阅读说明：本技术 微纳结构的测量以及加工方法 (Micro-nano structure measuring and processing method ) 是由 郭登极 陈章 黄海军 林建军 许佼 伍晓宇 徐斌 于 2020-05-15 设计创作，主要内容包括：一种微纳结构的测量方法和加工方法,测量方法包括：获得微纳结构的实时显微图像,微纳结构包括至少一个微纳单元；识别并拟合显微图像而得到微纳单元的拟合图形；测量拟合图形以获取至少一个微纳单元的尺寸和位置信息。本发明提供的微纳结构的测量方法,通过获得微纳结构的实时显微图像,并通过识别和拟合得到与微纳单元的外形轮廓最为一致的拟合图形,测量拟合图形相当于测量对应的微纳单元,从而获得微纳单元精确的尺寸和位置信息,同时由于能够在加工的过程中执行测量方法,以便于对于微纳结构加工过程进行实时监测,有利于微纳结构的高精度加工。(A measuring method and a processing method of a micro-nano structure are provided, the measuring method comprises the following steps: obtaining a real-time microscopic image of a micro-nano structure, wherein the micro-nano structure comprises at least one micro-nano unit; identifying and fitting the microscopic image to obtain a fitting graph of the micro-nano unit; and measuring the fitted graph to obtain the size and position information of at least one micro-nano unit. According to the method for measuring the micro-nano structure, the real-time microscopic image of the micro-nano structure is obtained, the fitting graph which is most consistent with the outline of the micro-nano unit is obtained through recognition and fitting, the measured fitting graph is equivalent to the measurement of the corresponding micro-nano unit, so that accurate size and position information of the micro-nano unit is obtained, and meanwhile, the measuring method can be executed in the processing process, so that the real-time monitoring of the processing process of the micro-nano structure is facilitated, and the high-precision processing of the micro-nano structure is facilitated.)

1. A method for measuring a micro-nano structure is characterized by comprising the following steps:

obtaining a real-time microscopic image of a micro-nano structure, wherein the micro-nano structure comprises at least one micro-nano unit;

identifying and fitting the microscopic image to obtain a fitting graph of the real-time micro-nano unit;

and measuring the fitted graph to obtain the size and position information of the at least one micro-nano unit.

2. The method for measuring a micro-nano structure according to claim 1, wherein identifying and fitting the microscopic image to obtain a fitted graph of the micro-nano unit comprises:

and identifying and fitting the micro-image of the micro-nano structure through Hough transform to obtain a fitting graph of the micro-nano structure.

3. A method for measuring a micro-nano structure according to claim 1, wherein obtaining a real-time microscopic image of the micro-nano structure comprises:

and shooting the micro-nano structure through an electron microscope to obtain the microscopic image.

4. A method for measuring a micro-nano structure according to claim 1, wherein obtaining a real-time microscopic image of the micro-nano structure comprises:

and emitting an ion beam by an ion microscope to process to obtain the micro-nano structure, and pausing the processing of the micro-nano structure by the ion microscope when the ion microscope shoots the micro-nano structure by the ion beam to obtain the microscopic image.

5. A method for measuring micro-nano structure according to any one of claims 1 to 4, wherein the size of the micro-nano unit is 0.1 nm-100 μm.

6. A processing method of a micro-nano structure is characterized by comprising the following steps:

processing the workpiece according to the design pattern by using a first processing parameter to form a micro-nano structure;

acquiring size and position information of the micro-nano structure by a measuring method of the micro-nano structure according to any one of claims 1 to 5;

comparing the design pattern with the size and position information of the micro-nano unit of the micro-nano structure to obtain a processing error;

and according to the processing error, correspondingly compensating and correcting the processing of the next micro-nano unit under the condition that the whole processing is not finished.

7. A method for processing a micro-nano structure according to claim 6, wherein according to the processing error, corresponding compensation and correction are performed on the processing of the next micro-nano unit under the condition that the whole processing is not completed, and the method comprises the following steps:

and when the machining error is larger than a first preset value, compensating the first machining parameter to obtain a second machining parameter, and forming a next micro-nano structure unit on the workpiece by using the second machining parameter.

