Thermal interface structure for optical transceiver module
阅读说明:本技术 用于光收发器模块的热界面结构 (Thermal interface structure for optical transceiver module ) 是由 张锴 沈玲 张立强 刘亚群 崔丽梅 于 2018-12-17 设计创作,主要内容包括:本公开提供了一种用于电子设备诸如电信或数据联网硬件的热界面结构,该热界面结构利用插入在该电子设备的保持架插孔内的光收发器模块。为了提供有效的热传递,该热界面结构设置在该光收发器模块和与该保持架插孔相关联的散热片之间并且与它们邻接。该热界面结构包括包含相变材料的热界面层和连接到该热界面层的聚合物层。(The present disclosure provides a thermal interface structure for an electronic device, such as telecommunications or data networking hardware, that utilizes optical transceiver modules inserted within cage receptacles of the electronic device. To provide efficient heat transfer, the thermal interface structure is disposed between and abuts the optical transceiver module and a heat sink associated with the cage receptacle. The thermal interface structure includes a thermal interface layer comprising a phase change material and a polymer layer coupled to the thermal interface layer.)
1. An optical transceiver module comprising:
a housing having an outer wall; and
a thermal interface structure coupled to the outer wall, the thermal interface structure comprising:
a thermal interface material comprising a phase change material, the thermal interface material having a first side and a second side, the first side being connected to the outer wall of the housing; and
a polymer layer coupled to the second side of the thermal interface material.
2. The optical transceiver module of claim 1, wherein the housing comprises a pair of opposing walls, each wall having a respective thermal interface structure coupled thereto.
3. The optical transceiver module of claim 1, wherein the thermal interface structure further comprises an adhesive layer connecting the thermal interface material and the polymer layer.
4. The optical transceiver module of claim 1, wherein the thermal interface material further comprises a polymer matrix and at least one filler.
5. An electronic component, comprising:
a cage receptacle comprising a heat sink;
an optical transceiver module including a housing having an outer wall; and
a thermal interface structure disposed between and abutting the outer wall and the heat sink, the thermal interface structure comprising:
a thermal interface material comprising a phase change material; and
a polymer layer coupled to the thermal interface material.
6. The electronic component of claim 5, wherein the thermal interface material comprises a first side and a second side, the first side being connected to the outer wall of the housing and the second side being connected to the polymer layer, and the polymer layer abutting the heat sink of the cage receiver.
7. The electronic component of claim 5, wherein the thermal interface material comprises a first side and a second side, the first side connected to the heat sink of the cage receptacle and the second side connected to the polymer layer, the polymer layer abutting the outer wall of the housing.
8. The electronic component of claim 5, wherein the thermal interface structure further comprises an adhesive layer connecting the polymer layer and the heat sink of the cage receiver.
9. The electronic component of claim 5, wherein the thermal interface structure further comprises an adhesive layer connecting the polymer layer and the outer wall of the optical transceiver module.
10. An electronic component, comprising:
a cage receptacle comprising a heat sink;
an optical transceiver module including a housing having an outer wall; and
a thermal interface structure disposed between and abutting the outer wall and the heat sink, the thermal interface structure comprising:
a thermal interface material comprising a phase change material;
an adhesive surrounding a perimeter of the thermal interface material; and
a polymer layer coupled to the thermal interface material and the adhesive;
wherein the thermal interface material and the adhesive each include a first side and a second side, each first side connected to the polymer layer and each second side connected to the heat sink of the cage receptacle; and is
Wherein the polymer layer includes a first side and a second side, the first side being connected to the thermal interface material and the adhesive, and the second side abutting the outer wall of the optical transceiver module housing.
1. Field of the invention
The present disclosure relates to thermal interface structures that may be used to dissipate heat from optical transceiver modules.
2. Description of the related Art
Optical transceiver modules are typically packaged in Small Form Factor (SFF) packages or Small Form Factor Pluggable (SFFP) packages, such as XFP modules or other industry standard formats. Typically, an optical transceiver module is inserted into a cage receptacle of a device of an electronic unit, such as telecommunications/data network hardware, with electrical contacts of the module engaging corresponding electrical contacts associated with the cage receptacle and a circuit board of the electronic unit to effect data transfer.
