阅读说明：本技术 金刚石有序排布的研磨修整器的制备方法 (Preparation method of grinding dresser with orderly arranged diamonds ) 是由 邹余耀 张富纬 于 2021-07-26 设计创作，主要内容包括：本发明属于半导体生产制造技术领域,具体公开了一种金刚石有序排布的研磨修整器的制备方法。其包括如下步骤：S1、丝网印刷油墨层：利用丝网印刷法在基体表面涂布印刷一层设定图案的油墨层；S2、电镀金刚石：采用埋砂法在表面印刷好设定图案油墨层的基体上电镀金刚石；S3、去除油墨层：将电镀金刚石后的基体放入碱溶液中浸泡使油墨层去除,得到去除油墨的基体；S4、基体整面电镀加厚：将去除油墨的基体放入电镀液中进行基体整面电镀加厚,得到金刚石有序排布的研磨修整器。本发明相比光刻胶法,工艺简单、周期短、易操作,油墨成本低,有利于大规模推广。本方法制备的金刚石研磨修整器,金刚石把持力高达50N以上。(The invention belongs to the technical field of semiconductor production and manufacturing, and particularly discloses a method for preparing a grinding dresser with orderly arranged diamonds. Which comprises the following steps: s1, screen printing ink layer: coating and printing an ink layer with a set pattern on the surface of a substrate by using a screen printing method; s2, electroplating diamond: electroplating diamond on the substrate with the printing ink layer with the set pattern printed on the surface by adopting a sand burying method; s3, removing the ink layer: soaking the substrate electroplated with the diamond in an alkali solution to remove the ink layer to obtain a substrate without the ink; s4, electroplating and thickening the whole surface of the substrate: and putting the substrate without the printing ink into electroplating solution to perform whole-surface electroplating thickening of the substrate to obtain the grinding dresser with the diamond arranged orderly. Compared with a photoresist method, the method has the advantages of simple process, short period, easy operation and low printing ink cost, and is favorable for large-scale popularization. The diamond grinding dresser prepared by the method has the diamond holding force of more than 50N.)

1. The preparation method of the grinding dresser with the orderly arranged diamonds is characterized by comprising the following steps:

s1, screen printing ink layer:

coating and printing an ink layer with a set pattern on the surface of a substrate by using a screen printing method;

s2, electroplating diamond:

electroplating diamond on the substrate with the printing ink layer with the set pattern printed on the surface by adopting a sand burying method;

s3, removing the ink layer:

soaking the substrate electroplated with the diamond in an alkali solution to remove the ink layer to obtain a substrate without the ink;

s4, electroplating and thickening the whole surface of the substrate:

and putting the substrate without the printing ink into electroplating solution to perform whole-surface electroplating thickening of the substrate to obtain the grinding dresser with the diamond arranged orderly.

2. The method for preparing a grinding dresser with orderly arranged diamonds according to claim 1, wherein in S1, the step of screen printing the ink layer specifically comprises the steps of:

s11, re-engraving the designed pattern on a silk screen, fixing the matrix on a sample table, and fixing the silk screen above the matrix;

s12, uniformly stirring the ink, and then flatly paving the ink above the screen;

s13, adjusting the coating pressure to 8-12N/cm²Starting a coating switch when the coating speed is 2-10 cm/s;

and S14, after the coating is finished, putting the sample into an oven to be baked at 200 ℃ to obtain the substrate with the ink layer with the set pattern.

3. The method of making a diamond-ordered abrasive dresser as recited in claim 2, wherein electroplating diamond in S2 comprises the steps of:

s21, putting the substrate with the surface printed with the ink layer with the set pattern into HCL solution, ultrasonically cleaning for 1-2 min to remove an oxide layer on the surface of the substrate in the micropore, and then washing with deionized water to remove residual acid liquor on the surface of the material and in the micropore;

s22, immersing the activated substrate into the electroplating solution, and uniformly spreading the diamond on the substrate;

s23, turning on the power supply at 0.2-5A/dm²Electroplating for 15-180 min under the condition.

4. The method for preparing a diamond-ordered abrasive dresser as claimed in claim 3, wherein in S3, the ink layer is removed by: putting the substrate electroplated with diamond into KNO of 200-500 g/L₃Soaking the ink layer in the solution at 50-70 ℃ for 1-2 h to fully dissolve the ink layer and separate the ink layer from the substrate.

