阅读说明：本技术 声音输出装置 (Sound output device ) 是由 佐藤明善 于 2018-01-29 设计创作，主要内容包括：声音输出装置具有：框体；电路基板,其配置于所述框体的内部,具有信号处理电路；以及扬声器单元,其配置于所述框体的内部,包含主体及支撑部件,该主体具有与从所述信号处理电路供给的信号相应地振动而放音的放音部,该支撑部件与所述主体一体地构成,相对于所述框体或者所述电路基板对所述主体进行支撑,并且具有使振动衰减的缓冲性。(The sound output device includes: a frame body; a circuit board disposed inside the housing and having a signal processing circuit; and a speaker unit disposed inside the housing, including a main body having a sound emitting unit that emits sound by vibrating in accordance with a signal supplied from the signal processing circuit, and a support member that is integrally configured with the main body, supports the main body with respect to the housing or the circuit board, and has a cushioning property for damping vibration.)

1. An audio output device, comprising:

a frame body;

a circuit board disposed inside the housing and having a signal processing circuit; and

and a speaker unit disposed inside the housing, including a main body having a sound emitting unit that emits sound by vibrating in accordance with a signal supplied from the signal processing circuit, and a support member that is integrally configured with the main body, supports the main body with respect to the housing or the circuit board, and has a cushioning property for damping vibration.

2. The sound output device according to claim 1,

the main body and the circuit board are electrically connected by a wiring.

3. The sound output device according to claim 1,

the support member has a function of an electrode, that is, supplies the signal to the main body.

4. The sound output device according to any one of claims 1 to 3,

a low-pass filter is formed by the mass of the speaker unit, the compliance of the support member, and the compliance of the gas present inside the housing.

5. The sound output device according to any one of claims 1 to 4,

the support member is a plate-like member.

6. The sound output device according to any one of claims 1 to 5,

a vibration absorbing material for absorbing vibration is provided between the frame body and the main body.

Technical Field

The present invention relates to a technique of an audio output device.

Background

Conventionally, for example, an audio output device having a speaker unit for outputting audio is installed in an automobile. The audio output device is mounted on the interior of an automobile, and processes an electrical signal based on audio to reproduce the audio.

In recent years, in order to reduce noise generated by vibration of an interior due to transmission of vibration of a speaker unit to an interior of an automobile, an audio output device has been developed in which an inner box incorporating the speaker unit is surrounded by an outer box and a vibration absorbing material is interposed between the inner box and the outer box (see, for example, patent document 1).

Patent document 1: international publication WO2017/022254

Disclosure of Invention

However, in the audio output device described in patent document 1, although noise is reduced, since the audio output device includes an inner box and an outer box, the number of components is large, which causes a problem of cost increase.

The present invention has been made in view of the above circumstances, and an object thereof is to provide an audio output device capable of reducing noise and reducing the number of components.

In order to achieve the above object, an audio output device according to claim 1 of the present invention includes: a frame body; a circuit board disposed inside the housing and having a signal processing circuit; and a speaker unit disposed inside the housing, including a main body having a sound emitting unit that emits sound by vibrating in accordance with a signal supplied from the signal processing circuit, and a support member that is integrally configured with the main body, supports the main body with respect to the housing or the circuit board, and has a cushioning property for damping vibration.

Drawings

Fig. 1 is a perspective view showing a schematic configuration of an audio output device according to embodiment 1.

Fig. 2 is a sectional view of the sound output device shown in fig. 1.

Fig. 3 is a plan view showing the interior of the audio output device shown in fig. 1.

Fig. 4 is a perspective view showing the speaker unit shown in fig. 2.

Fig. 5 is a sectional view of the audio output device according to embodiment 2.

Fig. 6 is a plan view showing the interior of the audio output device shown in fig. 5.

Detailed Description

The present invention will be described in detail below based on preferred embodiments shown in the drawings. In the drawings, the dimensions and scales of the respective portions are appropriately different from those in actual cases, and there are also portions schematically illustrated to facilitate understanding. The scope of the present invention is not limited to these embodiments unless otherwise specified in the following description.

