阅读说明：本技术 研磨垫修整单元以及装置 (Polishing pad dressing unit and device ) 是由 丁彦荣 张月 杨涛 卢一泓 刘青 于 2020-05-15 设计创作，主要内容包括：本发明提供一种研磨垫修整单元,包括：修整盘,用于对研磨垫的表面性能进行修整；至少一个喷头,设置在所述修整盘上,用于喷射清洗介质。本发明提供的研磨垫修整单元,通过修整盘打磨堆积在研磨垫表面的研磨渣,同时,喷嘴喷射清洗介质,当研磨渣被打磨下来时,立即被喷嘴喷射的清洗介质清洗掉,从而能够提供良好的清洗效果,大幅降低被研磨硅片表面出现划痕和缺陷的几率。(The invention provides a polishing pad dressing unit, comprising: the dressing disk is used for dressing the surface property of the grinding pad; and the at least one spray head is arranged on the trimming disk and used for spraying the cleaning medium. According to the polishing pad dressing unit provided by the invention, the polishing slag accumulated on the surface of the polishing pad is polished by the dressing disc, and meanwhile, the cleaning medium is sprayed by the nozzle, so that when the polishing slag is polished, the cleaning medium sprayed by the nozzle is immediately cleaned, thereby providing a good cleaning effect and greatly reducing the probability of scratches and defects on the surface of a polished silicon wafer.)

1. A polishing pad conditioning unit, comprising:

the dressing disk is used for dressing the surface property of the grinding pad;

and the at least one spray head is arranged on the trimming disk and used for spraying the cleaning medium.

2. The polishing pad conditioning unit of claim 1, wherein a lower surface of the conditioning disk is provided with a recess, the showerhead is disposed within the recess, and the lower surface of the showerhead is higher than the lower surface of the conditioning disk.

3. The polishing pad conditioning unit of claim 2, wherein the lower surface of the conditioning disk is further provided with a path for discharging the cleaning medium, the path for discharging the cleaning medium communicating with the groove.

4. The polishing pad conditioning unit of claim 1, wherein the at least one spray head is a plurality of spray heads arranged in a cross, a line, or a circle on the conditioning disk.

5. A polishing pad dressing apparatus, comprising:

the adjusting arm is arranged above the grinding pad; and

the polishing pad conditioning unit of any one of claims 1-4, disposed on the conditioning arm.

6. The polishing pad conditioning apparatus of claim 5, further comprising a rotary drive mechanism, the conditioning disk being in driving communication with the rotary drive mechanism, the rotary drive mechanism being configured to drive the conditioning disk in rotation.

7. The polishing pad conditioning device of claim 5, further comprising a vertical drive mechanism, the conditioning disk being in driving communication with the vertical drive mechanism, the vertical drive mechanism being configured to drive the conditioning disk to move vertically.

8. The polishing pad conditioning apparatus of claim 5, further comprising a swing drive in driving communication with the conditioning arm, the swing drive configured to drive the conditioning arm in a swinging motion within a predetermined angle.

9. The polishing pad conditioner of claim 8, wherein oscillation of said conditioning arm moves said conditioning disk between the center and the edge of said polishing pad.

10. The polishing pad conditioner of claim 5, further comprising a media conduit through which said spray head supplies a cleaning medium, said media conduit being disposed within said conditioning arm.

Technical Field

The invention relates to the technical field of chemical mechanical polishing, in particular to a polishing pad dressing unit and a polishing pad dressing device.

Background

The polishing pad has holes or grains for inflow and discharge of the polishing slurry, and the generated polishing debris is easily left in the holes or grains during polishing. In the prior art, in order to remove grinding slag remaining in the holes or grains, high-pressure pure water is used for cleaning. When the cleaning capability of the grinding slag on the grinding pad is insufficient, the grinding slag can be accumulated in the holes or the lines, and the accumulated grinding slag can easily cause scratches or defects on the surface of a ground silicon wafer in the subsequent grinding process.

