阅读说明：本技术 一种用于印刷基板的印刷装置 (Printing device for printing substrate ) 是由 谢桂荣 谢嘉敏 于 2021-06-29 设计创作，主要内容包括：本发明公开了一种用于印刷基板的印刷装置,包括印刷机主体,所述印刷机主体的底座上表面中间位置设置有矩阵吸附固定机构,所述矩阵吸附固定机构的右上角和左下角位置处均设置有L形限位板,所述L形限位板的外侧均固定连接有倾斜设置的第一气缸,所述印刷机主体的支架正面安装有升降移动座,所述升降移动座的下端安装有竖直设置的刮板,所述升降移动座的一侧固定安装有锡膏吸除擦拭机构。本发明的矩阵吸附固定机构利用真空从底部吸附固定住印刷基板,避免钢网与印刷基板之间存在空隙,进而杜绝因存在空隙导致的锡膏涂抹位置偏移或锡膏过多的问题；锡膏吸除擦拭机构则能够在锡膏印刷完成后吸去及擦除掉钢网上残余的锡膏。(The invention discloses a printing device for a printing substrate, which comprises a printing machine main body, wherein a matrix adsorption fixing mechanism is arranged in the middle of the upper surface of a base of the printing machine main body, L-shaped limiting plates are respectively arranged at the upper right corner and the lower left corner of the matrix adsorption fixing mechanism, first cylinders which are obliquely arranged are respectively and fixedly connected to the outer sides of the L-shaped limiting plates, a lifting moving seat is installed on the front surface of a support of the printing machine main body, a vertically arranged scraping plate is installed at the lower end of the lifting moving seat, and a tin paste adsorption wiping mechanism is fixedly installed on one side of the lifting moving seat. The matrix adsorption fixing mechanism utilizes vacuum to adsorb and fix the printed substrate from the bottom, so that a gap between the steel mesh and the printed substrate is avoided, and the problem of offset of a solder paste smearing position or excessive solder paste caused by the gap is solved; the solder paste sucking and wiping mechanism can suck and wipe off the residual solder paste on the steel screen after the solder paste printing is finished.)

1. The utility model provides a printing device for printing substrate, includes printing machine main part (1), its characterized in that, base (2) upper surface intermediate position of printing machine main part (1) is provided with matrix adsorption fixed establishment (30), the matrix adsorbs the upper right corner and the lower left corner position department of fixed establishment (30) and all is provided with L shape limiting plate (3), first cylinder (4) that the equal fixedly connected with in the outside slope of L shape limiting plate (3) set up, support (5) of printing machine main part (1) openly install lift removal seat (6), the lower extreme of lift removal seat (6) is installed scraper blade (7) of vertical setting, one side fixed mounting that lift removal seat (6) has the tin cream to inhale and removes and clean mechanism (8).

2. A printing unit for printing substrates according to claim 1, wherein the lines of the two first cylinders (4) in the telescopic direction are parallel to the diagonal of the matrix suction fixing mechanism (30).

3. The printing device for the printing substrate according to claim 2, wherein the matrix adsorption fixing mechanism (30) comprises a plurality of lifting rods (9) forming a matrix structure, the bottoms of the lifting rods (9) are communicated to an evacuation chamber (10) arranged inside the base (2), and a vacuum pump (11) is fixedly arranged in the middle of the bottom of the evacuation chamber (10).

4. The printing device for the printing substrate according to claim 3, wherein the lifting rods (9) respectively comprise a lifting inner rod (12) and an outer sleeve (13) which is sleeved outside the lifting inner rod (12) in a sealing and sliding manner, a supporting ring (14) is fixedly connected to the top end of the lifting inner rod (12), a rubber ring (15) is fixedly bonded to the upper surface of the supporting ring (14), a micro stepping motor (16) fixedly mounted on the upper surface of the vacuum pumping chamber (10) is vertically arranged on one side of each outer sleeve (13), a mounting frame (17) fixedly mounted on the upper surface of the vacuum pumping chamber (10) is vertically arranged on the outer side of the micro stepping motor (16), vertically arranged ball screws (18) are rotatably mounted in the middle positions of the mounting frame (17), and the lower ends of the ball screws (18) are connected to output shafts of the micro stepping motor (16), the lifting inner rod is characterized in that the ball screw (18) is provided with a connecting plate (19) in a sliding mode, and the other end of the connecting plate (19) is fixedly sleeved on the outer surface of the upper end of the lifting inner rod (12).

