阅读说明：本技术 电路板单元、电路组件及计算机电源、计算机 (Circuit board unit, circuit assembly, computer power supply and computer ) 是由 李剑英 黎惇昊 于 2019-10-24 设计创作，主要内容包括：本发明提供了一种电路板单元、电路组件、计算机电源及计算机,电路板单元包括至少一块线路板,所述线路板包括多层层叠设置的电气连接层,且所述线路板设置有用于连接电子元器件的电气连接结构；其中至少一块所述线路板为复用板,所述复用板的最外侧的两层所述电气连接层中,至少有一层所述电气连接层为导热层,所述导热层为铜箔层,所述导热层具有裸露区,所述裸露区露出所述复用板；在所述复用板中,至少部分所述电气连接结构位于所述裸露区内。本发明在线路板上减少甚至不设置独立的散热或者冷却结构,从而能够降低整个电路组件的体积,有利于产品的整体结构设计,尤其有利于小型产品的结构设计,以更好地满足用户的需求。(The invention provides a circuit board unit, a circuit assembly, a computer power supply and a computer, wherein the circuit board unit comprises at least one circuit board, the circuit board comprises a plurality of electrical connection layers which are stacked, and the circuit board is provided with an electrical connection structure for connecting electronic components; at least one circuit board is a multiplexing board, at least one of the two electrical connection layers at the outermost side of the multiplexing board is a heat conduction layer, the heat conduction layer is a copper foil layer, the heat conduction layer is provided with an exposed area, and the exposed area is exposed out of the multiplexing board; in the multiplexing board, at least part of the electrical connection structure is located in the exposed area. The invention reduces or even does not arrange an independent heat dissipation or cooling structure on the circuit board, thereby reducing the volume of the whole circuit assembly, being beneficial to the whole structure design of products, being particularly beneficial to the structure design of small products and better meeting the requirements of users.)

1. A circuit board unit comprises at least one circuit board, wherein the circuit board comprises a plurality of electrical connection layers which are arranged in a stacked mode, and the circuit board is provided with an electrical connection structure used for connecting electronic components; the circuit board is characterized in that at least one circuit board is a multiplexing board, at least one of the two electrical connection layers on the outermost side of the multiplexing board is a heat conduction layer, the heat conduction layer is a copper foil layer, the heat conduction layer is provided with an exposed area, and the exposed area is exposed out of the multiplexing board; in the multiplexing board, at least part of the electrical connection structure is located in the exposed area.

2. The circuit board unit of claim 1, wherein a plurality of said exposed areas are disposed on the same thermally conductive layer.

3. The circuit board unit of claim 1, wherein at least one of the exposed areas extends to an edge of the multiplexing board;

and/or

At least one exposed area extends along the edge of the multiplexing board.

4. The circuit board unit of claim 1, wherein the electrical connection structure comprises a first electrical connection structure for connecting a first one of the electronic components, the first electrical connection structures being located in the exposed area; wherein the first electronic component comprises a transistor.

5. The circuit board unit according to claim 4, wherein a plurality of the first electrical connection structures are provided on the same exposed area, and an area of a projection of the same exposed area in a direction perpendicular to the wiring board is greater than or equal to ten times a sum of areas of projections of the transistors connected thereto.

6. The circuit board unit according to any one of claims 1 to 5, wherein the multiplexing board is provided with at least two boards, one board is defined as a first board, the other board is defined as a second board, one of the first board and the second board is provided with a first electric socket, and the other board is provided with a first electric pin, and the first electric socket and the first electric pin can be plugged and matched to form an electric connection.

7. The circuit board unit according to claim 6, wherein the first board is disposed perpendicular to the second board;

and/or

The second plate is provided with a plurality of pieces.

8. A circuit board unit according to any one of claims 1-5, wherein the circuit boards are provided with a plurality of pieces, at least one circuit board is a universal board, one of the universal board and the multiplexing board is provided with a second electrical socket, and the other one of the universal board and the multiplexing board is provided with a second electrical pin, and the two are in plug fit with the second electrical pin through the second electrical socket to form an electrical connection.

9. A circuit assembly comprising electronic components and a circuit board unit according to any of claims 1-8, said electronic components being connected to said electrical connection structure.

10. The circuit assembly of claim 9, wherein the plurality of electronic components are provided, wherein a portion of the electronic components are first electronic components, and wherein the first electronic components comprise at least one of transistors, transformers, and bridges; the electrical connection structure corresponding to the first electronic component is a first electrical connection structure, and each first electrical connection structure is located in the exposed area.

11. The circuit assembly of claim 10, wherein the first electronic component comprises a transistor, a plurality of the transistors are connected to the same exposed area, and a projected area of the exposed area in a direction perpendicular to the circuit board is greater than or equal to ten times a sum of projected areas of the transistors connected thereto.

12. A computer power supply comprising a housing and a circuit assembly as claimed in any one of claims 9 to 11 mounted within the housing.