8. A method for processing a micro-nano structure according to claim 6, wherein according to the processing error, corresponding compensation and correction are performed on the processing of the next micro-nano unit under the condition that the whole processing is not completed, and the method comprises the following steps:

and when the machining error is smaller than or equal to a first preset value, continuing to use the first machining parameter to form a next micro-nano structure unit on the workpiece.

9. The method for processing a micro-nano structure according to claim 6, further comprising:

and when the machining error is larger than a second preset value, stopping machining.

10. The method for processing a micro-nano structure according to claim 6, further comprising:

and sending the coordinate information to a program script, and generating the design pattern by the program script according to the coordinate information.

Technical Field

The field belongs to the field of precision machining, and particularly relates to a high-precision machining method for a micro-nano structure.

Background

In recent years, micro-nano machining has been regarded as a new precision machining technology, and has a revolutionary significance for industries requiring high precision, such as medical treatment and semiconductors.

In the existing micro-nano processing scheme, generally, on a computer of processing equipment, simple drawing software provided by equipment manufacturers is used for designing corresponding patterns according to a pre-processed micro-nano structure, and then a processing program is executed until the processing is completely finished. In the process, due to the instability of energy sources such as an ion source and the like, even if the same parameters are adopted for micro-nano processing, the size and the position of the processed micro-nano structure can change to a certain extent, and the micro-nano structure is complex and the size of the micro-nano structure is nano-scale, so that the accurate size of the micro-nano structure is difficult to measure.

Therefore, the real-time accurate measurement of the size and the position of the micro-nano structure becomes the key of micro-nano processing in the processing process.

Disclosure of Invention

The invention aims to provide a method for measuring and processing a micro-nano structure, which can accurately measure the size and the position of the micro-nano structure in real time so as to monitor the micro-nano structure in real time during micro-nano processing and is beneficial to high-precision processing of the micro-nano structure.

In order to realize the purpose of the invention, the invention provides the following technical scheme:

in a first aspect, the invention provides a method for measuring a micro-nano structure, which comprises the following steps:

obtaining a real-time microscopic image of a micro-nano structure, wherein the micro-nano structure comprises at least one micro-nano unit;

identifying and fitting the microscopic image to obtain a fitting graph of the micro-nano unit;

and measuring the fitted graph to obtain the size and position information of the at least one micro-nano unit.

In one embodiment, identifying and fitting the microscopic image to obtain a fitted graph of the micro-nano unit includes:

and identifying and fitting the micro-image of the micro-nano structure through Hough transform to obtain a fitting graph of the micro-nano structure.

In one embodiment, obtaining a real-time microscopic image of a micro-nano structure comprises:

and shooting the micro-nano structure through an electron microscope to obtain the microscopic image.

In one embodiment, obtaining a real-time microscopic image of a micro-nano structure comprises:

and emitting an ion beam by an ion microscope to process to obtain the micro-nano structure, and pausing the processing of the micro-nano structure by the ion microscope when the ion microscope shoots the micro-nano structure by the ion beam to obtain the microscopic image.

In one embodiment, the size of the micro-nano unit is 0.1 nm-100 μm.

In a second aspect, the invention also provides a processing method of the micro-nano structure, and the processing method comprises the following steps:

processing the workpiece according to the design pattern by using a first processing parameter to form a micro-nano structure;

acquiring size and position information of the micro-nano structure by a micro-nano detection method according to any one of claims 1 to 5;

comparing the design pattern with the size and position information of the micro-nano unit of the micro-nano structure to obtain a processing error;

and according to the processing error, correspondingly compensating and correcting the processing of the next micro-nano unit under the condition that the whole processing is not finished.

In one embodiment, according to the processing error, performing corresponding compensation and correction on the processing of the next micro-nano unit under the condition that the whole processing is not completed yet includes:

and when the machining error is larger than a first preset value, compensating the first machining parameter to obtain a second machining parameter, and forming a next micro-nano structure unit on the workpiece by using the second machining parameter.

