阅读说明：本技术 感光性树脂组合物、光学膜及其制造方法 (Photosensitive resin composition, optical film and method for producing same ) 是由 许瑞佑 楼家豪 邱贞文 于 2019-01-15 设计创作，主要内容包括：本发明提供一种可形成具有较低的翘曲度及高穿透度的感光性树脂组合物、光学膜及其制造方法。感光性树脂组合物包含：(A)含乙烯性不饱和基的化合物,其具有一个或两个芳香环；(B)双酚芴寡聚物,其具有一个或两个(甲基)丙烯酰基；以及(C)光起始剂,其中,(A)含乙烯性不饱和基的化合物与(B)双酚芴寡聚物的重量比为0.50～0.95。(The invention provides a photosensitive resin composition capable of forming lower warping degree and high transmittance, an optical film and a manufacturing method thereof. The photosensitive resin composition comprises: (A) an ethylenically unsaturated group-containing compound having one or two aromatic rings; (B) a bisphenol fluorene oligomer having one or two (meth) acryloyl groups; and (C) a photoinitiator, wherein the weight ratio of the compound (A) containing ethylene unsaturated group to the bisphenol fluorene oligomer (B) is 0.50-0.95.)

1. A photosensitive resin composition comprising:

(A) an ethylenically unsaturated group-containing compound having one or two aromatic rings;

(B) a bisphenol fluorene oligomer having one or two (meth) acryloyl groups; and

(C) a photo-initiator,

wherein the weight ratio of the compound (A) containing ethylene unsaturated group to the bisphenol fluorene oligomer (B) is 0.50-0.95.

2. The photosensitive resin composition according to claim 1, further comprising (E) a solvent, wherein the content of the (E) solvent is 1% by weight or less of the photosensitive resin composition.

3. The photosensitive resin composition according to claim 1, wherein the photosensitive resin composition does not contain a solvent.

4. The photosensitive resin composition according to claim 1, wherein the (A) ethylenically unsaturated group-containing compound comprises at least one member selected from the group consisting of compounds represented by the formulae (1) to (14),

in the formula (1), n1 and m1 are each independently an integer of 0 to 20, the sum of n1 and n2 is an integer of 1 to 20,

in the formula (2), n2 and m2 are each independently an integer of 0 to 4, the sum of n2 and m2 is an integer of 2 to 4,

in the formula (3), n3 is an integer of 0 to 3,

in the formula (4), R¹An alkyl group having 1 to 20 carbon atoms,

in the formula (5), R²An alkyl group having 1 to 20 carbon atoms,

in the formula (6), R³An alkyl group having 1 to 20 carbon atoms,

in the formula (13), n4 is an integer of 1 to 3,

in the formula (14), n5 is an integer of 1 to 3.

5. The photosensitive resin composition according to claim 4, wherein the (A) ethylenically unsaturated group-containing compound comprises a compound represented by formula (1).

6. The photosensitive resin composition according to claim 1, wherein the (B) bisphenol fluorene oligomer has a weight average molecular weight of 500 to 5000.

7. The photosensitive resin composition according to claim 1, wherein the viscosity of the photosensitive resin composition at 25 ℃ is 600 to 7000 mPas.

8. A method of manufacturing an optical film, comprising

Applying the photosensitive resin composition according to any one of claims 1 to 7 to a substrate to form a coating film;

the coating film is subjected to an exposure step,

subjecting the exposed coating film to a baking step to form an optical film on the substrate.

9. The method for producing an optical film according to claim 8, wherein the wavelength in the exposure step is 200 to 500 nm.

10. The method of manufacturing an optical film according to claim 8, wherein the temperature of the baking step is 130 ℃ to 280 ℃.

11. An optical film produced by the method for producing an optical film according to any one of claims 8 to 10.

12. The optical film according to claim 11, wherein the optical film has a transmittance of 85% or more for visible light having a wavelength of 380nm to 780nm at a thickness of 20 to 120 μm.