13. The computer power supply according to claim 12, wherein a first guide groove is formed in the housing, the circuit boards are provided with a plurality of circuit boards and are connected with each other, at least one circuit board is a multiplexing board, and one multiplexing board is inserted into the first guide groove;

and/or a gap is reserved between the main surface of each circuit board and the shell.

14. The computer power supply according to claim 12 or 13, wherein the housing is provided with a heat dissipation hole and a second guide groove, and a fluid passage is formed between the exposed area and the heat dissipation hole;

the fan is used for forming air flow in the fluid channel; the fan is inserted in the second guide groove.

15. The computer power supply of claim 14, wherein the electrical connection structure comprises a third electrical connection structure, at least one of the multiplexing plates forms a non-zero included angle with the insertion direction of the fan, and the multiplexing plate is provided with the third electrical connection structure;

the fan is provided with a driving connecting part, one of the driving connecting part and the third electrical connecting structure comprises an elastic pin, the other one of the driving connecting part and the third electrical connecting structure comprises a contact, and the elastic pin is abutted against the contact to form electrical connection.

16. The computer power supply of claim 15, wherein the multiplexing board electrically connected to the fan is disposed perpendicular to the insertion direction, and both the multiplexing board and the driving connection portion are located at the end of the fan in the insertion direction.

17. The computer power supply of claim 16, wherein the multiplexing board electrically connected to the fan is provided with a limiting protrusion on a side facing away from the fan, the limiting protrusion abutting against the housing.

18. The computer power supply of claim 14, wherein the housing is provided with a stop structure in the insertion direction of the fan, and the fan abuts against the stop structure.

19. The computer power supply according to claim 18, wherein the housing comprises a middle shell, a front shell and a rear shell, the middle shell is a hollow structure, and two ends of the middle shell are respectively buckled with the front shell and the rear shell; the insertion direction is consistent with the relative direction of the front shell and the rear shell, and the limiting structure comprises a convex edge arranged on the end face of the front shell or the rear shell, which is close to the middle shell.

20. A computer comprising a computer power supply as claimed in any one of claims 12 to 19.

Technical Field

The invention relates to the technical field of electronics, in particular to a circuit board unit, a circuit assembly, a computer power supply and a computer.

Background

At present, the application of circuit board is very extensive, it exists in products such as various electronics, electrical apparatus, along with the promotion of these product performances, need set up the electronic components of a lot of high powers on the circuit board, these electronic components generate heat seriously, in order to guarantee the normal operating of product, among the prior art, often set up special heat dissipation or heat conduction structure outside the circuit board, aluminum sheet structure such as connecting radiating fin on the circuit board, some even directly set up special cooling device in the product, if flow through the coolant goes out the heat conduction, in order to guarantee the normal operating of product better.

However, the existing heat dissipation or heat conduction structure needs to be separately arranged from the circuit board, which inevitably occupies a larger space, increases the volume of the whole product, and especially reduces the overall effect of the product for the product whose volume is originally small.

Disclosure of Invention

Based on the above situation, the present invention is directed to a circuit board unit, a circuit assembly, a computer power supply, and a computer, so as to solve the problem of the conventional circuit board with an independent heat dissipation or heat conduction structure, which results in a large volume.

In order to achieve the purpose, the technical scheme adopted by the invention is as follows:

the first aspect of the invention provides a circuit board unit, which comprises at least one circuit board, wherein the circuit board comprises a plurality of electrical connection layers which are stacked, and the circuit board is provided with an electrical connection structure for connecting electronic components; at least one circuit board is a multiplexing board, at least one of the two electrical connection layers at the outermost side of the multiplexing board is a heat conduction layer, the heat conduction layer is a copper foil layer, the heat conduction layer is provided with an exposed area, and the exposed area is exposed out of the multiplexing board; in the multiplexing board, at least part of the electrical connection structure is located in the exposed area.

Preferably, a plurality of exposed areas are arranged on the same heat conduction layer.

Preferably, at least one exposed area extends to the edge of the multiplexing board, and/or at least one exposed area extends along the edge of the multiplexing board.

Preferably, the electrical connection structures include a first electrical connection structure, the first electrical connection structure is used for connecting a first electronic component in the electronic components, and the first electrical connection structures are located in the exposed area; wherein the first electronic component comprises a transistor.

Preferably, the same exposed area is provided with a plurality of first electrical connection structures, in a direction perpendicular to the circuit board, the area of the projection of the same exposed area is greater than or equal to ten times of the sum of the areas of the projections of the transistors connected to the same exposed area, preferably, the multiplexing board is provided with at least two blocks, one of the two blocks is defined as a first board, the other block is defined as a second board, one of the first board and the second board is provided with a first electrical socket, and the other block is provided with a first electrical pin, and the two blocks can be in plug fit with the first electrical pin through the first electrical socket to form electrical connection.

Preferably, the first plate is arranged perpendicular to the second plate; and/or the second plate is provided with a plurality of pieces.

Preferably, the circuit board is provided with a plurality of blocks, at least one circuit board is a universal board, one of the universal board and the multiplexing board is provided with a second slot, the other one of the universal board and the multiplexing board is provided with a second electric pin, and the universal board and the multiplexing board are in plug fit with the second electric pin through the second electric slot to form electric connection.

A second aspect of the invention provides a circuit assembly comprising an electronic component and a circuit board unit as defined in any of the above, said electronic component being connected to said electrical connection structure.

Preferably, a plurality of electronic components are provided, wherein part of the electronic components are first electronic components, and the first electronic components include at least one of transistors, transformers and bridges; the electrical connection structure corresponding to the first electronic component is a first electrical connection structure, and each first electrical connection structure is located in the exposed area.

Preferably, the first electronic component includes a transistor, a plurality of transistors are connected to the same exposed area, and in a direction perpendicular to the circuit board, an area of a projection of the exposed area is greater than or equal to ten times a sum of areas of projections of the transistors connected to the exposed area.

A third aspect of the invention provides a computer power supply comprising a housing and a circuit assembly as claimed in any preceding claim mounted within the housing.

Preferably, a first guide groove is formed in the shell, the circuit boards are provided with a plurality of circuit boards which are mutually connected, at least one circuit board is a multiplexing board, and one multiplexing board is inserted into the first guide groove;

and/or a gap is reserved between the main surface of each circuit board and the shell.

Preferably, the housing is provided with a heat dissipation hole and a second guide groove, and a fluid channel is formed between the exposed area and the heat dissipation hole;

the fan is used for forming air flow in the fluid channel; the fan is inserted in the second guide groove.

Preferably, the electrical connection structure comprises a third electrical connection structure, at least one of the multiplexing plates forms a non-zero included angle with the insertion direction of the fan, and the third electrical connection structure is arranged on the multiplexing plate;

the fan is provided with a driving connecting part, one of the driving connecting part and the third electrical connecting structure comprises an elastic pin, the other one of the driving connecting part and the third electrical connecting structure comprises a contact, and the elastic pin is abutted against the contact to form electrical connection.

Preferably, the multiplexing board electrically connected to the fan is disposed perpendicular to the insertion direction, and both the multiplexing board and the driving connection portion are located at the end of the fan in the insertion direction.

Preferably, the multiplexing board electrically connected with the fan is provided with a limiting protrusion on one side departing from the fan, and the limiting protrusion abuts against the shell.

Preferably, the housing is provided with a limiting structure in the insertion direction of the fan, and the fan abuts against the limiting structure.

Preferably, the shell comprises a middle shell, a front shell and a rear shell, the middle shell is of a hollow structure, and two ends of the middle shell are respectively buckled with the front shell and the rear shell; the insertion direction is consistent with the relative direction of the front shell and the rear shell, and the limiting structure comprises a convex edge arranged on the end face of the front shell or the rear shell, which is close to the middle shell.

A fourth aspect of the invention provides a computer comprising a computer power supply as claimed in any preceding claim.

In the circuit board unit, at least one circuit board is a multiplexing board, the multiplexing board is provided with an exposed area so as to expose the heat conducting layer out of the multiplexing board, and part of the electrical connection structure is arranged in the exposed area. Obviously, the multiplexing board not only has the functions of electrical connection and the like of a universal circuit board, but also has the functions of heat conduction and heat dissipation, so that when the circuit board unit is used, an independent heat dissipation or cooling structure can be reduced or even not arranged on the circuit board, the volume of the whole circuit assembly can be reduced, the whole structure design of a product is facilitated, and the structure design of a small product is particularly facilitated, so that the requirements of users are better met; and because the heat radiation structures such as aluminum sheets and the like are saved, the assembly procedures of the heat radiation structures and the connection procedures of the heat radiation structures and other structures can be saved, and the production efficiency of the product is further improved.

Drawings

Preferred embodiments of the present invention will be described below with reference to the accompanying drawings. In the figure:

FIG. 1 is a schematic diagram of a computer power supply according to a preferred embodiment of the present invention;

FIG. 2 is a schematic view of a hidden portion of the embodiment shown in FIG. 1;

FIG. 3 is a schematic view of the embodiment shown in FIG. 1 with another portion of the components hidden;

FIG. 4 is a schematic diagram of the fan and circuit assembly of the embodiment shown in FIG. 1;

fig. 5 is a schematic structural diagram of a preferred embodiment of the circuit board unit provided by the present invention.

In the figure:

100. a computer power supply; 101. a housing; 1011. a middle shell; 1012. a front housing; 1013. a rear housing; 1014. a first guide groove; 1015. heat dissipation holes; 1016. a second guide groove; 1017. a limiting structure; 102. a circuit component; 103. a fan; 1031. a drive connection portion;

1. a first electronic component;

2. a second electronic component;

3. a circuit board unit; 31. a first plate; 3111. an exposed area; 312. a first electrical connection structure; 313. a second electrical connection structure; 314. a first electrical socket; 32. a second plate; 322. a third electrical connection structure; 33. and a limiting bulge.

Detailed Description

The present invention will be described below based on examples, but the present invention is not limited to only these examples. In the following detailed description of the present invention, certain specific details are set forth in order to avoid obscuring the nature of the present invention, well-known methods, procedures, and components have not been described in detail.

Further, those of ordinary skill in the art will appreciate that the drawings provided herein are for illustrative purposes and are not necessarily drawn to scale.

Unless the context clearly requires otherwise, throughout the description and the claims, the words "comprise", "comprising", and the like are to be construed in an inclusive sense as opposed to an exclusive or exhaustive sense; that is, what is meant is "including, but not limited to".

In the description of the present invention, it is to be understood that the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. In addition, in the description of the present invention, "a plurality" means two or more unless otherwise specified.

The present application provides a computer comprising a computer power supply 100, as shown in fig. 1-5, comprising a housing 101 and a circuit assembly 102, the circuit assembly 102 being mounted within the housing 101.

The circuit assembly 102 includes electronic components (such as a first electronic component 1 and a second electronic component 2) and a circuit board unit 3, where the circuit board unit 3 includes at least one circuit board, that is, may include only one circuit board, or may include two, three or more circuit boards, and each circuit board may be a rigid printed circuit board or a flexible circuit board. Specifically, each circuit board includes a plurality of electrical connection layers stacked on top of each other, for example, two, three or more electrical connection layers are provided, it is understood that a silk-screen printing layer may be further provided on the outermost side of the plurality of electrical connection layers, for example, a green paint layer is brushed to form an insulating layer, and other layer structures may be further provided between two adjacent electrical connection layers. The circuit board is provided with an electrical connection structure for connecting electronic components, the electrical connection structure may be specifically a connection structure such as a pad, a solder leg, a solder hole, and the like, and when the circuit assembly 102 is formed, the electronic components are correspondingly connected with the electrical connection structure.

The electronic components include a first electronic component 1 and a second electronic component 2, the first electronic component 1 includes at least one of a transistor, a transformer, a bridge, and the like, wherein the transistor may be a Field-effect transistor (FET), and may specifically be a metal-oxide-semiconductor Field-effect transistor (MOSFET), and is usually a surface-mount structure, and the electronic components have a relatively high power and generate relatively severe heat, and an electrical connection structure connected to the circuit board is defined as a first electrical connection structure 312; the second electronic component 2 includes at least one of a resistor, a capacitor, an inductor, etc., and the power of the electronic component is relatively low, and the heat generation amount is relatively small, even negligible, and accordingly, the electrical connection structure on the circuit board connected thereto is defined as the second electrical connection structure 313. That is to say, part of the electrical connection structure is the first electrical connection structure, part of the electrical connection structure is the second electrical connection structure, and any one of the circuit boards may be provided with only the first electrical connection structure or the second electrical connection structure, or may be provided with both the first electrical connection structure and the second electrical connection structure, and of course, the circuit board may also be provided with other electrical connection structures, such as the third electrical connection structure.

Referring to fig. 5, at least one circuit board in the circuit board unit 3 is a multiplexing board, and at least one of the two outermost electrical connection layers of the multiplexing board is a heat conduction layer, the heat conduction layer is specifically a copper foil layer, the heat conduction layer has an exposed area 3111, the exposed area 3111 exposes out of the multiplexing board (such as the first board 31 and the second board 32), that is, when a silk-screen layer or other structural layers are disposed outside the outermost electrical connection layer, the structural layers are in a hollow structure at a position corresponding to the exposed area 3111, and in an embodiment where a green paint layer is brushed outside the outermost electrical connection layer, the green paint layer is not disposed outside the exposed area 3111, so as to completely expose the exposed area 3111. In the multiplexing board, at least a portion of the electrical connection structure is located within the exposed region 3111. In forming the circuit assembly 102, electronic components are connected to the electrical connection structure.

In the circuit board unit 3, at least one circuit board is a multiplexing board, the multiplexing board is provided with the exposed area 3111, the electrical connection layer in the circuit board is multiplexed as a heat conduction layer, when the circuit board unit is used, especially, high-power and high-calorific-value electronic components such as transistors are connected with the electrical connection structure of the exposed area, so that the electronic components are directly contacted with the copper foil layer of the exposed area 3111, the heat conduction efficiency of copper is higher, and the exposed area 3111 is directly exposed to the outside of the whole multiplexing board, so that most of heat of the first electronic component 1 can be directly and quickly conducted out of the circuit board through the exposed area 3111, and the heat can be dissipated out as soon as possible. Obviously, the multiplexing board not only has the functions of electrical connection and the like of a universal circuit board, but also has the functions of heat conduction and heat dissipation, so that when the circuit board unit 3 is used, the arrangement of an independent heat dissipation or cooling structure on the circuit board can be reduced, the volume of the whole circuit assembly 102 can be reduced, the whole structure design of a product is facilitated, the structure design of a small product is particularly facilitated, and the requirements of users can be better met; and because the heat radiation structures such as aluminum sheets and the like are saved, the assembly procedures of the heat radiation structures and the connection procedures of the heat radiation structures and other structures can be saved, and the production efficiency of the product is further improved.

For convenience of description, it can be defined that in the same multiplexing board, the two outermost electrical connection layers are respectively a top layer and a bottom layer, and only the top layer or the bottom layer may be a heat conduction layer, in a preferred embodiment, the top layer and the bottom layer are both heat conduction layers, that is, the two outermost electrical connection layers in the multiple electrical connection layers are both heat conduction layers, and both exposed regions 3111 are provided, so as to transfer heat out more quickly. In this preferred embodiment, the electrical connection structure may be provided only in the exposed area 3111 of the top layer or the bottom layer, or may be provided in both the exposed areas 3111 of the top layer and the bottom layer, that is, in the same multiplexing board, some of the exposed areas 3111 may be exposed only to the outside of the multiplexing board, and no electronic component is connected to the area. The top and bottom are depicted in the placement position of fig. 4, with the top in the figure being the top and the bottom in the figure being the bottom.

It should be noted that one, two or more exposed areas 3111 may be provided, and each exposed area 3111 may be provided with only one electrical connection structure or a plurality of electrical connection structures; the same exposed area 3111 may be provided with only the first electrical connection structure 312 or the second electrical connection structure 313, or with both the first electrical connection structure 312 and the second electrical connection structure 313, refer to fig. 5; of course, other electrical connections may be provided in the exposed area 3111. When the first electrical connection structures 312 are disposed on the multiplexing board, it is preferable that each first electrical connection structure 312 is located in the exposed area 3111, so that the mounting area (i.e., the exposed area 3111) of the first electronic component 1 with high power and serious heat generation is specially disposed on the multiplexing board to improve the heat dissipation efficiency of the heat of the electronic components, thereby ensuring the performance of the whole circuit assembly 102.

Further, only one exposed area 3111 may be disposed on the same heat conduction layer, or a plurality of exposed areas 3111 may be disposed on the same heat conduction layer, and similarly, in this embodiment, in the same heat conduction layer, some exposed areas 3111 may be disposed with an electrical connection structure, and some exposed areas 3111 are not disposed with an electrical connection structure.

It should be noted that when the heat of the electronic component is transferred to the exposed area 3111, a part of the heat is not directly dissipated through the exposed area 3111, but is first conducted to the unexposed portion of the heat conducting layer and then dissipated from the edge of the heat conducting layer. In order to solve this problem, in a preferred embodiment of the present invention, referring to fig. 4 and 5, at least one exposed region 3111 extends to the edge of the multiplexing board, and after such arrangement, the heat transferred to the exposed region 3111 can not only be dissipated as quickly as possible through the main surface thereof, but also as much heat as possible can be transferred directly to the edge of the heat conductive layer without passing through the unexposed portion of the heat conductive layer, so as to further improve the heat dissipation efficiency of the entire multiplexing board. Preferably, each of the exposed regions 3111 extends to an edge of the multiplexing board, and particularly, each of the exposed regions 3111 provided with the first electrical connection structure 312 extends to an edge of the multiplexing board, so as to better improve heat dissipation efficiency of the entire multiplexing board.

Each exposed area 3111 may be in any shape, such as a circle, a square, a bar, an ellipse, or other special-shaped structures, and preferably, at least one exposed area 3111 is arranged to extend along an edge of the multiplexing board, that is, at least one exposed area 3111 is in a bar-shaped structure, and the length direction of the exposed area 3111 is the same as the extending direction of the edge of the multiplexing board, for example, when the multiplexing board is in a circle, the extending direction of the edge is the direction of the edge arc line of the multiplexing board; also, if the multiplexing board is square, the extending direction of the edge is the extending direction of one side of the square or the direction from one side to the other side, and obviously, the structure of the exposed area 3111 is more favorable for the arrangement of the electronic components when a plurality of electrical connection structures are simultaneously provided.

Preferably, a plurality of first electrical connection structures 312 are disposed on the same exposed region 3111, and particularly in an embodiment where the first electrical connection structures 312 include transistors, a plurality of transistors are simultaneously connected on the same exposed region 3111. In the actual production of circuit assemblies, multiple transistors are often grouped together to form a transistor group, and the transistor group is mounted on the exposed region 3111 using SMT techniques. Generally, the surface mount transistor has a metal heat dissipation structure, and the metal heat dissipation structure is attached to the first electrical connection structure 312 after surface mounting, so as to transfer the heat of the transistor more directly.

In order to better improve the heat dissipation efficiency of the transistor group, in the direction perpendicular to the circuit board, the area of the projection of the same exposed region 3111 is greater than or equal to ten times the sum of the areas of the projections of the transistors connected thereto, that is, the area of the projection of the exposed region 3111 may be defined as a first area, and the sum of the areas of the projections of the transistors connected to the exposed region 3111 (i.e., the area of the projection of the transistor group or the area of the projection of only one transistor) is defined as a second area, and then the first area is equal to or greater than ten times the second area.

It should be noted that although the heat dissipation efficiency of the transistor through the exposed area 3111 is improved significantly, other first electronic components 1, such as a transformer, a bridge, etc., may also be directly connected to the first electrical connection structure 312 of the exposed area 3111 to improve the heat dissipation efficiency. Specifically, the area of the bare area 3111 may be set according to information such as power of an electronic component connected thereto.

In the above embodiments, the multiplexing board in the circuit board unit 3 may be provided with only one multiplexing board, or may be provided with a plurality of multiplexing boards, such as two multiplexing boards, three multiplexing boards, or more multiplexing boards. In a preferred embodiment, the multiplexing board is provided with at least two boards, one of which is defined as a first board 31, and the other is defined as a second board 32, and the first board 31 and the second board 32 can be electrically connected through wires, but this way inevitably causes a plurality of wires to contact each other, which may cause signals of the two to interfere with each other; this problem is particularly acute in the case where the number of connecting wires of the first plate 31 and the second plate 32 is relatively large, and is disadvantageous in terms of layout of the entire space. In order to solve the above problem, in a preferred embodiment of the present invention, as shown in fig. 5, one of the first board 31 and the second board 32 is provided with a first electrical socket 314, and the other is provided with a first electrical pin (not shown), and the first board 31 and the second board 32 can be plugged and matched with the first electrical pin through the first electrical socket 314 to form an electrical connection, as shown in the embodiment of fig. 5, the first board 31 is provided with the first electrical socket 314, and the second board 32 is provided with the first electrical pin, so that no wires are arranged between the interconnected multiplexing boards, and the signal connection is directly realized in a plugging manner, thereby avoiding mutual interference between signals due to mutual winding of the wires, and facilitating the overall layout of the circuit assembly 102. The first electrical socket 314 has a plurality of jacks, the first electrical pin has a plurality of pins, when the first electrical socket 314 is plugged and matched with the first electrical pin, the plurality of jacks and the plurality of pins are plugged and matched in a one-to-one correspondence manner, and the specific structures of the jacks and the pins are not limited in the present invention as long as the jacks and the pins can be matched with each other to realize signal connection.

The extension surfaces of the first board 31 and the second board 32 may be coplanar, or the extension surfaces of the first board 31 and the second board 32 may be perpendicular to each other or inclined to each other, preferably, the extension surfaces of the two boards are perpendicular to each other, that is, the first board 31 and the second board 32 are perpendicular to each other, as shown in fig. 5, especially when the circuit board unit 3 is applied to the computer power supply 100, the first board 31 may be disposed parallel to the bottom surface of the housing 101, and correspondingly, the second board 32 is disposed parallel to the height direction of the housing 101, as shown in fig. 2 and 3, so that the two multiplexing boards can form a larger space for facilitating the arrangement of electronic components thereon and the arrangement of other components in the computer power supply 100. Further, of the first plate 31 and the second plate 32, the second plate 32 is vertically disposed above the first plate 31, so that the second plate 32 is more reliably connected with the first plate 31 under the action of gravity.

No matter how the second boards 32 are arranged, one or more second boards 32 may be arranged, and when a plurality of second boards 32 are arranged, the plurality of second boards 32 may be parallel to each other, perpendicular to each other, or arranged in other manners, in this embodiment, the first board 31 is provided with a plurality of first electrical sockets or first electrical pins so as to be respectively connected with the plurality of second boards 32, and in this manner, especially when the circuit assembly 102 includes a plurality of first electronic components 1, the plurality of first electronic components 1 can be dispersed on different multiplexing boards, so that heat is prevented from being excessively concentrated, and the heat dissipation efficiency of the whole circuit assembly 102 is further improved; and mutual interference between the first electronic components 1 can be minimized, and the spatial arrangement of the entire circuit assembly 102 is facilitated.

In the embodiment where the circuit boards are provided with a plurality of boards, all the circuit boards may be the multiplexing board, but some of the electronic components on the circuit boards are the second electronic components 2, which generate less heat, and in order to save cost, these circuit boards may be universal boards, that is, some of the circuit boards may be the multiplexing board, and some may be the universal boards (not shown in the figure), that is, in each of the above embodiments, at least one circuit board may also be the universal board, and the universal board refers to an existing ordinary circuit board, which does not have an exposed area with a heat dissipation function, and the universal board may be connected to the first board 31 or the second board 32. Specifically, one of the universal board and the multiplexing board is provided with a second electric slot (not shown in the figure), the other one of the universal board and the multiplexing board is provided with a second electric pin (not shown in the figure), and the universal board and the multiplexing board are in plug fit with the second electric pin through the second electric slot to form electric connection; or the universal board is provided with a second electric pin, and the multiplexing board is provided with a second electric slot. The specific structures of the second electrical socket and the second electrical pin may refer to the structures of the first electrical socket and the first electrical pin, which is not described herein again.

With continued reference to fig. 1 and 2, the housing 101 includes a middle shell 1011, a front shell 1012 and a rear shell 1013, the middle shell 1011 is a hollow structure, such as a cylinder or a square cylinder, and two end faces thereof may be flat or inclined, wherein the inclined faces are inclined with respect to a penetrating direction thereof, and of course, other structures may be provided on each end face of the middle shell 1011. Both ends of the middle housing 1011 are respectively engaged with the front housing 1012 and the rear housing 1013, and specifically, the front housing 1012, the rear housing 1013 and the middle housing 1011 may be connected by a screw connection or a snap connection.

When the circuit module 102 is mounted to the housing 101, the circuit module 102 can be connected by means of screw connection, snap connection, adhesion, etc., for example, the circuit module 102 is first mounted to the middle housing 1011, and then the front housing 1012 and the rear housing 1013 are fastened together.

In a preferred embodiment, a first guide slot 1014 is formed in the housing 101, the circuit boards are provided with a plurality of circuit boards, at least one of the circuit boards is a multiplexing board, and one of the multiplexing boards is inserted into the first guide slot 1014, i.e. the circuit module 102 is inserted into and matched with the housing 101, so as to facilitate the installation of the circuit module 102, and further improve the stability of the circuit module 102. As shown in fig. 2, the first guide groove 1014 may be provided at the middle housing 1011 when the middle housing 1011 is provided, and in particular, the first guide grooves 1014 may be provided at opposite side walls of the middle housing 1011, respectively, and openings of the two first guide grooves 1014 are oppositely provided, so that the multiplexing board (e.g., the first board 31 in the drawing) is simultaneously inserted into the two first guide grooves 1014, further increasing the reliability of the installation of the circuit assembly 102. It is also possible to provide the first guide groove 1014 only at one side wall of the middle housing 1011 and to provide the support structure at the opposite side wall, in which case one side of the first plate 31 is inserted into the first guide groove 1014 and the other side is supported on the support structure. Of course, the first guide slot 1014 could also take other configurations, such as being formed directly from the support structure.

When the circuit module 102 is installed in the housing 101, in order to quickly transfer heat of the circuit board, especially the heat transferred to the exposed area 3111, a gap is left between the main surfaces (two opposite surfaces with a relatively large area of the circuit board, and usually the electrical connection structure is disposed on the two surfaces) of each circuit board and the housing 101, especially when the top layer and the bottom layer of the first board 31 are both heat transfer layers, referring to fig. 2, a gap is left between the first board 31 and the bottom surface of the housing 101, so that the heat transferred from the exposed area 3111 of the bottom layer can quickly circulate, and the heat dissipation efficiency of the circuit module 102 is further increased. Of course, some circuit boards may be directly bonded to the case 101, and particularly when the case 101 is a metal case, heat can be quickly transferred to the case 101.

In order to increase the heat dissipation efficiency of the circuit assembly 102, heat dissipation holes 1015 are disposed on the housing 101, for example, the heat dissipation holes 1015 may be disposed on the middle housing 1011 and the rear housing 1013, as shown in fig. 1 and fig. 2, a fluid channel is formed between the exposed area 3111 of the circuit assembly 102 and the heat dissipation holes 1015, so as to conduct the heat conducted from the exposed area 3111 to the outside of the housing 101 as soon as possible.

Further, the computer power supply 100 further comprises a fan 103 to create an airflow in the fluid channel to accelerate the airflow in the housing 101. Specifically, the fan 103 may be connected to the housing 101 by means of screws, clamping, etc., and in one embodiment, referring to fig. 2, the housing 101 is provided with a second guiding groove 1016; the fan 103 is inserted into the second guide groove 1016, wherein the structure of the second guide groove 1016 can refer to the structure of the first guide groove 1014, and the installation manner of the housing 101 and the fan 103 can refer to the installation manner of the housing 101 and the circuit assembly 102.

In one embodiment, the fan 103 is wired to the circuit assembly 102 to power the fan 103 through the circuit assembly 102. However, such wire connection may increase the number of wire harnesses in the housing 101, which may cause mutual interference between signals transmitted by the wires, and especially when the number of wires is too large, the wires may be entangled with each other, which may cause malfunction and affect the normal operation of the computer power supply 100. Therefore, in another embodiment, the fan 103 and the circuit assembly 102 are connected in a wireless manner, specifically, at least one multiplexing board forms a non-zero included angle with the insertion direction of the fan 103, for example, the multiplexing board is disposed perpendicular to the insertion direction or obliquely with respect to the insertion direction, and the multiplexing board is provided with a third electrical connection structure 322, as shown in fig. 4 and 5, the second board 32 is provided with the third electrical connection structure 322; accordingly, the fan 103 is provided with a driving connection 1031, one of the driving connection 1031 and the third electrical connection structure 322 comprises spring pins, and the other comprises contacts, that is, the spring pins may be provided on the second board 32, and the fan 103 provides contacts; alternatively, the second plate 32 may be provided with contacts and the fan 103 may be provided with spring feet. When the fan 103 is inserted into the second guide channel 1016, the spring pins press against the contacts to electrically connect the fan 103 to the multiplexing board. Obviously, by adopting the manner of pressing the spring pins against the contacts, the number of wires in the housing 101 can be reduced, and the contact reliability between the fan 103 and the circuit assembly 102 can be ensured by the elastic deformation of the spring pins.

Preferably, the multiplexing board electrically connected to the fan 103 is disposed perpendicular to the insertion direction, and both the multiplexing board (e.g., the second board 32 in fig. 2) and the driving connection part 1031 are located at the end of the fan 103 in the insertion direction, i.e., the opposite direction of the pogo pins to the contacts coincides with the insertion direction, and at the end of the second guide groove 1016 in the insertion direction, so that the direction of the elastic deformation force of the pogo pins is parallel to the insertion direction of the fan 103, thereby making the contact of the contacts and the pogo pins more reliable. Of course, the contacts and the spring pins may be disposed in the middle of the second guide groove 1016.

When the circuit assembly 102 includes both the first board 31 and the second board 32, the circuit board electrically connected to the fan 103 is the second board 32, and in the embodiment where the housing 101 is provided with the first guide groove 1014, the extending directions of the first guide groove 1014 and the second guide groove 1016 are preferably parallel to the inserting direction of the fan 103, so that the connection of the first board 31, the second board 32 and the fan 103 can be more reliable.

After the fan 103 is fully inserted into the second guiding groove 1016, the fan 103 may be directly locked with the housing 101 by a hook, or the like, or the fan 103 may be pressed by a portion of the housing 101 opposite to the second plate 32, such as by the front housing 1012 or the rear housing 1013.

When the fan 103 is inserted into the second guiding groove 1016, the fan 103 may be inserted too deeply, which may excessively press the second plate 32, which may cause deformation of the second plate 32, which may affect the reliability of the connection of the electronic components thereon, and may even cause the connection position between the second plate 32 and the first plate 31 to be loosened or deformed, so that the two plates cannot transmit electrical signals. In order to avoid the above problem, in a preferred embodiment of the present invention, the housing 101 is provided with a limit structure 1017 in the insertion direction of the fan 103, and when the fan 103 is fully inserted into the second guide groove 1016, i.e. at the end of the stroke of the fan 103, the fan 103 abuts against the limit structure 1017 to prevent the fan 103 from excessively pressing the second plate 32.

When the front housing 1012 is provided, the insertion direction is the same as the relative direction of the front housing 1012 and the rear housing 1013, the limiting structure 1017 may comprise a rib provided on the end surface of the front housing 1012 or the rear housing 1013 near the middle housing 1011, the rib may extend along the circumferential direction of the middle housing 1011, that is, when the insertion direction is the direction in which the rear housing 1013 points to the front housing 1012, the rib is provided on the front housing 1012, refer to fig. 3; the ribs are provided on the rear housing 1013 when the insertion direction is such that the front housing 1012 is directed toward the rear housing 1013. This kind of arrangement, directly set up limit structure 1017 into the bead, simple structure easily makes.

Further, the circuit board unit 3 further includes a limiting protrusion 33, and a multiplexing board (e.g., the second board 32 in fig. 2) electrically connected to the fan 103 is provided with the limiting protrusion 33 on a side away from the fan 103, such as a limiting post, which may be connected to the multiplexing board by welding or the like, or may be mounted on the second board 32 by bonding, clamping or the like. When the circuit board unit 3 is mounted on the housing 101, the limit protrusion 33 abuts against the housing 101, and with this structure, it is possible to prevent excessive squeezing of the second plate 32 by the fan 103, and also to limit the insertion position of the circuit board unit 3 when the circuit board unit is inserted into the first guide groove 1014, thereby facilitating assembly of other components.

The circuit board connected to the fan 103 may be the first board 31, or may be a general board directly, or may be electrically connected by pressing the spring pins against the contacts. In embodiments where the circuit board unit 3 comprises a common board, the common board may also be adapted to fit into the first guide slots 1014.

In addition, the housing 101 may be formed by integrally molding one of the front housing 1012 and the rear housing 1013 and the middle housing 1011, and then connected to the other by a screw connection, a snap connection, or the like; of course, other configurations for the housing 101 are possible.

In addition, the circuit board unit 3 and the circuit assembly 102 described in the present invention are not limited to be applied to the computer power supply 100, and may be applied to other electronic devices.

It will be appreciated by those skilled in the art that the above-described preferred embodiments may be freely combined, superimposed, without conflict.

It will be understood that the embodiments described above are illustrative only and not restrictive, and that various obvious and equivalent modifications and substitutions for details described herein may be made by those skilled in the art without departing from the basic principles of the invention.