In one embodiment, according to the processing error, performing corresponding compensation and correction on the processing of the next micro-nano unit under the condition that the whole processing is not completed yet includes:

and when the machining error is smaller than or equal to a first preset value, continuing to use the first machining parameter to form a next micro-nano structure unit on the workpiece.

In one embodiment, the method of processing further comprises:

and when the machining error is larger than a second preset value, stopping machining.

In one embodiment, the method of processing further comprises:

and sending the coordinate information to a program script, and generating the design pattern by the program script according to the coordinate information.

The method for measuring the micro-nano structure has the beneficial effects that:

the method comprises the steps of obtaining a real-time microscopic image of the micro-nano structure, obtaining a fitting graph which is most consistent with the outline of the micro-nano unit through identification and fitting, wherein the measurement of the fitting graph is equivalent to the measurement of the corresponding micro-nano unit, so that accurate size and position information of the micro-nano unit are obtained, and meanwhile, the measurement method can be executed in the processing process, so that the real-time monitoring of the processing process of the micro-nano structure is facilitated, and the high-precision processing of the micro-nano structure is facilitated.

The processing method of the micro-nano structure provided by the invention has the beneficial effects that:

by adding the measuring method of the micro-nano structure provided by the invention into the processing method, the size and position information of the micro-nano unit is monitored in real time to obtain the processing error of the micro-nano unit, the subsequently processed micro-nano unit is automatically compensated according to the processing error, the subsequently processed micro-nano unit is ensured to have higher precision, the accumulation of the processing error is avoided, the operation time of an operator is reduced, the operation efficiency is improved, meanwhile, the dependency of the process on the level of the operator is reduced, the trial processing is not needed, and the high-precision and full-automatic processing requirements of the micro-nano structure are favorably realized.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.

Fig. 1 is a schematic flow chart of a method for measuring a micro-nano structure in an embodiment;

FIG. 2a is a schematic structural view of a microscopic image in one embodiment;

FIG. 2b is a schematic structural view of a microscope image in another embodiment;

FIG. 3 is a schematic flow chart of a method for processing a micro-nano structure according to an embodiment;

fig. 4 is a schematic flow chart of a processing method of a micro-nano structure in another embodiment.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.

The embodiment of the invention provides a method for measuring a micro-nano structure, which can be applied to high-precision medical instruments such as a femtosecond laser surgical instrument popular in recent years, a micro-nano three-dimensional printing technology, a precise semiconductor manufacturing industry, an etching industry and the like.

Referring to fig. 1, the measurement method includes:

s101: obtaining a real-time microscopic image of a micro-nano structure, wherein the micro-nano structure comprises at least one micro-nano unit;

s102: identifying and fitting the microscopic image to obtain a fitting graph of the micro-nano unit;

s103: and measuring the fitted graph to obtain the size and position information of at least one micro-nano unit.

According to the method for measuring the micro-nano structure, the real-time microscopic image of the micro-nano structure is obtained, the fitting graph which is most consistent with the outline of the micro-nano unit is obtained through recognition and fitting, the measured fitting graph is equivalent to the measurement of the corresponding micro-nano unit, so that accurate size and position information of the micro-nano unit is obtained, and meanwhile, the measuring method can be executed in the processing process, so that the real-time monitoring of the processing process of the micro-nano structure is facilitated, and the high-precision processing of the micro-nano structure is facilitated.

Specifically, the contour of the micro-nano unit has certain irregularity, the dimension of the micro-nano unit is difficult to measure by a conventional measuring means, a fitting graph which is most consistent with the contour of the micro-nano unit and is in a regular shape is obtained through S102, and the contour of the micro-nano unit is replaced by the fitting graph. For example, if the fitting graph is an ellipse, the size and position information of the micro-nano unit can be obtained by measuring the numerical values of the long axis and the short axis of the ellipse and the coordinates of the focus; if the fitting graph is square, the size and the position information of the micro-nano unit can be obtained by measuring the side length and the center coordinate of the square.

In one embodiment, referring to fig. 2a, 10 is a microscopic image portion of the micro-nano cells, and 20 is a fitting graph of the micro-nano cells. Therefore, after one micro-nano unit is processed, the energy source needs to be turned off first, aligned to the position of the next micro-nano unit, and then turned on to process the next micro-nano unit.