In use, optical transceiver modules having data transfer rates of 40G, 100G, 200G, or even higher, may generate significant amounts of heat that must be dissipated from the module to ensure desired operational performance. Typically, the cage receptacle that receives the optical transceiver module includes a metal heat sink that contacts the walls of the optical transceiver module for heat dissipation. However, it is problematic that the quality of the metal-to-metal contact or metal-to-metal fit is often inaccurate, thereby compromising the integrity of the heat transfer contact between the transceiver module and the heat sink.
In another approach, a Thermal Interface Material (TIM), for example in the form of a gel, may be applied to the outer wall of the transceiver module, where the gel abuts the heat sink contact when the transceiver module is received within the cage receptacle. However, known thermal interface gels tend to eventually dry and harden, thereby compromising the heat transfer connection. Furthermore, repeated removal and insertion of the transceiver module into the cage receptacle may cause the thermal interface gel to deform, damage or remove, thereby further compromising heat transfer.
Other thermal interface materials in the form of grease often cannot be applied to sufficient thickness to mitigate variations in the interface gap between the cage receptacle and the inserted transceiver module. Other thermal interface materials in the form of gap pads may produce residue that typically results from the filler in the gap pads corroding off the surface of the gap pads during repeated removal and insertion of the transceiver module into the cage receptacle, and that may negatively impact the electrical contacts of the device. In addition, the grease and the gap pads are typically based on a silicone matrix, and silicone oil from the matrix may evaporate from the matrix and also negatively affect the electrical contacts of the device.
What is needed is a thermal interface structure for an optical transceiver module that is an improvement over the foregoing.
Background
Disclosure of Invention
The present disclosure provides a thermal interface structure for an electronic device, such as telecommunications or data networking hardware, that utilizes optical transceiver modules inserted within cage receptacles of the electronic device. To provide efficient heat transfer, the thermal interface structure is disposed between and abuts the optical transceiver module and a heat sink associated with the cage receptacle. The thermal interface structure includes a thermal interface layer comprising a phase change material and a polymer layer coupled to the thermal interface layer.
In one form thereof, the present disclosure provides an optical transceiver module comprising a housing having an outer wall; and a thermal interface structure coupled to the outer wall, the thermal interface structure comprising a thermal interface material comprising a phase change material, the thermal interface material having a first side and a second side, the first side coupled to the outer wall of the housing; and a polymer layer coupled to the second side of the thermal interface material.
The housing may include a pair of opposing walls, each wall having a respective thermal interface structure coupled thereto.
The thermal interface structure may additionally include an adhesive layer that connects the thermal interface material and the polymer layer.
The thermal interface material may additionally include a polymer matrix and at least one filler. The polymer layer may be formed of at least one polymer selected from the group consisting of: polyesters, polyimides, polysulfones, polycarbonates, polyamides, polyethylene terephthalates, polyethylene naphthalates, polybutylene terephthalates, polyvinyl chlorides, polylactic acids, polyvinyl chlorides, polyacrylates, polyvinyl alcohols, polyethylene vinyl acetates, polyethylenes, polypropylenes, polycyclopentadienes, polytetrafluoroethylenes, polyvinylidene fluorides, polyvinyl fluorides, poly (ethylene-co-tetrafluoroethylene), poly (hexafluoropropylene-co-tetrafluoroethylene), polychlorotrifluoroethylene, polystyrene, polyethersulfones, polyetheretherketones, and combinations thereof. The polymer layer can have a thermal conductivity of at least 0.2W/mK. The phase change material may have a melting point of 20 ℃ to 100 ℃.
In another form thereof, the present disclosure provides an electronic component including: a cage receptacle including a heat sink; an optical transceiver module including a housing having an outer wall; and a thermal interface structure disposed between and abutting the outer wall and the heat sink, the thermal interface structure comprising a thermal interface material comprising a phase change material; and a polymer layer coupled to the thermal interface material.
The thermal interface material can include a first side and a second side, the first side coupled to the outer wall of the housing and the second side coupled to the polymer layer, and the polymer layer abutting the heat sink of the cage receiver.
The thermal interface material may include a first side and a second side, the first side being coupled to the heat sink of the cage receptacle and the second side being coupled to the polymer layer, the polymer layer abutting the outer wall of the housing.