5. The printing device for the printing substrate according to claim 4, wherein the inner lifting rod (12) and the outer sleeve (13) are both of a hollow structure, the outer surface of the lower end of the inner lifting rod (12) is provided with an anti-drop boss (21), two rubber sealing rings (20) sleeved on the inner lifting rod (12) are arranged below the anti-drop boss (21), the top end of the outer sleeve (13) is provided with an anti-drop platform (22), the inner lower end of the outer sleeve (13) is fixedly provided with an air blocking plug (31), and the outer diameter of the air blocking plug (31) is the same as the inner diameter of the inner lifting rod (12).

6. The printing device for the printed substrate according to claim 5, wherein the solder paste sucking and wiping mechanism (8) comprises a connecting block (23) fixedly mounted on one side of the lifting and moving seat (6), a vertically arranged second cylinder (24) is fixedly mounted at the outer end of the connecting block (23), a strip-shaped suction head (25) is fixedly connected to the lower end of a telescopic inner rod of the second cylinder (24), connecting rods (26) are fixedly mounted at both ends of the outer side surface of the strip-shaped suction head (25), a wiping roller (27) is rotatably mounted at the other ends of the two connecting rods (26), a corrugated pipe (28) is communicated with the middle position of the outer side surface of the strip-shaped suction head (25), and the other end of the corrugated pipe (28) is connected to a dust collector (29) fixedly mounted at the upper end of the bracket (5).

7. A printing unit for printing substrates according to claim 6, characterized in that the strip-shaped suction head (25) is of flared configuration with its lower end, the strip-shaped suction head (25), the squeegee (7) and the wiping roller (27) all being perpendicular to the vertical plane in which the support (5) is located.

8. A printing unit for printing substrates according to claim 7, characterized in that both the first (4) and the second (24) cylinders are single-acting double-rod cylinders.

Technical Field

The invention relates to the technical field of solder paste printing devices, in particular to a printing device for a printed substrate.

Background

Generally, a plurality of welding holes for welding electronic components are formed in the printed substrate, and a solder paste printing device is used for smearing solder paste on the printed substrate in the production process of the printed substrate.

The existing solder paste printing device generally adopts a clamping structure to fix a printing substrate from the outer side, so that the printing substrate and a steel mesh can not be tightly attached during printing, and a gap between the printing substrate and the steel mesh can cause the problems of offset of a solder paste coating position or excessive solder paste, thereby being not beneficial to welding electronic components on the printing substrate; in addition, certain solder paste can remain on the steel mesh after solder paste printing is finished, and if the solder paste cannot be cleaned in time, the problems of unsmooth solder paste smearing and inaccurate printing position during next printing can be caused.

In view of this, the present invention has been devised a printing apparatus for printing a substrate to solve the above-mentioned problems.

Disclosure of Invention

The invention aims to provide a printing device for a printing substrate, which aims to solve the problems that the printing substrate is fixed from the outer side by generally adopting a clamping structure in the prior solder paste printing device in the background technology, so that the printing substrate cannot be clung to a steel mesh during printing, and a gap between the printing substrate and the steel mesh causes the offset of a solder paste coating position or excessive solder paste, thereby being not beneficial to welding electronic components on the printing substrate; in addition, certain solder paste can remain on the steel mesh after solder paste printing is finished, and if the solder paste cannot be cleaned in time, the problems of unsmooth solder paste smearing and inaccurate printing position during next printing can be caused.

In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a printing device for printing substrate, includes the printing machine main part, the base upper surface intermediate position of printing machine main part is provided with the matrix and adsorbs fixed establishment, the matrix adsorbs fixed establishment's upper right corner and lower left corner position department all to be provided with L shape limiting plate, the first cylinder that the equal fixedly connected with in the outside slope of L shape limiting plate set up, the support of printing machine main part openly installs the lift and removes the seat, the lower extreme that the lift removed the seat installs the scraper blade of vertical setting, one side fixed mounting that the lift removed the seat has tin cream to absorb removes and cleans the mechanism.

As a further scheme of the invention, the straight lines of the stretching directions of the two first cylinders are parallel to the diagonal line of the matrix adsorption fixing mechanism.