5. The method of making an abrasive conditioner having an ordered arrangement of diamonds according to claim 4 wherein: in S4, the method for electroplating and thickening the whole surface of the substrate comprises the following steps: putting the substrate without the printing ink into electroplating solution at 0.2-5A/dm²Electroplating for 60-360 min under the condition.

6. The method of making an abrasive conditioner having an ordered arrangement of diamonds according to claim 5 wherein: the thickness of the silk-screen printing ink layer is 5-10 mu m, and the aperture in the printing ink pattern is 50-100 mu m.

7. The method of making an abrasive conditioner having an ordered arrangement of diamonds according to claim 5 wherein: the diamond particle size is 100 to 200 μm.

8. The method of making an abrasive conditioner having an ordered arrangement of diamonds according to claim 5 wherein: the power is 10-40W during ultrasonic cleaning.

9. The method of making an abrasive conditioner having an ordered arrangement of diamonds according to claim 5 wherein: the electroplating solution is a sulfate system electroplating solution and comprises the following components in parts by weight: NiSO₄ 150～250g/L，NiCl₂ 10-50g/L，H₃BO₃ 20～30g/L，pH＝3～5。

10. The method of making an abrasive conditioner having an ordered arrangement of diamonds according to claim 5 wherein: the baking and heat preservation time is 30-150 min.

Technical Field

The invention belongs to the technical field of semiconductor production and manufacturing, and particularly relates to a preparation method of a grinding dresser with orderly arranged diamonds.

Background

The principle of chemical mechanical polishing is a processing technology combining chemical corrosion and mechanical removal, and the chemical mechanical polishing is the only technology capable of realizing global surface planarization in mechanical processing.

With the rapid development of the semiconductor industry, the size of electronic devices is reduced, and the surface flatness of wafers is required to reach the nanometer level. Thereby placing higher demands on the grinding process. The polishing pad, in which the polishing directly takes part in the polishing of the wafer surface, blocks the pores by the abraded debris in use, thereby affecting its own roughness and the transportation of the polishing liquid, and deteriorating the polishing performance. In order to prevent this and prolong the life of the polishing pad, it is necessary to dress the polishing pad with a dresser.

At present, a photoresist method is generally adopted in the preparation method of the grinding dresser with orderly arranged electroplated diamond, and the method comprises the steps of coating a layer of photoresist on a stainless steel substrate, forming a specific pattern through illumination-etching, and finally, electroplating after diamond is distributed. This production process is tedious and the use of photoresist greatly increases the production cost.

Disclosure of Invention

In order to solve the technical problems, the invention aims to provide a method for preparing a grinding dresser with orderly arranged diamonds, which can greatly shorten the process flow, remarkably reduce the production cost and has high holding force.

In order to achieve the technical purpose, the invention adopts the following technical scheme:

the preparation method of the grinding dresser with the orderly arranged diamonds comprises the following steps:

s1, screen printing ink layer:

coating and printing an ink layer with a set pattern on the surface of a substrate by using a screen printing method;

s2, electroplating diamond:

electroplating diamond on the substrate with the printing ink layer with the set pattern printed on the surface by adopting a sand burying method;

s3, removing the ink layer:

soaking the substrate electroplated with the diamond in an alkali solution to remove the ink layer to obtain a substrate without the ink;

s4, electroplating and thickening the whole surface of the substrate:

and putting the substrate without the printing ink into electroplating solution to perform whole-surface electroplating thickening of the substrate to obtain the grinding dresser with the diamond arranged orderly.

As a preferred technical solution, in S1, the screen printing ink layer specifically includes the following steps:

s11, re-engraving the designed pattern on a silk screen, fixing the matrix on a sample table, and fixing the silk screen above the matrix;

s12, uniformly stirring the ink, and then flatly paving the ink above the screen;

s13, adjusting the coating pressure to 8-12N/cm²Starting a coating switch when the coating speed is 2-10 cm/s; the coating speed is preferably 5cm/s, and the faster the coating speed is, the thinner the thickness of the obtained coating is;

s14, after coating, putting the sample into an oven to bake at 200 ℃ to obtain a substrate with a pattern ink layer; the baking temperature is increased, which is helpful for obtaining an ink layer more resistant to the corrosion of the electroplating solution.

As a preferred technical solution, in S2, the electroplating of diamond specifically includes the steps of:

s21, putting the substrate with the surface printed with the ink layer with the set pattern into HCL solution, ultrasonically cleaning for 1-2 min to remove an oxide layer on the surface of the substrate in the micropore, and then washing with deionized water to remove residual acid liquor on the surface of the material and in the micropore;

s22, immersing the activated substrate into the electroplating solution, and uniformly spreading the diamond on the substrate;

s23, turning on the power supply at 0.2-5A/dm²Electroplating for 15-180 min under the condition.