13. The optical film according to claim 11, wherein the optical film has a transmittance of 90% or more for infrared rays having a wavelength of 780nm to 1100nm at a thickness of 20 to 120 μm.

14. The optical film according to claim 11, wherein when the thickness of the optical film is 20 to 120 μm, the warp of the optical film relative to the substrate is less than 0.25 mm.

Technical Field

The present invention relates to a resin composition, an optical film and a method for producing the same, and more particularly, to a photosensitive resin composition, an optical film and a method for producing the same.

Background

In recent years, thick film photosensitive compositions have been widely used, for example, in touch mobile devices, fingerprint recognition systems, and wafer packaging, but since thick film photosensitive compositions mostly contain an additive solvent, it is difficult to achieve a thickness of about 20 to 120 μm on a substrate, and problems such as low transmittance and high warpage tend to occur at a high film thickness.

In particular, the optical requirements of fingerprint recognition systems are more stringent, requiring thicker optical films as spacers and high transmittance for both infrared and visible light, however, there are many problems to be overcome in order to achieve high transmittance for both infrared and visible light at high film thickness (e.g., 120 μm), such as: the thick film causes problems such as warpage of the substrate, difficulty in achieving a thick viscosity of the photosensitive resin solution, difficulty in uniform surface coating, and cracking of the optical film after photo-curing.

From the above, it is known that those skilled in the art have been eagerly required to solve the problem of providing a photosensitive resin composition having desirable optical and mechanical properties at a film thickness of 20 μm to 120 μm.

Disclosure of Invention

Accordingly, the present invention provides a photosensitive resin composition capable of forming a film having a low warpage and a high transmittance, an optical film, and a method for manufacturing the same.

The invention provides a photosensitive resin composition, comprising: (A) an ethylenically unsaturated group-containing compound having one or two aromatic rings; (B) a bisphenol fluorene oligomer having one or two (meth) acryloyl groups; and (C) a photoinitiator. Wherein the weight ratio of the compound (A) containing ethylene unsaturated group to the bisphenol fluorene oligomer (B) is 0.50-0.95.

In an embodiment of the present invention, the photosensitive resin composition further includes (E) a solvent, and the content of the (E) solvent is 1 wt% or less of the photosensitive resin composition.

In an embodiment of the invention, the photosensitive resin composition does not contain a solvent.

In an embodiment of the invention, the compound (a) containing an ethylenically unsaturated group includes at least one selected from the group consisting of compounds represented by formulae (1) to (14).

In the formula (1), n1 and m1 are each independently an integer of 0 to 20, the sum of n1 and n2 is an integer of 1 to 20,

in the formula (2), n2 and m2 are each independently an integer of 0 to 4, the sum of n2 and m2 is an integer of 2 to 4,

in the formula (3), n3 is an integer of 0 to 3,

in the formula (4), R¹An alkyl group having 1 to 20 carbon atoms,

in the formula (5), R²An alkyl group having 1 to 20 carbon atoms,

in the formula (6), R³An alkyl group having 1 to 20 carbon atoms,

in the formula (13), n4 is an integer of 1 to 3,

in the formula (14), n5 is an integer of 1 to 3.

In an embodiment of the present invention, the compound (a) containing an ethylenically unsaturated group includes a compound represented by formula (1).

In an embodiment of the present invention, the bisphenol fluorene oligomer (B) has a weight average molecular weight of 500-5000.

In one embodiment of the present invention, the viscosity of the photosensitive resin composition at 25 ℃ is 600 to 7000 mPas.

The invention also provides a manufacturing method of the optical film, which comprises the following steps: first, the photosensitive resin composition is applied to a substrate to form a coating film. Subsequently, the coating film is subjected to an exposure step. Then, the exposed coating film is subjected to a baking step to form an optical film on the substrate.

