阅读说明：本技术 放大器 (Amplifier with a high-frequency amplifier ) 是由 堀口健一 于 2018-01-22 设计创作，主要内容包括：具有：输入分配部,其具有将输入信号进行分支的第1路径和第2路径,该第1路径的通过相位与该第2路径的通过相位不同；第1放大元件,其对输入至该第1路径的信号进行放大；第2放大元件,其对输入至该第2路径的信号进行放大；输出合成部,其利用传输该第1放大元件的输出的第3路径和传输该第2放大元件的输出的第4路径将该第1放大元件和该第2放大元件的输出合成,该第3路径和该第4路径的通过相位不同；以及电磁耦合部,其使通过该输入分配部而输入至该第1放大元件和该第2放大元件的2个信号、或从该第1放大元件和该第2放大元件输出而输入至该输出合成部的2个信号电磁耦合。(Comprising: an input distributor having a 1 st path and a 2 nd path for branching an input signal, a passing phase of the 1 st path being different from a passing phase of the 2 nd path; a 1 st amplification element that amplifies a signal input to the 1 st path; a 2 nd amplification element that amplifies a signal input to the 2 nd path; an output combining section that combines outputs of the 1 st amplification element and the 2 nd amplification element by a 3 rd path that transmits an output of the 1 st amplification element and a 4 th path that transmits an output of the 2 nd amplification element, the 3 rd path and the 4 th path having different passing phases; and an electromagnetic coupling unit that electromagnetically couples 2 signals input to the 1 st and 2 nd amplification elements through the input distribution unit or 2 signals output from the 1 st and 2 nd amplification elements and input to the output combining unit.)

1. An amplifier, comprising:

an input distributor having a 1 st path and a 2 nd path for branching an input signal, a passing phase of the 1 st path being different from a passing phase of the 2 nd path;

a 1 st amplification element that amplifies a signal input to the 1 st path;

a 2 nd amplification element that amplifies a signal input to the 2 nd path;

an output combining section that combines outputs of the 1 st amplification element and the 2 nd amplification element using a 3 rd path that transmits an output of the 1 st amplification element and a 4 th path that transmits an output of the 2 nd amplification element, the 3 rd path and the 4 th path having different passing phases; and

and an electromagnetic coupling unit configured to electromagnetically couple 2 signals input to the 1 st and 2 nd amplification elements through the input distribution unit or 2 signals output from the 1 st and 2 nd amplification elements and input to the output combining unit.

2. The amplifier of claim 1,

the electromagnetic coupling unit is a coupling circuit provided between the input distributor and the 1 st and 2 nd amplifying elements.

3. The amplifier of claim 1,

the electromagnetic coupling unit is a coupling circuit provided between the 1 st and 2 nd amplification elements and the output combining unit.

4. Amplifier according to any of claims 1 to 3,

the input distributing section has a 90-degree mixer circuit, and the output combining section has a 90-degree mixer circuit.

5. The amplifier of claim 1,

the input distributor has a phase line on the 2 nd path,

the output combining section has a phase line in the 3 rd path,

the electromagnetic coupling unit is a coupling circuit provided between the input distributor and the 1 st and 2 nd amplifying elements.

6. The amplifier of claim 1,

the input distributor has a phase line on the 2 nd path,

the output combining section has a phase line in the 3 rd path,

the electromagnetic coupling unit is a coupling circuit provided between the 1 st and 2 nd amplification elements and the output combining unit.

7. Amplifier according to claim 5 or 6,

the phase line has a 90 degree phase shifter.

8. Amplifier according to claim 1, characterized in that it has:

a 1 st input matching circuit provided between the 1 st path and the 1 st amplifying element;

a 2 nd input matching circuit provided between the 2 nd path and the 2 nd amplifying element;

a 1 st output matching circuit provided between the 1 st amplifying element and the 3 rd path; and

a 2 nd output matching circuit disposed between the 2 nd amplifying element and the 4 th path,

the electromagnetic coupling portion is provided in the 1 st input matching circuit and the 2 nd input matching circuit.

9. The amplifier of claim 8,

a part of the 1 st input matching circuit and a part of the 2 nd input matching circuit are opposed to each other without interposing a GND pattern therebetween, and a part having a coupling amount of-20 dB or more and-3 dB or less is used as the electromagnetic coupling portion.

