阅读说明：本技术 安装装置、检测装置及检测方法 (Mounting device, detection device and detection method ) 是由 樱山岳史 于 2017-12-19 设计创作，主要内容包括：安装装置具备：装配部,装配送出以预定间隔封装有元件的封装部件而供给元件的供给部；安装头,从封装部件拾取元件；拍摄部,拍摄封装部件；及控制部,基于对拾取元件之前的封装部件进行拍摄而得到的拾取前图像和对拾取了元件之后的封装部件进行拍摄而得到的拾取后图像来取得封装有元件的封装部件的基准图案,并基于基准图案来求出元件的封装间距。(The mounting device is provided with: a mounting section for mounting a supply section for supplying a component by feeding a package member in which the component is packaged at a predetermined interval; a mounting head picking up a component from the package member; an imaging unit that images the package; and a control unit that acquires a reference pattern of the package in which the component is packaged based on a pre-pickup image obtained by capturing an image of the package before the component is picked up and a post-pickup image obtained by capturing an image of the package after the component is picked up, and that obtains a package pitch of the component based on the reference pattern.)

1. A mounting device is provided with:

an assembling part for assembling a supplying part which supplies the component by sending out the packaging component packaged with the component at a predetermined interval;

a mounting head picking up the component from the package member;

an imaging unit that images the package; and

and a control unit that obtains a reference pattern of the package in which the component is packaged based on a pre-pickup image obtained by imaging the package before the component is picked up and a post-pickup image obtained by imaging the package after the component is picked up, and obtains a package pitch of the component based on the reference pattern.

2. The mounting device of claim 1,

the control unit obtains the reference pattern from the pre-pickup image and the post-pickup image, and then obtains the package pitch from intervals between a plurality of regions corresponding to the reference pattern included in an image obtained by imaging the package component.

3. The mounting device of claim 1 or 2,

the control unit repeats, after the reference pattern is acquired, a process of sending the package member by a standard pitch, capturing an image of the package member, and determining whether or not the reference pattern is included in the captured image, and when an area matching the reference pattern is detected, obtains the package pitch from a feed amount up to the detection.

4. A mounting device according to any one of claims 1 to 3,

the control unit integrates the luminances of the plurality of rows of the pre-pickup image and the plurality of rows of the post-pickup image to acquire the reference pattern, integrates the luminances of the plurality of rows of the picked-up image, and determines whether or not the reference pattern is included in the picked-up image.

5. The mounting device according to any one of claims 1 to 4,

the control unit executes either one of a first process of obtaining the package pitch based on a reference pattern obtained from the pre-pickup image and the post-pickup image, and a second process of obtaining the package pitch based on a reference pattern obtained from the pre-pickup image without using the post-pickup image.

6. The mounting device according to any one of claims 1 to 5,

the mounting device is provided with an identification part for identifying the component picked up by the mounting head,

the control unit acquires the reference pattern by using the picked-up image in which the recognition unit has confirmed the pickup of the component as the picked-up image.

7. The mounting device according to any one of claims 1 to 6,

the mounting device is provided with a notification unit for notifying an operator of information,

the control unit causes the notification unit to notify the worker of the determined package pitch.

8. The mounting device according to any one of claims 1 to 7,

after the package pitch is obtained, the control unit causes the supply unit to send out the package components by a feeding amount of the package pitch, and causes the mounting head to pick up the components from the package components.

9. A detection device is used for installing a device,

the mounting device is provided with:

an assembling part for assembling a supplying part which supplies the component by sending out the packaging component packaged with the component at a predetermined interval;

a mounting head picking up the component from the package member; and

an imaging unit that images the package member,

the inspection apparatus includes a control unit that acquires a reference pattern of a package in which the component is packaged based on a pre-pickup image obtained by imaging the package before the component is picked up and a post-pickup image obtained by imaging the package after the component is picked up, and that obtains a package pitch of the component based on the reference pattern.

