitudinal wire 1454 is connected between the first outer side pad 1241 and the third outer side pad 1243 so that the first outer side circuit board 1201 can be electrically connected with the second outer side circuit board 1202 through the first outer side pad 1241, at least one second longitudinal wire 1454, and the third outer side pad 1243.

The frame plate 1203 may also include at least one third longitudinal wire 1456, a second inboard pad 1245, and a fourth outboard pad 1246. A second inner side pad 1245 is disposed on the second step face 1214. A fourth outboard pad 1246 is disposed on the second horizontal plane 1212. Each third longitudinal wire 1456 is connected between the second inner side pad 1245 and the fourth outer side pad 1246 so that the second inner side circuit board 1205 can be electrically connected to the second outer side circuit board 1202 through the second inner side pad 1245, at least one third longitudinal wire 1456, and the fourth outer side pad 1246.

Optionally, the frame plate 1203 may further include one or more transverse wires arranged perpendicularly with respect to the first direction of the frame plate 1203. The transverse wires may be used, for example, to make electrical connections between the first longitudinal wires 1455, the second longitudinal wires 1454, and/or between the first longitudinal wires 1455, the third longitudinal wires 1456, and/or between the second longitudinal wires 1454, the third longitudinal wires 1456.

The specific processing manner of the frame plate 1203 shown in fig. 16 (b) can refer to the embodiment shown in fig. 11, and thus, a detailed description thereof is not necessary.

Fig. 16 (c) is a schematic sectional view of a frame plate 1203.

The frame plate 1203 may include a plurality of first lateral lines 1459 disposed at intervals, and at least one first via hole 1460. The plurality of first transverse wires 1459 and the at least one first via 1460 are used to electrically connect to a circuit board or an electronic component disposed on the first stepped surface 1213 and the second horizontal surface 1212. Any one of the first via holes 1460 is disposed in parallel with respect to the first direction of the frame plate. Any one of the first via holes 1460 is connected between adjacent two of the first lateral wires 1459. The plurality of first lateral wires 1459 may include a first lateral wire 1459 disposed on a first step surface 1213 of the frame plate 1203, and a first lateral wire 1459 disposed on a second horizontal surface 1212 of the frame plate 1203. Accordingly, the first inner circuit board 1204 may be electrically connected to the second outer circuit board 1202 through the plurality of first transverse wires 1459 and the at least one first via 1460.

The frame plate 1203 may further include a plurality of second lateral wires 1457 disposed at intervals, and at least one second via 1458. The plurality of second transverse wires 1457 and the at least one second via 1458 are used to electrically connect to a circuit board or an electronic component disposed on the first and second horizontal surfaces 1211 and 1212. Any one of the second via holes 1458 is disposed in parallel with respect to the first direction of the frame plate. Any one of the second via holes 1458 is connected between adjacent two of the second transverse wires 1457. The plurality of second transverse wires 1457 may include second transverse wires 1457 disposed on the first horizontal surface 1211 of the frame plate 1203 and second transverse wires 1457 disposed on the second horizontal surface 1212 of the frame plate 1203. Accordingly, the first outer circuit board 1201 can be electrically connected to the second outer circuit board 1202 through the plurality of second lateral wires 1457 and the at least one second via 1458. Alternatively, as shown in (c) of fig. 16, the first lateral wire 1459 provided on the first step surface 1213 may not be connected to any of the second lateral wires 1457.

The frame plate 1203 may further include a plurality of third transverse lines 1461 arranged at intervals, and at least one third via hole 1462. The plurality of third transverse lines 1461 and the at least one third via hole 1462 are used for electrical connection with a circuit board or an electronic component disposed on the second step surface 1214 and the second horizontal surface 1212. Any one of the third via holes 1462 is disposed in parallel with respect to the first direction of the frame plate. Any one of the third via holes 1462 is connected between the adjacent two third transverse lines 1461. The plurality of third transverse lines 1461 may include third transverse lines 1461 provided on the second step surface 1214 of the frame plate 1203, and third transverse lines 1461 provided on the second horizontal surface 1212 of the frame plate 1203. Accordingly, the second inner board 1205 can be electrically connected to the second outer board 1202 through the plurality of third transverse lines 1461 and the at least one third via 1462. Alternatively, as shown in (c) of fig. 16, the third transverse wire 1461 provided on the second step face 1214 may be connected to any one of the second transverse wires 1457.

Alternatively, the transverse lines may be spaced apart in a direction parallel to the horizontal plane (or X-Y plane) of the circuit board, and may also be spaced apart in a first direction (Z direction) parallel to the circuit board. By providing the transverse wiring on the target plane parallel to the horizontal plane of the circuit board, a plurality of via holes can be electrically connected together, the plurality of via holes being arranged at intervals in a direction parallel to the horizontal plane of the circuit board. For example, a lateral line may be used to achieve electrical connection between the first via 1460 and the second via 1458, and/or electrical connection between the first via 1460 and the third via 1462, and/or electrical connection between the second via 1458 and the third via 1462. It should be noted that such connection may be achieved through direct connection of the transverse lines, or through indirect connection of the transverse lines with other lines.

The specific processing manner of the frame plate 1203 shown in fig. 16 (c) can refer to the embodiment shown in fig. 13, and thus, a detailed description thereof is not necessary.

Compared with the frame plate 1203 shown in fig. 4, the frame plate 1203 shown in fig. 14 includes a larger number of step surfaces in the step holes 1220, so that more electronic components can be accommodated in the step holes 1220, the assembly compactness of the circuit board and the electronic components is improved, and the occupied space in the transverse direction (X, Y direction) of the circuit board assembly 1200 is reduced. In order to ensure the mechanical strength of the frame plate 1203, the height of the frame plate 1203 shown in fig. 14 may be slightly higher relative to the height of the frame plate 1203 shown in fig. 4.

Fig. 17 is a schematic structural diagram of a circuit board assembly according to an embodiment of the present application. The structure of frame plate 1503 in fig. 17 is slightly different from that of frame plate 1203 in fig. 14, as compared with circuit board assembly 1200 shown in fig. 14. In the frame plate 1503 shown in fig. 17, a projected area of the second hole 1522 on the first step surface 1513 is located within a projected area of the first hole 1521 on the first step surface 1513; the projected area of the third bore on the second step surface 1514 is located within the projected area of the second bore 1522 on the second step surface 1514. Due to the different structures of the frame plates, the electrical connection manner between the plurality of circuit boards provided on the frame plates is also different. Next, referring to fig. 18, the structure of the frame plate 1503 and the manner of electrical connection between the plurality of circuit boards will be described. In the example shown in fig. 17, the projected area of the second hole 1522 on the second step surface 1514 may refer to an area surrounded by a pattern obtained by intersection of the hole wall of the second hole 1522 and the second step surface 1514. In the example shown in fig. 17, the projected area of the third hole 1523 on the second step surface 1514 may refer to an area surrounded by a pattern in which the hole walls of the third hole 1523 intersect with the second step surface 1514.

In one example, the circuit board assembly 1500 may include at least one of a Radio Frequency (RF) circuit board, an Application Processor (AP) circuit board.

An RF circuit board may for example refer to a circuit board provided with radio frequency electronic components. The radio frequency electronic components may include, for example, RF ICs, RF PAs, WIFI chips, and the like.

