BIPV assembly and preparation method thereof
阅读说明:本技术 一种bipv组件及其制备方法 (BIPV assembly and preparation method thereof ) 是由 蒋建彗 倪志春 魏青竹 蔡霞 石刚 柯坡 陆文华 曹海波 余嫦 吴镇 于 2020-05-06 设计创作,主要内容包括:本发明公开了一种BIPV组件及其制备方法。该BIPV组件,包括前板、背板及封装于所述前板和所述背板之间的电池片层,所述电池片层包括太阳能电池片,所述BIPV组件还包括用于将所述太阳能电池片产生电流传输出去的接线排组件,所述接线排组件设置于所述前板和所述背板之间。本发明解决接线盒体积过大的问题的同时满足机械性能的要求。(The invention discloses a BIPV assembly and a preparation method thereof. This BIPV subassembly, including front bezel, backplate and encapsulate in the front bezel with the battery lamella between the backplate, the battery lamella includes solar wafer, BIPV subassembly still including be used for with solar wafer produces the wiring row subassembly that current transmission goes out, wiring row subassembly set up in the front bezel with between the backplate. The invention solves the problem of overlarge volume of the junction box and simultaneously meets the requirement of mechanical property.)
1. A BIPV subassembly, includes front bezel, backplate and encapsulates in the front bezel with the battery piece layer between the backplate, the battery piece layer includes solar wafer, its characterized in that: the BIPV assembly further comprises a wiring bar assembly used for transmitting current generated by the solar cell pieces, and the wiring bar assembly is arranged between the front plate and the back plate.
2. The BIPV assembly of claim 1, wherein: the wiring bar assembly comprises a circuit board provided with a diode and a pair of lead-out cables, one ends of the lead-out cables are electrically connected with the circuit board, and the other ends of the lead-out cables are led out of the BIPV assembly from the space between the front plate and the back plate.
3. The BIPV assembly of claim 2, wherein: the front plate and the back surface are respectively provided with inner side surfaces, the two inner side surfaces are opposite to each other, the inner side surface of the back plate is provided with a back surface accommodating groove matched with the circuit board, and part of the circuit board is embedded in the back surface accommodating groove; and/or the inner side surface of the front plate is provided with a front accommodating groove matched with the circuit board, and part of the circuit board is embedded in the front accommodating groove.
4. The BIPV assembly of claim 2, wherein: the current generated by the solar cell is collected through the bus bar, the back plate is also provided with a through hole for leading out the bus bar, the circuit board is provided with a leading-out hole for leading the bus bar to pass through, and the leading-out hole is at least aligned with part of the through hole.
5. The BIPV assembly of claim 2, wherein: the front plate and/or the back plate are/is provided with a cable leading-out groove matched with the leading-out cable, the cable leading-out groove extends to the outer edge of the front plate and/or the back plate, and the leading-out cable is embedded in the wire groove.
6. The BIPV assembly of claim 2, wherein: the other end of each leading-out cable is electrically connected with the connector lug respectively.
7. The BIPV assembly of claim 1, wherein: the solar cell and the wiring bar assembly are bonded on the inner side surface of the front plate through adhesive films, and the solar cell and the wiring bar assembly are bonded on the inner side surface of the back plate through adhesive films.
8. A method of manufacturing a BIPV module according to any of claims 1 to 7, comprising the steps of:
A. providing a front plate provided with a front accommodating groove, and enabling the surface of one side provided with the front accommodating groove to face upwards;
B. laying an adhesive film or coating an adhesive on the upper surface of the front plate, wherein the adhesive film or the adhesive at least covers the area of the front plate where the solar cell piece is required to be placed and the front accommodating groove;
C. forming a cell sheet layer on the upper surface of the front plate, and placing a wiring row assembly in the front face accommodating groove;
D. paving a glue film or coating an adhesive on the battery sheet layer and the wiring bar assembly;
E. placing the backboard glass provided with the back accommodating groove on the battery piece layer and the wiring bar assembly in a manner that the surface provided with the back accommodating groove faces downwards, and enabling part of the wiring bar assembly to be located in the back accommodating groove;
F. and (6) laminating.
9. The manufacturing method of claim 8, wherein the front plate and the back surface are respectively provided with a cable outlet groove, and the connection bank assembly comprises a circuit board provided with a diode and a pair of outlet cables electrically connected with the circuit board at one end; in the step C, the circuit board is placed in the front face accommodating groove, and the lead-out cable is also placed in the cable lead-out groove on the front plate; in the step E, a part of the circuit board is located in the back surface accommodating groove, and a part of the lead-out cable is also located in the cable lead-out groove on the back plate.