In one embodiment, referring to fig. 2b, 100 is a micro-image portion of the micro-nano structure, and 20 is a fitting graph of the micro-nano structure. The micro-nano units can be regarded as each section of contour of the micro-nano structure, and the micro-nano units are sequentially connected end to form the micro-nano structure. The micro-nano units can be continuously processed without resetting an energy source.

In one embodiment, referring to fig. 1, S102: identifying and fitting the microscopic image to obtain a fitting graph of the micro-nano unit, wherein the fitting graph comprises the following steps:

and identifying and fitting the micro-images of the micro-nano structure through Hough transform to obtain a fitting graph of the micro-nano structure.

Specifically, the basic principle of hough transform is that a set conforming to the specific shape is obtained as a hough transform result by calculating a local maximum value of an accumulated result in a parameter space, so that a fitting graph with a relatively close micro-nano structure can be obtained through hough transform. After the fitting graph of the micro-nano unit is identified and fitted through Hough transform, the size and the position of the fitting graph can be measured by writing a measuring program in computer languages such as Python language, C language and the like. The measuring program can be transplanted to various software and hardware platforms, such as a device for shooting a micro-nano structure to obtain a microscopic image, or a source device for emitting an energy beam, and the like, and can also be a separately arranged computer. In addition, the hough transform and the measurement program are preferably located on the same carrier, so as to improve the processing efficiency.

The most consistent fitting graph of the micro-nano structure is obtained by adopting Hough transform, so that the information closest to the real size and position of the micro-nano structure can be obtained in the subsequent measurement work, and the micro-nano processing precision can be improved.

In one embodiment, referring to fig. 1, S101: obtaining a microscopic image of the micro-nano structure, comprising:

and shooting the micro-nano structure through an electron microscope to obtain a microscopic image.

Specifically, when the electron microscope is used for shooting the micro-nano structure, the micro-nano structure can be manufactured on a workpiece by adopting processing equipment such as an ion source equipment, other electron source equipment or laser source equipment, and the shooting and the processing are not interfered with each other, so that the shooting and the processing can be carried out simultaneously. It can be understood that after a micro-nano unit is processed by the processing equipment, the energy source needs to be turned off first, then the energy source is aligned to the next position on the next workpiece where the micro-nano unit needs to be manufactured, and then the energy is emitted to manufacture the next micro-nano unit. And when the micro-nano unit is manufactured, the electron microscope can shoot the micro-nano unit which is just manufactured to obtain a microscopic image of the micro-nano unit, and then the size and the position information of the micro-nano unit are obtained through the microscopic image, and the time consumed in the process is less than the intermittent time between the processing of two micro-nano units by the processing equipment, so that the measuring method can ensure the efficiency of micro-nano processing and simultaneously improve the precision of the micro-nano processing.

In addition, after the machining equipment finishes machining the micro-nano units, the electron microscope can shoot the micro-nano units to obtain microscopic images of the micro-nano units, and then the positions and the sizes of the microscopic images of the micro-nano units can be measured.

In one embodiment, referring to fig. 1, S101: obtaining a microscopic image of the micro-nano structure, comprising:

and emitting an ion beam by the ion microscope to process to obtain the micro-nano structure, and pausing the processing of the micro-nano structure by the ion microscope when the ion microscope shoots the micro-nano structure by the ion beam to obtain a microscopic image.

Specifically, in this embodiment, the operations of processing the micro-nano structure and photographing the micro-nano structure are both performed by the ion microscope, so that the processing and photographing of the micro-nano unit cannot be performed simultaneously, and of course, if the ion microscope has a plurality of ion sources, the processing and photographing of the micro-nano unit can be performed simultaneously with reference to the previous embodiment. Generally, the ion microscope is provided with an ion source, so that the micro-nano unit cannot be shot and processed simultaneously, but the ion microscope has an intermittent time after the micro-nano unit is manufactured, so that the micro-nano unit can be shot and the size of the micro-nano unit can be obtained within the intermittent time, and the next micro-nano unit can be processed conveniently. Similarly, the ion microscope may process a plurality of micro-nano cells and then take an image. Because processing and shooting are finished by the ion microscope, equipment with a shooting function does not need to be additionally arranged, and the cost of micro-nano processing is reduced.