The AP circuit board may be, for example, to a circuit board provided with application electronics. Application electronics may include, for example, SOC0 components, DDR memory, PMUs, PoP components, and so on.

For example, the first outer circuit board 1501, the second outer circuit board 1502, the first inner circuit board 1504, and the second inner circuit board 1505 are all RF circuit boards.

For another example, the first outer circuit board 1501, the second outer circuit board 1502, the first inner circuit board 1504, and the second inner circuit board 1505 are all AP circuit boards.

For another example, the first outer circuit board 1501 and the second outer circuit board 1502 are both RF circuit boards, and the first inner circuit board 1504 and the second inner circuit board 1505 are both AP circuit boards.

For another example, the first outer circuit board 1501 and the second outer circuit board 1502 are both AP circuit boards, and the first inner circuit board 1504 and the second inner circuit board 1505 are both RF circuit boards.

For another example, the first outer circuit board 1501 is an RF circuit board, and the second outer circuit board 1502, the first inner circuit board 1504, and the second inner circuit board 1505 are AP circuit boards.

For another example, the first outer circuit board 1501 is an AP circuit board, and the second outer circuit board 1502, the first inner circuit board 1504, and the second inner circuit board 1505 are RF circuit boards.

For another example, the first inner circuit board 1504 is an RF circuit board, and the first outer circuit board 1501, the second outer circuit board 1502 and the second inner circuit board 1505 are AP circuit boards.

For another example, the first inner circuit board 1504 is an AP circuit board, and the first outer circuit board 1501, the second outer circuit board 1502, and the second inner circuit board 1505 are RF circuit boards.

For another example, the first outer circuit board 1501 and the first inner circuit board 1504 are both RF circuit boards, and the second outer circuit board 1502 and the second inner circuit board 1505 are both AP circuit boards.

For another example, the first outer circuit board 1501 and the first inner circuit board 1504 are both AP circuit boards, and the second outer circuit board 1502 and the second inner circuit board 1505 are both RF circuit boards.

The pads on the circuit board assembly 1500 shown in fig. 17 can refer to the pads shown in fig. 6 to 7, and thus, a detailed description thereof is not necessary.

As shown in fig. 17, the third aperture 2523 in the circuit board assembly 1500 may be relatively large, and the circuit board assembly 1500 may more easily accommodate more electronic components. With a given number of electronic components, the circuit board assembly 1500 is more likely to have a relatively small volume. A relatively small circuit board assembly may provide space for other electronic components. In one example, the volume of a circuit board assembly in the camera module is reduced, which is beneficial to increasing the zoom distance of a lens in the camera, and further can be beneficial to improving the shooting effect of the camera module; in addition, the installation of electronic components in the camera is facilitated.

Fig. 18 (a) is a schematic cross-sectional view of a frame plate 1503.

Frame plate 1503 may include at least one first connection line 1652. Each first connection line 1652 is arranged in parallel with respect to the first direction of the frame plate 1503. Each first connection line 1652 is connected between the first step face 1513 of the frame plate 1503 and the second step face 1514 of the frame plate 1503, so that the first inner circuit board 1504 can be electrically connected to the second inner circuit board 1505 by at least one first connection line 1652 in the frame plate 1503.

Frame plate 1503 may also include at least one second connection line 1651. Each second connection line 1651 is arranged in parallel with respect to the first direction of the frame plate 1503. Each second connection line 1651 is connected between the first horizontal plane 1511 of the frame plate 1503 and the second horizontal plane 1512 of the frame plate 1503, so that the first outer circuit board 1501 may be electrically connected to the second outer circuit board 1502 through at least one second connection line 1651 within the frame plate 1503.

Optionally, frame plate 1503 may also include one or more transverse connection lines arranged perpendicularly with respect to the first direction of frame plate 1503. The transverse connection lines may be used, for example, to make electrical connection between the first connection line 1652 and the second connection line 1651.

The specific processing manner of frame plate 1503 shown in fig. 18 (a) can refer to the embodiment shown in fig. 9, and thus, a detailed description thereof is not necessary.

Fig. 18 (b) is a schematic cross-sectional view of a frame plate 1503.

Frame plate 1503 may include at least one first longitudinal wire 1654, first inner bond pad 1642, second inner bond pad 1644. The first inner land 1642 is provided on the first step surface 1513. The second inner land 1644 is provided on the second step surface 1514. Each first longitudinal wire 1654 is connected between the first inner pad 1642 and the second inner pad 1644, so that the first inner circuit board 1504 can be electrically connected with the second inner circuit board 1505 through the first inner pad 1642, at least one first longitudinal wire 1654, and the second inner pad 1644.

Frame plate 1503 may also include at least one second longitudinal wire 1653, first outside land 1641, and second outside land 1643. The first outside pad 1641 is disposed on the first horizontal plane 1511. A second outboard pad 1643 is disposed on the second horizontal plane 1512. Each second longitudinal wire 1653 is connected between the first outer pad 1641 and the second outer pad 1643 so that the first outer circuit board 1501 may be electrically connected with the second outer circuit board 1502 through the first outer pad 1641, at least one second longitudinal wire 1653, and the second outer pad 1643.

Optionally, frame plate 1503 may also include one or more transverse lines arranged perpendicularly with respect to the first direction of frame plate 1503. The transverse wires may be used, for example, to make electrical connections between the first and second longitudinal wires 1654, 1653.

The specific processing manner of frame plate 1503 shown in fig. 18 (b) can refer to the embodiment shown in fig. 11, and thus, a detailed description thereof is not necessary.

Fig. 18 (c) is a schematic sectional view of a frame plate 1503.

Frame plate 1503 may also include a plurality of first transverse lines 1657 disposed at intervals, and at least one first via hole 1658. The plurality of first transverse lines 1657 and the at least one first via hole 1658 are used to electrically connect with a circuit board or an electronic component disposed on the first step surface 1513 and the second step surface 1514. Any one of the first via holes 1658 is disposed in parallel with respect to the first direction of the frame plate 1503. Any one of the first via holes 1658 is connected between adjacent two of the first transverse lines 1657. The plurality of first transverse lines 1657 may include a first transverse line 1657 provided on the first step surface 1513 of the frame plate 1503, and a first transverse line 1657 provided on the second step surface 1514 of the frame plate 1503. Accordingly, the first inner circuit board 1504 may be electrically connected to the second inner circuit board 1505 through the plurality of first transverse wires 1657 and the at least one first via hole 1658.

The frame plate 1503 may include a plurality of second lateral lines 1655 disposed at intervals, and at least one fourth via 1656. The plurality of second transverse wires 1655 and the at least one fourth via hole 1656 are used for electrical connection with a circuit board or an electronic component disposed on the first horizontal surface 1511 and the second horizontal surface 1512. Any one of the fourth via holes 1656 is disposed in parallel with respect to the first direction of the frame plate 1503. Any one of the fourth via holes 1656 is connected between adjacent two of the second transverse lines 1655. The plurality of second transverse wires 1655 may include a second transverse wire 1655 disposed on the first horizontal surface 1511 of the frame plate 1503, and a second transverse wire 1655 disposed on the second horizontal surface 1512 of the frame plate 1503. Accordingly, the first outer circuit board 1501 may be electrically connected to the second outer circuit board 1502 through the plurality of second transverse wires 1655 and the at least one fourth via 1656. Alternatively, as shown in (c) of fig. 18, the first transverse line 1657 provided on the first step surface 1513 may not be connected to any of the second transverse lines 1655; the first lateral line 1657 provided on the second step surface 1514 may be connected to any one of the second lateral lines 1655.