10. The manufacturing method according to claim 8, wherein in the step C, a bus bar of the battery sheet layer is also passed through a lead-out hole on the terminal block; in the step E, the bus bar penetrates out of the through hole formed in the back plate; the preparation method also comprises the following steps after the step E: and welding the bus bar, and pouring glue into the through hole.
Technical Field
The invention belongs to the field of crystalline silicon solar cells, and relates to a BIPV (building integrated photovoltaics) assembly and a preparation method thereof.
Background
Solar energy is a green renewable resource. The conversion of solar energy into electric energy can save energy, relieve the problem of power supply shortage and reduce environmental pollution. Solar cells are made of materials that produce the photovoltaic effect, such as silicon, gallium arsenide, copper indium selenide, or other materials, thereby converting light energy into electrical energy using the photovoltaic effect. At present, solar module products are rapidly developed, and meanwhile, as green zero-energy-consumption building engineering is promoted globally, photovoltaic modules and buildings are further combined to generate building integrated photovoltaic modules (BIPV modules). BIPV modules are currently available for most buildings, and can be installed in flat roofs, pitched roofs, curtain walls, ceilings, and the like.
With the rapid development of the photovoltaic industry, BIPV modules occupy an increasing market share. Compared with the conventional photovoltaic module, the BIPV module has the advantages that the service life is longer, and the aesthetic, mechanical and electrical properties are perfectly matched with those of a building besides the reliable performance of the conventional photovoltaic module. The appearance effect of the building is generally high from the aesthetic point of view, and the full coordination is achieved, the junction box of the conventional photovoltaic module is generally adhered to the back of the battery panel, and the junction box is large, so that the integral coordination sense of the building is easily damaged, and the junction box is generally not accepted. Chinese patent application CN103825547A discloses a small-sized BIPV module junction box, which has a small contact area when connected with a BIPV module. Although the junction box has the advantages of small volume, capability of being hidden in a curtain wall framework structure and the like. But because the junction box protrudes out of the surface of the assembly, the junction box has a great risk of falling off during installation and transportation. Meanwhile, according to experimental data of the junction box adopted by the BIPV assembly in the last two years, the current junction box needs to accommodate diodes with fixed volumes while ensuring small volumes, so that the junction box is made of thin materials, the mechanical performance cannot meet the actual requirements, and the service life of the building is ensured to be 50 years.
Disclosure of Invention
Aiming at the technical problems, the invention provides a BIPV assembly and a preparation method thereof, which solve the problem of overlarge volume of a junction box and simultaneously meet the requirement on mechanical performance.
In order to achieve the purpose, the invention adopts a technical scheme as follows:
the utility model provides a BIPV subassembly, includes front bezel, backplate and encapsulate in the front bezel with battery piece layer between the backplate, battery piece layer includes solar wafer, BIPV subassembly still including be used for with solar wafer produces the line bank subassembly that current transmission goes out, the line bank subassembly set up in the front bezel with between the backplate.
Herein, "between the front plate and the back plate" encompasses portions of the front plate and/or the back plate, i.e. as long as they are located between the outer side surface of the front plate and the outer side surface of the back plate, they can be considered as being between the front plate and the back plate.
Preferably, the terminal block assembly is disposed between an edge portion of the front plate and an edge portion of the rear plate.
In an embodiment, the wiring bar assembly includes a circuit board provided with a diode and a pair of lead-out cables having one ends electrically connected to the circuit board, and the other ends of the lead-out cables are led out from between the front plate and the back plate to the outside of the BIPV assembly.
Furthermore, the front plate and the back surface are respectively provided with inner side surfaces, the two inner side surfaces are opposite to each other, the inner side surface of the back plate is provided with a back surface accommodating groove matched with the circuit board, and part of the circuit board is embedded in the back surface accommodating groove.