< embodiment 1 >

Fig. 1 is a perspective view showing a schematic configuration of an audio output device according to embodiment 1. Fig. 2 is a sectional view of the sound output device shown in fig. 1. Fig. 3 is a plan view showing the interior of the sound output device shown in fig. 1, and is a cross-sectional view taken along line a 1-a 1 in fig. 2. In each of the drawings, 3 axes, i.e., x, y, and z axes, which are orthogonal to each other are shown in order to facilitate understanding of the arrangement of each portion.

As shown in fig. 1 and 2, the audio output device 100 includes: a frame body 1; a circuit board 2 provided inside the housing 1 and having a signal processing circuit; and a speaker unit 3 provided inside the housing 1 and emitting sound in accordance with an audio signal which is an electric signal supplied from the signal processing circuit. As shown in fig. 2, the speaker unit 3 has: a main body 31 having a sound emitting unit 311 formed of a vibration member, and configured to vibrate the sound emitting unit 311 in response to an electric signal to emit sound; and a plurality of support members 32 that support the main body 31 and have a cushioning property for damping vibration. The audio output device 100 includes a plurality of microphones 4, which are provided inside the housing 1 and convert audio into audio signals. Therefore, the audio output device 100 can also be said to be an audio input/output device. In fig. 3, the microphone 4 is not shown.

The audio output device 100 can be used as a device for realizing a handsfree phone call. The audio output device 100 is configured to be able to communicate with a mobile phone held by a user by wire or wirelessly. The sound output apparatus 100 collects the user's sound with the microphone 4 and converts the collected sound into a sound signal. In addition, the audio output device 100 can output the audio of the call partner from the speaker unit 3. For example, the audio output device 100 receives an audio signal related to a voice of a call partner received via a mobile phone of a user, processes the audio signal, and reproduces the processed audio signal. The audio output device 100 converts the audio generated by the user into an audio signal, processes the audio signal, and transmits the processed audio signal to the mobile phone of the user. The voice signal transmitted to the user's mobile phone is transmitted to the mobile phone of the call partner via the user's mobile phone.

The sound output device 100 is used in, for example, a vehicle interior of an automobile. In this case, the audio output device 100 is attached to an object 7 such as an interior of an automobile (see fig. 2), for example. Next, the configuration of each part of the audio output device 100 will be explained in order. In the following, a case where the audio output device 100 is installed in a vehicle interior of an automobile will be described as an example. In the present specification, the observation from the z-axis direction is referred to as "plan view".

[ frame body ]

The housing 1 is a rectangular column-shaped member having an internal space S for accommodating the circuit board 2 and the speaker unit 3. The housing 1 is configured to be attachable to the object 7. For example, the housing 1 can be detachably attached to the object 7 by bonding, fitting, or the like. The outer shape of the housing 1 is not limited to the illustrated shape, and may be, for example, a cylindrical shape.

The housing 1 includes: a1 st member 11 having a rectangular flat plate shape; a2 nd member 12 having a rectangular flat plate shape provided separately from the 1 st member 11; and a 3 rd member 13 which is positioned between the 1 st member 11 and the 2 nd member 12 and has a rectangular tubular shape. In the present embodiment, the 1 st member 11, the 2 nd member 12, and the 3 rd member 13 are separately configured, and are connected by, for example, adhesion, fitting, or the like.

The 1 st member 11 is formed with a through hole 101, and the through hole 101 guides sound output from the speaker unit 3 described later to the outside. The through hole 101 penetrates in the thickness direction of the 1 st member 11, and is formed in the center of the 1 st member 11. In addition, 2 through holes 102 are formed in the 1 st member 11, and these 2 through holes 102 are used for guiding a user's voice to the microphone 4 described later. These through holes 102 each penetrate in the thickness direction of the 1 st member 11, and are formed in the 1 st member 11 so as to sandwich the through hole 101 in a plan view.

A member 14 is provided on the outer surface of the 1 st member 11, and the member 14 is used to improve the adhesion between the housing 1 and the object 7. The member 14 is interposed between the object 7 and the 1 st member 11 in a state where the housing 1 is attached to the object 7, and is in contact with both of them. The member 14 is provided so as not to block the through- holes 101 and 102.

When the housing 1 is attached to the object 7, the member 14 closely contacts the object 7 following the shape thereof. This prevents a gap from occurring between the housing 1 and the object 7, and reduces fluctuation in acoustic characteristics.

