阅读说明：本技术 用于将电缆端接至集成电路的方法和装置 (Method and apparatus for terminating a cable to an integrated circuit ) 是由 詹姆斯·邓洛普 于 2018-11-14 设计创作，主要内容包括：电部件被配置为允许电缆直接安装到封装基板,以便封装基板的电迹线直接使电缆与安装到封装基板的集成电路处于电连通,而无需行经电连接器的任何可分离的接口。(The electrical components are configured to allow the electrical cables to be mounted directly to the package substrate such that the electrical traces of the package substrate directly place the electrical cables in electrical communication with an integrated circuit mounted to the package substrate without having to travel through any separable interface of the electrical connector.)

1. An electrical component, comprising:

a substrate having a first layer and a second layer adjacent to the first layer; and

an integrated circuit mounted to the first layer such that electrical signal traces of the substrate are in electrical communication with the integrated circuit,

wherein an electrical signal conductor of an electrical cable is configured to be mounted to the first layer so as to be in electrical communication with the integrated circuit along electrical signal traces of the substrate, and an electrical ground of the electrical cable that is electrically insulated from the electrical signal conductor is configured to be mounted to the second layer.

2. The electrical component of claim 1, wherein the electrical signal trace extends along a first layer of the substrate.

3. The electrical component of any of the preceding claims, wherein the first layer and the second layer define respective electrical contacts, and the electrical signal trace extends from the electrical contact of the first layer to the integrated circuit.

4. The electrical component of claim 3, wherein the contact electrical contact comprises an electrical contact pad.

5. The electrical component of any of claims 3 to 4, wherein electrical contacts of one or both of the first and second layers are substantially flat along an entirety of each of the first and second layers.

6. The electrical connector of any of claims 3-5, wherein the electrical signal conductor is configured to be mounted to an electrical contact of the first layer and the electrical ground is configured to be mounted to an electrical contact of the second layer.

7. The electrical component of any of claims 3 to 5, wherein the first layer defines a recess that includes the electrical contact of the first layer, and the recess receives the electrical signal conductor such that the electrical signal conductor is mounted to the electrical contact of the first layer inside the recess.

8. The electrical component of claim 7, wherein the groove is configured to receive an electrical signal conductor of the electrical cable.

9. The electrical component as claimed in any one of claims 7 to 8 wherein the groove of the first layer is defined by a surface of the first layer facing away from the second layer.

10. The electrical component of claim 9, wherein the groove opens to an outer perimeter of the first layer in a direction substantially perpendicular to a direction facing the first layer toward the second layer.

11. The electrical component as claimed in any one of claims 9 to 10 wherein the electrical signal trace extends along a surface of the first layer facing away from the second layer.

12. The electrical component of any of claims 7 to 11, wherein the electrical signal trace extends from the electrical contact of the first layer to the integrated circuit such that the electrical contact of the first layer is in electrical communication with the integrated circuit.

13. The electrical component of claim 12, wherein the electrical signal trace is a different material than the electrical contact.

14. The electrical component of claim 12, wherein the electrical signal trace and the electrical contact comprise the same material.

15. The electrical component of any of claims 3 to 14, wherein:

the first layer defines a respective first surface facing away from the second layer, and the second layer defines a second surface facing away from the first layer.

16. The electrical component of claim 15, wherein the first and second surfaces of the first and second layers, respectively, oppose each other along a transverse direction, and the first layer is recessed relative to the second layer along a plane oriented substantially perpendicular to the transverse direction such that the second layer defines an offset region that is offset outward along the plane relative to the first layer.

17. The electrical component of claim 16, wherein the electrical contact of the second layer is disposed at the offset region.

18. The electrical component of any of claims 3-17, wherein the electrical contact of the first layer is disposed adjacent an outer perimeter of the first layer.

19. The electrical component as recited in any one of claims 1 to 2, further comprising a printed circuit board, wherein the substrate is mounted to the printed circuit board.

20. The electrical component of claim 19, wherein the second layer is mounted to the printed circuit board.

21. The electrical component as recited in any one of claims 3 to 13, further comprising a printed circuit board, wherein the substrate is mounted to the printed circuit board.

22. The electrical component of claim 21, wherein the second layer is mounted to the printed circuit board.

23. The electrical component of any of claims 21 to 22, wherein the first layer comprises a plurality of contacts and a plurality of electrical signal traces extending from the respective electrical contacts to the integrated circuit.