10. A detection method is used for installing a device,

the mounting device is provided with:

an assembling part for assembling a supplying part which supplies the component by sending out the packaging component packaged with the component at a predetermined interval;

a mounting head picking up the component from the package member; and

an imaging unit that images the package member,

the detection method comprises the following steps:

(a) acquiring a reference pattern of a package in which the component is packaged based on a pre-pickup image obtained by imaging the package before the component is picked up and a post-pickup image obtained by imaging the package after the component is picked up; and

(b) and finding the packaging pitch of the element based on the obtained reference pattern.

Technical Field

The present specification discloses a mounting device, a detection device, and a detection method.

Background

Conventionally, as a mounting apparatus, there has been proposed a mounting apparatus that takes an image of a tape in which components are packaged at predetermined intervals and performs recognition processing to measure a pitch of a component housing section (see, for example, patent documents 1 and 2). In the mounting device of patent document 1, when the measured pitch is different from the library data, an abnormality is notified. In the mounting device of patent document 2, the intermittent feeding is performed by changing the feeding pitch from a predetermined feeding pitch to a measured pitch. In these devices, integration between the feeding pitch of the component housing tape and the component suction position can be achieved.

Disclosure of Invention

Problems to be solved by the invention

However, in the devices of patent documents 1 and 2, which area is the component housing section or the tape and which area is the component area cannot be determined by the captured image, and the package pitch of the components may be erroneously recognized. When the package pitch is recognized by mistake, a large number of components or the like which are not used in the mounting process are generated, and therefore, in the mounting apparatus, it is required to more reliably obtain the package pitch of the components.

The present invention has been made in view of the above problems, and a main object of the present invention is to provide a mounting apparatus, a detection apparatus, and a detection method capable of more reliably determining a package pitch of an element.

Means for solving the problems

The mounting device, the detection device, and the detection method according to the present disclosure adopt the following means in order to achieve the main object.

The mounting device disclosed in the present specification includes:

a mounting section that mounts a supply section that sends out a package member in which components are packaged at predetermined intervals;

a mounting head picking up the component from the package member;

an imaging unit that images the package member; and

and a control unit which acquires a reference pattern of the package in which the component is packaged based on a pre-pickup image obtained by capturing the package before the component is picked up and a post-pickup image obtained by capturing the package after the component is picked up, and determines a package pitch of the component based on the reference pattern.

In this mounting apparatus, a reference pattern of the package in which the component is packaged is obtained based on a pre-pickup image obtained by imaging the package before picking up the component and a post-pickup image obtained by imaging the package after picking up the component, and the package pitch of the component is obtained based on the reference pattern. In this mounting apparatus, the area of the component can be detected using the pre-pickup image and the post-pickup image, and the package position of the component can be grasped more reliably, so that the package pitch of the component can be obtained more reliably. Here, the "sealing member" may be a tape, and the sealing method may be a method of attaching a component to a tape or a method of housing a component in a housing portion formed in a tape.

Drawings

Fig. 1 is a schematic explanatory view showing an example of the mounting system 10.

Fig. 2 is an explanatory view of the feeder 16 and the package member 30.

Fig. 3 is a flowchart showing an example of a package pitch detection routine.

Fig. 4 is an explanatory diagram of the pre-pickup image 50 and the post-pickup image 51.

Fig. 5 is an explanatory diagram of the reference pattern 54 obtained without sending out the package member 30.

Fig. 6 is an explanatory diagram of the reference pattern obtained by sending out the package member 30.

Detailed Description

A. The first embodiment:

the present embodiment will be described below with reference to the drawings. Fig. 1 is a schematic explanatory view of a mounting system 10 as an example of the present disclosure. Fig. 2 is an explanatory view of the feeder 16 and the package member 30. The mounting system 10 is, for example, a system that performs a process of mounting the components P on the substrate S. The mounting system 10 includes a mounting device 11 and a host (PC) 40. The mounting system 10 is configured as a mounting line in which a plurality of mounting apparatuses 11 for performing a mounting process of mounting components P on a substrate S are arranged from upstream to downstream. In fig. 1, only one mounting device 11 is shown for convenience of explanation. In the present embodiment, the left-right direction (X axis), the front-rear direction (Y axis), and the up-down direction (Z axis) are as shown in fig. 1 and 2.