The thermal interface structure may additionally include an adhesive layer that connects the polymer layer and the heat sink of the cage receiver.
The thermal interface structure may additionally include an adhesive layer that connects the polymer layer and the outer wall of the optical transceiver module.
The thermal interface material may additionally include an adhesive layer that connects the thermal interface material and the polymer layer.
The thermal interface material may additionally include a polymer matrix and at least one filler. The polymer layer may be formed of at least one polymer selected from the group consisting of: polyesters, polyimides, polysulfones, polycarbonates, polyamides, polyethylene terephthalates, polyethylene naphthalates, polybutylene terephthalates, polyvinyl chlorides, polylactic acids, polyvinyl chlorides, polyacrylates, polyvinyl alcohols, polyethylene vinyl acetates, polyethylenes, polypropylenes, polycyclopentadienes, polytetrafluoroethylenes, polyvinylidene fluorides, polyvinyl fluorides, poly (ethylene-co-tetrafluoroethylene), poly (hexafluoropropylene-co-tetrafluoroethylene), polychlorotrifluoroethylene, polystyrene, polyethersulfones, polyetheretherketones, and combinations thereof. The polymer layer can have a thermal conductivity of at least 0.2W/mK. The phase change material may have a melting point of 20 ℃ to 100 ℃.
In yet another form thereof, the present disclosure provides an electronic component including: a cage receptacle including a heat sink; an optical transceiver module including a housing having an outer wall; and a thermal interface structure disposed between and abutting the outer wall and the heat sink, the thermal interface structure comprising a thermal interface material comprising a phase change material; an adhesive surrounding a perimeter of the thermal interface material; and a polymer layer coupled to the thermal interface material and the adhesive; wherein the thermal interface material and the adhesive each include a first side and a second side, each first side connected to the polymer layer and each second side connected to the heat sink of the cage receptacle; and wherein the polymer layer includes a first side and a second side, the first side being coupled to the thermal interface material and the adhesive, and the second side abutting the outer wall of the optical transceiver module housing.
The thermal interface material may additionally include a polymer matrix and at least one filler. The phase change material may have a melting point of 20 ℃ to 100 ℃. The polymer layer can have a thermal conductivity of at least 0.2W/mK.
Drawings
The above-mentioned and other features and objects of this disclosure, and the manner of attaining them, will become more apparent and the disclosure itself will be better understood by reference to the following description of embodiments of the disclosure taken in conjunction with the accompanying drawings, wherein:
FIG. 1 is a perspective view showing an optical transceiver module and an associated cage jack of an electronic device;
FIG. 2 is a cross-sectional view through a cage receptacle showing an optical transceiver module received within the cage receptacle;
FIG. 3A is a cross-sectional view of a first exemplary thermal interface structure;
FIG. 3B is a cross-sectional view of a second exemplary thermal interface structure;
FIG. 3C is a cross-sectional view of a third exemplary thermal interface structure;
FIG. 3D is a cross-sectional view of a fourth exemplary thermal interface structure;
FIG. 3E is a cross-sectional view of a fifth exemplary thermal interface structure;
FIG. 4 is a cross-sectional view of a first optical transceiver module and cage receptacle configuration;
FIG. 5 is a cross-sectional view of a second optical transceiver module and cage receptacle configuration;
FIG. 6 is a cross-sectional view of a third optical transceiver module and cage receptacle configuration, including the thermal interface structure of FIG. 3C;
FIG. 7 is a cross-sectional view of a fourth optical transceiver module and cage receptacle configuration, including the thermal interface structure of FIG. 3C;
FIG. 8 is a cross-sectional view illustrating a first step of an exemplary method for making a thermal interface structure;
FIG. 9 is a cross-sectional view illustrating a second step of an exemplary method for making a thermal interface structure;
FIG. 10 is a cross-sectional view illustrating a third step of an exemplary method for making a thermal interface structure; and
FIG. 11 is a cross-sectional view illustrating a fourth step of an exemplary method for making a thermal interface structure.
Corresponding reference characters indicate corresponding parts throughout the several views. Although the exemplification set out herein illustrates embodiments of the disclosure, the embodiments disclosed below are not intended to be exhaustive or to be construed as limiting the scope of the disclosure to the precise forms disclosed.