In one embodiment, referring to fig. 2a and 2b, the size of the micro-nano unit is 0.1nm to 100 μm. Specifically, the size of the micro-nano unit can be the perimeter, the area, the height of the recess or the protrusion, and the like of the contour. When the contour of the micro-nano unit is circular, the size of the micro-nano unit can also refer to the radius of the micro-nano unit.

Referring to fig. 3, an embodiment of the present invention further provides a method for processing a micro/nano structure, where the method includes:

s1: processing the workpiece according to the design pattern by using a first processing parameter to form a micro-nano structure;

s2: the size and position information of the micro-nano structure is obtained through the micro-nano detection method provided by the embodiment of the invention;

s3: comparing the design pattern with the size and position information of the micro-nano unit of the micro-nano structure to obtain a processing error;

s4: and according to the machining error, correspondingly compensating and correcting the machining of the next micro-nano unit under the condition that the whole machining is not finished.

The method can be understood that in the existing micro-nano processing scheme, processing is started after a pattern is drawn until the micro-nano structure is manufactured, whether a processing result meets design requirements cannot be known in the whole micro-nano structure processing process, evaluation can be carried out after processing is finished, if large size or position deviation occurs in the processing process, correction cannot be carried out, processing errors are accumulated, the micro-nano structure cannot meet the design requirements, and the whole workpiece is scrapped. Moreover, due to the instability of energy sources such as the ion source, even if the same parameters are adopted for micro-nano processing, the size and the position of the processed micro-nano structure change to a certain extent, so that in order to achieve consistency of processing results, an operator needs to re-optimize the parameters through 'trial processing' to start working after the energy sources such as the ion source are restarted.

According to the machining method of the micro-nano structure, the measuring method of the micro-nano structure is added into the machining method, the size and position information of the micro-nano unit is monitored in real time, the machining error of the micro-nano unit is obtained, the micro-nano unit which is subsequently machined is automatically compensated according to the machining error, the micro-nano unit which is subsequently machined is guaranteed to have higher precision, the accumulation of the machining error is avoided, the operation time of an operator is reduced, the operation efficiency is improved, meanwhile, the dependency of the process on the level of the operator is reduced, trial machining is not needed, and the high-precision and full-automatic machining requirements of the micro-nano structure are favorably met.

Specifically, the processing method can be applied to material reduction manufacturing of etching and material increase manufacturing of deposition, and in addition, the processing method can also be applied to precision semiconductor manufacturing and various types of micro-nano ultra-precision processing using energy beams. The first processing parameters include the focus position of the energy beam, the irradiation duration, the scanning path, the movement of the motion platform, the movement of the manipulator, and the like.

In one embodiment, referring to fig. 3, S4: according to the processing error, the corresponding compensation and correction are carried out on the processing of the next micro-nano unit under the condition that the whole processing is not finished, and the method comprises the following steps:

s41: and when the machining error is larger than a first preset value, compensating the first machining parameter to obtain a second machining parameter, and forming a next micro-nano structure unit on the workpiece by using the second machining parameter.

Specifically, the first preset value is a design tolerance, that is, an allowable deviation range between the micro-nano unit and the design pattern. When the processing error exceeds the deviation range, the action effect of the micro-nano unit is weakened to a certain degree, and if the processing error is accumulated, the action effect of the micro-nano structure is greatly reduced, and even various industrial tasks cannot be completed and are scrapped.

For example, if the position deviation of the micro-nano unit a is greater than a first preset value, the first processing parameter may be compensated, and the focusing position of the energy beam, the irradiation duration, the scanning path, the movement of the motion platform, and the like may be adjusted, so as to ensure that the position deviation of the next micro-nano unit B is less than the first preset value. Otherwise, along with the accumulation of the position deviation, the integral micro-nano structure has larger difference with the design pattern.

