阅读说明：本技术 一种改善cob led显示屏色块的方法 (Method for improving COB L ED display screen color block ) 是由 龚文 杜典文 于 2020-03-31 设计创作，主要内容包括：本发明涉及COB LED封装领域,特别是涉及一种改善COB LED显示屏色块的方法,包括COB基板、一组承载LED芯片的蓝膜、随机分布的二维坐标文件、能读取二维坐标文件的固晶机；COB基板正面有呈阵列排布的焊盘,用于安装LED芯片,该阵列为m行n列,其中m、n为非零自然数；固晶机先读取随机分布的二维坐标文件,然后捉取蓝膜上的LED芯片,之后固晶机按照二维坐标文件上的二维坐标对应的在COB基板上的焊盘固定LED芯片。本发明通过在固晶阶段,同时使用多张芯片蓝膜,利用随机固晶的方式,来取代普通LED的分光制程,提高COB LED的发光一致性,达到消除色块问题的目的。(The invention relates to the field of COB L ED packaging, in particular to a method for improving a COB L ED display screen color block, which comprises a COB substrate, a group of blue films for bearing L ED chips, a two-dimensional coordinate file which is randomly distributed and a die bonder capable of reading the two-dimensional coordinate file, wherein the front surface of the COB substrate is provided with pads which are arranged in an array mode and used for mounting L ED chips, the array is m rows and n columns, m and n are non-zero natural numbers, the die bonder reads the two-dimensional coordinate file which is randomly distributed firstly, then catches L ED chips on the blue films, and then the die bonder fixes L ED chips on the COB substrate according to the pads which correspond to the two-dimensional coordinates on the two-dimensional coordinate file.)

1. A method for improving color blocks of a COB L ED display screen is characterized by comprising a COB substrate, a group of blue films for bearing L ED chips, two-dimensional coordinate files which are distributed randomly and a die bonder capable of reading the two-dimensional coordinate files;

the front surface of the COB substrate is provided with pads arranged in an array for mounting L ED chips, the array is m rows and n columns, wherein m and n are non-zero natural numbers;

the die bonder reads a two-dimensional coordinate file which is randomly distributed, then captures L ED chips on the blue film, and then fixes L ED chips on the COB substrate according to bonding pads corresponding to two-dimensional coordinates on the two-dimensional coordinate file.

2. The method for improving color blocks of a COB L ED display screen of claim 1, wherein the randomly distributed two-dimensional coordinate file is a data file containing i groups of random two-dimensional coordinates F ═ (x, y), wherein i, x, y are non-zero natural numbers and i ═ m ≦ n, x ≦ m, and y ≦ n.

3. The method for improving color blocks of the COB L ED display screen according to claim 1, wherein the COB substrate is a PCB substrate carrying L ED chips and driving electronics.

4. The method for improving color blocks of COB L ED displays according to claim 1, wherein the blue film carrying L ED chips is L ED material carrying L ED chips.

5. The method for improving color blocks of COB L ED display screen according to claim 4, wherein the blue film has three layers, the bottom layer is PVC or PET material, the middle layer is acrylic colloid, and the top layer is polyethylene.

6. The method for improving color blocks of the COB L ED display screen according to claim 1, wherein the die bonder is a L ED die bonder with an identification two-dimensional coordinate file, and the die bonder can bond L ED chips on the COB substrate with die bonder according to the two-dimensional coordinates on the two-dimensional coordinate file.

7. The method for improving color blocks of COB L ED display screens of claim 1, wherein L ED chips on the blue film are L ED chips with red or green or blue color.

8. The method for improving color blocks of the COB L ED display screen according to claim 6, wherein L ED chips are randomly distributed on the array bonding pads of the COB substrate according to the two-dimensional coordinates of the two-dimensional coordinate file to form a plurality of basic pixel points consisting of red, green and blue L ED chips, the plurality of basic pixel points form a display array packaged inside the COB display screen, and the display array is m rows and n columns.