As a further scheme of the invention, the matrix adsorption fixing mechanism comprises a plurality of lifting rods forming a matrix structure, the bottoms of the lifting rods are communicated to a vacuum pumping chamber arranged in the base, and a vacuum pump is fixedly arranged in the middle of the bottom of the vacuum pumping chamber.

As a further scheme of the invention, the lifting rods respectively comprise a lifting inner rod and an outer sleeve which is sleeved outside the lifting inner rod in a sealing and sliding manner, the top end of the lifting inner rod is fixedly connected with a supporting ring, the upper surface of the supporting ring is fixedly bonded with a rubber ring, one side of each outer sleeve is vertically provided with a micro stepping motor which is fixedly installed on the upper surface of the vacuum pumping chamber, the outer sides of the micro stepping motors are respectively and vertically provided with an installation frame which is fixedly installed on the upper surface of the vacuum pumping chamber, the middle position of the installation frame is respectively and rotatably provided with a vertically arranged ball screw, the lower end of each ball screw is connected to an output shaft of the micro stepping motor, the ball screws are respectively and slidably provided with a connecting plate, and the other end of each connecting plate is fixedly sleeved on the outer surface of the upper end of the lifting inner rod.

As a further scheme of the invention, the inner lifting rod and the outer sleeve are both of a hollow structure, the outer surface of the lower end of the inner lifting rod is provided with an anti-disengaging boss, two rubber sealing rings sleeved on the inner lifting rod are arranged below the anti-disengaging boss, the top end of the outer sleeve is provided with an anti-disengaging table, the lower end of the inner part of the outer sleeve is fixedly provided with an air blocking plug, and the outer diameter of the air blocking plug is the same as the inner diameter of the inner lifting rod.

As a further scheme of the invention, the solder paste sucking and wiping mechanism comprises a connecting block fixedly arranged on one side of a lifting moving seat, a second air cylinder which is vertically arranged is fixedly arranged at the outer end of the connecting block, a strip-shaped suction head is fixedly connected to the lower end of a telescopic inner rod of the second air cylinder, connecting rods are fixedly arranged at two ends of the outer side surface of the strip-shaped suction head, wiping rollers are rotatably arranged at the other ends of the two connecting rods, a corrugated pipe is communicated with the middle position of the outer side surface of the strip-shaped suction head, and the other end of the corrugated pipe is connected to a dust collector fixedly arranged at the upper end of a support.

As a further scheme of the invention, the strip-shaped suction head is of a horn-shaped structure with the lower end expanding outwards, and the strip-shaped suction head, the scraper and the wiping roller are all perpendicular to a vertical surface where the bracket is located.

As a further scheme of the invention, the two first air cylinders and the two second air cylinders are single-action double-rod air cylinders.

Compared with the prior art, the invention has the beneficial effects that:

(1) the matrix adsorption fixing mechanism can lift the printed substrate from the bottom of the printed substrate and fix the printed substrate by vacuum adsorption, so that a gap between a steel mesh and the printed substrate can be avoided, and the problem of offset of a solder paste coating position or excessive solder paste caused by the gap is solved; the solder paste sucking and wiping mechanism can suck and wipe off residual solder paste on the steel mesh after the solder paste printing is finished, so that the surface of the steel mesh is kept in a cleaner and cleaner state, and the subsequent printing is facilitated;

(2) the vacuum pump of the matrix adsorption fixing mechanism works to vacuumize the interior of the vacuum pumping chamber, so that the top of the lifting rod communicated with the vacuum pumping chamber can generate certain suction force, and the aim of adsorption fixing is fulfilled; when the matrix adsorption fixing mechanism consisting of a plurality of lifting rods is used, the lifting inner rods of the lifting rods corresponding to the positions of the welding holes on the printed substrate are not lifted, namely, only the lifting rods corresponding to the areas without the welding holes on the printed substrate are in a lifting and vacuumizing working state, so that the sealing property of the tight adhesion positions of the lifting rods and the lower surface of the printed substrate is ensured;

(3) the anti-falling boss and the anti-falling buckling table can prevent the inner lifting rod from falling off from the top of the outer sleeve 13, and the matching of the two rubber sealing rings can ensure the airtightness of the inner part of the lifting rod, so that the vacuum adsorption function is conveniently realized; when the lifting inner rod slides to the lowest end in the outer sleeve, the air blocking plug is inserted into the inner bottom end of the lifting inner rod, so that the vacuum pumping chamber can be blocked from being communicated with the outside air through the non-lifted lifting inner rod, and the sealing performance of the vacuum pumping chamber is ensured; when the lifting inner rod rises, the lifting inner rod is separated from the choke plug, and when the top of the lifting inner rod is shielded, vacuum generated in the vacuumizing chamber can generate certain suction to the top of the lifting inner rod;