10. Amplifier according to claim 1, characterized in that it has:

a 1 st input matching circuit provided between the 1 st path and the 1 st amplifying element;

a 2 nd input matching circuit provided between the 2 nd path and the 2 nd amplifying element;

a 1 st output matching circuit provided between the 1 st amplifying element and the 3 rd path; and

a 2 nd output matching circuit disposed between the 2 nd amplifying element and the 4 th path,

the electromagnetic coupling portion is provided in the 1 st output matching circuit and the 2 nd output matching circuit.

11. The amplifier of claim 10,

a part of the 1 st output matching circuit and a part of the 2 nd output matching circuit are opposed to each other without interposing a GND pattern therebetween, and a part having a coupling amount of-20 dB or more and-3 dB or less is used as the electromagnetic coupling portion.

12. Amplifier according to any of claims 8 to 11,

the input distributor has a phase line in the 2 nd path, and the output combiner has a phase line in the 3 rd path.

13. The amplifier of claim 1,

the semiconductor package includes: a 1 st input lead; a 1 st input lead connecting the 1 st input lead with the 1 st amplifying element; a 2 nd input lead; a 2 nd input wire connecting the 2 nd input lead with a 2 nd amplifying element; 1 st output lead; a 1 st output wire connecting the 1 st output lead with the 1 st amplifying element; a 2 nd output lead; and a 2 nd output wire connecting the 2 nd output lead with the 2 nd amplifying element,

the 1 st amplification element and the 2 nd amplification element are constituted by different chips,

connecting the 1 st input wire to the 2 nd input lead side of the 1 st input lead, and connecting the 2 nd input wire to the 1 st input lead side of the 2 nd input lead, thereby making the 1 st input wire and the 2 nd input wire the electromagnetic coupling portion.

14. The amplifier of claim 13,

the distance between the 1 st input lead and the 2 nd input lead is less than or equal to 2mm, or less than or equal to 1/100 wavelengths of the center frequency of a signal frequency band.

15. The amplifier of claim 1,

the semiconductor package includes: a 1 st input lead; a 1 st input lead connecting the 1 st input lead with the 1 st amplifying element; a 2 nd input lead; a 2 nd input wire connecting the 2 nd input lead with the 2 nd amplifying element; 1 st output lead; a 1 st output wire connecting the 1 st output lead with the 1 st amplifying element; a 2 nd output lead; and a 2 nd output wire connecting the 2 nd output lead with the 2 nd amplifying element,

the 1 st amplification element and the 2 nd amplification element are constituted by different chips,

connecting the 1 st output wire to the 2 nd output lead side of the 1 st output lead, and connecting the 2 nd output wire to the 1 st output lead side of the 2 nd output lead, thereby making the 1 st output wire and the 2 nd output wire the electromagnetic coupling portion.

16. The amplifier of claim 15,

the distance between the 1 st output lead and the 2 nd output lead is less than or equal to 2mm, or less than or equal to 1/100 wavelengths of the center frequency of the signal frequency band.

17. The amplifier of claim 1,

the semiconductor package includes: a 1 st input lead; 1 st pre-matching circuit; a 1 st connecting wire connecting the 1 st input lead with the 1 st pre-match circuit; a 1 st input lead connecting the 1 st pre-match circuit with the 1 st amplifying element; a 2 nd input lead; 2 nd pre-matching circuit; a 2 nd connecting wire connecting the 2 nd input lead with the 2 nd pre-matching circuit; a 2 nd input lead connecting the 2 nd pre-matching circuit with the 2 nd amplifying element; 1 st output lead; a 1 st output wire connecting the 1 st output lead with the 1 st amplifying element; a 2 nd output lead; and a 2 nd output wire connecting the 2 nd output lead with the 2 nd amplifying element,

the 1 st amplification element and the 2 nd amplification element are constituted by different chips,

connecting the 1 st connecting wire to the 2 nd input lead side of the 1 st input lead, and connecting the 2 nd connecting wire to the 1 st input lead side of the 2 nd input lead, thereby making the 1 st connecting wire and the 2 nd connecting wire the electromagnetic coupling portion.