As shown in fig. 1, the mounting device 11 includes: a substrate processing section 12, a mounting section 13, a component supply section 14, a component camera 17, a control device 25, and an operation panel 28. The substrate processing unit 12 is a unit that carries in and carries out the substrate S, and fixes and carries out the substrate S at a mounting position. The substrate processing unit 12 includes a pair of conveyor belts provided at a distance from each other in the front-rear direction of fig. 1 and arranged to extend in the left-right direction. The substrate S is conveyed by the conveyor belt.

The mounting portion 13 is a unit that picks up the component P from the component supply portion 14 and is disposed on the substrate S fixed to the substrate processing portion 12. The mounting portion 13 includes: a head moving part 20, a mounting head 21, and a suction nozzle 22 (pickup component). The head moving unit 20 includes a slider guided by a guide rail and moving in the XY direction, and a motor driving the slider. The mounting head 21 picks up a plurality of components P and moves in the XY direction by the head moving part 20. The mounting head 21 is detachably attached to the slider. At the lower surface of the mounting head 21, one or more suction nozzles 22 are detachably mounted. The mounting head 21 can fit a plurality of suction nozzles 22 picking up the components P on the circumference. The suction nozzle 22 picks up the component using negative pressure. The pickup of the component P may be performed by a mechanical chuck or the like that mechanically holds the component P, in addition to the suction nozzle 22. A mark camera 23 is disposed on the lower surface side of the mounting head 21. The mark camera 23 moves in the XY direction in accordance with the movement of the mounting head 21, and images the pickup position of the component feeder 14 in addition to the mark formed on the substrate S.

The component supply unit 14 is a unit that feeds out a sealing member 30 (for example, a tape) in which the components P are sealed at a predetermined interval (a sealing pitch) and supplies the components P to the mounting unit 13. In the component supply unit 14, a plurality of feeders 16 on which tape reels are mounted are detachably mounted on the front side of the mounting device 11 via a mounting unit 15. A sealing member 30 is wound around each reel, and a plurality of elements P are sealed in the sealing member 30 along the longitudinal direction of the sealing member 30. As shown in fig. 2, the package member 30 is formed with a feed hole 31 and a receiving portion 32. The feed hole 31 is for the insertion of the teeth of a sprocket wheel provided to the feeder 16. The packing member 30 is fed out by the rotational drive of the sprocket. The accommodating portion 32 is a space formed on the belt, and the component P is accommodated therein. In addition, as a method of packaging the element P as the package member 30, the element P may be attached to the surface in addition to being accommodated in the internal space. The package member 30 is unwound from the reel to the rear, and is sent out by the feeder 16 to the pickup position sucked by the suction nozzle 22 in a state where the component P is exposed. The feeder 16 includes a controller, not shown. The controller stores the feeding amount (pack pitch) of the pack member 30 and controls the driving motor of the sprocket.

As shown in fig. 1, the part camera 17 is a device that takes images of one or more components P picked up and held by the mounting head 21. The component camera 17 is disposed between the component supply unit 14 and the substrate processing unit 12. The imaging range of the part camera 17 is above the part camera 17. The component camera 17 takes one or more images when the mounting head 21 holding the component P passes above the component camera 17, and outputs the taken images to the control device 25. The control device 25 can detect whether or not the component P is picked up from the package member 30 by the captured image of the part camera 17.

The control device 25 is configured as a microprocessor including a CPU26 as a center, and includes a storage unit 27 and the like that store various data. The control device 25 outputs control signals to the substrate processing unit 12, the mounting unit 13, the component supply unit 14, the component camera 17, and the operation panel 28, and inputs signals from the mounting unit 13, the component supply unit 14, the component camera 17, and the operation panel 28. The storage unit 27 stores mounting condition information including the order and position of mounting the components P on the substrate S. The operation panel 28 receives an input from an operator, notifies the operator of information, and includes a display unit and an operation unit.

The host PC40 is a computer that manages information of each device in which the system 10 is installed. The host PC40 transmits mounting condition information and the like to the mounting apparatus 11, and receives mounting processing results and the like from the mounting apparatus 11.