Examples of the member 14 include a porous structure such as a rubber member, a soft resin member, an open cell sponge or an open cell sponge, and a gel-like material. Among them, as the member 14, a self-contained bubble sponge is preferable. The self-contained bubble sponge is excellent in rebound, and therefore, by using it as the member 14, the fluctuation of the acoustic characteristic can be reduced particularly effectively. Further, it is also excellent in that it is easily available and easy to handle.

The constituent materials of the 1 st, 2 nd and 3 rd members 11, 12 and 13 are not particularly limited, and various resin materials can be used, for example.

[ Circuit Board ]

The circuit board 2 is fixed to the 1 st member 11 by an adhesive body 201 made of, for example, a double-sided tape. An IC (integrated circuit) having a signal processing circuit for amplifying an audio signal or performing various audio processing is mounted on the circuit board 2. Various communication modules for receiving and transmitting audio signals are mounted on the circuit board 2.

A vibration absorbing material 51 (2 nd vibration absorbing material) that absorbs vibration is interposed between the circuit board 2 and the 1 st member 11. The vibration absorbing material 51 is provided in a portion other than the adhesive body 201, and is located outside the adhesive body 201 in a plan view in the drawing. By providing the vibration absorbing material 51 between the circuit board 2 and the 1 st member 11, it is possible to effectively absorb vibration that may be transmitted from the circuit board 2 to the housing 1. As the vibration absorbing material 51, the members exemplified as the above-described member 14 can be used. The vibration absorbing material 51 and the member 14 may be the same member or different members. However, for the sake of simplicity of design and cost reduction, the vibration absorbing material 51 and the member 14 are preferably the same member, and particularly preferably both are independent bubble sponges.

The number and arrangement of the circuit boards 2 are not limited to those shown in the drawings, and may be arbitrary. Therefore, the circuit board 2 may be located on the 1 st member 11 side, for example, and a plurality of circuit boards 2 may be provided.

[ microphone ]

The 2 microphones 4 are mounted on the circuit board 2. The microphone 4 is disposed so as to correspond to the through hole 102 formed in the first member 11, and is disposed so as to sandwich the speaker unit 3 in a plan view.

The microphone 4 converts the user's voice into an electric signal, i.e., a voice signal. The converted audio signal is output to a signal processing circuit of the circuit board 2. As the microphone 4, for example, a MEMS (Micro-Electrical-Mechanical Systems) microphone can be used. The number and arrangement of the microphones 4 are not limited to those shown in the drawings, and may be arbitrary.

[ speaker unit ]

The speaker unit 3 is located on the 2 nd member 12 side of the circuit board 2, and is disposed separately from the circuit board 2 and the housing 1. As described above, the speaker unit 3 includes: a main body 31 having a sound emitting unit 311 for outputting sound; and a plurality of support members 32 integrally formed with the main body 31.

(Main body)

The main body 31 converts an audio signal supplied from a signal processing circuit provided in the circuit board 2 into vibration and outputs the sound. As shown in fig. 2, the main body 31 mainly has: a sound emitting unit 311 configured by a vibration member that vibrates in accordance with an audio signal; a drive source 312 that vibrates the sound emitting unit 311; and a frame 313 that houses the drive source 312. The conversion method is not particularly limited, but a so-called dynamic method can be used, for example. For example, when the body 31 is of a so-called dynamic type, the drive source 312 is constituted by a permanent magnet and a voice coil, and the sound emitting unit 311 is constituted by a diaphragm connected to the voice coil. The sound emitting unit 311 formed of a vibrating member may have a plate shape or a cone shape.

The sound emitting unit 311 is located on the 1 st member 11 side and is disposed to correspond to the through hole 101. Specifically, the through hole 101 is disposed so as to correspond to the sound emitting unit 311, and allows sound output from the sound emitting unit 311 to be emitted to the outside. Further, a seal ring 60 as a sealing member for securing airtightness between the body 31 and the 1 st member 11 is provided therebetween.

(supporting Member)

Fig. 4 is a perspective view showing the speaker unit shown in fig. 2. As shown in fig. 4, 2 support members 32 are connected to the main body 31. These support members 32 are disposed on both sides with the body 31 interposed therebetween. As shown in fig. 2, the support member 32 is attached to the circuit board 2 to support the main body 31 and to damp vibration of the main body 31.