As a preferable embodiment, in S3, the method for removing the ink layer includes: putting the substrate electroplated with diamond into KNO of 200-500 g/L₃Soaking the ink layer in the solution at 50-70 ℃ for 1-2 h to fully dissolve the ink layer and separate the ink layer from the substrate.

As a preferable technical solution, in S4, the method for thickening the entire surface of the substrate by electroplating comprises: putting the substrate without the printing ink into electroplating solution at 0.2-5A/dm²Electroplating for 60-360 min under the condition.

Preferably, the thickness of the silk-screen printing ink layer is 5-10 μm, and the aperture in the ink pattern is 50-100 μm.

Preferably, the diamond has a particle size of 100 to 200 μm.

As a preferable technical scheme, the power during ultrasonic cleaning is 10-40W, and preferably 20W.

As a preferred technical scheme, the electroplating solution is a sulfate system electroplating solution, and comprises the following components in percentage by weight: NiSO₄ 150～250g/L，NiCl₂ 10-50g/L，H₃BO₃ 20～30g/L，pH＝3～5。

As an optimized technical scheme, the baking heat preservation time is 30-150 min.

Due to the adoption of the technical scheme, the invention has at least the following beneficial effects:

(1) the screen printing process is simple, the period is short, the operation is easy, and the ideal coating thickness can be conveniently controlled by adjusting the viscosity and the coating parameters of the printing ink.

(2) Compared with a photoresist method, the ink disclosed by the invention is low in cost and beneficial to large-scale popularization.

(3) The screen printing and the nickel electroplating method are combined to prepare the diamond grinding dresser, and the diamond grinding dresser has high diamond holding force which is as high as more than 50N.

Drawings

The drawings are only for purposes of illustrating and explaining the present invention and are not to be construed as limiting the scope of the present invention. Wherein:

FIG. 1 is a graphical representation of ink on a substrate after screen printing;

FIG. 2 is a schematic sectional view taken along the line A-A in FIG. 1;

FIG. 3 is a schematic diagram of diamond distribution during a sand distribution process using a sand burying method;

FIG. 4 is a schematic view showing the state of diamond and nickel plating after the ink layer is removed;

FIG. 5 is a schematic cross-sectional view of a finished abrasive dresser;

fig. 6 is a photograph of a finished abrasive dresser (showing metallographic structure).

Detailed Description

The invention is further illustrated below with reference to the figures and examples. In the following detailed description, certain exemplary embodiments of the present invention are described by way of illustration only. Needless to say, a person skilled in the art realizes that the described embodiments can be modified in various different ways without departing from the spirit and scope of the present invention. Accordingly, the drawings and description are illustrative in nature and not intended to limit the scope of the claims.

Example one

The preparation method of the grinding dresser with the orderly arranged diamonds comprises the following steps:

s1, screen printing ink layer:

coating and printing an ink layer with a set pattern on the surface of the stainless steel substrate 1 by using a screen printing method; the specific method comprises the following steps:

s11, repeatedly engraving the designed specific pattern on a silk screen with the aperture of 50 mu m, fixing a stainless steel substrate 1 with the thickness of 4mm and the side length of 120mm on a sample table, and fixing the silk screen above the substrate 1;

s12, uniformly stirring the ink, and then flatly paving the ink above the screen;

s13, turning on a power switch of the coating machine, and adjusting the coating pressure to 9N/cm after the equipment enters a standby mode²Setting the coating speed to be 4cm/s, and starting a coating switch to obtain an ink layer 2 with the thickness of 7 microns;

s14, after coating, putting the substrate into an oven to bake for 40min at 200 ℃ to obtain the substrate with the ink layer with the set pattern, and forming orderly-arranged micropores 3 on the substrate (refer to figures 1 and 2);

s2, electroplating diamond:

electroplating diamond on the substrate with the printing ink layer with the set pattern printed on the surface by adopting a sand burying method; the specific method comprises the following steps:

s21, putting the substrate with the surface printed with the ink layer with the set pattern into 1mol/l HCL solution, ultrasonically cleaning for 1-2 min, removing an oxide layer on the surface of the substrate in the micropore 3, and then washing for 3 times by using deionized water to thoroughly remove the residual acid liquor on the surface of the material and in the micropore;

