Chemical mechanical polishing retaining ring with integrated sensor

文档序号:1331248 发布日期:2020-07-17 浏览:24次 中文

阅读说明:本技术 具有集成传感器的化学机械抛光保持环 (Chemical mechanical polishing retaining ring with integrated sensor ) 是由 西蒙·亚沃伯格 于 2015-05-28 设计创作,主要内容包括:本文中提供一种用于化学机械抛光承载头的保持环,具有用于基板的固定表面。在一些实施方式中,该保持环可以包括具有中央开口的环形主体、被形成在该主体中的通道,其中该通道的第一端邻近该中央开口;以及被设置在该通道内并邻近该第一端的传感器,其中该传感器配置为检测来自在该基板上进行的工艺的声波及/或振动发射。(A retaining ring for a chemical mechanical polishing carrier head having a retaining surface for a substrate is provided herein. In some embodiments, the retaining ring may include an annular body having a central opening, a channel formed in the body, wherein a first end of the channel is adjacent the central opening; and a sensor disposed within the channel and adjacent the first end, wherein the sensor is configured to detect acoustic and/or vibrational emissions from a process performed on the substrate.)

1. A retaining ring for a carrier head having a mounting surface for a substrate, comprising:

an annular body having a central opening;

a channel formed in the body; and

a sensor disposed within the channel, wherein the sensor is configured to detect acoustic and/or vibrational emissions from a process performed on the substrate.

2. The retaining ring of claim 1, further comprising:

a seal disposed within the channel between the sensor and the central opening.

3. The retaining ring of claim 2, wherein the seal is a silicon membrane separating the central opening from the sensor.

4. The retaining ring of any one of claims 2-3, wherein the channel extends from an outer surface of the retaining ring to an inner surface of the retaining ring.

5. The retaining ring of any of claims 2-3, wherein the seal is about 1mm to about 10mm thick.

6. The retaining ring of any of claims 2-3, further comprising:

a second sensor to detect whether the seal is malfunctioning, wherein the second sensor is one of a humidity sensor or a pressure sensor.

7. The retaining ring of any of claims 1-3, wherein the sensor is one of a microphone to detect acoustic wave emissions from a process performed on the substrate or a micro-electro-mechanical system (MEMS) accelerometer to detect vibrations generated from a process performed on the substrate.

8. The retaining ring of any of claims 1-3, wherein the sensor is coupled to a transmitter via one or more electrical leads.

9. The retaining ring of claim 8, wherein the transmitter is a wireless transmitter configured to wirelessly transmit information related to acoustic and/or vibrational emissions obtained from the sensor.

10. The retaining ring of claim 8, wherein the transmitter is disposed on an outer surface of the retaining ring.

11. A carrier head for a chemical mechanical polishing apparatus, comprising:

a base;

a retaining ring connected to the base, wherein the retaining ring comprises:

an annular body having a central opening;

a channel formed in the body; and

a sensor disposed within the channel, wherein the sensor is configured to detect acoustic and/or vibrational emissions from a chemical mechanical polishing process;

a support structure connected to the base by a flexure, the flexure being movable independently of the base and the retaining ring; and

a flexible membrane bounding a pressurizable chamber, the membrane being connected to the support structure and having a fixed surface for a substrate.

12. The carrier head of claim 11, wherein the retaining ring further comprises a seal disposed within the channel between the sensor and the central opening.

13. The carrier head of claim 12, wherein the seal is a silicon membrane separating the central opening from the sensor.

14. The carrier head of any of claims 11-13, wherein the channel extends from an outer surface of the retaining ring to an inner surface of the retaining ring.

15. The carrier head of any of claims 11 to 13, wherein the sensor is coupled to a transmitter via one or more electrical leads.

16. The carrier head of claim 15, wherein the transmitter is a wireless transmitter configured to wirelessly transmit information related to acoustic and/or vibrational emissions obtained from the sensor.

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