Furthermore, the inner side surface of the front plate is provided with a front accommodating groove matched with the circuit board, and part of the circuit board is embedded in the front accommodating groove.
Furthermore, the current generated by the solar cell is collected through the bus bar, the back plate is also provided with a through hole for leading out the bus bar, the circuit board is provided with a leading-out hole for leading the bus bar to pass through, and the leading-out hole is at least aligned with part of the through hole.
Furthermore, a cable leading-out groove matched with the leading-out cable is formed in the front plate and/or the back plate, the cable leading-out groove extends to the outer edge of the front plate and/or the back plate, and the leading-out cable is embedded in the wire groove.
Furthermore, the other end of each lead-out cable is electrically connected with the connector lug respectively.
Furthermore, the solar cell pieces and the wiring bar assemblies are bonded on the inner side surface of the front plate through front glue layers, and the solar cell pieces and the wiring bar assemblies are bonded on the inner side surface of the back plate through back glue layers. .
Furthermore, the front adhesive layer and/or the back adhesive layer are adhesive films.
The invention also adopts the following technical scheme:
a method of making a BIPV module as described above, comprising the steps of:
A. providing a front plate provided with a front accommodating groove, and enabling the surface of one side provided with the front accommodating groove to face upwards;
B. laying an adhesive film or coating an adhesive on the upper surface of the front plate, wherein the adhesive film or the adhesive at least covers the area of the front plate where the solar cell piece is required to be placed and the front accommodating groove;
C. forming a cell sheet layer on the upper surface of the front plate, and placing a wiring row assembly in the front face accommodating groove;
D. paving a glue film or coating an adhesive on the battery sheet layer and the wiring bar assembly;
E. placing the backboard glass provided with the back accommodating groove on the battery piece layer and the wiring bar assembly in a manner that the surface provided with the back accommodating groove faces downwards, and enabling part of the wiring bar assembly to be located in the back accommodating groove;
F. and (6) laminating.
Preferably, the front board and the back surface are respectively provided with a cable leading-out groove, and the wiring bar assembly comprises a circuit board provided with a diode and a pair of leading-out cables of which one ends are electrically connected with the circuit board; in the step C, the circuit board is placed in the front face accommodating groove, and the lead-out cable is also placed in the cable lead-out groove on the front plate; in the step E, a part of the circuit board is located in the back surface accommodating groove, and a part of the lead-out cable is also located in the cable lead-out groove on the back plate.
Preferably, in the step C, the bus bar of the battery sheet layer is also inserted through the lead-out hole on the wire connecting bar; in the step E, the bus bar penetrates out of the through hole formed in the back plate; the preparation method also comprises the following steps after the step E: and welding the bus bar, and pouring glue into the through hole.
Compared with the prior art, the invention has the following advantages by adopting the scheme:
according to the BIPV assembly, the wiring bar is arranged between the front plate and the back plate, and the BIPV assembly has the advantages of small size, attractive appearance, long service life, good heat dissipation performance of the diode, less sealant of the junction box, reduction in cost of the junction box and the like.
Drawings
In order to more clearly illustrate the technical solution of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on the drawings without creative efforts.
FIG. 1 is a schematic view of a terminal block assembly according to an embodiment of the present invention;
FIG. 2 is a schematic view of an inside surface of a front plate according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of an inner surface of a backplate according to an embodiment of the present invention;
FIG. 4 is an enlarged view of a portion of FIG. 3;
fig. 5 is a schematic view of a backplane incorporating a termination block assembly according to an embodiment of the present invention.
Wherein the content of the first and second substances,
1. a terminal block assembly; 11. a circuit board; 111. a diode; 112. an exit aperture; 12. leading out a cable; 13. a connector lug;
2. a front plate; 20. an inner side surface; 21. a front accommodating groove; 22. a cable leading-out groove;
3. a back plate; 30. an inner side surface; 31. back face accommodating grooves; 32. a cable leading-out groove; 33. and a through hole.