Next, the operation of the mounting system 10 of the present embodiment configured as described above, particularly, the process of detecting the package pitch, which is the interval between the receiving portions 32 of the package members 30, will be described. Fig. 3 is a flowchart showing an example of a package pitch detection routine executed by the CPU26 of the control device 25. Fig. 4 is an explanatory diagram of a pre-pickup image 50 (fig. 4A) of the component P and a post-pickup image 51 (fig. 4B) of the component P. Fig. 5 is an explanatory diagram of obtaining the reference pattern 54 without sending out the package member 30, fig. 5A is an explanatory diagram before the pickup of the component P, fig. 5B is an explanatory diagram after the pickup of the component P, and fig. 5C is an explanatory diagram of an example of the reference pattern 54. Fig. 5 is a cross-sectional view of the sealing member 30 as viewed from the side. Fig. 6 is a schematic explanatory view of the reference pattern obtained by sending out the package member 30, fig. 6A is an explanatory view of a pre-pickup image 50 in which the storage portion 32 is not in the imaging area, fig. 6B is an explanatory view of the pre-pickup image 50 of the storage portion 32 in which the component P is stored, and fig. 6C is an explanatory view of a post-pickup image 51 of the storage portion 32 after the component P is picked up. In the mounting apparatus 11, when a plurality of receiving portions 32 are included in one image by the shooting of the mark camera 23, the package pitch is determined by detecting the discharge of the package member 30 without fixing the package member, and when one receiving portion 32 is included in one image, the package pitch is determined by detecting the discharge of the package member 30. In the mounting apparatus 11, a first process of obtaining a package pitch using captured images before and after picking up the component P and a second process of obtaining a package pitch without picking up the component P are performed in a switched manner based on a predetermined setting.

The package pitch detection routine is stored in the storage unit 27 and executed in accordance with an instruction from the operator after the feeder 16 is mounted on the component supply unit 14. When this routine is executed, CPU26 acquires information stored in feeder 16 (S100). The CPU26 obtains, for example, the identifiers of the feeder 16, the package components 30, and the components P, the set feed amount (package pitch) of the package components 30, and the like from the feeder 16. Next, the CPU26 determines whether or not the package component fixation detection is performed based on the acquired information (S110). Based on the obtained information on the type of feeder 16 and the package component 30, the CPU26 determines whether package component fixing detection or package component feeding detection should be performed based on whether or not a plurality of receiving portions 32 are photographed in one photographed image.

In this feeder 16, when it is determined that a plurality of accommodating portions 32 are photographed in one photographed image, the CPU26 performs package component fixation detection and determines whether the set processing is the first processing or the second processing (S120). When the set processing is the first processing for obtaining the package pitch using the picked-up images before and after the component P is picked up, the CPU26 moves the mounting head 21 upward of the feeder 16 and causes the mark camera 23 to pick up the package component 30 before the component P is picked up as the image before pickup 50(S130, see fig. 4A). Next, the CPU26 causes the mounting head 21 to pick up the component P (S140), and images the mounting head 21 with the part camera 17, thereby recognizing whether the component P is picked up by the mounting head 21 based on the captured image (S150). When it is not recognized that the component is picked up to the mounting head 21, the CPU26 sends out the packaged component 30 by the amount of the minimum standard pitch, for example, and executes the processing of S130 to S150. For example, even when the receiving portion 32 is not at the pickup position immediately after the feeder 16 is mounted, the mounting head 21 can pick up the component P by repeating this process. The "minimum standard pitch" may be the shortest pitch (for example, 1mm or 2 mm) among the package pitches of the various package components 30 used in the mounting apparatus 11.

