阅读说明：本技术 针对rf应用的异质结双极晶体管中的发射极-基极网格结构 (Emitter-base lattice structure in heterojunction bipolar transistors for RF applications ) 是由 R·达塔 于 2018-11-07 设计创作，主要内容包括：在某些方面,异质结双极晶体管(HBT)包括集电极台面(502)、集电极台面上的基极台面(504)以及基极台面上的发射极台面。发射极台面具有多个开口(510)。HBT还包括在连接到基极台面的多个开口中的多个基极金属(514)。(In certain aspects, a Heterojunction Bipolar Transistor (HBT) includes a collector mesa (502), a base mesa (504) on the collector mesa, and an emitter mesa on the base mesa. The emitter mesa has a plurality of openings (510). The HBT further comprises a plurality of base metals (514) in a plurality of openings connected to the base mesa.)

1. A Heterojunction Bipolar Transistor (HBT), comprising:

a collector mesa;

a base mesa on the collector mesa;

an emitter mesa on the base mesa, wherein the emitter mesa has a plurality of openings; and

a plurality of base metals in the plurality of openings connected to the base mesa.

2. The Heterojunction Bipolar Transistor (HBT) of claim 1, further comprising an extrinsic base metal disposed outside the emitter mesa and connected to the base mesa, wherein the plurality of base metals and the extrinsic base metal are electrically coupled.

3. The Heterojunction Bipolar Transistor (HBT) of claim 2, wherein the extrinsic base metal is arranged to surround the emitter mesa.

4. The Heterojunction Bipolar Transistor (HBT) of claim 1, further comprising an emitter metal coupled to the emitter mesa.

5. The Heterojunction Bipolar Transistor (HBT) of claim 1, further comprising a collector metal coupled to the collector mesa.

6. The Heterojunction Bipolar Transistor (HBT) of claim 1, wherein each of the plurality of openings has the same dimensions.

7. The Heterojunction Bipolar Transistor (HBT) of claim 6, wherein each opening of the plurality of openings is square-shaped.

8. The Heterojunction Bipolar Transistor (HBT) of claim 6, wherein the plurality of openings is at least four.

9. The Heterojunction Bipolar Transistor (HBT) of claim 6, wherein the plurality of openings are arranged in an array.

10. The Heterojunction Bipolar Transistor (HBT) of claim 9, wherein the plurality of openings are arranged as an array of 2 × 2, 3 × 3, or 3 × 1.

11. The Heterojunction Bipolar Transistor (HBT) of claim 6, wherein each of the plurality of openings is in the shape of a hexagon.

12. The Heterojunction Bipolar Transistor (HBT) of claim 11, wherein each of the plurality of base metals is in the shape of a hexagon.

13. The Heterojunction Bipolar Transistor (HBT) of claim 1, wherein the spacing between the emitter mesa and the plurality of base metals is the minimum dimension allowed by the process technology used.

14. The Heterojunction Bipolar Transistor (HBT) of claim 1, wherein the ratio of the area of the base mesa to the area of the emitter mesa is less than 1.8.

15. A method, comprising:

providing a wafer comprising a collector mesa stack, a base mesa stack, and an emitter mesa stack;

patterning the emitter mesa stack to form an emitter mesa having a plurality of openings;

providing a plurality of base metals in the plurality of openings connected to the base mesa stack; and

the base mesa stack is patterned to form a base mesa.

16. The method of claim 15, further comprising providing an extrinsic base metal disposed outside of the emitter mesa and connected to the base mesa, wherein the plurality of base metals and the extrinsic base metal are electrically coupled.