As shown in fig. 4, the support member 32 is formed by bending an elongated plate-like member a plurality of times in the longitudinal direction. Specifically, the support member 32 is formed of a leaf spring formed using a thin metal plate. The support member 32 has: a portion 321 extending from the speaker unit 3 toward the opposite side to the speaker unit 3 in the x-axis direction; a portion 322 extending from the portion 321 toward the + z-axis direction; and a portion 323 extending from the portion 322 toward the opposite side to the speaker unit 3 in the x-axis direction. As shown in fig. 2, one end of the support member 32 is integrally connected to the main body 31, and the other end of the support member 32 is fixed to the circuit board 2 using a screw 301. Here, the support member 32 and the body 31 being integrally configured means that the support member 32 and the body 31 are not configured to be detachable, and includes not only a structure in which the support member 32 and the body 31 are integrally molded, but also a structure in which the support member 32 and the body 31 are integrated by welding. In the present embodiment, the support member 32 is welded to the frame 313 of the main body 31. The connecting portion of the frame 313 and the support member 32 is made of a metal material that can be welded to the support member 32.

As described above, since the support member 32 is formed using a plate-like member, the vibration of the main body 31 can be damped with a relatively simple structure. Therefore, the vibration transmitted to the circuit board 2 and further to the housing 1 via the support member 32 can be reduced. In addition, the support member 32 is thin and therefore easily elastically deformed. Therefore, the vibration of the main body 31 can be effectively damped.

Further, since the main body 31 and the support member 32 are integrally formed, the vibration of the main body 31 can be damped particularly effectively as compared with a case where they are formed separately. The structure can be simplified without requiring a member for fixing the main body 31 and the support member 32.

In the present embodiment, the support member 32 has a function of an electrode, that is, supplies an audio signal output from the signal processing circuit of the circuit board 2 to the main body 31. Since the support member 32 also functions as an electrode, it is not necessary to provide an electrode separately from the support member 32. Since it is not necessary to provide an electrode separately, the number of components can be reduced as compared with the configuration of embodiment 2 described later. In particular, in the present embodiment, the support member 32 is constituted by a thin plate spring. The plate spring is a member that is easily bent. Therefore, by using the plate spring, the support member 32 that supports the main body 31 and has the function of an electrode can be easily formed.

Here, in the acoustic output device 100, a low-pass filter is formed by the mass of the speaker unit 3, the compliance (compliance) of the support member 32, and the compliance of the gas existing in the internal space S of the housing 1. The input of the low-pass filter is a force for driving the sound emitting unit 311, and the output thereof is a force for pressing the circuit board 2. Accordingly, it is preferable that the thickness, shape, material, and the like of the support member 32 are appropriately set in the support member 32 so that the low-pass filter is configured by the mass of the speaker unit 3, the compliance of the support member 32, and the compliance of the gas existing in the internal space S of the housing 1. This reduces the vibration transmitted to the circuit board 2 and further to the housing 1. As a result, noise generated by the vibration of object 7 due to the transmission of the vibration of housing 1 to object 7 can be further reduced.

The support member 32 is formed of a leaf spring, but is not limited thereto, and may be a coil spring, for example. The support member 32 may have a cushioning property for relaxing vibration, but is preferably an elongated member having elasticity, a small thickness, and a small width in order to improve the vibration relaxing effect. The number of the support members 32 is not limited to 2, and may be 1 or 3 or more. The arrangement of the support member 32 is not limited to the illustrated arrangement. However, in order to stably support the main body 31, when the number of the support members 32 is plural, they are preferably arranged at equal intervals. In the case where the number of the support members 32 is plural, the structures of all the support members 32 may be the same or different. For example, there may be a support member 32 having a function as an electrode and a support member 32 not having a function as an electrode.

Further, a vibration absorbing material 52 (1 st vibration absorbing material) is interposed between the main body 31 and the 2 nd member 12 of the housing 1. The vibration absorbing material 52 is located at the center of the main body 31 in plan view. With this configuration, the main body 31 can be more stably installed in the housing 1 than in the case where the vibration absorbing material 52 is not installed. In addition, the vibration of the body 31 can be effectively absorbed. Therefore, noise generated by vibration of object 7 due to transmission of vibration of main body 31 to object 7 through frame 1 can be reduced.