s22, immersing the activated substrate into electroplating solution (composition: NiSO)₄ 180g/L，NiCl₂30g/L，H₃BO₃20g/L, pH 3), diamond 4 was uniformly spread on the substrate 1 (refer to fig. 3);

s23, turning on the power supply at 2.5A/dm²Electroplating for 40min under the condition to form a nickel plating layer 5 on the surface of the substrate in the micropores and the diamond, and obtaining a sample with an ink layer and orderly arranged diamond;

s3, removing the ink layer:

putting the base body after diamond electroplating into KNO of 300g/L₃Soaking in the solution at 50 deg.C for 2h to dissolve the ink layer completely and separate from the substrate to obtain a substrate with orderly arranged diamond (see FIG. 4);

s4, electroplating and thickening the whole surface of the substrate:

the substrate from which the ink was removed was again placed in the plating bath at 3A/dm²Electroplating the whole surface for 100min under the condition of (1) to form a thickened nickel-plated layer 6, and obtaining the grinding dresser with orderly arranged diamonds (refer to fig. 5).

According to the grinding dresser obtained in the embodiment, the arrangement of the diamonds is highly ordered, the high utilization rate of diamond abrasive particles can be realized, the ordered gaps among the diamonds are utilized, the grinding and grinding discharge is improved, and the grinding capacity is improved. The diamond holding force of the polishing pad obtained in this example was 55N or more.

Example two

The preparation method of the grinding dresser with the orderly arranged diamonds comprises the following steps:

s1, screen printing ink layer:

coating and printing an ink layer 2 with a set pattern on the surface of a stainless steel substrate 1 by using a screen printing method; the specific method comprises the following steps:

s11, repeatedly engraving the designed specific pattern on a silk screen with the aperture of 50 mu m, fixing a stainless steel substrate 1 with the thickness of 4mm and the diameter of 120mm on a sample table, and fixing the silk screen above the substrate 1;

s12, uniformly stirring the ink, and then flatly paving the ink above the screen;

s13, turning on a power switch of the coating machine, and adjusting the coating pressure to 10N/cm after the equipment enters a standby mode²Setting the coating speed to be 3cm/s, and starting a coating switch to obtain an ink layer 2 with the thickness of 9 microns;

s14, after coating, putting the substrate into an oven to bake for 90min at 200 ℃ to obtain the substrate with the ink layer with the set pattern, and forming orderly-arranged micropores 3 on the substrate (refer to figures 1 and 2);

s2, electroplating diamond:

electroplating diamond on the substrate with the printing ink layer with the set pattern printed on the surface by adopting a sand burying method; the specific method comprises the following steps:

s21, putting the substrate with the surface printed with the ink layer with the set pattern into 1mol/l HCL solution, ultrasonically cleaning for 2min to remove an oxide layer on the surface of the substrate in the micropore 3, and then washing for 3 times by deionized water to thoroughly remove the residual acid liquor on the surface of the material and in the micropore;

s22, immersing the activated substrate into electroplating solution (composition: NiSO)₄ 200g/L，NiCl₂30g/L，H₃BO₃20g/L, pH 3.2), diamond 4 was uniformly laid on the substrate 1 (refer to fig. 3);

s23, turning on the power supply at 2.5A/dm²Electroplating for 70min under the condition to form a nickel plating layer 5 (refer to figure 4) on the surface of the substrate in the micropores and the diamond, and obtaining a sample with an ink layer and orderly arranged diamond;

s3, removing the ink layer:

putting the base body after diamond electroplating into KNO of 300g/L₃Soaking in the solution at 60 deg.C for 2h to dissolve the ink layer completely and separate from the substrate to obtain a substrate with orderly arranged diamond (see FIG. 4);

s4, electroplating and thickening the whole surface of the substrate:

the substrate from which the ink was removed was again placed in the plating bath at 3A/dm²Electroplating the whole surface for 100min under the condition of (1) to form a thickened nickel-plated layer 6, and obtaining the grinding dresser with orderly arranged diamonds (refer to fig. 5 and 6).

In the grinding dresser obtained in the embodiment, the arrangement of diamonds is highly ordered, and the holding force of the diamonds reaches more than 50N.

The above description is only an exemplary embodiment of the present invention, and is not intended to limit the scope of the present invention. Any equivalent changes and modifications that can be made by one skilled in the art without departing from the spirit and principles of the invention shall fall within the protection scope of the invention.