Alternatively, the transverse lines may be spaced apart in a direction parallel to the horizontal plane (or X-Y plane) of the circuit board, and may also be spaced apart in a first direction (Z direction) parallel to the circuit board. By providing the transverse wiring on the target plane parallel to the horizontal plane of the circuit board, a plurality of via holes can be electrically connected together, the plurality of via holes being arranged at intervals in a direction parallel to the horizontal plane of the circuit board. For example, a lateral line may be used to realize electrical connection between the first via hole 1658 and the fourth via hole 1656.

The specific processing manner of frame plate 1503 shown in fig. 18 (c) can refer to the embodiment shown in fig. 13, and thus, a detailed description thereof is not necessary.

Frame plate 1503 shown in fig. 18 is advantageous in that, compared with frame plate 1503 shown in fig. 14, since the space in stepped hole 1520 is relatively large, more electronic components can be accommodated in stepped hole 1520, the compactness of assembling the circuit board and the electronic components is improved, and the occupied space in the lateral direction (X, Y direction) of the circuit board assembly is reduced. Frame plate 1503 shown in fig. 18 can be electrically connected in a different manner from frame plate 1503 shown in fig. 14. Different frame plate 1503 configurations may enable flexible routing formats.

In the embodiment shown in fig. 4, the stepped bore may include 1 stepped surface. In the embodiment shown in fig. 14, 17, the stepped bore may include 2 stepped surfaces. If the number of step surfaces in the step hole is large, more circuit boards and electronic components can be accommodated in the step hole. Fig. 19 and 20 show a circuit board assembly provided by an embodiment of the present application. As shown in fig. 19, stepped bore 1720 may include 4 stepped surfaces 1721. As shown in fig. 20, the stepped bore 1820 may include 6 stepped surfaces 1821. The number of step faces in 1 step hole is suggested to be 1-6.

Fig. 21 is a schematic structural diagram of a circuit board assembly according to an embodiment of the present application. The structure of the frame plate 1903 of the circuit board assembly 1900 shown in fig. 21 is similar to the structure of the frame plate 1703 of the circuit board assembly 1700 shown in fig. 19. The difference between circuit board assembly 1900 shown in fig. 21 and circuit board assembly 1700 shown in fig. 19 includes that circuit boards other than frame plate 1903 in circuit board assembly 1900 may be disposed in stepped hole 1920 of frame plate 1903. As shown in fig. 21, by providing the first inner circuit board 1901 on the first step face 1913, electrical connection between the first inner circuit board 1901 and the frame plate 1903 can be achieved. By disposing the second inner circuit board 1904 on the second step face 1914, electrical connection between the second inner circuit board 1904 and the frame plate 1903 can be achieved. By providing the third inner circuit board 1905 on the third step face 1915, electrical connection between the third inner circuit board 1905 and the frame plate 1903 can be achieved. By providing the fourth inner circuit board 1902 on the fourth step surface 1916, electrical connection between the fourth inner circuit board 1902 and the frame plate 1903 can be achieved.

The frame plate 1903 of the circuit board assembly 1900 shown in fig. 21 may surround the first and second inner circuit boards 1901, 1902 relative to the circuit board assembly 1700 shown in fig. 19, increasing the mechanical stability of the circuit board assembly 1900. Compared with the circuit board assembly 1900 shown in fig. 21, the circuit board assembly 1700 shown in fig. 19 can accommodate more electronic components in the stepped hole 1720, so that the assembly compactness of the circuit board and the electronic components is improved, and the occupied space in the transverse direction (X, Y direction) of the circuit board assembly is reduced. The embodiment shown in fig. 21 can also be combined with other embodiments to create new embodiments. Many modifications and other embodiments of the disclosure will come to mind to one skilled in the art to which this disclosure pertains having the benefit of the teachings presented in the embodiments herein. Therefore, it is to be understood that the application is not limited to the specific embodiments disclosed.

Fig. 22 is a schematic structural diagram of a circuit board assembly according to an embodiment of the present application. The structure of the frame plate 2003 in fig. 22 is slightly different from the structure of the frame plate 1203 in fig. 14, as compared to the circuit board assembly 1200 shown in fig. 14. In the frame plate 2003 shown in fig. 22, a projection area of the first hole 2021 on the first stepped surface 2013 is located within a projection area of the second hole 2022 on the first stepped surface 2013; the projected area of the third hole 2023 on the second step surface 2014 is located within the projected area of the second hole 2022 on the second step surface 2014. It should be noted that the circuit board disposed in the stepped hole 2020 may be a flexible circuit board.

As shown in fig. 23, the first outer circuit board 2001 can be fixed on the first horizontal plane 2011 by the pads 2041 on the first horizontal plane 2011, and electrical connection between the first outer circuit board 2001 and the frame plate 2003 is achieved. The second inner circuit board 2005 can be fixed on the second step surface 2014 by the land 2042 on the second step surface 2014, and electrical connection between the second inner circuit board 2005 and the frame plate 2003 is achieved. The first inner circuit board 2004 may be fixed to the first step surface 2013 of the frame plate 2003, and the second outer circuit board 2002 may be fixed to the second horizontal surface 2012 of the frame plate 2003, and the specific fixing manner will not be described herein again.

Due to the different structures of the frame plates, the electrical connection manner between the plurality of circuit boards provided on the frame plates is also different. Next, referring to fig. 24, the structure of the frame plate 2003 and the manner of electrical connection between the plurality of circuit boards will be described.

Fig. 24 (a) is a schematic cross-sectional view of a frame plate 2003.

The frame plate 2003 may include at least one first connection line 2252. Each of the first connection lines 2252 is arranged in parallel with respect to the first direction of the frame plate 2003. Each first connection line 2252 is connected between the first horizontal surface 2011 of the frame plate 2003 and the first step surface 2013 of the frame plate 2003, so that the first inner circuit board 2004 may be electrically connected to the first outer circuit board 2001 by at least one first connection line 2252 in the frame.

The frame plate 2003 may also include at least one second connection line 2251. Each of the second connection lines 2251 is arranged in parallel with respect to the first direction of the frame plate 2003. Each of the second connection lines 2251 is connected between the first horizontal plane 2011 of the frame plate 2003 and the second horizontal plane 2012 of the frame plate 2003, so that the first outside circuit board 2001 may be electrically connected to the second outside circuit board 2002 by at least one second connection line 2251 in the frame plate 2003.

The frame plate 2003 may also include at least one third connection line 2253. Each of the third connection lines 2253 is arranged in parallel with respect to the first direction of the frame plate 2003. Each of the third connection lines 2253 is connected between the second step face 2014 of the frame plate 2003 and the second horizontal face 2012 of the frame plate 2003, so that the second inner circuit board 2005 can be electrically connected to the second outer circuit board 2002 by at least one third connection line 2253 in the frame.