24. The electrical component of any one of claims 21 to 23, wherein the first layer comprises a plurality of contacts and a plurality of electrical vias that electrically connect the respective electrical contacts to the printed circuit board.

25. The electrical component of claim 24, wherein the via extends from the first layer, through the second layer, and is in electrical contact with the printed circuit board.

26. Electrical component according to any of the preceding claims, wherein the substrate is a glass substrate.

27. The electrical component of claim 26, wherein the first layer and the second layer each comprise glass.

28. The electrical component as recited in any one of claims 1 to 25, wherein at least one or both of the first layer and the second layer is made of a non-glass material.

29. The electrical component as claimed in any one of the preceding claims wherein the substrate defines an interface between the first layer and the second layer.

30. Electrical component according to any of the preceding claims, wherein the first layer and the second layer are integral with each other.

31. The electrical component as claimed in any one of claims 3 to 30 wherein the electrical signal trace establishes an electrical path from the contact to the integrated circuit without traveling through a separable interface of an electrical connector.

32. The electrical component as claimed in any one of claims 3 to 31 wherein the electrical signal trace extends continuously and uninterruptedly from the contact to the integrated circuit.

33. The electrical component as claimed in any one of the preceding claims wherein the electrical cable is configured to be mounted to the substrate such that the electrical cable is in electrical communication with the integrated circuit without signal transmission through a separable interface of an electrical connector.

34. The electrical component of any of the preceding claims, further comprising the electrical cable.

35. An electrical connector, comprising:

the electrical component of claim 34; and

an electrical insulator that encapsulates 1) a respective interface between the electrical signal conductor and the substrate, and 2) a respective interface between the electrical ground and the second layer.

36. An electrical component, comprising:

a package substrate defining a plurality of electrical signal contacts;

an integrated circuit mounted to the package substrate such that a plurality of electrical signal traces of the substrate are in electrical communication with the integrated circuit; and

wherein the electrical signal traces extend continuously and uninterruptedly from the electrical signal contacts to the integrated circuit without traveling through any separable interface of an electrical connector.

37. The electrical component of claim 36, wherein the package substrate comprises a first layer and a second layer adjacent to the first layer,

wherein the integrated circuit is mounted to the first layer and the electrical signal traces extend along the first layer.

38. The electrical component as recited in claim 37, further comprising a plurality of ground traces extending along the second layer.

39. The electrical component of claim 38, wherein the second layer defines an offset region that extends outwardly relative to a leading edge of the first layer.

40. The electrical component of claim 39, further comprising a plurality of contacts at the offset region, wherein an electrical ground of an electrical cable is configured to be mounted to a respective said contact.

41. The electrical component of claim 40, wherein the first layer defines a respective plurality of electrical contacts adjacent a leading edge of the first layer, wherein electrical signal conductors of the electrical cable are configured to be mounted to respective contacts of the first layer.

42. A method of manufacturing an electrical component, comprising:

the electrical signal conductors of the cable are mounted to the signal contacts of the package substrate such that electrical signals of the cable are continuously and uninterruptedly transmitted from the electrical signal contacts to the integrated circuit of the package substrate along the electrical signal traces of the package substrate without traveling through any separable interfaces.

43. The method of claim 42, wherein the mounting step further comprises mounting electrical grounds of the electrical cables to ground contacts of the package substrate.

44. The method of claim 42, wherein the signal contacts are arranged in a row of signal contacts oriented in a lateral direction, the ground contacts are arranged in a row of ground contacts oriented in the lateral direction, and the row of ground contacts is spaced apart from the row of signal contacts in a direction perpendicular to the lateral direction.

45. The method of any one of claims 42 to 44, further comprising the step of: mounting the package substrate to a second substrate such that the electrical vias of the package substrate are in electrical communication with the second substrate.

46. The method of claim 45, further comprising the steps of: attaching a protective cover to one or both of the package substrate and the second substrate.

Disclosure of Invention

In one example, the present disclosure describes an electrical component. The electrical component may include: a substrate having a first layer and a second layer adjacent to the first layer; an integrated circuit mounted to the first layer such that the electrical signal traces of the substrate are in electrical communication with the integrated circuit. The electrical signal conductors of the electrical cable may be configured to be mounted to the first layer such that the electrical signal conductors are in electrical communication with the integrated circuit along the electrical signal traces of the substrate, and the electrical ground of the electrical cable that is electrically insulated from the electrical signal conductors may be configured to be mounted to the second layer.