As the vibration absorbing material 52, the members exemplified as the member 14 described above can be used. The vibration absorbing material 52 may be the same as the member 14 and the vibration absorbing material 51, or may be a different member. In the drawings, the vibration absorbing material 52 is provided only in a part of the region between the main body 31 and the housing 1, but may be provided so as to fill the entire region therebetween.

As described above, the audio output device 100 includes: a frame body 1; a circuit board 2 disposed inside the housing 1 and having a signal processing circuit; and a speaker unit 3 disposed inside the housing 1, including a main body 31 and a support member 32, the main body 31 having a sound emitting portion 311 that emits sound by vibrating in accordance with an audio signal supplied from the signal processing circuit, the support member 32 being integrally configured with the main body 31, supporting the main body 31 with respect to the circuit board 2, and having a cushioning property that attenuates vibration.

According to the sound output device 100 described above, since the support member 32 is provided, the vibration of the main body 31 can be damped. Therefore, the vibration transmitted to the circuit board 2 and further to the housing 1 via the support member 32 can be reduced. As a result, the noise generated by the vibration of body 31 transmitted to object 7 and the vibration of object 7 can be reduced. Further, since the main body 31 and the support member 32 are integrally formed, the vibration of the main body 31 can be damped particularly effectively as compared with a case where they are formed separately. Further, since the support member 32 is provided, the vibration transmitted to the object 7 is reduced, and therefore, the noise generated by the vibration of the body 31 transmitted to the microphone 4 via the housing 1 and the vibration of the microphone 4 can be reduced. As described above, the sound quality of the sound output device 100 can be improved. Further, since the support member 32 is integrally formed with the main body 31, it is not necessary to provide a member for supporting the main body 31 and a member for damping vibration separately, and therefore the number of components can be reduced, and the cost can be reduced.

In the present embodiment, the support member 32 is connected to the circuit board 2, but the support member 32 may be connected to the housing 1. In this case, noise generated by vibration of body 31 transmitted to object 7 through frame 1 and vibration of object 7 can be reduced. In the case where the support member 32 is connected to the housing 1, the support member 32 may be connected to any one of the 1 st, 2 nd, and 3 rd members 11, 12, and 13.

Further, as described above, since the low-pass filter is configured by the mass of the speaker unit 3, the compliance of the support member 32, and the compliance of the gas existing in the internal space S, the vibration transmitted to the housing 1 can be reduced. Therefore, noise generated by vibration of object 7 due to transmission of vibration of frame 1 to object 7 can be further reduced. Therefore, the sound quality of the sound output device 100 can be improved.

As described above, the sound output apparatus 100 further includes the vibration absorbing material 52 in addition to the support member 32. By the synergistic effect of the vibration-damping action of the support member 32 and the vibration-absorbing action of the vibration-absorbing material 52, it is possible to reduce noise generated by vibration of the object 7 due to vibration of the body 31 transmitted to the object 7 via the frame 1. The audio output device 100 includes the member 14 as described above. The component 14 is connected to a sealing ring 60. Therefore, the vibration of the seal ring 60 connected to the body 31 can be absorbed. Therefore, since the member 14 is provided in addition to the support member 32, the effect of reducing the noise generated by the vibration of the object 7 can be further improved. For example, by controlling the material of the vibration absorbing material 52, the material of the member 14, the shape of the support member 32, and the like, it is possible to effectively reduce noise generated by the vibration of the object 7, which is transmitted to the object 7 by the vibration of the sound output device 100.

The sound output device 100 described above can also output sounds other than sound, for example, music.

< embodiment 2 >

Next, embodiment 2 of the present invention will be explained. Fig. 5 is a sectional view of the audio output device according to embodiment 2. Fig. 6 is a plan view showing the interior of the sound output device shown in fig. 5, and is a sectional view taken along line a 2-a 2 in fig. 5.

This embodiment is the same as embodiment 1, except that the support member has a different structure and includes wiring.

In the following description, embodiment 2 will be mainly described focusing on differences from the above-described embodiments, and descriptions of the same matters will be omitted. In fig. 5 and 6, the same components as those of embodiment 1 are denoted by the same reference numerals.