Detailed Description
The present disclosure provides a thermal interface structure for an electronic device, such as telecommunications or data networking hardware, that utilizes optical transceiver modules inserted within cage receptacles of the electronic device. To provide efficient heat transfer, the thermal interface structure is disposed between and abuts the optical transceiver module and a heat sink associated with the cage receptacle. The thermal interface structure includes a thermal interface layer comprising a phase change material and a polymer layer coupled to the thermal interface layer.
I.Background。
Referring to fig. 1, an
In use, the
Typically, the
As discussed in further detail below, thermal interface structure 46 may be disposed in abutting contact between the housing of
II.Thermal interface material。
The Thermal Interface Material (TIM)48 may be provided as a solid thermal interface layer and generally includes a formulation including one or more components such as a matrix, at least one filler, at least one phase change material, at least one coupling agent, and optional additives.
The thermal interface material 48 may have a thickness as low as 0.01mm, 0.05mm, or 0.1mm, or as high as 1mm, 2.0mm, or 10.0mm, or any range defined between any two of the foregoing values, such as 0.01mm to 10.0mm, 0.05mm to 2.0mm, or 0.1mm to 1 mm. In general, a higher thickness may potentially affect the overall thermal impedance, while a smaller thickness may not be sufficient to mitigate variations in different surface roughness of the
The thermal interface material 48 may have a thermal conductivity as low as 0.2W/mK, 0.5W/mK, 1W/mK, or 2W/mK, or as high as 4W/mK, 6W/mK, 10W/mK, or 500W/mK, or any range defined between any two of the foregoing values, such as 0.2W/mK to 500W/mK, 1W/mK to 6W/mK, or 2W/mK to 10W/mK. Thermal conductivity can be determined according to astm d 5470.
A.Substrate。
The matrix of the thermal interface material 48 may be a polymeric material that provides a matrix or scaffold for incorporating thermally conductive fillers and provides flowability when pressed under heat and pressure.
In one exemplary embodiment, the polymer matrix material comprises a hydrocarbon rubber compound or a blend of rubber compounds. Exemplary materials include saturated rubber compounds and unsaturated rubber compounds. In some embodiments, saturated rubbers may be less susceptible to thermo-oxidative degradation than unsaturated rubber compounds. Exemplary saturated rubber compounds include ethylene-propylene rubber (EPR, EPDM), polyethylene/butylene, polyethylene-butylene-styrene, polyethylene-propylene-styrene, hydrogenated polydiene "monol" species (such as hydrogenated polybutadiene monol, hydrogenated polypropylene monol, hydrogenated polypentadiene monol), hydrogenated polydiene "diol" species (such as hydrogenated polybutadiene diol, hydrogenated polypropylene diol, hydrogenated polypentadiene diol), and hydrogenated polyisoprene, polyolefin elastomers, or any other suitable saturated rubber or blends thereof. In one embodiment, the polymer matrix material is hydrogenated polybutadiene monol, which may also be referred to as a hydroxyl terminated ethylene butene copolymer, a specialty monol.
In other embodiments, unsaturated rubbers may be used. Examples of unsaturated rubbers and rubber compounds are polybutadiene, polyisoprene, polystyrene-butadiene and other suitable unsaturated rubbers, blends thereof or blends of saturated and unsaturated rubber compounds. If the rubber is unsaturated, in some embodiments, the compound may be subjected to a hydrogenation process to break or remove at least some of the double bonds. As used herein, the phrase "hydrogenation process" refers to the reaction of unsaturated organic compounds with hydrogen by direct addition of hydrogen to some or all of the double bonds, thereby producing saturated products (addition hydrogenation), or by complete rupture of the double bonds, thereby further reacting the fragments with hydrogen (hydrogenolysis).
The rubber compounds may be "self-crosslinkable" in that they may undergo intermolecular crosslinking with other rubber molecule molecules or intramolecular crosslinking with themselves, depending on the other components of the composition. Intramolecular and intermolecular crosslinking with the rubber compound may be facilitated by an optional crosslinking agent, as discussed further below.