9. The method for improving color blocks of the COB L ED display screen of claim 1, wherein electrodes of the L ED chip are electrically connected with bonding pads of the COB substrate through bonding wires.

10. The method for improving color blocks of the COB L ED display screen of claim 1, wherein the COB substrate comprises one of aluminum substrate, copper substrate, ceramic plate or BT plate.

Technical Field

The invention relates to the field of COB L ED packaging, in particular to a method for improving a COB L ED display screen color block.

Background

However, due to the particularity of packaging, a plurality of L EDs are packaged on a COB L ED module, a light splitting process similar to a common L ED cannot be performed on each L ED, and the light emitting consistency becomes a big problem in the manufacturing process.

Disclosure of Invention

In view of this, the present invention provides a method for solving the color block problem of COB L ED display screen, which uses a plurality of chip blue films at the same time in the die attach stage, and utilizes a random die attach method to replace the ordinary L ED light splitting process, thereby improving the light emitting consistency of COB L ED and achieving the purpose of eliminating the color block problem.

The technical scheme of the invention is as follows:

a method for improving a COB L ED display screen color block comprises a COB substrate, a group of blue films bearing L ED chips, two-dimensional coordinate files distributed randomly and a die bonder capable of reading the two-dimensional coordinate files;

the front surface of the COB substrate is provided with pads arranged in an array for mounting L ED chips, the array is m rows and n columns, wherein m and n are non-zero natural numbers;

the die bonder reads a two-dimensional coordinate file which is randomly distributed, then captures L ED chips on the blue film, and then fixes L ED chips on the COB substrate according to bonding pads corresponding to two-dimensional coordinates on the two-dimensional coordinate file.

Further, the randomly distributed two-dimensional coordinate file is a data file containing i groups of random two-dimensional coordinates F ═ x, y, wherein i, x, y are non-zero natural numbers and i ═ m × n, x ≦ m, and y ≦ n.

Further, the COB substrate is a PCB substrate carrying L ED chips and driving electronic components.

Further, the blue film carrying L ED chips was L ED material carrying several L ED chips.

Further, the blue film has three layers in total: the bottom layer is made of PVC or PET material, the middle layer is made of acrylic colloid, and the top layer is made of polyethylene.

Furthermore, the die bonder is an L ED die bonder with an identification two-dimensional coordinate file, and can fix L ED chips on the COB substrate by using die bonding glue according to two-dimensional coordinates on the two-dimensional coordinate file.

Further, the L ED chip on the blue film was a L ED chip emitting red or green or blue light.

Further, L ED chips are distributed on the array bonding pad of COB base plate at random according to the two-dimensional coordinate of two-dimensional coordinate file, form a plurality of basic pixel that constitute by red, green and blue three-colour L ED chip, and a plurality of basic pixel forms the display array of encapsulation in COB display screen inside, and the display array is m row n row.

Further, the electrode of the L ED chip is electrically connected to the pad of the COB substrate via a bonding wire.

Further, the COB substrate includes one of an aluminum substrate, a copper substrate, a ceramic plate, or a BT plate.

The invention has the beneficial effects that:

according to the invention, L ED chips are packaged on a COB substrate by simultaneously using a plurality of blue films and according to a random crystal fixing mode, so that the problem of COB L ED display color blocks caused by L ED chip differences in the same blue film and different blue films is solved.

Drawings

FIG. 1 is a schematic diagram of a process embodying the present invention;

in the figure: 1-COB substrate, 2-blue film.

Detailed Description

The drawings are for illustrative purposes only and are not to be construed as limiting the patent; for the purpose of better illustrating the embodiments, certain features of the drawings may be omitted, enlarged or reduced, and do not represent the size of an actual product; it will be understood by those skilled in the art that certain well-known structures in the drawings and descriptions thereof may be omitted. The positional relationships depicted in the drawings are for illustrative purposes only and are not to be construed as limiting the present patent.