Detailed Description
Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings so that the advantages and features of the invention may be more readily understood by those skilled in the art. It should be noted that the description of the embodiments is provided to help understanding of the present invention, but the present invention is not limited thereto. In addition, the technical features involved in the embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
The present embodiment provides a BIPV module, of which fig. 1 shows a
The
The front plate 2 is transparent and preferably made of glass to allow light to impinge on the cell layers. As shown in fig. 2, the front plate 2 has an inner side surface 20, specifically, the inner side surface 20 refers to a side surface of the front plate 2 closer to the cell sheet layers. The inner side surface 20 of the front plate 2 is provided with a front accommodating groove 21 matched with the
The back plate 3 is preferably made of glass. As shown in fig. 3, the back sheet 3 has an
In addition, as shown in fig. 3 and 4, the back plate 3 is further provided with a through
The cell layer comprises a plurality of solar cells, the solar cells are welded in series through bus bars to form a cell string, and the current generated by each solar cell is collected through the bus bars.
The packaging material specifically comprises a front adhesive layer and a back adhesive layer, which are used for respectively fixing the battery sheet layer on the inner side surface 20 of the front plate 2 and the
Further, the depth of the front receiving groove 21 and the depth of the
The BIPV assembly solves the problems of existing aesthetics, reliability and the like of the two-generation junction box of the conventional BIPV assembly, the glass-junction box integrated design is carried out, meanwhile, the junction box shell is saved, the cost of the BIPV assembly is integrally reduced, and the reliability and the heat dissipation performance are further optimized. This technique unites two into one traditional glass and terminal box, rejects conventional terminal box body, only remains circuit board and cable, can guarantee that the BIPV subassembly is more pleasing to the eye, reduces sealed glue pouring volume simultaneously. Simultaneously because diode, circuit board, cable etc. all encapsulate inside sealed subassembly, can have better weatherability, increase life. And because the glass has good heat dissipation performance, the heat dissipation of the diode is facilitated, and the temperature saving of the diode is reduced. Besides, the box body structure of the conventional junction box is eliminated, and the glue is only filled in the groove of the back glass, so that the using amount of the sealing glue is greatly reduced. The cost of the junction box can be further reduced.
The embodiment also provides a preparation method of the BIPV assembly, which comprises the following steps
A. Providing a front plate 2 provided with a front accommodating groove 21, and enabling a side surface provided with the front accommodating groove 21 to face upwards;
B. an adhesive film or an adhesive coating is laid on the upper surface of the front plate 2, and the adhesive film or the adhesive at least covers the region of the front plate 2 where the solar cell is to be placed and the front accommodating groove 21;
C. forming a cell sheet layer on the upper surface of the front plate 2, placing the
D. laying a glue film or coating an adhesive on the battery sheet layer and the
E. placing the back plate 3 glass provided with the
F. and (6) laminating.
In the step C, the
In the step C, the bus bars of the battery sheet layer also pass through the leading-out
The specific implementation process of the preparation method is as follows:
carrying out procedures of front plate placement, front PVB (polyvinyl butyral) adhesive film laying, battery string arrangement, bus bar welding and the like according to a conventional BIPV assembly; firstly, accurate calculation is carried out, and sufficient PVB adhesive films are additionally added to the front holding groove and the cable leading-out groove so as to prevent bubbles from being formed in the groove and ensure that the groove is completely filled, and the mechanical performance of the cable leading-out groove is improved. The circuit board and the outgoing line thereof are placed in the front accommodating groove and the cable outgoing groove, and the outgoing line can be fixed by high-temperature adhesive tape in order to prevent the outgoing line from deviating. When the wiring bar is placed, the assembly bus bar needs to pass through a bus bar leading-out port on the circuit board, then, sufficient PVB adhesive films are correspondingly paved above the wiring bar, the PVB adhesive films on the back surface are paved, and the back plate is placed. Note that the bus bars are led out from the through holes of the back plate when the back plate is placed, and the back plate is fixed and laminated after being placed, as shown in fig. 5. After lamination, the bus bar welding, the back side opening glue filling and other processes are carried out at the through hole, and the assembly is put into use after being cooled.
The above embodiments are merely illustrative of the technical ideas and features of the present invention, and are preferred embodiments, which are intended to enable those skilled in the art to understand the contents of the present invention and implement the present invention, and not to limit the scope of the present invention. All equivalent changes or modifications made according to the principles of the present invention should be covered within the protection scope of the present invention.
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