Similarly, referring to fig. 4, when the machining error of the micro-nano unit machined by using the second machining parameter also exceeds the first preset value, the second machining parameter may be compensated to obtain a third machining parameter, and the next micro-nano unit is machined on the workpiece by using the third machining parameter.

In one embodiment, referring to fig. 3, S4: according to the processing error, the corresponding compensation and correction are carried out on the processing of the next micro-nano unit under the condition that the whole processing is not finished, and the method comprises the following steps:

and when the machining error is smaller than or equal to a first preset value, continuously using the first machining parameter to form a next micro-nano structure unit on the workpiece.

It can be understood that when the machining error is less than or equal to the first preset value, i.e. the machining error is within the range of the design tolerance, the design requirement is met, and the first machining parameter does not need to be adjusted. Due to uncertainty of errors, the machining error of the next micro-nano unit may be larger than that of the previous micro-nano unit, or may be smaller than or equal to that of the previous micro-nano unit, and the machining error smaller than or equal to that of the previous micro-nano unit meets the design requirement. However, when the machining error is larger than the machining error of the previous micro-nano unit, the first machining parameter may still stay within the design tolerance without being adjusted, and the first machining parameter may also be compensated if the first machining parameter exceeds the design tolerance.

Specifically, a program for compensating the first processing parameter can be written through computer languages such as Python language, C language, JAVA language and the like to meet the design requirement of automatic compensation, and the automation of micro-nano processing is facilitated.

By setting a first preset value, when the machining error is larger than the first preset value, compensating the first machining parameter to obtain a second machining parameter, and forming a next micro-nano structure unit on the workpiece by using the second machining parameter; when the machining error is smaller than or equal to the first preset value, the first machining parameter is continuously used for forming a next micro-nano structure unit on the workpiece, so that the machining error of the micro-nano unit is basically within the range of design tolerance, the precision of the micro-nano structure is higher, meanwhile, an automatic compensation mechanism is used for reducing the operation time of an operator, and the risk of error of the operator is reduced.

In one embodiment, referring to fig. 3, the processing method further includes:

and when the machining error is larger than a second preset value, stopping machining.

Specifically, the second preset value is the maximum allowable deviation from the design pattern, i.e., a limit value greater than the design tolerance. When the machining error exceeds the limit value, the micro-nano structure completely deviates from the design pattern, the micro-nano structure is difficult to save, the workpiece is basically scrapped, and only working hours and energy are wasted when the workpiece is continuously machined. Therefore, the second preset value is set, the waste micro-nano structure in the processing process can be abandoned, so that the loss is reduced as much as possible, the micro-nano processing efficiency is improved, and the production cost is reduced.

In one embodiment, the method of processing further comprises:

s0: and sending the coordinate information to a program script, and generating a design pattern by the program script according to the coordinate information.

It can be understood that the simple drawing software provided by the current micro-nano processing equipment provider has single function, and operators need to draw basic graphs such as rectangles and circles one by one, so that errors are easy to occur and the efficiency is low. Especially, when a complex micro-nano structure is processed, the efficiency of drawing a corresponding design pattern is lower.

By setting the program script and inputting coordinate information to the program script, the corresponding design pattern of the micro-nano structure can be generated, and the method has the advantages of high efficiency and low possibility of error. Especially for the design pattern of the array or some complex design patterns, the time of operators can be greatly saved, and the error rate is greatly reduced.

In addition, S4 "in the processing method may be completed by the program script" to perform corresponding compensation and correction on the processing of the next micro-nano cell if the whole processing is not completed yet according to the processing error ".

In one embodiment, referring to fig. 3, S1: according to the design pattern, a micro-nano structure is formed on a workpiece by using first processing parameters, and the method comprises the following steps:

and injecting an energy beam to form a micro-nano structure on the workpiece, wherein the energy beam can be a focusing energy beam such as an ion beam, an electron beam, laser and the like.

In one embodiment, referring to fig. 3, the processing method further includes S5: stopping the machining when all the micro-nano units are machined, and executing S5 when all the micro-nano units are machined except for the condition that the machining is stopped for reducing loss when the machining error is larger than a second preset value: and stopping the machining, which is beneficial to the automation of micro-nano machining.

While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.