(4) the second cylinder of the solder paste absorbing and wiping mechanism extends downwards to drive the strip-shaped suction head to descend, the dust collector works, then the lifting moving seat drives the solder paste absorbing and wiping mechanism to move left and right, the strip-shaped suction head can absorb and clean residual solder paste on the surface of the steel mesh, and the wiping roller on one side of the strip-shaped suction head can also wipe the surface of the steel mesh after the strip-shaped suction head absorbs the residual solder paste, so that the surface of the steel mesh is kept in a clean and tidy state, and the next solder paste printing is facilitated.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic view of the overall structure of a printing apparatus for printing a substrate according to the present invention;

FIG. 2 is a schematic top view of a base of a printing apparatus for printing a substrate according to the present invention;

FIG. 3 is a schematic longitudinal sectional view of a matrix adsorption fixing mechanism of a printing apparatus for printing a substrate according to the present invention;

FIG. 4 is a schematic view of a driving connection structure of a micro stepping motor and a lifting rod of a printing device for printing a substrate according to the present invention;

FIG. 5 is a schematic view of a vertical cross-section of a lifter of a printing apparatus for printing a substrate according to the present invention;

fig. 6 is a schematic view of a choke plug structure of a printing apparatus for printing a substrate according to the present invention;

FIG. 7 is a schematic view of a solder paste sucking and wiping mechanism of a printing apparatus for printing a substrate according to the present invention.

In the drawings, the components represented by the respective reference numerals are listed below:

1. a printer main body; 2. a base; 3. an L-shaped limiting plate; 4. a first cylinder; 5. a support; 6. a lifting moving seat; 7. a squeegee; 8. a solder paste sucking and wiping mechanism; 9. a lifting rod; 10. vacuumizing the chamber; 11. a vacuum pump; 12. an inner lifting rod; 13. an outer sleeve; 14. a support ring; 15. a rubber ring; 16. a micro stepper motor; 17. a mounting frame; 18. a ball screw; 19. a connecting plate; 20. a rubber seal ring; 21. the anti-falling boss; 22. an anti-trip platform; 23. connecting blocks; 24. a second cylinder; 25. a strip-shaped suction head; 26. a connecting rod; 27. a wiping roller; 28. a bellows; 29. a vacuum cleaner; 30. a matrix adsorption fixing mechanism; 31. and (5) blocking air.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

The first embodiment is as follows:

please refer to fig. 1, a printing device for a printed substrate, includes a printing machine main body 1, the middle position of the upper surface of a base 2 of the printing machine main body 1 is provided with a matrix adsorption fixing mechanism 30, the upper right corner and the lower left corner of the matrix adsorption fixing mechanism 30 are provided with an L-shaped limiting plate 3, a first cylinder 4 obliquely arranged on the outer side of the L-shaped limiting plate 3 is fixedly connected with, a lifting moving seat 6 is positively installed on a support 5 of the printing machine main body 1, a scraping plate 7 vertically arranged is installed at the lower end of the lifting moving seat 6, and a tin paste adsorption wiping mechanism 8 is fixedly installed on one side of the lifting moving seat 6.

The matrix adsorption fixing mechanism 30 can lift the printed substrate from the bottom of the printed substrate and fix the printed substrate by vacuum adsorption, so that a gap between a steel mesh and the printed substrate can be avoided, and the problem of offset of a solder paste coating position or excessive solder paste caused by the gap is solved; the solder paste absorbing and wiping mechanism 8 can absorb and wipe off residual solder paste on the steel mesh after the solder paste printing is finished, so that the surface of the steel mesh is kept in a clean and tidy state, and the subsequent printing is facilitated.

Referring to fig. 2, the straight lines of the two first cylinders 4 in the telescopic directions are both parallel to the diagonal line of the matrix adsorption fixing mechanism 30; two the flexible of first cylinder 4 can drive two L shape limiting plates 3 and adsorb the inside and outside removal of the direction of fixed establishment 30 diagonal along the matrix to can fix a position the printing substrate of placing on the fixed establishment 30 is adsorbed to the matrix earlier, and adjustable position's L shape limiting plate 3 can be applicable to the not printing substrate of equidimension.

