阅读说明：本技术 一种快速固化树脂及其生产方法 (Fast curing resin and production method thereof ) 是由 徐晶 于 2019-02-22 设计创作，主要内容包括：本发明公开了一种快速固化树脂,其原料按重量份重量计如下：环氧树脂70-85份、低分子聚酰胺40-55份,酚醛树脂30-45份,固化剂10-23份、助剂1-5份、溶剂3-9份。本发明中咪唑类化合物为2-乙基-4-甲基咪唑,是一种新型固化剂,可在较低温度下固化而得到耐热性优良的固化物,并且具有优异的力学性能；固化温度低,在60℃左右即能快速固化,远低于普通环氧树脂24小时以上的固化时间；低分子聚酰胺无毒或低毒,挥发性小,易与环氧树脂混合,体系柔性及抗冲击性能好,高温下粘结强度比较高,从而克服了低温固化力学性能差和高温固化耗能高的缺陷,保证了产品的尺寸稳定性。(The invention discloses a fast curing resin which comprises the following raw materials in parts by weight: 70-85 parts of epoxy resin, 40-55 parts of low molecular polyamide, 30-45 parts of phenolic resin, 10-23 parts of curing agent, 1-5 parts of assistant and 3-9 parts of solvent. The imidazole compound is 2-ethyl-4-methylimidazole, is a novel curing agent, can be cured at a lower temperature to obtain a cured product with excellent heat resistance, and has excellent mechanical properties; the curing temperature is low, the epoxy resin can be rapidly cured at about 60 ℃, and the curing time is far shorter than that of common epoxy resin for more than 24 hours; the low molecular polyamide is non-toxic or low-toxic, has small volatility, is easy to mix with epoxy resin, has good system flexibility and impact resistance, and has higher bonding strength at high temperature, thereby overcoming the defects of poor low-temperature curing mechanical property and high-temperature curing energy consumption and ensuring the dimensional stability of the product.)

1. A fast curing resin characterized by: the raw materials are as follows by weight: 70-85 parts of epoxy resin, 40-55 parts of low molecular polyamide, 30-45 parts of phenolic resin, 10-23 parts of curing agent, 1-5 parts of assistant and 3-9 parts of solvent.

2. The fast curing resin of claim 1, wherein: the low molecular polyamide is linoleic acid dimer or eleostearic acid dimer and aliphatic polyamine.

3. The fast curing resin of claim 2, wherein: the aliphatic polyamine is one or a mixture of ethylenediamine and diethylenetriamine.

4. The fast curing resin of claim 1, wherein: the curing agent is an imidazole compound, and the imidazole compound is 2-ethyl-4-methylimidazole.

5. The fast curing resin of claim 1, wherein: the solvent is selected from one or a mixture of more of chloroform, dichloromethane, toluene and xylene, the auxiliary agent is one or a mixture of more of a diluent, a defoaming agent, a stabilizer and an inhibitor, and the diluent is triethylene glycol divinyl ether or dodecyl vinyl ether.

6. A method for producing a rapid-curing resin according to claim 1, characterized in that: the method comprises the following steps:

s1: uniformly mixing epoxy resin, low-molecular polyamide and phenolic resin, heating and mechanically stirring at the constant temperature of 80 ℃ for 30-80min, then adding into a reaction kettle, and keeping the temperature at 50-60 ℃;

s2: and then uniformly mixing the curing agent and the auxiliary agent, heating and mechanically stirring for 30-80min, then adding the solvent for uniformly mixing, mechanically stirring, performing vacuum defoamation, putting into a reaction kettle, keeping the constant temperature of 60 ℃ for reaction for 4-8h, and drying at 60 ℃ for 2-3h to finally obtain the fast curing resin.

Technical Field

The invention relates to the technical field of resin, in particular to a fast curing resin and a production method thereof.

Background

The synthetic resin is widely applied in many fields, has excellent mechanical property, adhesive property, heat resistance and dimensional stability, and is widely applied in the fields of structures, aerospace, adhesives, coatings and the like.

Epoxy resin room temperature curing systems are often too slow in reaction and too low in efficiency, and cured products are poor in mechanical properties, so that a fast curing resin and a production method thereof are provided.

Disclosure of Invention

The invention aims to solve the defects in the prior art and provides a fast curing resin and a production method thereof.

In order to achieve the purpose, the invention adopts the following technical scheme:

the fast curing resin comprises the following raw materials in parts by weight: 70-85 parts of epoxy resin, 40-55 parts of low molecular polyamide, 30-45 parts of phenolic resin, 10-23 parts of curing agent, 1-5 parts of assistant and 3-9 parts of solvent.

Preferably, the low molecular polyamide is linoleic acid dimer or eleostearic acid dimer and aliphatic polyamine.

Preferably, the aliphatic polyamine is one or a mixture of ethylene diamine and diethylenetriamine.

Preferably, the curing agent is an imidazole compound, and the imidazole compound is 2-ethyl-4-methylimidazole.

Preferably, the solvent is one or a mixture of more of chloroform, dichloromethane, toluene and xylene, the auxiliary agent is one or a mixture of more of a diluent, an antifoaming agent, a stabilizer and an inhibitor, and the diluent is triethylene glycol divinyl ether or dodecyl vinyl ether.

A method of producing a fast curing resin comprising the steps of:

s1: uniformly mixing epoxy resin, low-molecular polyamide and phenolic resin, heating and mechanically stirring at the constant temperature of 80 ℃ for 30-80min, then adding into a reaction kettle, and keeping the temperature at 50-60 ℃;

s2: and then uniformly mixing the curing agent and the auxiliary agent, heating and mechanically stirring for 30-80min, then adding the solvent for uniformly mixing, mechanically stirring, performing vacuum defoamation, putting into a reaction kettle, keeping the constant temperature of 60 ℃ for reaction for 4-8h, and drying at 60 ℃ for 2-3h to finally obtain the fast curing resin.

Compared with the prior art, the invention has the beneficial effects that: according to the fast curing resin and the production method thereof provided by the invention, the imidazole compound is 2-ethyl-4-methylimidazole, is a novel curing agent, can be cured at a lower temperature to obtain a cured product with excellent heat resistance, and has excellent mechanical properties;

the curing temperature is low, the epoxy resin can be rapidly cured at about 60 ℃, and the curing time is far shorter than that of common epoxy resin for more than 24 hours;

the low molecular polyamide is non-toxic or low-toxic, has small volatility, is easy to mix with epoxy resin, has good system flexibility and impact resistance, and has higher bonding strength at high temperature, thereby overcoming the defects of poor low-temperature curing mechanical property and high-temperature curing energy consumption and ensuring the dimensional stability of the product.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.