Disclosure of Invention

The polishing pad dressing unit and the polishing pad dressing device provided by the invention can have a good cleaning effect on the polishing pad.

In a first aspect, the present invention provides a polishing pad dressing unit, comprising:

the dressing disk is used for dressing the surface property of the grinding pad;

and the at least one spray head is arranged on the trimming disk and used for spraying the cleaning medium.

Optionally, a groove is formed in the lower surface of the trimming disk, the spray head is arranged in the groove, and the lower surface of the spray head is higher than the lower surface of the trimming disk.

Optionally, the lower surface of the conditioning disc is further provided with a path for discharging the cleaning medium, and the path for discharging the cleaning medium is communicated with the groove.

Optionally, the at least one spray head is a plurality of spray heads, and the plurality of spray heads are arranged on the trimming disk in a cross shape, a straight shape or a ring shape.

According to the polishing pad dressing unit provided by the invention, the spray head of the cleaning medium is arranged on the dressing disc, when the dressing disc dresses the polishing pad, the dressing disc polishes the polishing slag accumulated on the surface of the polishing pad, and meanwhile, the nozzle sprays the cleaning medium, and when the polishing slag is polished, the cleaning medium sprayed by the nozzle is immediately cleaned, so that a good cleaning effect can be provided, and the probability of scratches and defects on the surface of the polished silicon wafer is greatly reduced.

In a second aspect, the present invention provides a polishing pad dressing apparatus, comprising:

the adjusting arm is arranged above the grinding pad; and

the polishing pad conditioning unit of any one of the above claims, disposed on the conditioning arm.

Optionally, the dressing disk further comprises a rotary driving mechanism, wherein the dressing disk is in transmission connection with the rotary driving mechanism, and the rotary driving mechanism is used for driving the dressing disk to rotate.

Optionally, the trimming disk further comprises a vertical driving mechanism, the trimming disk is in transmission connection with the vertical driving mechanism, and the vertical driving mechanism is used for driving the trimming disk to vertically move.

Optionally, the swing mechanism is in transmission connection with the adjusting arm, and the swing mechanism is configured to drive the adjusting arm to swing within a predetermined angle.

Optionally, the oscillating movement of the conditioning arm moves the conditioning disk between the center and the edge of the polishing pad.

Optionally, the cleaning device further comprises a medium pipeline, the spray head supplies cleaning medium through the medium pipeline, and the medium pipeline is arranged inside the adjusting arm.

According to the polishing pad dressing device provided by the invention, the spray head for cleaning media is arranged on the dressing disc, when the dressing disc dresses the polishing pad, the dressing disc polishes the polishing slag accumulated on the surface of the polishing pad, and meanwhile, the nozzle sprays the cleaning media, so that when the polishing slag is polished, the cleaning media sprayed by the nozzle can be immediately cleaned, thereby providing a good cleaning effect and greatly reducing the probability of scratches and defects on the surface of the polished silicon wafer.

Drawings

FIG. 1 is a schematic structural diagram of a polishing pad dressing unit according to an embodiment of the present invention;

FIG. 2 is a schematic structural diagram of a polishing pad dressing apparatus according to an embodiment of the invention.

Detailed Description

Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. It should be understood that the description is illustrative only and is not intended to limit the scope of the present disclosure. Moreover, in the following description, descriptions of well-known structures and techniques are omitted so as to not unnecessarily obscure the concepts of the present disclosure.

Various structural schematics according to embodiments of the present disclosure are shown in the figures. The figures are not drawn to scale, wherein certain details are exaggerated and possibly omitted for clarity of presentation. The shapes of various regions, layers, and relative sizes and positional relationships therebetween shown in the drawings are merely exemplary, and deviations may occur in practice due to manufacturing tolerances or technical limitations, and a person skilled in the art may additionally design regions/layers having different shapes, sizes, relative positions, as actually required.