In some exemplary embodiments, the thermal interface material 48 may comprise a polymer matrix material, such as one or more of any of the polymer matrix materials listed above, in an amount as low as 1 wt.%, 3 wt.%, 5 wt.%, 10 wt.%, as high as 15 wt.%, 25 wt.%, 50 wt.%, 75 wt.%, or in any range defined between any two of the foregoing values, based on the total weight of the thermal interface material 48.
In a more preferred embodiment, the thermal interface material 48 may comprise a polymeric matrix material, such as one or more of any of the polymeric matrix materials listed above, in an amount as low as 1 wt.%, 2 wt.%, or 3 wt.%, as high as 7 wt.%, 8 wt.%, or 10 wt.%, or in any range defined between any two of the foregoing values, such as 1 wt.% to 10 wt.%, 2 wt.% to 8 wt.%, or 3 wt.% to 7 wt.%, based on the total weight of the thermal interface material 48.
B.Filler material。
The thermally conductive filler may include a primary thermally conductive filler and may also include one or more secondary thermally conductive fillers. In one exemplary embodiment, the primary thermally conductive filler has a larger particle size than the secondary thermally conductive filler.
The primary and secondary thermally conductive fillers may be different sized particles of the same material, or different sized particles of different materials. The thermally conductive filler may be a metal such as aluminum, copper, silver, zinc, nickel, tin, indium, or lead. In a more specific embodiment, the primary thermally conductive filler is aluminum.
In an exemplary embodiment, the thermally conductive filler includes particles having a particle size as low as 1 micron, 2 microns, 3 microns, 5 microns, 8 microns, as high as 10 microns, 12 microns, 15 microns, 20 microns, 25 microns, 50 microns, 100 microns, or within any range defined between any two of the foregoing values.
In a more specific embodiment, each of the primary and secondary conductive fillers has a particle size of about 1 micron to about 25 microns. In a more specific embodiment, the primary thermally conductive filler has a particle size of about 3 microns to about 5 microns. In a more specific embodiment, the secondary thermally conductive filler has a particle size of about 3 microns to about 15 microns. In a more specific embodiment, the secondary thermally conductive filler has a particle size of about 8 microns to about 12 microns. In a more specific embodiment, the primary thermally conductive filler has a particle size of about 3 microns. In a more specific embodiment, the secondary thermally conductive filler has a particle size of about 10 microns.
Thermal interface material 48 may include a total filler content in an amount as low as 10 wt%, 25 wt%, 50 wt%, 75 wt%, 80 wt%, 85 wt%, up to 90 wt%, 92 wt%, 95 wt%, 97 wt%, 98 wt%, 99 wt%, or within any range defined between any two of the foregoing values, based on the total weight of thermal interface material 48.
In more preferred embodiments, the thermal interface material 48 may include a total filler content in an amount as low as 80, 85, or 90 percent by weight, as high as 95, 97, or 98 percent by weight, or in any range defined between any two of the foregoing values, such as 80 to 98, 85 to 97, or 90 to 95 percent by weight, based on the total weight of the thermal interface material 48.
C.Phase change material。
In some exemplary embodiments, the thermal interface material 48 comprises one or more phase change materials. The phase change material is a material having a melting point or melting point range that is equal to or below the operating temperature of the portion of the electronic device in which the thermal interface material 48 is to be used. An exemplary phase change material is a wax, such as paraffin wax. The paraffin wax is represented by the general formula CnH2n+2Represents a mixture of solid hydrocarbons having a melting point in the range of about 20 ℃ to 100 ℃. Polymeric waxes include polyethylene waxes and polypropylene waxes, and typically have a melting point range of about 40 ℃ to 160 ℃. Other exemplary phase change materials include low melting point alloys, such as wood's metal, field's metal, or metals or alloys with melting points between about 20 ℃ and 90 ℃.
In some embodiments, the amount of phase change material may be used to adjust the hardness of the thermal interface material 48. For example, in some embodiments where the loading of the phase change material is low, the composition may be in the form of a soft gel, and in some embodiments where the loading of the phase change material is high, the composition may be a hard solid.