In an embodiment of the present invention, in the method for manufacturing an optical film, a wavelength of the exposure step is 200 to 500 nm.

In an embodiment of the invention, in the manufacturing method of the optical film, the temperature of the baking step is 130 ℃ to 280 ℃.

The present invention also provides an optical film prepared by the above method for manufacturing an optical film.

In an embodiment of the invention, the optical film has a transmittance of 85% or more for visible light with a wavelength of 380nm to 780nm when the thickness of the optical film is 20 to 120 μm.

In an embodiment of the invention, the optical film has a transmittance of 90% or more for infrared rays having a wavelength of 780nm to 1100nm when the thickness of the optical film is 20 to 120 μm.

In an embodiment of the invention, when the thickness of the optical film is 20 to 120 μm, the warpage of the optical film relative to the substrate is less than 0.25 mm.

In view of the above, when the photosensitive resin composition of the present invention uses the weight ratio of (a) the compound containing an ethylenically unsaturated group to (B) the bisphenol fluorene oligomer of 0.50 to 0.95, the optical film can have a low warpage and a high transmittance when the photosensitive resin composition is used in the optical film, thereby improving the problems of substrate warpage and insufficient transmittance caused by thick films.

In order to make the aforementioned and other features and advantages of the invention more comprehensible, embodiments accompanied with figures are described in detail below.

Detailed Description

Definition of

The terms "comprising," "having," and the like, unless expressly stated otherwise, are generally to be construed as open-ended as well as non-limiting.

In the absence of a specific recitation, singular terms include the plural (and vice versa). In addition, the word "about" preceding a value generally includes the particular value unless specifically stated otherwise. As used herein, the term "about" refers to a variation of a standard value of + -10%, unless otherwise stated or implied.

It should be understood that the order of steps or order of performing certain actions is immaterial so long as the invention remains operable. Further, two or more steps or actions may be performed simultaneously.

Hereinafter, acrylic acid and/or methacrylic acid is represented by (meth) acrylic acid, and acrylate and/or methacrylate is represented by (meth) acrylate; similarly, (meth) acryloyl represents acryloyl and/or methacryloyl.

< photosensitive resin composition >

The invention provides a photosensitive resin composition, which comprises (A) a compound containing ethylene unsaturated group, which has one or two aromatic rings; (B) a bisphenol fluorene oligomer having one or two (meth) acryloyl groups; and (C) a photoinitiator. In addition, if necessary, the photosensitive resin composition may further include (D) an additive, (E) a solvent, or a combination thereof. The respective components used in the photosensitive resin composition of the present invention will be described in detail below.

(A) Compounds containing ethylenically unsaturated groups

(A) The ethylenically unsaturated group-containing compound has one or two aromatic rings. The warpage of an optical film formed from the photosensitive resin composition can be reduced by introducing an aromatic ring into the ethylenically unsaturated group-containing compound (A), and when the number of aromatic rings contained in the ethylenically unsaturated group-containing compound (A) is more than two, the transmittance of the optical film is reduced.

In addition, (a) the ethylenically unsaturated group-containing compound is preferably a (meth) acryloyl group having one or two groups. Since both the (A) ethylenically unsaturated group-containing compound and the (B) bisphenol fluorene oligomer used in the present invention have a (meth) acryloyl group, the reaction rate is uniform and the partial hardening is not too fast, so that the transmittance of the optical film can be maintained.

Specifically, the ethylenically unsaturated group-containing compound (a) includes at least one selected from the group consisting of compounds represented by formulae (1) to (14).

In the formula (1), n1 and m1 are each independently an integer of 0 to 20, and the sum of n1 and n2 is an integer of 1 to 20.

In the formula (2), n2 and m2 are each independently an integer of 0 to 4, and the sum of n2 and m2 is an integer of 2 to 4.

In the formula (3), n3 is an integer of 0 to 3.

In the formula (4), R¹Is an alkyl group having 1 to 20 carbon atoms.