In the context of the present disclosure, when a layer/element is referred to as being "on" another layer/element, it can be directly on the other layer/element or intervening layers/elements may be present. In addition, if a layer/element is "on" another layer/element in one orientation, then that layer/element may be "under" the other layer/element when the orientation is reversed.

An embodiment of the invention provides a polishing pad dressing unit, as shown in fig. 1, including: a conditioning disk 1 for conditioning the surface properties of a polishing pad: at least one spray head 2, arranged on the conditioning disk 1, for spraying a cleaning medium. As an alternative embodiment, the cleaning medium is high pressure deionized water.

In the course of the work, dressing disk 1 can rotate and exert the holding down force to the grinding pad, carries out swing motion along with adjusting arm 3 simultaneously, and the motion through dressing disk 1 is maintained the surface property of grinding pad, and simultaneously, shower nozzle 2 sprays cleaning medium, rinses the grinding slag that the grinding pad produced to dressing disk 1 repairment, can rinse promptly when grinding the slag and dropping. Therefore, the polishing pad dressing device provided by the embodiment can provide a good cleaning effect, and greatly reduce the probability of scratches and defects on the surface of a polished silicon wafer.

As an alternative embodiment of this embodiment, the lower surface of the conditioning disk 1 is provided with a groove 4, the spray head 2 is arranged in the groove 4, and the lower surface of the spray head 2 is higher than the lower surface of the conditioning disk 1. The arrangement is such that the conditioning disc 1 is arranged on the lower surface of the conditioning disc 1, and since the conditioning disc 1 is rotated when it conditions the surface of the polishing pad, the arrangement can alternate between conditioning and cleaning in a very short time, thereby improving the cleaning effect. However, it should be understood by those skilled in the art that the above-described arrangement is merely an example of a preferable arrangement, and the arrangement position of the nozzle is not limited, and may be arranged, for example, on the edge of the conditioning disk 1.

As an alternative embodiment of the present embodiment, when the nozzles are provided in the grooves 4 of the lower surface of the conditioning disc 1, a path for discharging the cleaning medium is further provided in the lower surface of the conditioning disc 1, and the path for discharging the cleaning medium communicates with the grooves 4. The discharging path of the cleaning medium is arranged on the dressing disk 1, so that the cleaning liquid and the cleaned grinding slag can be discharged along the discharging path, and the cleaning liquid and the cleaned grinding slag can not enter between the dressing disk 1 and the grinding pad again to influence the dressing process.

As an alternative embodiment of the present embodiment, the at least one spray head 2 is a plurality of spray heads 2, and the plurality of spray heads 2 are arranged on the trimming disk 1 in a cross shape, a straight shape or a ring shape. As shown in fig. 1, the spray heads 2 are arranged in a cross pattern.

An embodiment of the present invention further provides a polishing pad dressing apparatus, as shown in fig. 2, including:

the adjusting arm 3 is arranged above the grinding pad;

the polishing pad dressing unit in the above embodiment is provided on the conditioning arm 3.

In the course of the work, dressing disk 1 can rotate and exert the holding down force to the grinding pad, carries out swing motion along with adjusting arm 3 simultaneously, and the motion through dressing disk 1 is maintained the surface property of grinding pad, and simultaneously, shower nozzle 2 sprays cleaning medium, rinses the grinding slag that the grinding pad produced to dressing disk 1 repairment, can rinse promptly when grinding the slag and dropping. Therefore, the polishing pad dressing device provided by the embodiment can provide a good cleaning effect, and greatly reduce the probability of scratches and defects on the surface of a polished silicon wafer.

As an alternative embodiment of this embodiment, a rotary driving mechanism is further included, and the conditioning disk 1 is in transmission connection with a rotary driving mechanism (not shown in the figure) for driving the conditioning disk 1 to rotate. The rotary driving mechanism drives the dressing disk 1 to rotate, and the rotation of the dressing disk 1 can enable the dressing action of the dressing disk 1 on the surface of the grinding pad and the cleaning action of the nozzle to be alternately carried out in a very short time, so that the dressing and cleaning effects are improved.