Optionally, the frame plate 2003 may further include one or more transverse connecting lines arranged perpendicularly with respect to the first direction of the frame plate 2003. The transverse connection lines may be used, for example, to make an electrical connection between the first connection line 2252 and the second connection line 2251, and/or between the second connection line 2251 and the third connection line 2253.

The specific processing manner of the frame plate 2003 shown in fig. 24 (a) can be referred to the embodiment shown in fig. 9, and thus, a detailed description thereof is not necessary.

Fig. 24 (b) is a schematic cross-sectional view of a frame plate 2003.

The frame plate 2003 may include at least one first longitudinal line 2255, a first inboard pad 2244, and a fifth outboard pad 2243. A first inside land 2244 is provided on the first step surface 2013. The fifth outside pad 2243 is disposed on the first horizontal plane 2011. Each of the first longitudinal lines 2255 is connected between the first inner pad 2244 and the fifth outer pad 2243 so that the first inner board 2004 may be electrically connected with the first outer board 2001 through the first inner pad 2244, at least one of the first longitudinal lines 2255, and the fifth outer pad 2243.

The frame plate 2003 may further include at least one second longitudinal wire 2254, a first outer pad 2241, and a second outer pad 2242. The first outside pad 2241 is disposed on the first horizontal plane 2011. A second outboard pad 2242 is disposed on the second horizontal plane 2012. Each of the second longitudinal lines 2254 is connected between the first outer pad 2241 and the second outer pad 2242, so that the first outer board 2001 can be electrically connected to the second outer board 2002 through the first outer pad 2241, at least one of the second longitudinal lines 2254, and the second outer pad 2242.

The frame plate 2003 may also include at least one third longitudinal line 2256, a second inboard pad 2246, and a sixth outboard pad 2245. The second inside land 2246 is provided on the second step face 2014. The sixth outside pad 2245 is disposed on the second horizontal plane 2012. Each third longitudinal wiring 2256 is connected between the second inside land 2246 and the sixth outside land 2245, so that the second inside circuit board 2005 can be electrically connected to the second outside circuit board 2002 through the second inside land 2246, at least one third longitudinal wiring 2256, and the sixth outside land 2245.

Optionally, the frame plate 2003 may further include one or more transverse wires arranged perpendicularly with respect to the first direction of the frame plate 2003. The transverse lines can be used, for example, to make electrical connections between the first longitudinal line 2255 and the second longitudinal line 2254, and/or between the second longitudinal line 2254 and the third longitudinal line 2256.

The specific processing manner of the frame plate 2003 shown in fig. 24 (b) can be referred to the embodiment shown in fig. 11, and thus, a detailed description thereof is not necessary.

Fig. 24 (c) is a schematic sectional view of a frame plate 2003.

The frame plate 2003 may further include a plurality of first lateral lines 2259 arranged at intervals, and a plurality of first via holes 2260. The plurality of first lateral lines 2259 and the plurality of first via holes 2260 are used for electrical connection with a circuit board or an electronic component disposed on the first horizontal plane 2011 or the first step surface 2013. The projected area of the first lateral line 2259 on the first horizontal plane 2011 is located at least partially within the projected area of the first step surface 2013 on the first horizontal plane 2011. A projected area of the first via 2260 on the first horizontal plane 2011 is at least partially located within a projected area of the first step surface 2013 on the first horizontal plane 2011. Any one of the first via holes 2260 is disposed in parallel with respect to the first direction of the frame plate 2003. Any one of the first via holes 2260 is connected between two adjacent first lateral lines 2259. The plurality of first lateral lines 2259 may include a first lateral line 2259 provided on the first horizontal surface 2011 of the frame plate 2003, and a first lateral line 2259 provided on the first step surface 2013 of the frame plate 2003. Accordingly, the first outer circuit board 2001 may be electrically connected with the first inner circuit board 2004 through the plurality of first transverse lines 2259 and the plurality of first via holes 2260.

The frame plate 2003 may include a plurality of second lateral lines 2257 arranged at intervals, and a plurality of second via holes 2258. The plurality of second lateral lines 2257 and the plurality of second via holes 2258 are used to electrically connect to a circuit board or an electronic component disposed on the first horizontal plane 2011 or the second horizontal plane 2012. The projected area of the second lateral line 2257 on the first horizontal plane 2011 is located at least partially outside the projected area of the first step surface 2013 on the first horizontal plane 2011. A projection area of the second transverse line 2257 on the second horizontal plane 2012 is at least partially located outside a projection area of the second step surface 2014 on the second horizontal plane 2012. The projected area of the second via 2258 on the first horizontal plane 2011 is at least partially outside the projected area of the first step surface 2013 on the first horizontal plane 2011. The projected area of the second via 2258 on the second horizontal plane 2012 is at least partially located outside the projected area of the second step surface 2014 on the second horizontal plane 2012. Any one of the second via holes 2258 is disposed in parallel with respect to the first direction of the frame plate 2003. Any one of the second via holes 2258 is connected between two adjacent second lateral lines 2257. The plurality of second lateral lines 2257 may include a second lateral line 2257 disposed on the first horizontal plane 2011 of the frame plate 2003 and a second lateral line 2257 disposed on the second horizontal plane 2012 of the frame plate 2003. Accordingly, the first outer circuit board 2001 can be electrically connected with the second outer circuit board 2002 through the plurality of second transverse wires 2257 and the plurality of second via holes 2258. Alternatively, as shown in (c) of fig. 24, the first transverse line 2259 provided on the first step surface 2013 may be connected to the second transverse line 2257, or may not be connected to any of the second transverse lines 2257.

The frame plate 2003 may further include a plurality of third lateral lines 2261, and a plurality of third via holes 2262, which are disposed at intervals. The plurality of third lateral lines 2261 and the plurality of third via holes 2262 are used for electrical connection with a circuit board or an electronic component disposed on the second horizontal plane 2012 or the second step plane 2014. The projection area of the third transverse line 2261 on the second horizontal plane 2012 is at least partially located within the projection area of the second step surface 2014 on the second horizontal plane 2012. The projection area of the third via 2262 on the second horizontal plane 2012 is at least partially located within the projection area of the second step 2014 on the second horizontal plane 2012. Any one of the third via holes 2262 is disposed in parallel with respect to the first direction of the frame plate 2003. Any one of the third via holes 2262 is connected between adjacent two of the third lateral lines 2261. The plurality of third lateral lines 2261 may include a third lateral line 2261 disposed on the second horizontal surface 2012 of the framed panel 2003, and a third lateral line 2261 disposed on the second step surface 2014 of the framed panel 2003. Accordingly, the second outer circuit board 2002 may be electrically connected to the second inner circuit board 2005 through the plurality of third transverse lines 2261 and the plurality of third via holes 2262. Alternatively, as shown in fig. 24 (c), the third transverse line 2261 provided on the second step surface 2014 may or may not be connected to the second transverse line 2257.

Alternatively, the transverse lines may be spaced apart in a direction parallel to the horizontal plane (or X-Y plane) of the circuit board, and may also be spaced apart in a first direction (Z direction) parallel to the circuit board. By providing the transverse wiring on the target plane parallel to the horizontal plane of the circuit board, a plurality of via holes can be electrically connected together, the plurality of via holes being arranged at intervals in a direction parallel to the horizontal plane of the circuit board. For example, a lateral route may be used to achieve electrical connection between the first via 2260 and the second via 2258, and/or electrical connection between the second via 2258 and the third via 2262.