Exemplary waxes having a needle penetration value of less than 70 according to ASTM D1321 include TAC wax available from international Group ltd (the international Group, Inc.) and RT44HC available from Hangzhou luer Tech (Hangzhou Ruhr Tech.). The hardness of the wax may be characterized by a penetration value, such as a penetration value determined according to ASTM D1321 at 25 ℃, the disclosure of which is hereby incorporated by reference in its entirety.
The thermal interface material 48 may include one or more phase change materials in an amount as low as 0.1 wt%, 1 wt%, 5 wt%, 10 wt%, up to 15 wt%, 25 wt%, 50 wt%, 75 wt%, or in any range defined between any two of the foregoing values, based on the total weight of the thermal interface material 48.
In more preferred embodiments, the thermal interface material 48 may include one or more phase change materials in an amount as low as 0.1 wt%, 0.2 wt%, or 0.5 wt%, as high as 1 wt%, 2 wt%, or 3 wt%, or within any range defined between any two of the preceding values, such as 0.1 wt% to 3 wt%, 0.2 wt% to 2 wt%, or 0.5 wt% to 1 wt%, based on the total weight of the thermal interface material 48.
D.Coupling agent。
In some exemplary embodiments, the thermal interface material 48 includes one or more coupling agents. In some exemplary embodiments, the inclusion of a coupling agent may improve thermal properties, such as properties at relatively high temperatures. Exemplary coupling agents include titanate coupling agents, such as those disclosed in U.S. patent application publication 2011/0308782, the disclosure of which is hereby incorporated by reference in its entirety. Exemplary coupling agents include 2, 2 (bis 2-propenolomethyl) butanolate, tris (dioctyl) pyrophosphato-titanium O IV; 2, 2 (bis 2-propenoloromethyl) butanolate, tris (diisooctyl) pyrophosphato-0 zirconium IV; adduct of 2-propanol, tris (dioctyl) -pyrophosphato-O) titanium IV with 1 mol of diisooctyl phosphite; bis (dioctyl) pyrophosphato-O, oxoethyleneglycolato titanium IV (adduct) bis (dioctyl) (hydrogen) phosphite-0; bis (dioctyl) pyrophosphato-0, ethyleneglycolato titanium IV (adduct) bis (dioctyl) hydrogenphosphite; and 2, 2-bis (2-propenolonomethyl) butanolate, cyclodi [2, 2- (bis 2-propenoloromethyl) butanolate ], pyrophosphato-O, O zirconium IV. In an exemplary embodiment, the coupling agent is 2, 2 (bis 2-propenolomethyl) butanolate, tris (dioctyl) pyrophosphato-titanium O IV.
In some exemplary embodiments, the thermal interface material 48 may include one or more coupling agents in an amount as low as 0.1 wt%, 0.3 wt%, 0.5 wt%, up to 1 wt%, 2 wt%, 3 wt%, 5 wt%, or any range defined between any two of the preceding values, such as 0.1 wt% to 5 wt%, 0.3 wt% to 3 wt%, or 0.5 wt% to 1 wt%, based on the total weight of the thermal interface material 48.
E.Additive agent。
In some exemplary embodiments, the thermal interface material 48 includes one or more additives. Exemplary additives include antioxidants, ion scavengers, and cross-linking agents.
Exemplary antioxidants include phenolic antioxidants, amine antioxidants, or any other suitable type of antioxidant or combination thereof. In some exemplary embodiments, the thermal interface material 48 may include one or more antioxidants in an amount as low as 0.1 wt%, 0.5 wt%, 1 wt%, or as high as 1.5 wt%, 2 wt%, 5 wt%, 10 wt%, or any range defined between any two of the foregoing values, such as between 0.1 wt% and 10 wt%, 0.5 wt% to 5 wt%, or 1 wt% to 1.5 wt%, based on the total weight of the thermal interface material 48.
Exemplary ion scavengers are disclosed in PCT application No. PCT/CN2014/081724, the disclosure of which is hereby incorporated by reference in its entirety. In some exemplary embodiments, the thermal interface material 48 may include one or more ion scavengers in an amount as low as 0.1 wt%, 0.5 wt%, 1 wt%, up to 1.5 wt%, 2 wt%, 5 wt%, 10 wt%, or in any range defined between any two of the foregoing values, such as between 0.1 wt% and 10 wt%, 0.5 wt% and 5 wt%, or 1 wt% and 2 wt%, based on the total weight of the thermal interface material 48.