Referring to fig. 3, the matrix adsorption fixing mechanism 30 includes a plurality of lifting rods 9 forming a matrix structure, the bottoms of the lifting rods 9 are all communicated to an evacuation chamber 10 disposed inside the base 2, and a vacuum pump 11 is fixedly mounted in the middle of the bottom of the evacuation chamber 10.

The vacuum pump 11 of the matrix adsorption fixing mechanism 30 works to vacuumize the interior of the vacuum pumping chamber 10, so that a certain suction force can be generated at the top of the lifting rod 9 communicated with the vacuum pumping chamber 10, and the purpose of adsorption fixing is achieved.

Referring to fig. 4, the lifting rods 9 each include a lifting inner rod 12 and an outer sleeve 13 hermetically slidably sleeved on the outer side of the lifting inner rod 12, a supporting ring 14 is fixedly connected at the top end of the lifting inner rod 12, a rubber ring 15 is fixedly bonded on the upper surface of the supporting ring 14, a micro stepping motor 16 fixedly installed on the upper surface of the vacuum pumping chamber 10 is vertically arranged on one side of each outer sleeve 13, the outer sides of the micro stepping motors 16 are vertically provided with mounting frames 17 fixedly arranged on the upper surface of the vacuum pumping chamber 10, the middle positions of the mounting frames 17 are rotatably provided with vertically arranged ball screws 18, the lower ends of the ball screws 18 are connected to the output shaft of the micro stepping motor 16, the ball screw 18 is provided with a connecting plate 19 in a sliding manner, and the other end of the connecting plate 19 is fixedly sleeved on the outer surface of the upper end of the inner lifting rod 12.

The micro stepping motor 16 drives the ball screw 18 to rotate forwards and backwards, and can drive the connecting plate 19 to slide up and down on the ball screw 18, so that the lifting inner rod 12 can be driven to slide up and down in the outer sleeve 13; the support ring 14 at the top end of the lifting inner rod 12 plays a role in providing enough supporting force and structural strength, the rubber ring 15 is arranged to prevent the lower surface of the printing substrate from being scratched, and meanwhile, the lower surface of the printing substrate can be tightly attached, so that the lifting rod 9 can conveniently absorb the vacuum of the printing substrate when the vacuum pump 11 works.

Referring to fig. 5 and 6, the inner lifting rod 12 and the outer sleeve 13 are both of a hollow structure, the outer surface of the lower end of the inner lifting rod 12 is provided with an anti-falling boss 21, two rubber seal rings 20 sleeved on the inner lifting rod 12 are arranged below the anti-falling boss 21, the top end of the outer sleeve 13 is provided with an anti-falling platform 22, the lower end of the inner part of the outer sleeve 13 is fixedly provided with an air blocking plug 31, and the outer diameter of the air blocking plug 31 is the same as the inner diameter of the inner lifting rod 12.

The anti-falling boss 21 and the anti-falling buckling table 22 can prevent the inner lifting rod 12 from falling off from the top of the outer sleeve 13, and the matching of the two rubber sealing rings 20 can ensure the airtightness of the inner part of the lifting rod 9, so that the vacuum adsorption function can be conveniently achieved; when the inner lifting rod 12 slides to the lowest end in the outer sleeve 13, the choke plug 31 is inserted into the inner bottom end of the inner lifting rod 12, so that the communication between the vacuum pumping chamber 10 and the outside air through the non-lifted inner lifting rod 12 can be blocked, and the sealing performance of the vacuum pumping chamber 10 is ensured; when the elevator inner rod 12 is lifted, the elevator inner rod 12 is separated from the choke plug 31, and when the top of the elevator inner rod 12 is shielded, a certain suction force can be generated on the top of the elevator inner rod 12 by the vacuum generated in the vacuum pumping chamber 10.

It should be added that, when the matrix adsorption fixing mechanism 30 composed of a plurality of lifting rods 9 is used, the lifting inner rod 12 of the lifting rod 9 corresponding to the position of the welding hole on the printed substrate is not lifted, that is, only the lifting rod 9 corresponding to the region without the welding hole on the printed substrate is in the working state of lifting and vacuum-pumping, so as to ensure the sealing property of the close-contact position of the lifting rod 9 and the lower surface of the printed substrate.