18. The amplifier of claim 1,

the semiconductor package includes: a 1 st input lead; a 1 st input lead connecting the 1 st input lead with the 1 st amplifying element; a 2 nd input lead; a 2 nd input wire connecting the 2 nd input lead with the 2 nd amplifying element; 1 st pre-matching circuit; 1 st output lead; a 1 st output wire connecting the 1 st amplifying element with the 1 st pre-matching circuit; a 1 st connecting wire connecting the 1 st pre-match circuit with the 1 st output lead; 2 nd pre-matching circuit; a 2 nd output lead; a 2 nd output wire connecting the 2 nd amplifying element with the 2 nd pre-matching circuit; and a 2 nd connecting wire connecting the 2 nd pre-matching circuit with the 2 nd output lead,

the 1 st amplification element and the 2 nd amplification element are constituted by different chips,

connecting the 1 st connecting wire to the 2 nd output lead side of the 1 st output lead, and connecting the 2 nd connecting wire to the 1 st output lead side of the 2 nd output lead, thereby making the 1 st connecting wire and the 2 nd connecting wire the electromagnetic coupling portion.

19. The amplifier according to claim 17 or 18,

the 1 st pre-matching circuit and the 2 nd pre-matching circuit are formed on 1 chip.

Technical Field

The present invention relates to amplifiers.

Background

With the increase in communication capacity, it is necessary for wireless communication to amplify a signal having a wider frequency band or a signal spanning multiple frequency bands. In addition, in response to the demand for downsizing the heat sink and for reducing the running cost, the wireless transmitter is required to reduce power consumption. Therefore, in the case of a high-frequency amplifier, it is important to achieve high efficiency over a wide frequency range.

Patent document 1 discloses a high-frequency amplifier. Patent document 1 discloses a technique in which, in an amplifier that branches input signals into 2 paths, amplifies the input signals, and combines the amplified signals, a 90-degree mixer circuit is interposed between the amplifier and an output combining circuit. This creates output matching in which the input signal is open-circuited to the fundamental wave and short-circuited to the 2 nd harmonic, thereby achieving high efficiency of the amplifier.

Patent document 1: japanese laid-open patent publication No. 11-112252

Disclosure of Invention

In a conventional high-frequency amplifier, a frequency band in which high efficiency is obtained is limited to a narrow band in accordance with frequency characteristics of a circuit including a semiconductor, and high efficiency cannot be achieved over a wide frequency band.

The present invention has been made to solve the above-described problems, and an object of the present invention is to provide an amplifier that operates efficiently over a wide frequency band in a configuration in which input signals are branched into 2 paths, amplified respectively, and then combined and output.

The amplifier according to the present invention is characterized by comprising: an input distributor having a 1 st path and a 2 nd path for branching an input signal, a passing phase of the 1 st path being different from a passing phase of the 2 nd path; a 1 st amplification element that amplifies a signal input to the 1 st path; a 2 nd amplification element that amplifies a signal input to the 2 nd path; an output combining section that combines outputs of the 1 st amplification element and the 2 nd amplification element by a 3 rd path that transmits an output of the 1 st amplification element and a 4 th path that transmits an output of the 2 nd amplification element, the 3 rd path and the 4 th path having different passing phases; and

and an electromagnetic coupling unit configured to electromagnetically couple 2 signals input to the 1 st and 2 nd amplification elements through the input distribution unit or 2 signals output from the 1 st and 2 nd amplification elements and input to the output combining unit.

Other features of the present invention will be apparent from the following.

ADVANTAGEOUS EFFECTS OF INVENTION

According to the present invention, by electromagnetically coupling 2 branched signals, it is possible to provide an amplifier that operates efficiently over a wide frequency band.

Drawings

Fig. 1 is a configuration diagram of an amplifier according to embodiment 1.

Fig. 2 is a configuration diagram of an amplifier according to a modification.

Fig. 3 is a graph showing frequency characteristics of drain efficiency.

Fig. 4 is a configuration diagram of an amplifier according to embodiment 2.

Fig. 5 is a configuration diagram of an amplifier according to embodiment 3.

Fig. 6 is a diagram showing a method of determining the coupling amount.

Fig. 7 is a configuration diagram of an amplifier according to embodiment 4.

Fig. 8 is a top view of a semiconductor package.

Fig. 9 is a configuration diagram of an amplifier according to embodiment 5.

Fig. 10 is a top view of a semiconductor package.

Fig. 11 is a plan view of a semiconductor package according to a modification.

Fig. 12 is a configuration diagram of an amplifier according to embodiment 6.

Fig. 13 is a top view of a semiconductor package.

Fig. 14 is a structural diagram of an amplifier of a comparative example.

Detailed Description

An amplifier according to an embodiment will be described with reference to the drawings. The same or corresponding components are denoted by the same reference numerals, and redundant description may be omitted.