The specific processing manner of the frame plate 2003 shown in fig. 24 (c) can refer to the embodiment shown in fig. 13, and thus, a detailed description thereof is not necessary.

The frame plate 2003 shown in fig. 24 contributes to an improvement in mechanical stability of the circuit board assembly, compared to the frame plate 2003 shown in fig. 14, since the second hole of the stepped hole can restrain the circuit board disposed in the second hole to some extent. The frame plate 2003 shown in fig. 24 is different from the frame plate 2003 shown in fig. 14 in the electrical connection manner. Different frame plate 2003 configurations allow for flexible routing.

Fig. 25 is a schematic structural diagram of a circuit board assembly according to an embodiment of the present application. The circuit board assembly 2300 may be one example of the circuit board assembly 30 of the electronic device 100 shown in fig. 1.

The circuit board assembly 2300 may include a first circuit board 2305. As shown in fig. 25, the first circuit board 2305 may include a first stepped portion 2315. The first step 2315 may include fifth and sixth step surfaces 2311 and 2312. The fifth step surface 2311 and the sixth step surface 2312 are both located on the same side of the first circuit board 2305. The fifth and sixth step surfaces 2311 and 2312 may be disposed perpendicularly to the first direction (Z direction) of the first circuit board 2305, and the fifth step surface 2311 may be spaced apart from the sixth step surface 2312. The first circuit board 2305 may also include a second step 2316. The second step 2316 may include seventh and eighth step surfaces 2313 and 2314. The seventh step surface 2313 and the eighth step surface 2314 are both located on the same side of the first circuit board 2305. The fifth and seventh step surfaces 2311 and 2313 may be located at both sides of the first circuit board 2305. The sixth and eighth step surfaces 2312 and 2314 may be located at both sides of the first circuit board 2305. The seventh and eighth step surfaces 2313 and 2314 may be spaced apart from each other in the first direction (Z direction) of the first circuit board 2305. By providing the positional relationship among the fifth step surface 2311, the sixth step surface 2312, the seventh step surface 2313 and the eighth step surface 2314, the overall structure of the first circuit board 2305 can be changed, and thus the assembly manner of the circuit board assembly 2300 can be changed. For example, as shown in fig. 26, the fifth step surface 2311 is disposed opposite to the seventh step surface 2313, the sixth step surface 2312 is disposed opposite to the eighth step surface 2314, and both a plane of the sixth step surface 2312 and a plane of the eighth step surface 2314 may be located between the fifth step surface 2311 and the seventh step surface 2313.

The first circuit board 2305 may be a frame plate, wherein the frame plate may include receiving cavities for receiving electronic components 2330. As shown in fig. 25, the first circuit board 2305 may further include a first receiving chamber 2321 and a second receiving chamber 2322 for receiving circuit boards and/or electronic components 2330. The shapes of the first and second receiving cavities 2321 and 2322 may be through holes, stepped holes, and the like. The first and second accommodating cavities 2321 and 2322 are disposed at both sides of the first step 2315 and at both sides of the second step 2316. The first receiving chamber 2321 may be located adjacent to the fifth and seventh step surfaces 2311 and 2313, and the second receiving chamber 2322 may be located adjacent to the sixth and eighth step surfaces 2312 and 2314. The height of the first receiving cavity 2321 (in the Z direction) may be different from the height of the second receiving cavity 2322 (in the Z direction).

The circuit board assembly 2300 may further include a second circuit board 2301, a third circuit board 2302, a fourth circuit board 2303, and a fifth circuit board 2304. As shown in fig. 26, the second circuit board 2301 can be fixed on the fifth step face 2311 by the first pads 2341 on the fifth step face 2311, and electrical connection between the second circuit board 2301 and the first circuit board 2305 is achieved. The third circuit board 2302 may be fixed on the sixth step surface 2312 and electrically connected to the first circuit board 2305 through the second pads 2342 on the sixth step surface 2312. The fourth circuit board 2303 may be fixed on the seventh step surface 2313 of the first circuit board 2305, and the fifth circuit board 2304 may be fixed on the eighth step surface 2314 of the first circuit board 2305, and the specific fixing manner is not described herein again. Both sides of the second circuit board 2301, the third circuit board 2302, the fourth circuit board 2303 and the fifth circuit board 2304 may be used to arrange electronic components 2330.

The structure of the first circuit board 2305 is explained in detail by fig. 27.

Fig. 27 (a) is a schematic cross-sectional view of a first circuit board 2305.

The first circuit board 2305 may include at least one fourth connection line 2551. Each of the fourth connection lines 2551 is disposed in parallel with respect to the first direction of the first circuit board 2305. Each of the fourth connection lines 2551 is connected between the fifth stepped surface 2311 of the first circuit board 2305 and the seventh stepped surface 2313 of the first circuit board 2305, so that the second circuit board 2301 can be electrically connected with the fourth circuit board 2303 through at least one fourth connection line 2551 in the first circuit board 2305.

The first circuit board 2305 may also include at least one fifth connection line 2552. Each of the fifth connection lines 2552 is disposed in parallel with respect to the first direction of the first circuit board 2305. Each of the fifth connection lines 2552 is connected between the sixth stepped surface 2312 of the first circuit board 2305 and the eighth stepped surface 2314 of the first circuit board 2305, so that the third circuit board 2302 can be electrically connected with the fifth circuit board 2304 through at least one fifth connection line 2552 in the frame.

Optionally, the first circuit board 2305 may further include one or more lateral connection lines arranged perpendicularly with respect to the first direction of the first circuit board 2305. The lateral connection line may be used, for example, to make an electrical connection between the fourth connection line 2551 and the fifth connection line 2552. The specific processing manner of the first circuit board 2305 shown in fig. 27 (a) can refer to the embodiment shown in fig. 9, and thus, a detailed description thereof is not necessary.

Fig. 27 (b) is a schematic cross-sectional view of a first circuit board 2305.

The first circuit board 2305 may include at least one fourth longitudinal wiring 2553, first pads 2341, and third pads 2343. The first pad 2341 is disposed on the fifth step face 2311. The third pad 2343 is provided on the seventh step face 2313. Each of the fourth longitudinal wires 2553 is connected between the first pads 2341 and the third pads 2343 so that the second circuit board 2301 can be electrically connected with the fourth circuit board 2303 through the first pads 2341, at least one of the fourth longitudinal wires 2553, and the third pads 2343.

The first circuit board 2305 may include at least one fifth longitudinal wiring 2554, second pads 2342, and fourth pads 2344. The second pad 2342 is disposed on the sixth step face 2312. The fourth pad 2344 is disposed on the eighth step face 2314. Each of the fifth longitudinal wires 2554 is connected between the second pads 2342 and the fourth pads 2344 so that the third circuit board 2302 can be electrically connected to the fifth circuit board 2304 through the second pads 2342, at least one of the fifth longitudinal wires 2554, and the fourth pads 2344.