Exemplary crosslinking agents are disclosed in U.S. patent No.7,244,491, the disclosure of which is hereby incorporated by reference in its entirety. Exemplary crosslinking agents include alkylated melamine resins. In some exemplary embodiments, the thermal interface material 48 may include one or more cross-linking agents in an amount as low as 0.1 wt%, 0.5 wt%, 1 wt%, up to 1.5 wt%, 2 wt%, 5 wt%, 10 wt%, or any range defined between any two of the foregoing values, such as between 0.1 wt% and 10 wt%, 0.5 wt% and 5 wt%, or 1 wt% and 2 wt%, based on the total weight of the thermal interface material 48.
III.Polymer layer。
Thermal interface structure 46 may also include a
The polymeric layer may be in the form of a multi-layer laminate comprising multiple layers of a single plastic or multiple layers of different plastics selected from those listed above. The polymer layer may also contain one or more electrically conductive fillers, such as those described above, to enhance the thermal conductivity of the film. The polymer layer may also contain one or more other agents, such as lubricants and/or pigments.
Exemplary plastic films include HM, HPD, PPY, PAC, PET, PP, PTD, and PTS, all available from Guofeng corporation; OA-1, OA-2, BOA, TOA, LX, N-CO, RS, RCO, CO2, PGLS, VILBO, and EASYTEX, all available from Flex technologies (FSPG); lumirrorTM、TorelinaTM、mictronTM、TORAYFANTM、RAYFANTM、TOYOFLONTMAnd TORETECTMBoth from Toray corporation;
andboth from Toyo Boseki (TOYOBO);andboth from dupont teijin films (dupont teijin films);andboth from European Tutai corporation (Autotype);、TefzelTMandall available from Dupont; LEXANTM、VALOXTM、ULTEMTMAnd NORYLTMBoth from Samite basic Industrial Corp (SABIC);andall purchased from scientific creative corporation (Covestro);andboth available from Honeywell corporation (Honeywell);from Solvay, sovley; FLONFILMTMFrom Polyflon, Inc.;from ARKEMA, inc (ARKEMA). Another exemplary thermally conductive plastic film is a polyimide, including those available from DuPontFrom Uty corporation (UBE)APICAL from bells corporation (Kaneka)TMCPI from SKC KolonTMAnd KYPI from kyying.Preferably, the thermally conductive plastic film has a thermal conductivity of greater than 0.2W/mK, as determined according to ASTM D5470. The thermally conductive plastic film may also have a tensile strength of greater than 100MPa as determined according to ASTM D882.
The thickness of the
In use, the
IV.Adhesive agent。
The thermal interface structure 46 may also include an adhesive 52 to provide adhesion between the
V.Exemplary configurations。
An exemplary configuration of thermal interface structure 46 is shown in fig. 3A-3E. Referring to fig. 3A, a first configuration of a thermal interface structure 46 is shown, which generally includes a thermal interface material 48 attached to a
As shown in fig. 3C, one side of thermal interface material 48 is surrounded by
In fig. 3D, the thermal interface material 48 is secured to the
Referring to fig. 3E, a thermal interface material 48 is disposed between the lower polymer layer and the
Referring to fig. 4-7, exemplary configurations for associating the thermal interface material of the present disclosure with an optical transceiver module and a cage receptacle of an electronic device are shown.
Referring to fig. 4, the
In fig. 5, a similar arrangement is shown with a thermal interface structure 46 connected to the
In fig. 6 and 7, an exemplary configuration is shown that includes the thermal interface structure 46 shown in fig. 3C. In fig. 6,
Referring to fig. 8-11, an exemplary method for forming a thermal interface structure is illustrated. Referring to fig. 8, one or more layers of thermal interface material 48 may be pressed onto the
Referring to fig. 9, an
Thereafter, as shown in fig. 10, a
As used herein, the phrase "within any range defined between any two of the preceding values" literally means that any range can be selected from any two values listed before such phrase, whether such values are in the lower portion of the list or in the upper portion of the list. For example, a pair of values may be selected from two lower values, two higher values, or a lower value and a higher value.
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