In the formula (5), R²Is an alkyl group having 1 to 20 carbon atoms.

In the formula (6), R³Is an alkyl group having 1 to 20 carbon atoms.

In the formula (13), n4 is an integer of 1 to 3.

In the formula (14), n5 is an integer of 1 to 3.

Specific examples of the compound represented by the formula (1) include compounds represented by the formula (1-1).

Specific examples of the compound represented by the formula (2) include compounds represented by the formula (2-1).

Specific examples of the compound represented by the formula (3) include compounds represented by the formula (3-1).

Specific examples of the compound represented by the formula (4) include compounds represented by the formula (4-1).

Specific examples of the compound represented by the formula (5) include compounds represented by the formula (5-1).

Specific examples of the compound represented by the formula (6) include compounds represented by the formula (6-1).

Specific examples of the compound represented by the formula (13) include compounds represented by the formula (13-1).

Specific examples of the compound represented by the formula (14) include compounds represented by the formula (14-1).

The above-mentioned (A) ethylenically unsaturated group-containing compound preferably contains a compound represented by the formula (1), more preferably a compound represented by the formula (1-1). The transmittance of the optical film can be further increased by using the compound represented by formula (1).

(B) Bisphenol fluorene oligomer

(B) The bisphenol fluorene oligomer has one or two (meth) acryloyl groups. Since both the (A) ethylenically unsaturated group-containing compound and the (B) bisphenol fluorene oligomer used in the present invention have a (meth) acryloyl group, the reaction rate is uniform and the partial hardening is not too fast, so that the transmittance of the optical film can be maintained.

(B) The bisphenol fluorene oligomer is not particularly limited, and MIRAMER HR6100 (modified bisphenol fluorene diacrylate) and MIRAMER HR6200 (modified bisphenol fluorene diacrylate) manufactured by wemon co., L td, inc.

(A) The weight ratio of the compound containing an ethylenically unsaturated group to the bisphenol fluorene oligomer (B) may be 0.50 to 0.95, preferably 0.66 to 0.86. When the weight ratio of the compound containing ethylene unsaturated group (A) and the bisphenol fluorene oligomer (B) is in the above range, the optical film formed by the photosensitive resin composition has low warpage and high transmittance.

(B) The bisphenol fluorene oligomer may have a weight average molecular weight of 500 to 5000. When the weight average molecular weight of the bisphenol fluorene oligomer (B) is in the above range, the viscosity of the photosensitive resin composition can be further adjusted to a desired range.

(C) Photoinitiator

(C) The photoinitiator is not particularly limited, and examples thereof include acetophenone compounds (acetophenone), phenyl acetone compounds (phenyl ketone), diimidazole compounds (biimidazole), benzophenone compounds (benzophenone), acyloxime compounds (acyloxide), acylphosphine oxide compounds (acylphosphine oxide), α -dione compounds (α -dione), ketone alcohol compounds (acyloin), ketone alcohol ether compounds (acyloinher), quinone compounds (quinone), halogen compounds, peroxides, cationic compounds, and combinations thereof.

Examples of the acetophenone-based compound include p-dimethylaminoacetophenone (p-dimethylaminoacetophenone), α '-dimethoxyazoxyacetophenone (α' -dimethoxyazoxy-acetophenone), 2 '-dimethyl-2-phenylacetophenone (2, 2' -dimethyl-2-phenyl-acetophenone), p-methoxyacetophenone (p-methoxy-acetophenone), 2-methyl-1- (4-methylthiophenyl) -2-morpholinopropan-1-one (2-methyl-1- (4-methylthiophenyl) -2-morpholinopropan-1-one), 2-phenyl-2-N, N-dimethylamine-1- (4-morpholinophenyl) -1-butanone (2-benzyl-2-N, N-dimethylamino-1- (4-morpholinophenyl) -1-butanone), and combinations thereof.