When recognizing the component pickup, the CPU26 moves the mounting head 21 upward of the feeder 16, and causes the mark camera 23 to take an image of the packaged component 30 after the component P is picked up as a picked-up image 51(S160, see fig. 4B). Next, the CPU26 acquires the reference pattern of the package component 30 based on the pre-pickup image 50 and the post-pickup image 51 (S170). For example, as shown in fig. 5, the CPU26 can extract the area of the component P from the difference between the pre-pickup image 50 and the post-pickup image 51, set the area near the component P as the accommodating section 32, and set it as the reference pattern. As shown in fig. 5A, when the color of the element P and the package 30 are similar, the luminance is also similar, and therefore, the region of the element may not be accurately extracted. In the first process, the area of the component P is accurately obtained by picking up the component P, and a reference pattern free of errors can be obtained. Here, when acquiring the reference pattern, the CPU26 may acquire the reference pattern by integrating the luminances of the plurality of rows of the pre-pickup image 50 and adding or multiplying the luminances of the plurality of rows of the post-pickup image 51. As shown by the broken line in fig. 4, if the luminances of a plurality of rows (for example, 30 rows) are integrated, when the black luminance is a value of 30, the value can be 900, and even in the same color system, the region can be determined with higher accuracy. Next, the CPU26 performs fitting processing of the reference pattern 54 on the area of the pre-pickup image 50 or the post-pickup image 51 to find the package pitch (S180). The CPU26 obtains the package pitch from the intervals of the plurality of regions corresponding to the reference pattern included in the captured image of the package component 30. The CPU26 may fit the reference pattern 54 to each region of the luminance integrated value shown in fig. 5, for example. In this way, the package pitch of the package member 30 can be obtained as an actual measurement value.

On the other hand, if the set processing is the second processing for obtaining the package pitch using only the captured image before the pickup element P in S120, the CPU26 causes the mark camera 23 to capture the image before pickup 50(S190), and acquires the reference pattern from the image before pickup 50 in S170. The CPU26 acquires, for example, a luminance distribution of a pickup position in the pre-pickup image 50 as a reference pattern. In the second process, since the photographing process is performed once and the pickup of the component P is not performed, the processing time can be shortened, but the accuracy is not as good as that of the first process. The mounting device 11 is configured to allow a user to select the first process or the second process in consideration of advantages and disadvantages thereof. When the reference pattern is acquired, the CPU26 determines the package pitch by fitting to the reference pattern in S180 in the same manner as described above.

On the other hand, if it is determined in S110 that only one accommodating unit 32 is photographed in one photographed image in feeder 16, CPU26 detects the package component feeding and determines whether the set process is the first process or the second process (S200). In the following processing, the same processing as the above-described package component fixation detection is performed, and a detailed description thereof is omitted. Next, when the set processing is the first processing, the CPU26 causes the mark camera 23 to capture the pre-pickup image 50(S210, see fig. 6A and 6B). Next, the CPU26 causes the mounting head 21 to pick up the component P (S220), and recognizes whether the component P is picked up by the mounting head 21 (S230). When the component pickup on the mounting head 21 is not recognized, the CPU26 causes the packaged components 30 to be sent out by the amount of the minimum standard pitch (S240), and executes the processing of S210 to S230. For example, even when the receiving portion 32 is not at the pickup position immediately after the feeder 16 is mounted, the receiving portion 32 is sent to the pickup position as long as the process is repeatedly executed.

When recognizing that the component is picked up, the CPU26 causes the mark camera 23 to capture the picked-up image 51(S250, refer to fig. 6C). Next, the CPU26 obtains the reference pattern of the package component 30 based on the pre-pickup image 50 and the post-pickup image 51 (S260). The reference pattern can be obtained by the same processing as S170. Next, the CPU26 sends the package 30 the minimum standard pitch amount, images the package 30, and performs fitting processing with the reference pattern to obtain the package pitch (S270). After the reference pattern is acquired, the CPU26 repeatedly executes processing for sending the package member 30 by the minimum standard pitch and shooting the package member 30 to determine whether or not the reference pattern is included in the shot image, and when an area matching the reference pattern is detected, obtains the package pitch from the feed amount up to the time of the detection. In this way, the package pitch of the package member 30 can be obtained as an actual measurement value.

On the other hand, if the set process is the second process in S200, the CPU26 causes the mark camera 23 to capture the pre-pickup image 50(S280), and acquires the reference pattern from the pre-pickup image 50 in S260. The CPU26 acquires, for example, the luminance distribution of the pickup position in the pre-pickup image 50 (fig. 6B) as a reference pattern. When the reference pattern is acquired, the CPU26 determines the package pitch by fitting to the reference pattern in S270 as described above.