As an optional embodiment of this embodiment, the trimming disk drive further includes a vertical driving mechanism, and the trimming disk 1 is in transmission connection with the vertical driving mechanism (not shown in the figure), and the vertical driving mechanism is used for driving the trimming disk 1 to move vertically. A certain downward pressure is required during the dressing process of the polishing pad by the dressing disk 1, and therefore, a vertical driving mechanism is required to drive the dressing disk 1 to make a vertical movement, so as to provide a downward pressure to the polishing pad.

As an alternative embodiment of this embodiment, a swing driving mechanism (not shown in the drawings) is further included, and is in transmission connection with the adjusting arm 3, and the swing driving mechanism is used for driving the adjusting arm 3 to swing within a predetermined angle. Preferably, the oscillation of the adjusting arm 3 moves the conditioning disc 1 between the center and the edge of the polishing pad. Since the size of the polishing pad is larger than that of the conditioning disc 1, in order to ensure the conditioning of the entire surface of the polishing pad, an oscillating motion of the conditioning disc 1 is required, which, in cooperation with the rotating motion of the polishing pad itself, enables the conditioning disc 1 to condition the entire surface of the polishing pad.

Alternatively, the spray head 2 is supplied with the cleaning medium via a medium conduit, which is arranged inside the adjusting arm 3.

The embodiment of the invention further provides a polishing pad dressing device, which is different from the above embodiments in that the polishing pad dressing device comprises a plurality of dressing disks, and the plurality of dressing disks are respectively used for dressing different areas of the surface of the polishing pad. In the process of dressing the grinding pad, the plurality of dressing disks can dress different areas by adopting different rotating speeds and different downward pressures. Therefore, the polishing pad can be trimmed in a larger range in unit time, different trimming parameters can be adopted by different trimming disks, the polishing pad can be ensured to recover the original surface performance after being trimmed, and the repeatability and the dispersity of the polishing process are improved.

As an alternative embodiment of this embodiment, a plurality of conditioning disks may be driven by the same rotary drive, in which the rotary drive is in driving connection with the conditioning disks by means of a variable transmission ratio, so that different conditioning disks can have different rotation parameters by adjusting the transmission of different conditioning disks. Alternatively, the present embodiment may also employ a plurality of rotary driving mechanisms, the rotary driving mechanisms correspond to the trimming disks one-to-one, and each rotary driving mechanism drives one trimming disk, so that each trimming disk may have different rotary parameters by adjusting the driving parameters of the rotary driving mechanism.

As an alternative to this embodiment, there should be multiple vertical drive mechanisms, each driving vertical movement of one conditioning disk, so that each conditioning disk can have a different downforce on the polishing pad by adjusting the drive parameters of different vertical mechanisms.

As an alternative embodiment of this embodiment, the plurality of conditioning disks may be arranged in a linear manner or in a staggered manner. Because in the process of dressing the surface of the grinding pad, the regulating arm can drive the dressing disks to swing, and the plurality of dressing disks are arranged in a linear mode, the overlapping of dressing areas caused by the swinging of the regulating arm can be reduced. And a plurality of conditioning disks are arranged in a staggered fashion, the gap of the conditioning area due to the gap between the conditioning disks can be reduced.

In the above description, the technical details of patterning, etching, and the like of each layer are not described in detail. It will be appreciated by those skilled in the art that layers, regions, etc. of the desired shape may be formed by various technical means. In addition, in order to form the same structure, those skilled in the art can also design a method which is not exactly the same as the method described above. In addition, although the embodiments are described separately above, this does not mean that the measures in the embodiments cannot be used in advantageous combination.

The above description is only for the specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.