Examples of the phenylacetone-based compound include 1-hydroxycyclohexyl phenyl ketone (trade name: Irgacure 184, product of Ciba Specialty Chemicals), 2-hydroxy-2-methyl-1-phenyl-propan-1-one (trade name: DAROCUR 1173, product of Ciba Specialty Chemicals), 2-hydroxy-1- {4- [4- (2-hydroxy-2-methyl-propionyl) -benzyl ] phenyl } -2-methyl-propan-1-one (2-hydroxy-1- {4- [4- (2-hydroxy-2-methyl-propionyl) benzyl ] phenyl } -2-methyl-propan-1-one -1-one, trade name: IRGACURE 127, manufactured by nubuck corporation), or combinations thereof.

Examples of the diimidazole compound include 2,2 ' -bis (o-chlorophenyl) -4,4 ', 5,5 ' -tetraphenyldiimidazole (2,2 ' -bis (o-chlorophenyl) -4,4 ', 5,5 ' -tetraphenyldiimidazole), 2 ' -bis (o-fluorophenyl) -4,4,5,5 ' -tetraphenyldiimidazole (2,2 ' -bis (o-fluorophenyl) -4,4 ', 5,5 ' -tetraphenyldiimidazole), 2 ' -bis (o-methylphenyl) -4,4 ', 5,5 ' -tetraphenyldiimidazole (2,2 ' -bis (o-methylphenyl) -4,4 ', 5,5 ' -tetraphenyldiimidazole), 2 ' -bis (o-methoxyphenyl) -4,4 ', 5,5 ' -tetraphenyldiimidazole, 2 ' -bis (o-methoxyphenyl) -4,4 ', 5,5 ' -tetraphenyldiimidazole, 4 ', 5, 5' -tetraphenyldiimidazole (2,2 '-bis (o-methoxyphenyl) -4, 4', 5,5 '-tetraphenyldiimidazole), 2' -bis (o-ethylphenyl) -4,4 ', 5, 5' -tetraphenyldiimidazole (2,2 '-bis (o-ethylphenyl) -4, 4', 5,5 '-tetraphenyldiimidazole), 2' -bis (p-methoxyphenyl) -4,4 ', 5, 5' -tetraphenyldiimidazole (2,2 '-bis (p-methoxyphenyl) -4, 4', 5,5 '-tetraphenyldiimidazole), 2' -bis (2,2 ', 4, 4' -tetramethoxyphenyl) -4,4 ', 5, 5' -tetraphenyldiimidazole (2,2 ' -bis (2,2 ', 4,4 ' -tetramethylxyphenyl) -4,4 ', 5,5 ' -tetraphenyldiazole), 2 ' -bis (2-chlorophenyl) -4,4 ', 5,5 ' -tetraphenyldiimidazole (2,2 ' -bis (2-chlorophenyl) -4,4 ', 5,5 ' -tetraphenyldiimidazole), 2 ' -bis (2,4-dichlorophenyl) -4,4 ', 5,5 ' -tetraphenyldiimidazole (2,2 ' -bis (2,4-dichlorophenyl) -4,4 ', 5,5 ' -tetraphenyldiimidazole), or a combination thereof.

Examples of the benzophenone-based compound include Thioxanthone (Thioxanthone), 2, 4-diethylthioxanthone (2, 4-diethylthioxanthone), Thioxanthone-4-sulfone (Thioxanthone-4-sulfone), benzophenone (benzophenone)4,4 '-bis (dimethylamine) benzophenone (4, 4' -bis (dimethylamino) benzophenone), 4 '-bis (diethylamine) benzophenone (4, 4' -bis (dimethylamino) benzophenone), and a combination thereof.