Next, the CPU26 stores the acquired package pitch, and when the package pitch is different from the pitch set in the feeder 16, notifies the worker of the fact (S290), and ends the routine. The CPU26 can display a message and a warning on the display unit of the operation panel 28, for example. The package member 30 in which the element P is packaged sometimes has a variety of package pitches. When the package pitch is erroneously input when the package component 30 is mounted on the feeder 16, a lot of component loss may occur in the mounting process. In the mounting apparatus 11, since the package pitch is automatically measured, such a loss of components can be prevented. The worker who confirms the content of the notification may perform a process of changing the package pitch determined by the mounting device 11. Alternatively, CPU26 may send the package pitch to feeder 16 and update it.

Then, the mounting device 11 sends out the package components 30 by the determined feeding amount of the package pitch, and executes a mounting process of causing the mounting head 21 to pick up the components P from the package components 30 in accordance with the arrangement order of the components P included in the mounting condition information.

Here, the correspondence relationship between the components of the present embodiment and the components of the present disclosure is clarified. The mounting head 21 of the present embodiment corresponds to the mounting head of the present disclosure, the mounting part 15 corresponds to the mounting part, the feeder 16 corresponds to the supply part, the marker camera 23 corresponds to the imaging part, the CPU26 corresponds to the control part, the part camera 17 and the control device 25 correspond to the recognition part, the operation panel 28 corresponds to the notification part, and the control device 25 corresponds to the inspection device. In the present embodiment, an example of the detection device and the detection method of the present disclosure is also clarified by explaining the operation of the mounting device 11.

In the mounting device 11 of the present embodiment described above, the reference pattern of the package member 30 in which the component P is packaged is obtained based on the pre-pickup image 50 obtained by imaging the package member 30 before the component P is picked up and the post-pickup image 51 obtained by imaging the package member 30 after the component P is picked up, and the package pitch of the component P is obtained based on the reference pattern. In the mounting apparatus 11, the area of the component P can be detected using the pre-pickup image 50 and the post-pickup image 51, and the package position of the component P can be grasped more reliably, so that the package pitch of the component P can be obtained more reliably. Further, the control device 25 obtains the reference pattern from the pre-pickup image 50 and the post-pickup image 51, and then obtains the package pitch from the intervals of the plurality of regions corresponding to the reference pattern included in the image obtained by imaging the package member 30. In the mounting apparatus 11, for example, when the package positions of a plurality of components P are included in one shot image, the package pitch of the components P can be more reliably determined using the shot image.

After the reference pattern is acquired, the control device 25 repeatedly executes a process of sending the package member 30 by the standard pitch and shooting the package member 30 to determine whether or not the reference pattern is included in the shot image, and when an area matching the reference pattern is detected, obtains the package pitch from the feed amount up to the time of the detection. In the mounting apparatus 11, for example, when a package position of one component is included in one captured image, the package member 30 is sent out at an interval of a standard pitch, and the next package position can be detected. In the mounting apparatus 11, the package pitch of the component P can be more reliably determined using one or more captured images of the package member 30 that is sent out and captured. The control device 25 integrates the luminance of the plurality of rows of the pre-pickup image 50 and the luminance of the plurality of rows of the post-pickup image 51 to acquire the reference pattern, integrates the luminance of the plurality of rows of the picked-up image, and determines whether or not the picked-up image includes the reference pattern. Although many of the sealing members 30, the components P, the sealing positions of the components P, and the like are of the same color system (for example, black or gray), and it is sometimes difficult to distinguish them, in the mounting apparatus 11, the differences between the brightness of the plurality of rows can be made more clear by, for example, integrating the brightness of the plurality of rows by using a method such as multiple exposure, and therefore the inter-package pitch of the components can be determined more reliably.