The second embodiment:

referring to fig. 1 and 7, the solder paste sucking and wiping mechanism 8 includes a connecting block 23 fixedly mounted on one side of the lifting and moving base 6, a vertically arranged second cylinder 24 is fixedly mounted at the outer end of the connecting block 23, a bar-shaped suction head 25 is fixedly connected to the lower end of a telescopic inner rod of the second cylinder 24, connecting rods 26 are fixedly mounted at both ends of the outer side surface of the bar-shaped suction head 25, a wiping roller 27 is rotatably mounted at the other ends of the two connecting rods 26, a corrugated pipe 28 is communicated with the middle position of the outer side surface of the bar-shaped suction head 25, and the other end of the corrugated pipe 28 is connected to a dust collector 29 fixedly mounted at the upper end of the bracket 5.

The second cylinder 24 of the solder paste absorbing and removing wiping mechanism 8 stretches out downwards to drive the bar-shaped suction head 25 to descend, the dust collector 29 works, then the lifting and moving seat 6 drives the solder paste absorbing and removing wiping mechanism 8 to move left and right, the bar-shaped suction head 25 can absorb and remove the residual solder paste on the surface of the steel mesh, the wiping roller 27 on one side of the bar-shaped suction head 25 can also wipe the surface of the steel mesh after the bar-shaped suction head 25 is absorbed, the surface of the steel mesh is kept in a clean and tidy state, and the next solder paste printing is facilitated.

Referring to fig. 7, the strip-shaped suction head 25 is of a flared structure with the lower end expanding outwards, and the strip-shaped suction head 25, the scraper 7 and the wiping roller 27 are all perpendicular to the vertical plane where the bracket 5 is located.

Referring to fig. 1 and 7, the two first cylinders 4 and the second cylinders 24 are single-acting double-rod cylinders; the double-rod cylinder can improve the stability of the L-shaped limiting plate 3 and the strip-shaped suction head 25 during movement.

In practical use, the positions of the two L-shaped limiting plates 3 are adjusted in advance, so that the working positions of the L-shaped limiting plates 3, the matrix adsorption fixing mechanism 30 and the steel mesh are matched, namely, the welding holes on the printing substrate correspond to the welding holes on the steel mesh after the L-shaped limiting plates 3 are fixed, and the matrix adsorption fixing mechanism 30 is in a lifting and vacuumizing working state only if the lifting rod 9 corresponding to the area without the welding holes on the printing substrate is in a lifting and vacuumizing working state; placing a printed substrate on a matrix adsorption fixing mechanism 30, lifting a lifting rod 9 of the matrix adsorption fixing mechanism 30 corresponding to a region without a welding hole on the printed substrate upwards under the driving of a micro stepping motor 16, jacking the printed substrate, simultaneously operating a vacuum pump 11 to vacuumize the interior of a vacuum pumping chamber 10, further generating a certain suction force at the top of the lifting rod 9 in a working state communicated with the vacuum pumping chamber 10, adsorbing and fixing the printed substrate, enabling the printed substrate to be attached to a steel mesh, avoiding a gap between the steel mesh and the printed substrate, and further avoiding the problem of tin paste coating position deviation or excessive tin paste caused by the existence of the gap; after the printing is accomplished, the second cylinder 24 of wiping mechanism 8 is absorbed to the solder paste stretches out downwards, drives bar-shaped suction head 25 and descends, dust catcher 29 work, then lift removal seat 6 drives the solder paste and absorbs and remove about wiping mechanism 8, bar-shaped suction head 25 can absorb the clearance with the remaining solder paste in steel mesh surface and fall, and cleaning roller 27 can also clean the steel mesh surface after bar-shaped suction head 25 absorbs, make the steel mesh surface keep clean and tidy state, do benefit to next time solder paste printing.

The matrix adsorption fixing mechanism utilizes vacuum to adsorb and fix the printed substrate from the bottom, so that a gap between the steel mesh and the printed substrate is avoided, and the problem of offset of a solder paste smearing position or excessive solder paste caused by the gap is solved; the solder paste sucking and wiping mechanism can suck and wipe off the residual solder paste on the steel screen after the solder paste printing is finished.

The preferred embodiments of the invention disclosed above are intended to be illustrative only. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, to thereby enable others skilled in the art to best utilize the invention. The invention is limited only by the claims and their full scope and equivalents.