As the acyloxime-based compound, there may be mentioned, for example, an alkanone, 1- [9-ethyl-6- (2-methylbenzoyl) -9-hydro-carbazol-3-substituent ] -,1- (O-acetyloxime) (ethanone,1- [9-ethyl-6- (2-methylbenzoyl) -9H-carbazol-3-yl ] -,1- (O-acetyloxime) such as "CGI-242" product produced by Ciba refinement), 1- (4-phenyl-thio-phenyl) -octane-1, 2-dione 2-oxime-oxy-benzoate (1- (4-phenyl-thio-phenyl) -octane-1, 2-dione 2-oxide-O-benzoate, such as "CGI-124" products manufactured by gasoline refining), ethanone,1- [9-ethyl-6- (2-chloro-4-benzyl-thio-benzoyl) -9-hydro-carbazol-3-substituent ] -,1- (oxy-acetyl oxime) (ethanone,1- [9-ethyl-6- (2-chloro-4-benzyl-thio-benzoyl) -9H-carbazol-3-yl ] -,1- (O-acyl oxime), manufactured by asahi electric company), or a combination thereof.

Examples of acylphosphine oxides (acylphosphine oxides) include 2,4, 6-trimethylbenzoyldiphenylphosphine oxide (2,4, 6-trimethy-benzoyldiphenylsilane oxide), bis- (2, 6-dimethoxybenzoyl) -2,4, 4-trimethylphenylphosphine oxide (bis- (2, 6-dimethy-benzoyi) -2,4, 4-trimethylbenzylphosphinoxide), Phenylbis (2,4,6-trimethylbenzoyl) phosphine oxide (Phenylbis (2,4, 6-trimethylphenylzoyl) phosphine oxide), or a combination thereof.

α -diketone (α -diketone) compounds include benzil (benzil), acetyl (acetyl) or a combination thereof.

Examples of the ketol (acyloin) type compounds include benzoin (benzoin).

Examples of ketone alcohol ether (acyloinether) compounds include benzoin methyl ether (benzophenone), benzoin ethyl ether (benzophenone), benzoin isopropyl ether (benzophenone), or a combination thereof.

Examples of quinone compounds include anthraquinone (anthraquinone), 1,4-naphthoquinone (1,4-naphthoquinone), and combinations thereof.

Examples of the halogen compound include phenacyl chloride (phenacyl chloride), tribromomethyl phenyl sulfone (tribromomethyl phenyl sulfone), tris (trichloromethyl) -s-triazine (tris (trichloromethyl) -s-triazine), and a combination thereof.

Examples of the peroxide include di-tert-butyl peroxide (di-tert-butylperoxide).

Examples of the cationic compound include diazonium salts, iodonium salts, sulfonium salts, and combinations thereof.

(C) The photoinitiator is preferably 2-methyl-1- (4-methylthiophenyl) -2-morpholinopropan-1-one, 2-phenyl-2-N, N-dimethylamine-1- (4-morpholinophenyl) -1-butanone, 2,4, 6-trimethylbenzoyldiphenylphosphine oxide, phenylbis (2,4,6-trimethylbenzoyl) phosphine oxide, or a combination thereof.

The amount of the photoinitiator (C) is 0.05 to 40 parts by weight, preferably 0.1 to 20 parts by weight, more preferably 0.5 to 10 parts by weight, based on 100 parts by weight of the ethylenically unsaturated group-containing compound (A). When the photoinitiator (C) is in the above range, the reactivity of the initiator can be sufficiently exerted.

(D) Additive agent

On the premise of not influencing the efficacy of the invention, the photosensitive resin composition of the invention can be further optionally added with (D) additives. (D) The additive is not particularly limited, and specifically, the (D) additive includes a fluorine-based surfactant, a silicone surfactant, a nonionic surfactant, a leveling agent, or a combination thereof.

Based on 100 parts by weight of (A) the ethylenically unsaturated group-containing compound, (D) the additive may be 0.005 to 0.015 parts by weight,

(E) solvent(s)

The photosensitive resin composition preferably does not contain any solvent. However, the photosensitive resin composition of the present invention may further optionally contain (E) a solvent without affecting the efficacy of the present invention. (E) The solvent is a solvent which can dissolve (A) the compound containing an ethylenically unsaturated group, (B) the bisphenol fluorene oligomer, (C) the photoinitiator, and (D) the additive, but does not react with the above components.

