阅读说明：本技术 带粘贴装置 (Tape sticking apparatus ) 是由 井上笃史 于 2020-02-14 设计创作，主要内容包括：提供带粘贴装置,其抑制更换带卷时的困难。带粘贴装置(1)具有：支承辊(20),带卷(210)装卸自如地插通于支承辊(20)；通过辊(30、31),其供从支承辊所支承的带卷(210)拉出的带(200)通过；以及板状的带切割台(60),其用于在将带卷从支承辊取下时将搭挂于通过辊(30、31)的带(200)切断,支承辊和通过辊的轴心与带粘贴装置(1)的第1侧壁(3)平行地配置,带切割台(60)被配置成在退避位置和切割位置之间进退自如,在该退避位置,带切割台退避至比通过通过辊的带靠带粘贴装置(1)的里侧的位置,在该切割位置,带切割台将带推出至带粘贴装置的第1侧壁附近并使带(200)效仿带切割台(60)的正面(62)。(Provided is a tape sticking device which can prevent difficulty in replacing a tape roll. A tape application device (1) is provided with: a support roller (20) through which the tape roll (210) is detachably inserted and passed through the support roller (20); passing rollers (30, 31) through which a tape (200) pulled out from a tape roll (210) supported by the support roller passes; and a plate-shaped tape cutter table (60) for cutting the tape (200) that is attached to the pass rollers (30, 31) when the tape roll is removed from the support roller, wherein the support roller and the pass roller are disposed with the axis thereof parallel to the 1 st side wall (3) of the tape joining device (1), and wherein the tape cutter table (60) is disposed so as to be able to advance and retreat between a retreat position at which the tape cutter table retreats to a position on the back side of the tape joining device (1) relative to the tape that has passed through the pass roller, and a cutting position at which the tape cutter table pushes the tape to the vicinity of the 1 st side wall of the tape joining device and causes the tape (200) to follow the front surface (62) of the tape cutter table (60).)

1. A tape sticking apparatus for sticking a tape, which is wound in a roll form and has an adhesive layer on one surface of a base material layer, to a work by pulling out the tape from the roll,

the tape joining apparatus includes:

a support roller through which the tape roll is detachably inserted;

a pass-through roller through which the tape pulled out from the tape roll supported by the support roller passes; and

a plate-like tape cutter for cutting the tape hung on the passing roller when the tape roll is removed from the support roller,

the support roller and the passing roller are disposed in parallel with the side surface of the tape application device,

the tape cutter is configured to be movable between a retreat position where the tape cutter retreats to a position on the inner side of the tape joining device relative to the tape passing through the passing roller and a cutting position where the tape cutter pushes the tape out to the vicinity of the side surface of the tape joining device and causes the tape to follow the front surface of the tape cutter.

Technical Field

The present invention relates to a tape application device.

Background

The tape bonding apparatus (see, for example, patent document 1) is used, for example, to bond a dicing tape to a back surface of a semiconductor wafer and a ring frame to form a frame unit that is a semiconductor wafer held by the ring frame. The dicing tape is formed by laminating an adhesive layer on one surface of a base material layer, is provided by winding a predetermined length around a cylindrical core material to form a tape roll, and is provided on a tape roll support roller of a tape joining apparatus.

The dicing tape provided in the tape bonding apparatus is drawn out by a plurality of rollers, and is bonded to an adherend such as a wafer and cut to be consumed. The amount of the dicing tape used is controlled according to the number of the wafers to be bonded, and if a small amount of tape wound around the core member remains after the dicing tape is bonded to a wafer or more, the apparatus notifies the operator to replace the tape roll.

Patent document 1: japanese patent laid-open publication No. 2016-008104

In the tape sticking apparatus shown in patent document 1 and the like, since it takes a lot of time to repeat the operation of passing the dicing tape through the plurality of rollers at the time of replacement of the tape roll, the dicing tape before replacement is cut at a position immediately after being pulled out from the tape rollers in advance, the dicing tape after replacement is bonded to the dicing tape before replacement in advance, and pulling out of the dicing tape is restarted. Then, the replaced dicing tape passes through the roller as a predetermined path by the dicing tape before replacement, and replacement is easily completed.

In the tape joining apparatus shown in patent documents and the like, in order to cut the dicing tape before replacement, an operator needs to perform manual work, but the tape roll is usually disposed at a position close to the center of the apparatus, which makes access inconvenient, difficult, and requires man-hours.

Disclosure of Invention

The present invention has been made in view of the above problems, and an object thereof is to provide a tape sticking apparatus capable of suppressing difficulty in replacing a tape roll.

In order to solve the above problems, a tape joining apparatus according to the present invention is a tape joining apparatus for drawing out a tape from a roll of the tape having an adhesive layer on one surface of a base material layer and joining the tape to a workpiece, the tape joining apparatus including: a support roller through which the tape roll is detachably inserted; a pass-through roller through which the tape pulled out from the tape roll supported by the support roller passes; and a plate-shaped tape cutter table for cutting the tape hung on the passing roller when the tape roll is removed from the support roller, wherein the support roller and the passing roller are arranged in parallel with the side surface of the tape joining device, the tape cutter table is arranged to be movable between a retreat position at which the tape cutter table retreats to a position on the back side of the tape joining device with respect to the tape passing through the passing roller and a cutting position at which the tape cutter table pushes the tape to the vicinity of the side surface of the tape joining device and causes the tape to follow the front surface of the tape cutter table.

The present invention has an effect of suppressing difficulty in replacing a tape roll.

Drawings

Fig. 1 is a side sectional view schematically showing a schematic configuration of a tape application device according to embodiment 1.

Fig. 2 is a perspective view of a tape roll of tape to be attached to a workpiece by the tape attaching apparatus shown in fig. 1.

Fig. 3 is a sectional view taken along the line III-III in fig. 2.

Fig. 4 is a plan view schematically showing a main part of the tape application apparatus shown in fig. 1.

Fig. 5 is a side sectional view schematically showing a state where the tape application apparatus shown in fig. 1 stops the application operation and removes the 1 st and 2 nd sidewalls to position the tape cutting table at the cutting position.

Fig. 6 is a plan view schematically showing a main part of the tape application device shown in fig. 5.

Fig. 7 is a plan view schematically showing a state where the tape roll is removed from the support roller of the tape application device shown in fig. 6.

Fig. 8 is a plan view schematically showing a state in which a support roller of the tape application device shown in fig. 7 supports a new tape roll.

Fig. 9 is a side sectional view schematically showing a state where the tape application device according to the modification of embodiment 1 stops the application operation, removes the 1 st and 2 nd side walls, and positions the tape cutting table at the cutting position.

Description of the reference symbols

1: a tape application device; 3: 1 st side wall (side surface); 20: a support roller; 30. 31: passing through a roller; 60: a strip cutting table; 62: a front side; 100: a workpiece; 200. 200-1, 200-2: a belt; 201: a substrate layer; 202: an adhesive layer; 204: a face; 210. 210-1, 210-2: and (4) rolling a tape.

Detailed Description

A mode (embodiment) for carrying out the present invention will be described in detail with reference to the accompanying drawings. The present invention is not limited to the contents described in the following embodiments. The components described below include those that can be easily conceived by those skilled in the art and substantially the same. The following structures may be combined as appropriate. Various omissions, substitutions, and changes in the structure may be made without departing from the spirit of the invention.

[ embodiment 1]

A tape application device according to embodiment 1 of the present invention will be described with reference to the drawings. Fig. 1 is a side sectional view schematically showing a schematic configuration of a tape application device according to embodiment 1. Fig. 2 is a perspective view of a tape roll of tape applied to a workpiece by the tape application device shown in fig. 1. Fig. 3 is a sectional view taken along the line III-III in fig. 2. Fig. 4 is a plan view schematically showing a main part of the tape application apparatus shown in fig. 1.