Optionally, the first circuit board 2305 may also include one or more lateral traces disposed perpendicular with respect to the first direction of the first circuit board 2305. The transverse lines can be used, for example, to make an electrical connection between the fourth longitudinal line 2553 and the fifth longitudinal line 2554.

The specific processing manner of the first circuit board 2305 shown in fig. 27 (b) can refer to the embodiment shown in fig. 11, and thus, a detailed description thereof is not necessary.

Fig. 27 (c) is a schematic cross-sectional view of a first circuit board 2305.

The first circuit board 2305 may include a plurality of fourth lateral wires 2555 arranged at intervals, and a plurality of fourth via holes 2556. The fourth plurality of lateral lines 2555 and the fourth plurality of via holes 2556 are used to electrically connect the circuit board or the electronic component 2330 disposed on the fifth and seventh step surfaces 2311 and 2313. Any of the fourth via holes 2556 is disposed in parallel with respect to the first direction of the first circuit board 2305. Any one fourth via 2556 is connected between adjacent two fourth transverse lines 2555. The plurality of fourth lateral lines 2555 may include a fourth lateral line 2555 disposed on the fifth step surface 2311 of the first circuit board 2305, and a fourth lateral line 2555 disposed on the seventh step surface 2313 of the first circuit board 2305. Accordingly, the second circuit board 2301 can be electrically connected with the fourth circuit board 2303 through the plurality of fourth lateral lines 2555 and the plurality of fourth via holes 2556.

The first circuit board 2305 may include a plurality of fifth transverse wires 2557 arranged at intervals, and a plurality of fifth via holes 2558. The fifth lateral lines 2557 and the fifth via 2558 are electrically connected to the circuit board or the electronic component 2330 disposed on the sixth and eighth step surfaces 2312 and 2314. Any one of the fifth via holes 2558 is disposed in parallel with respect to the first direction of the first circuit board 2305. Any one of the fifth via 2558 is connected between adjacent two of the fifth transverse lines 2557. The plurality of fifth transverse wires 2557 may include fifth transverse wires 2557 disposed on the sixth stepped surface 2312 of the first circuit board 2305, and fifth transverse wires 2557 disposed on the eighth stepped surface 2314 of the first circuit board 2305. Accordingly, the third circuit board 2302 can be electrically connected to the fifth circuit board 2304 through the plurality of fifth transverse wires 2557 and the plurality of fifth via holes 2558. Alternatively, as shown in (c) of fig. 27, the fifth lateral line 2557 provided on the eighth step surface 2314 may be connected to any one of the fourth lateral lines 2555.

Alternatively, the transverse lines may be spaced apart in a direction parallel to the horizontal plane (or X-Y plane) of the circuit board, and may also be spaced apart in a first direction (Z direction) parallel to the circuit board. By providing the transverse wiring on the target plane parallel to the horizontal plane of the circuit board, a plurality of via holes can be electrically connected together, the plurality of via holes being arranged at intervals in a direction parallel to the horizontal plane of the circuit board. For example, a lateral line can be used to realize the electrical connection between the fourth and fifth vias 2556, 2558.

The specific processing manner of the first circuit board 2305 shown in fig. 27 (c) can refer to the embodiment shown in fig. 13, and thus, a detailed description thereof is not necessary.

In the embodiment of the present application, by providing the step portion on the first circuit board 2305, the height of the first circuit board 2305 can be locally reduced, and on the premise of reducing the material of the first circuit board 2305 to a limited extent, the occupied space of the circuit board assembly 2300 can be reduced, thereby improving the assembly compactness of the circuit board and the electronic component 2330. For example, a specially shaped device housing may be more easily accommodated.

By modifying the circuit board assembly shown in fig. 4 to 27, a plurality of embodiments shown in fig. 28 to 34 can be obtained. Other embodiments will be apparent to those skilled in the art from consideration of the specification and guidance presented in the associated drawings. Therefore, it is to be understood that the application is not limited to the specific embodiments disclosed. It should be understood that fig. 8, fig. 10, fig. 12, fig. 16, fig. 18, fig. 24, and fig. 27 may be referred to for specific structures of the circuit boards in fig. 28 to fig. 34, and fig. 9, fig. 11, and fig. 13 may be referred to for specific processing manners of the circuit boards, which need not be repeated herein.

Fig. 28 is a circuit board assembly according to an embodiment of the present disclosure. In contrast to the circuit board assembly 2300 shown in fig. 25, in the circuit board assembly 2600 shown in fig. 28, the first circuit board 2605 further includes a third step portion 2617 and a fourth step portion 2631. Third step portion 2617 may include fifth step surface 2611 and ninth step surface 2618. The fifth step surface 2611 and the ninth step surface 2618 may be located on the same side of the first circuit board 2605. The ninth step surface 2618 may be vertically disposed with respect to the first direction (Z direction) of the first circuit board 2605, and the fifth step surface 2611 may be disposed at a distance from the ninth step surface 2618. The fourth step portion 2631 may include seventh and tenth step surfaces 2613 and 2620. The seventh stepped surface 2613 and the tenth stepped surface 2620 may be located on the same side of the first circuit board 2605. The tenth step surface 2620 may be vertically disposed along the first direction (Z direction) of the first circuit board 2605, and the seventh step surface 2613 may be spaced apart from the tenth step surface 2620. The ninth step surface 2618 and the tenth step surface 2620 are disposed opposite to each other, and a plane where the ninth step surface 2618 is located and a plane where the tenth step surface 2620 is located may be located between the fifth step surface 2611 and the seventh step surface 2613.

The first circuit board 2605 may further include a third receiving cavity 2623 for receiving a circuit board and/or electronic components 2630. The third receiving cavity 2623 may have a shape of, for example, a through hole, a stepped hole, or the like. The third housing cavity 2623 is disposed on a side of the third stepped portion 2617 away from the second stepped portion. The height of the third accommodation cavity 2623 (in the Z direction) may be different from the height of the first accommodation cavity 2621 (in the Z direction). The circuit board assembly 2600 may further include a sixth circuit board 2606 and a seventh circuit board 2607. The sixth circuit board 2606 and the seventh circuit board 2607 are each provided with an electronic component 2630. The sixth circuit board 2606 may be fixed to the ninth step surface 2618 of the first circuit board 2605, and the seventh circuit board 2607 may be fixed to the tenth step surface 2620 of the first circuit board 2605.