(E) The solvent is not particularly limited, and examples thereof include ethylene glycol monoalkylethers, ethylene glycol dialkyl ethers, ethylene glycol monoalkylether acetates, propylene glycol monoalkylethers, propylene glycol dialkyl ethers, propylene glycol monoalkylether acetates, diethylene glycol dialkyl ethers (e.g., diethylene glycol diethyl ether, diethylene glycol methyl ethyl ether, etc.), diethylene glycol monoalkylether acetates, dipropylene glycol monoalkylethers, dipropylene glycol dialkyl ethers, dipropylene glycol monoalkylether acetates, esters, ketones, amides, lactones, and the like. Specific examples of preferred solvents include: propylene glycol monomethyl ether acetate, diethylene glycol ethyl methyl ether, gamma-butyrolactone, N-methylpyrrolidinone, 1, 3-butanediol diacetate, or combinations thereof.

(E) The content of the solvent is 1 wt% or less of the photosensitive resin composition. When the content of the solvent (E) exceeds 1% by weight of the photosensitive resin composition, when the photosensitive resin composition is intended to form a thick coating film (having a thickness of 50 μm or more), the solvent is volatilized to easily generate bubbles in the coating film. Further, the photosensitive resin composition preferably does not contain any solvent.

< method for producing photosensitive resin composition >

The method which can be used for preparing the photosensitive resin composition is not particularly limited, and examples thereof include: a liquid photosensitive resin composition is obtained by stirring (A) an ethylenically unsaturated group-containing compound, (B) a bisphenol fluorene oligomer, and (C) a photoinitiator in a stirrer to uniformly mix the mixture in a solution state, and if necessary, adding (D) an additive, (E) a solvent or a combination thereof to uniformly mix the mixture.

The viscosity of the photosensitive resin composition of the present invention at 25 ℃ is preferably 600 to 7000 mPas.

< method for producing optical film >

The invention provides a manufacturing method of an optical film, which comprises the following steps: first, the photosensitive resin composition is applied to a substrate to form a coating film. Subsequently, the coating film is subjected to an exposure step. Then, the exposed coating film is subjected to a baking step to form an optical film on the substrate.

As a method for applying the photosensitive resin composition to a substrate, a spin coater (spin coater), a non-spin coating machine (spin coating machine), or a slit-die coating machine (slit-die coating machine) can be used, and a spin coater is preferred. When a spin coater is used, the rotation speed is 800 to 3500rpm, and the thickness of the formed coating film is 20 to 120 μm.

Examples of the substrate include a glass substrate, a sapphire substrate, and a silicon wafer substrate.

The light source in the exposure step may be ultraviolet rays such as g-line, h-line, i-line, etc. The apparatus for the exposure step is not particularly limited, and a high mercury lamp, an ultra-high mercury lamp, or a metal halide lamp may be used. The wavelength of the exposure step may be 200 to 500 nm.

The temperature of the baking step may be 130 ℃ to 280 ℃.

The optical film has a transmittance of 85% or more for visible light having a wavelength of 380nm to 780nm and a transmittance of 90% or more for infrared light having a wavelength of 780nm to 1100nm when the thickness of the optical film is 20 to 120 [ mu ] m. In addition, when the thickness of the optical film is 20-120 μm, the warping degree of the optical film relative to the substrate is less than 0.25 mm.

The present invention will be further described with respect to the following examples, but it should be understood that these examples are for illustrative purposes only and should not be construed as limiting the practice of the invention.

Photosensitive resin composition and examples of optical film

Examples 1 to 3 and comparative examples 1 to 2 of the photosensitive resin composition and the optical film are described below: