阅读说明：本技术 一种梯度电子封装壳体的制备方法 (Preparation method of gradient electronic packaging shell ) 是由 吴昊 于 2020-03-30 设计创作，主要内容包括：本发明公开一种梯度电子封装壳体的制备方法,该方法具体为：根据功率与基板材料对T/R组件进行结构、热设计,确定底板导热率、热膨胀系数与厚度及壳体外形；根据底板热导率、热膨胀系数确定金刚石比例；根据封装壳体结构外形,制造石墨模具,并在石墨模具表面刷脱模剂,晾干；按封装壳体底板形状与厚度,在模具内填充填入金刚石颗粒粉末,预成型压实,形成预制体；将熔炼铝或铝合金熔液采用压力铸造的方法注入磨具内；脱模,得到近净成型的梯度壳体坯料,整体退火；对坯料进行精加工；然后去机加工应力退火。(The invention discloses a preparation method of a gradient electronic packaging shell, which comprises the following steps: carrying out structural and thermal design on the T/R assembly according to the power and the substrate material, and determining the heat conductivity, the thermal expansion coefficient and the thickness of the bottom plate and the appearance of the shell; determining the proportion of the diamond according to the heat conductivity and the thermal expansion coefficient of the bottom plate; manufacturing a graphite mold according to the structural shape of the packaging shell, brushing a release agent on the surface of the graphite mold, and airing; filling diamond particle powder into the mold according to the shape and thickness of the bottom plate of the packaging shell, performing and compacting to form a prefabricated body; pouring molten aluminum or aluminum alloy into a grinding tool by adopting a pressure casting method; demolding to obtain a near-net-shape gradient shell blank, and integrally annealing; carrying out finish machining on the blank; and then removing the machining stress and annealing.)

具体实施方式

下面结合附图对本发明做进一步说明

以雷达T/R封装组件为例，基板材料为低温共烧陶瓷(LTCC)为例：

(1)根据功率与基板材料对T/R组件确定结构，如附图1；

(2)根据热耗与芯片结壳温度进行热设计，确定壳体底部导热率不低于450W/m·K，热膨胀系数不高于8ppm/℃(0～200℃)；

(3)根据底板热导率、热膨胀系数确定复合材料中金刚石与铝合金比例为70:30(体积比)；

(4)根据封装壳体结构外形，制造石墨模具，并在石墨模具表面刷脱模剂，晾干；按封装壳体底板形状与厚度，在模具内填充填入金刚石颗粒粉末，预成型压实，形成预制体，如图2；

(5)将熔炼6063牌号铝合金熔液采用压力铸造的方法注入磨具内，如图3；

(6)脱模，得到近净成型的梯度壳体坯料，如图4；

(7)整体退火；

(8)对坯料进行精加工；

(9)去机加工应力退火。