Fig. 29 is a circuit board assembly according to an embodiment of the present disclosure. In contrast to the circuit board assembly 2600 shown in fig. 28, in the circuit board assembly 2700 shown in fig. 29, the first circuit board 2705 includes a first stepped portion 2715, a second stepped portion 2716, a third stepped portion 2717, and a fourth stepped portion 2719. The first step portion 2715 may include fifth and sixth step surfaces 2711 and 2712. The second step portion 2716 may include seventh and eighth step surfaces 2713, 2714. The third step portion 2717 may include fifth and ninth step surfaces 2711 and 2718. The fourth step portion 2719 may include a seventh step surface 2713 and a tenth step surface 2720. The fifth step surface 2711 and the seventh step surface 2713 are arranged oppositely, the sixth step surface 2712 and the eighth step surface 2714 are arranged oppositely, the ninth step surface 2718 and the tenth step surface 2720 are arranged oppositely, the plane where the fifth step surface 2711 is located and the plane where the seventh step surface 2713 is located can be located between the sixth step surface 2712 and the eighth step surface 2714, and the plane where the fifth step surface 2711 is located and the plane where the seventh step surface 2713 is located can be located between the ninth step surface 2718 and the tenth step surface 2720. It should be understood that if the ninth step surface 2718 is coplanar with the sixth step surface 2712 and the tenth step surface 2720 is coplanar with the eighth step surface 2714 and further includes a through hole for receiving a circuit board or an electronic component between the first step portion 2715 (or the second step portion 2716) and the third step portion 2717 (or the fourth step portion 2719), which may pass through the fifth step portion 2711 and the seventh step portion 2713, the first step portion 2715, the second step portion 2716, the third step portion 2717, and the fourth step portion 2719 collectively form a step hole, and the step surfaces in the step hole include the fifth step portion 2711 and the seventh step portion 2713, as shown in fig. 29.

Fig. 30 is a circuit board assembly according to an embodiment of the present disclosure. In contrast to circuit board assembly 2700 shown in fig. 29, in circuit board assembly 2800 shown in fig. 30, circuit board assembly 2800 may further include eighth circuit board 2808, ninth circuit board 2809. The eighth circuit board 2808 and the ninth circuit board 2809 are both arranged in parallel with respect to the first direction of the first circuit board 2805, i.e., the first direction of the eighth circuit board 2808 and the first direction of the ninth circuit board 2809 are both perpendicular to the first direction of the first circuit board 2805. Both sides of the eighth circuit board 2808 and both sides of the ninth circuit board 2809 may be used to mount electronic components 2830. As shown in (a) of fig. 30, the eighth circuit board 2808 may be fixed on a sixth stepped surface 2812 of the first circuit board 2805, and the ninth circuit board 2809 may be fixed on an eighth stepped surface 2814 of the first circuit board 2805. As shown in (b) of fig. 30, the eighth circuit board 2808 may be fixed on a fifth stepped surface 2811 of the first circuit board 2805, and the ninth circuit board 2809 may be fixed on a seventh stepped surface 2813 of the first circuit board 2805. Thus, the circuit board assembly 2800 shown in fig. 30 may take the form of a "cross-shaped" assembly.

Fig. 31 is a circuit board assembly according to an embodiment of the present disclosure. In contrast to the circuit board assembly 2300 shown in fig. 25, in the circuit board assembly 2900 shown in fig. 31, the first circuit board 2905 further includes a third step 2917 and a fourth step 2919. The third step portion 2917 may include fifth and ninth step surfaces 2911 and 2918. The ninth step surface 2918 may be vertically disposed with respect to the first direction of the first circuit board 2905, and the fifth step surface 2911 may be disposed spaced apart from the ninth step surface 2918. The fourth step portion 2919 may include a seventh step surface 2913, a tenth step surface 2920. The tenth step surface 2920 may be vertically disposed in the first direction of the first circuit board 2905, and the seventh step surface 2913 may be disposed spaced apart from the tenth step surface 2920. The ninth step surface 2918 is opposite to the tenth step surface 2920, and both a plane where the ninth step surface 2918 is located and a plane where the tenth step surface 2920 is located may be located between the fifth step surface 2911 and the seventh step surface 2913.

As shown in (a) of fig. 31, the circuit board assembly 2900 may further include a tenth circuit board 2961. The tenth circuit board 2961 may be disposed in parallel with respect to the first direction of the first circuit board 2905, i.e., the first direction of the tenth circuit board 2961 may be perpendicular to the first direction of the first circuit board 2905. The tenth circuit board 2961 may be used to arrange the electronic components 2930. The tenth circuit board 2961 may be fixed to the ninth step surface 2918 of the first circuit board 2905. Thus, the circuit board assembly 2900 shown in fig. 31(a) may present an "L-shaped" assembly.

As shown in (b) of fig. 31, the circuit board assembly 2900 may further include a tenth circuit board 2961, an eleventh circuit board 2962. The tenth circuit board 2961 and the eleventh circuit board 2962 may be disposed in parallel with respect to the first direction of the first circuit board 2905, i.e., the first direction of the tenth circuit board 2961 and the first direction of the eleventh circuit board 2962 may be perpendicular to the first direction of the first circuit board 2905. Both sides of the tenth circuit board 2961 and both sides of the eleventh circuit board 2962 may be used to dispose the electronic components 2930. The tenth circuit board 2961 may be fixed to the ninth step surface 2918 of the first circuit board 2905, and the eleventh circuit board 2962 may be fixed to the tenth step surface 2920 of the first circuit board 2905. Thus, the circuit board assembly 2900 shown in fig. 31(b) may present a "T-shaped" assembly.

Fig. 32 is a circuit board assembly according to an embodiment of the present disclosure. In contrast to the circuit board assembly 2900 shown in fig. 31(a), in the circuit board assembly 3000 shown in fig. 32, the first circuit board 3005 further includes a fifth stepped portion 3071 and a sixth stepped portion 3073. Fifth step 3071 may include sixth step face 3012, eleventh step face 3072. The eleventh step face 3072 may be disposed perpendicularly with respect to the first direction of the first circuit board 3005, and the sixth step face 3012 may be disposed spaced apart from the eleventh step face 3072. Sixth step 3073 may include eighth step face 3014, twelfth step face 3074. The twelfth step surface 3074 may be vertically disposed along the first direction of the first circuit board 3005, and the eighth step surface 3014 may be disposed spaced apart from the twelfth step surface 3074. Eleventh step surface 3072 is disposed opposite to twelfth step surface 3074, and a plane where sixth step surface 3012 is located and a plane where eighth step surface 3014 is located may be located between eleventh step surface 3072 and twelfth step surface 3074. The eleventh and twelfth step surfaces 3072, 3074 may be used to dispose circuit boards and/or electronic components 3030.

For example, as shown in (a) of fig. 32, the circuit board assembly 3000 may include tenth and twelfth circuit boards 3061 and 3063. Tenth circuit board 3061 and twelfth circuit board 3063 may each be arranged in parallel with respect to the first direction of first circuit board 3005, i.e., the first direction of tenth circuit board 3061 and the first direction of twelfth circuit board 3063 may be perpendicular to the first direction of first circuit board 3005. Both sides of the tenth circuit board 3061 and both sides of the twelfth circuit board 3063 may be used to dispose the electronic component 3030. The tenth circuit board 3061 may be fixed on the ninth stepped surface 3018 of the first circuit board 3005. The twelfth circuit board 3063 may be fixed to an eleventh step surface 3072 of the first circuit board 3005. Accordingly, the circuit board assembly 3000 shown in fig. 32(a) may take the form of a "U-shaped" assembly.