Further, the control device 25 executes either one of a first process of obtaining the package pitch based on the reference pattern obtained from the pre-pickup image 50 and the post-pickup image 51 and a second process of obtaining the package pitch based on the reference pattern obtained from the pre-pickup image 50 without using the post-pickup image 51. In the mounting apparatus 11, either the first process for more reliably determining the package pitch or the second process for simplifying the process can be executed. In the mounting apparatus 11, the component P picked up by the mounting head 21 is confirmed by the component camera 17, and therefore the package pitch of the component can be more reliably obtained. In the mounting device 11, the determined package pitch is notified to the operator via the operation panel 28, whereby the mounting process can be performed at an accurate package pitch. After obtaining the package pitch, the controller 25 causes the feeder 16 to feed the package components 30 by the amount of feed of the package pitch, and causes the mounting head 21 to pick up the components P from the package components 30. In the mounting apparatus 11, the package pitch of the components P can be determined more reliably, and thus more reliable mounting processing can be performed.

It is to be understood that the present disclosure is not limited to the above embodiments, and may be implemented in various forms as long as the present disclosure falls within the technical scope of the present disclosure.

For example, in the above embodiment, the second process can be selected, but the present invention is not particularly limited thereto, and only the first process may be performed. In this mounting apparatus, the package pitch of the components P can be determined more reliably. In the above embodiment, the package component fixing detection and the package component feeding detection are performed in a switched manner, but only one of the detections may be performed. In this mounting device, the above-described effects of the adopted form can be obtained.

In the above embodiment, the reference pattern is obtained by integrating the luminances of the plurality of rows, but the present invention is not particularly limited thereto, and the luminances of the plurality of rows may not be integrated. In the case where the color tones of the element P and the encapsulating member 30 are different, the region of the element P can be determined, and therefore the inter-package pitch of the element P can be determined more reliably.

In the above embodiment, the component pickup is recognized by the part camera 17, but the component pickup is not particularly limited as long as the component pickup from the package member 30 can be detected, and whether or not the component P is picked up may be recognized by an image pickup unit that picks up an image from the side of the mounting head 21, for example. Further, in the case where the imaging unit that captures an image from the side of the mounting head 21 is provided in the mounting head 21 itself, it is not necessary to move the mounting head 21 from the component supply unit 14 to the component camera 17 or another imaging unit provided outside the mounting head 21 in order to identify whether or not the component P is picked up by the mounting head 21, and therefore it is possible to quickly identify the pickup of the component P. Alternatively, the mounting device 11 may omit the pickup recognition of the component P. It may also be recognized that the component P is picked up when there is a difference in the images of the pre-pickup image 50 and the post-pickup image 51, for example.

In the above embodiment, the calculated package pitch is notified to the operator through the operation panel 28, but may be omitted. The mounting device 11 may automatically update the package pitch of the feeder 16 to a correct value. In the mounting apparatus 11, the mounting process can be more reliably executed.

In the above embodiment, the present disclosure has been described as the mounting apparatus 11, but the present disclosure may be used as a control method of the mounting apparatus 11 or a program for realizing the control method. Alternatively, the present disclosure may be a detection device configured by the control device 25, or may be a detection method or a program thereof. The detection device may be, for example, a component provided in the host PC40, or may be a device dedicated to inspection of the package component 30.

In the mounting device according to the present disclosure, the control unit may obtain the reference pattern from the pre-pickup image and the post-pickup image, and then obtain the package pitch from intervals between a plurality of regions corresponding to the reference pattern included in an image obtained by imaging the package member. In this mounting apparatus, for example, when the package positions of a plurality of components are included in one shot image, the package pitch of the components can be more reliably determined using the shot image.

Alternatively, in the mounting device of the present disclosure, after the reference pattern is acquired, the control unit may repeat a process of feeding the package member by a standard pitch, capturing an image of the package member, and determining whether or not the captured image includes the reference pattern, and when an area matching the reference pattern is detected, the control unit may determine the package pitch based on a feed amount up to the detection. In this mounting apparatus, for example, when a package position of one component is included in one captured image, the next package position can be detected by feeding out the package components at intervals of a standard pitch. Therefore, in this mounting apparatus, the package pitch of the component can be more reliably determined using one or more captured images obtained by picking up the package components. Here, the "standard pitch" may be the shortest pitch among the package pitches of the various package components used in the mounting apparatus.