The speaker unit 3A included in the audio output device 100A shown in fig. 5 and 6 is formed by integrally molding the main body 31 and the support member 32A. Specifically, the frame 313 and the support member 32A of the main body 31 are integrally molded. The frame 313 and the support member 32A are formed using various resin materials and various metal materials, for example.

The support member 32A in the present embodiment does not have the function of an electrode unlike the support member 32 in embodiment 1. Instead, the audio output device 100A in the present embodiment includes a plurality of wires 33 that electrically connect the main body 31 and the circuit board 2. The number of the wires 33 is not limited to 2 as shown in the drawing, and may be 1 or 3 or more. The wiring 33 supplies the audio signal output from the signal processing circuit of the circuit substrate 2 to the drive source 312 of the main body 31. As described above, since the wiring 33 is provided, the degree of freedom in designing the support member 32A can be improved as compared with the structure of the support member 32 in embodiment 1. Therefore, the structure for relaxing the vibration can be designed more simply, and the cost reduction can be achieved more easily.

In the present embodiment, the support member 32A is formed by bending a thin plate-like member at a plurality of positions, but the shape of the support member 32A is not limited to this, and may be a spiral shape, a mesh shape, or the like.

As described above, according to embodiment 2, noise can be reduced and the number of components can be reduced.

The sound output device of the present invention has been described above based on the illustrated embodiments, but the present invention is not limited to the above. The configuration of each part of the present invention may be replaced with any configuration that exerts the same function as the above-described embodiment, and any configuration may be added. In the present invention, any configurations of the above-described embodiments may be combined with each other.

In the above-described embodiments, the description has been given taking the example of the sound output device having the microphone, but the present invention may not have the microphone.

In the above-described embodiment, the case where the audio output device is used inside the automobile was described as an example, but the present invention can be used outside the automobile. For example, the sound output device may be mounted on an inner wall of a building.

From the modes described in the above examples, for example, the following modes are grasped.

An audio output device according to a preferred embodiment of the present invention includes: a frame body; a circuit board disposed inside the housing and having a signal processing circuit; and a speaker unit disposed inside the housing, including a main body having a sound emitting unit that emits sound by vibrating in accordance with a signal supplied from the signal processing circuit, and a support member that is integrally configured with the main body, supports the main body with respect to the housing or the circuit board, and has a cushioning property for damping vibration. According to this aspect, since the support member is provided, the support member has a cushioning property, and thus can damp vibration of the main body. Therefore, the vibration transmitted to the housing or the circuit board via the support member can be reduced. As a result, it is possible to reduce noise generated by vibration of the object due to transmission of vibration of the main body to the object through the housing. Further, since the support member is integrally formed with the main body, the number of components can be reduced, and the cost can be reduced.

In the preferred embodiment of the above-described audio output device, the main body and the circuit board are electrically connected by a wiring. According to this aspect, the degree of freedom in designing the support member can be improved.

In a preferred example of the aforementioned sound output device, the support member has a function of an electrode that supplies the signal to the main body. According to this aspect, the support member also functions as an electrode, and therefore, it is not necessary to provide an electrode separately from the support member. Therefore, the number of components can be further reduced.

In the preferred embodiment of the above-described audio output device, the mass of the speaker unit, the compliance of the support member, and the compliance of the gas present inside the housing form a low-pass filter. According to this aspect, the vibration transmitted to the circuit board or the housing can be further reduced. As a result, noise can be further reduced.

In a preferred example of the aforementioned sound output device, the support member is a plate-like member. According to this aspect, with a relatively simple configuration, it is possible to reduce the transmission of vibration of the main body to the housing or the circuit board and the vibration of the circuit board or the housing. The "plate-like shape" includes not only a shape like a flat plate but also a shape like a plate having a bent or curved portion.

In the preferred example of the above-described sound output device, a vibration absorbing material that absorbs vibration is provided between the housing and the main body. According to this aspect, the main body can be provided more stably and vibration transmitted from the main body to the housing can be absorbed, as compared with the case where no vibration absorbing material is used. Therefore, it is possible to further reduce noise generated by vibration of the body transmitted to the object through the housing.

Description of the reference numerals

1 … frame body, 2 … circuit board, 3a … speaker unit, 7 … non-mounted object, 31 … main body, 32a … supporting member, 33 … wiring, 52 … vibration absorbing material (1 st vibration absorbing material), 100a … sound output device, 311 … sound emitting part.