As shown in (b) of the drawing, the circuit board assembly 3000 may further include a tenth circuit board 3061, an eleventh circuit board 3062, a twelfth circuit board 3063, and a thirteenth circuit board 3064. Tenth circuit board 3061, eleventh circuit board 3062, twelfth circuit board 3063, and thirteenth circuit board 3064 may all be disposed in parallel with respect to the first direction of first circuit board 3005, i.e., the first direction of tenth circuit board 3061, the first direction of eleventh circuit board 3062, the first direction of twelfth circuit board 3063, and the first direction of thirteenth circuit board 3064 may all be perpendicular to the first direction of first circuit board 3005. Both sides of the tenth circuit board 3061, both sides of the eleventh circuit board 3062, both sides of the twelfth circuit board 3063, and both sides of the thirteenth circuit board 3064 may be used to dispose the electronic components 3030. Tenth circuit board 3061 may be secured to ninth step face 3018 of first circuit board 3005, eleventh circuit board 3062 may be secured to tenth step face 3020 of first circuit board 3005, twelfth circuit board 3063 may be secured to eleventh step face 3072 of first circuit board 3005, and thirteenth circuit board 3064 may be secured to twelfth step face 3074 of first circuit board 3005. Accordingly, the circuit board assembly 3000 shown in fig. 32(b) may take the form of an "H-shaped" assembly.

Fig. 33 is a circuit board assembly according to an embodiment of the present disclosure. In contrast to the circuit board assembly 2300 shown in fig. 25, in the circuit board assembly 3100 shown in fig. 33, the first circuit board 3105 further includes a fifth step portion 3171 and a sixth step portion 3173. Fifth step portion 3171 may include sixth step surface 3112 and eleventh step surface 3172. The eleventh step surface 3172 may be vertically disposed with respect to the first direction of the first circuit board 3105, and the sixth step surface 3112 may be disposed spaced apart from the eleventh step surface 3172. Sixth step portion 3173 may include eighth step surface 3114 and twelfth step surface 3174. The twelfth step surface 3174 may be vertically disposed along the first direction of the first circuit board 3105, and the eighth step surface 3114 may be disposed spaced apart from the twelfth step surface 3174. Eleventh step surface 3172 and twelfth step surface 3174 are disposed opposite to each other, and a plane on which sixth step surface 3112 is located and a plane on which eighth step surface 3114 is located may be located between eleventh step surface 3172 and twelfth step surface 3174. Eleventh and twelfth step surfaces 3172, 3174 may be used to mount a circuit board and/or an electronic component 3130 thereon.

For example, as shown in (a) of fig. 33, the circuit board assembly 3100 may include a twelfth circuit board 3163. The twelfth circuit board 3163 may be disposed in parallel with respect to the first direction of the first circuit board 3105, i.e., the first direction of the twelfth circuit board 3163 may be perpendicular to the first direction of the first circuit board 3105. Both sides of the twelfth circuit board 3163 may be used to dispose the electronic component 3130. The twelfth circuit board 3163 may be fixed on the eleventh step surface 3172 of the first circuit board 3105. Thus, the circuit board assembly 3100 shown in fig. 33(a) may take the form of an "L-shaped" assembly.

As shown in fig. (b), the circuit board assembly 3100 may further include a twelfth circuit board 3163, a thirteenth circuit board 3164. The twelfth circuit board 3163 and the thirteenth circuit board 3164 may be disposed in parallel with respect to the first direction of the first circuit board 3105, that is, the first direction of the twelfth circuit board 3163 and the first direction of the thirteenth circuit board 3164 may be perpendicular to the first direction of the first circuit board 3105. Both sides of the twelfth circuit board 3163 and both sides of the thirteenth circuit board 3164 may be used to dispose the electronic component 3130. The twelfth circuit board 3163 may be fixed on the eleventh step surface 3172 of the first circuit board 3105, and the thirteenth circuit board 3164 may be fixed on the twelfth step surface 3174 of the first circuit board 3105. Thus, the circuit board assembly 3100 shown in fig. 33(b) may take the form of a "T-shaped" assembly.

Fig. 34 is a circuit board assembly according to an embodiment of the present disclosure.

The circuit board assembly 3200 may include a first circuit board 3205. As shown in fig. 34, the first circuit board 3205 may include a first stepped portion 3215, a second stepped portion 3216, a third stepped portion 3217, and a fourth stepped portion 3219. The first step portion 3215 may include fifth and sixth step surfaces 3211, 3212. The fifth step surface 3211 and the sixth step surface 3212 may be disposed vertically with respect to the first direction of the first circuit board 3205, and the fifth step surface 3211 may be disposed at an interval from the sixth step surface 3212. The second step portion 3216 may include seventh and eighth step surfaces 3213, 3214. The seventh step surface 3213 and the eighth step surface 3214 may be spaced apart from each other in the first direction of the first circuit board 3205. The third step portion 3217 may include fifth and ninth step surfaces 3211, 3218. The ninth step surface 3218 may be disposed vertically with respect to the first direction of the first circuit board 3205, and the fifth step surface 3211 may be disposed at an interval from the ninth step surface 3218. The fourth stepped portion 3219 may include a seventh stepped surface 3213 and a tenth stepped surface 3220. The tenth step surface 3220 may be vertically disposed along the first direction of the first circuit board 3205, and the seventh step surface 3213 may be spaced apart from the tenth step surface 3220. A plane on which the ninth step surface 3218 is located and a plane on which the tenth step surface 3220 is located may be located between the fifth step surface 3211 and the seventh step surface 3213. The fifth step surface 3211 is opposite to the seventh step surface 3213, the sixth step surface 3212 is opposite to the eighth step surface 3214, and the ninth step surface 3218 is opposite to the tenth step surface 3220; a plane where the sixth step surface 3212 is located and a plane where the eighth step surface 3214 is located may be located between the fifth step surface 3211 and the seventh step surface 3213; in addition, both the plane on which the ninth step surface 3218 is located and the plane on which the tenth step surface 3220 is located may be located between the fifth step surface 3211 and the seventh step surface 3213.

The first circuit board 3205 may further include a first receiving cavity 3221 for receiving a circuit board and/or an electronic component 3230. The first receiving cavity 3221 may be shaped, for example, as a through hole, a stepped hole, or the like. The first receiving cavity 3221 may be located between the first stepped portion 3215 (or the second stepped portion 3216) and the third stepped portion 3217 (the fourth stepped portion 3219).

The fifth step surface 3211, the sixth step surface 3212, the seventh step surface 3213, the eighth step surface 3214, the ninth step surface 3218, and the tenth step surface 3220 may each be provided with a circuit board or an electronic component 3230. As shown in fig. 34, the circuit board assembly 3200 may further include a second circuit board 3201, a third circuit board 3202, a fourth circuit board 3203, and a fifth circuit board 3204. The fourth circuit board 3203 and the fifth circuit board 3204 may be disposed in parallel with respect to the first direction of the first circuit board 3205, i.e., the first direction of the fourth circuit board 3203 and the fifth circuit board 3204 may be perpendicular to the first direction of the first circuit board 3205. The second circuit board 3201 may be fixed on the fifth step surface 3211 of the first circuit board 3205. The third circuit board 3202 may be fixed on the seventh stepped surface 3213 of the first circuit board 3205. The fourth circuit board 3203 may be fixed on the sixth step surface 3212 of the first circuit board 3205. The fifth circuit board 3204 may be fixed on the ninth step surface 3218 of the first circuit board 3205. Both sides of the second circuit board 3201, both sides of the third circuit board 3202, both sides of the fourth circuit board 3203, and both sides of the fifth circuit board 3204 are used for disposing the electronic element 3230.

The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and all the changes or substitutions should be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.