In the mounting device of the present disclosure, the control unit may acquire the reference pattern by integrating luminances of a plurality of rows of the pre-pickup image and a plurality of rows of the post-pickup image, and may determine whether or not the reference pattern is included in the picked-up image by integrating luminances of a plurality of rows of the picked-up image. Although many of the package members, the elements, the package positions of the elements, and the like are of the same color system (for example, black or gray), and it is sometimes difficult to distinguish them, in this mounting apparatus, the differences can be made more clear by integrating the luminances of a plurality of rows, and therefore the package pitch of the elements can be determined more reliably.

In the mounting device of the present disclosure, the control unit may execute one of a first process of obtaining the package pitch based on a reference pattern obtained from the pre-pickup image and the post-pickup image and a second process of obtaining the package pitch based on a reference pattern obtained from the pre-pickup image without using the post-pickup image. In this mounting apparatus, either the first process for more reliably determining the package pitch or the second process for simplifying the process can be executed.

The mounting apparatus of the present disclosure may further include a recognition unit configured to recognize a component picked up by the mounting head, and the control unit may acquire the reference pattern by using a picked-up image in which the recognition unit has confirmed the pickup of the component as the picked-up image. In this mounting apparatus, since the component picked up by the mounting head is confirmed, the package pitch of the component can be more reliably obtained.

The mounting device of the present disclosure may further include a notification unit configured to notify an operator of information, and the control unit may cause the notification unit to notify the operator of the obtained package pitch. In this mounting device, the mounting process can be performed at an accurate package pitch by notifying the operator of the obtained package pitch.

In the mounting apparatus of the present disclosure, the control unit may cause the supply unit to send out the package component by a feeding amount of the package pitch after the package pitch is obtained, and cause the mounting head to pick up the component from the package component. In this mounting apparatus, the package pitch of the element can be determined more reliably, and more reliable mounting processing can be performed.

The detection device disclosed in the present specification is used for a mounting device, and the mounting device includes: a mounting section for mounting a supply section for supplying a component by feeding a package member in which the component is packaged at a predetermined interval; a mounting head picking up the component from the package member; and an imaging unit for imaging the package member,

the inspection apparatus includes a control unit that acquires a reference pattern of a package in which the component is packaged based on a pre-pickup image obtained by imaging the package before the component is picked up and a post-pickup image obtained by imaging the package after the component is picked up, and that obtains a package pitch of the component based on the reference pattern.

As with the mounting apparatus described above, this inspection apparatus can inspect the area of the component using the before-pickup image and the after-pickup image, and thus can determine the package pitch of the component more reliably. In this detection method, a process to be executed by any of the above-described mounting apparatuses may be added, or the configuration of any of the above-described mounting apparatuses may be adopted.

The detection method disclosed in the present specification is used for a mounting device including: a mounting section for mounting a supply section for supplying a component by feeding a package member in which the component is packaged at a predetermined interval; a mounting head picking up the component from the package member; and an imaging unit for imaging the package member,

the detection method comprises the following steps:

(a) acquiring a reference pattern of a package in which the component is packaged based on a pre-pickup image obtained by picking up the package before the component is picked up and a post-pickup image obtained by picking up the package after the component is picked up; and

(b) and obtaining a package pitch of the element based on the obtained reference pattern.

According to this detection method, as in the mounting apparatus described above, since the area of the component can be detected using the image before pickup and the image after pickup, the package pitch of the component can be determined more reliably. In this detection method, a step process to be executed by any of the above-described mounting apparatuses may be added, or the configuration of any of the above-described mounting apparatuses may be adopted.

Industrial applicability

The mounting device, the detection device and the detection method disclosed by the invention can be applied to the field of mounting of electronic components.

Description of the reference numerals

10 mounting system, 11 mounting device, 12 substrate processing section, 13 mounting section, 14 component supplying section, 15 assembling section, 16 feeder, 17 part camera, 20 head moving section, 21 mounting head, 22 suction nozzle, 23 marking camera, 25 control device, 26CPU, 27 storage section, 28 operation panel, 30 package component, 31 feeding hole, 32 receiving section, 40 host PC, 50 before picking up image, 51 after picking up image, 54 reference pattern, P component, S substrate.