17. The method of claim 16, wherein the extrinsic base metal is disposed around the emitter mesa.

18. The method of claim 15, further comprising providing an emitter metal coupled to the emitter mesa stack.

19. The method of claim 15, further comprising providing a collector metal coupled to the collector mesa stack.

20. The method of claim 15, wherein each of the plurality of openings has the same dimensions.

21. The method of claim 20, wherein the plurality of openings are arranged in an array of 2 × 2, 3 × 3, or 3 × 1.

22. The method of claim 20 wherein the emitter mesa has 4 or more openings.

23. The method of claim 15, wherein each of the plurality of openings is square in shape.

24. The method of claim 15, wherein each of the plurality of openings is in a hexagonal shape.

25. The method of claim 24, wherein each of the plurality of base metals is in a hexagonal shape.

26. The method of claim 15 wherein a ratio of an area of the base mesa to an area of the emitter mesa is less than 1.8.

Technical Field

Aspects of the present disclosure relate generally to heterojunction bipolar transistors and, more particularly, to methods and arrangements for fabricating emitter mesas, base mesas and collector mesas of heterojunction bipolar transistors for RF applications.

Background

A Heterojunction Bipolar Transistor (HBT) is a type of Bipolar Junction Transistor (BJT) that uses different semiconductor materials for the emitter and base regions, thereby creating a heterojunction. The HBT is modified over the BJT so that the HBT can handle very high frequency signals up to hundreds of GHz. HBTs are commonly used in modern ultrafast circuits, primarily Radio Frequency (RF) systems, and in applications requiring high power efficiency, such as RF power amplifiers in cellular telephones.

Conventional heterojunction bipolar transistor layouts arrange the emitters in stripes. However, HBTs using such structures face several challenges. For any given emitter mesa area (set by the required output RF power), the base mesa occupies a large area. A typical ratio of base mesa to emitter mesa area on a conventional HBT unit cell is approximately 2.4. Particularly at high frequencies, the HBT's base-collector junction capacitance (Cbc) is a very critical limiting factor for device performance (e.g., power gain). The larger Cbc from the larger mesa area compromises the power gain and efficiency of the device. HBTs with stripe layouts also take up more space to accommodate the emitter mesa area required to provide a given output power, resulting in large die size and high manufacturing costs.

It would therefore be beneficial to provide an improved HBT structure and an improved method of fabrication that reduces area and improves device performance.

Disclosure of Invention

The following presents a simplified summary of one or more implementations in order to provide a basic understanding of such implementations. This summary is not an extensive overview of all contemplated implementations, and is intended to neither identify key or critical elements of all implementations, nor delineate the scope of any or all implementations. The sole purpose of this summary is to present concepts related to one or more implementations in a simplified form as a prelude to the more detailed description that is presented later.

In one aspect, a Heterojunction Bipolar Transistor (HBT) includes a collector mesa, a base mesa on the collector mesa, and an emitter mesa on the base mesa. The emitter mesa has a plurality of openings. The HBT further comprises a plurality of base metals in a plurality of openings connected to the base mesa.

In another aspect, a method includes providing a wafer with a collector mesa stack, a base mesa stack, and an emitter mesa stack; patterning the emitter mesa stack to define an emitter mesa having a plurality of openings; providing a plurality of base metals in a plurality of openings connected to the base mesa stack; and patterning the base mesa stack to define a base mesa.

To the accomplishment of the foregoing and related ends, the one or more implementations comprise the features hereinafter fully described and particularly pointed out in the claims. The following description and the annexed drawings set forth in detail certain illustrative aspects of the one or more implementations. These aspects are indicative, however, of but a few of the various ways in which the principles of various implementations may be employed and the described implementations are intended to include all such aspects and their equivalents.

Drawings

Figure 1 illustrates a top view of an exemplary HBT having a stripe layout.

Fig. 2 illustrates an exemplary cross-section of fig. 1 along line a-a'.

FIG. 3 illustrates another exemplary cross-section of FIG. 1 along line A-A'.

Figure 4 illustrates an exemplary implementation of an HBT having emitter mesas arranged in a mesh structure according to certain aspects of the present disclosure.

Figure 5 illustrates another exemplary implementation of an HBT having emitter mesas arranged in a mesh structure according to certain aspects of the present disclosure.

Fig. 6 illustrates an exemplary cross-section of fig. 5 along line B-B', in accordance with certain aspects of the present disclosure.

Figure 7 illustrates another exemplary implementation of an HBT having emitter mesas arranged in a mesh structure according to certain aspects of the present disclosure.

Figures 8 a-8 g illustrate an exemplary process flow for fabricating an HBT in accordance with certain aspects of the present disclosure.

Figure 9 illustrates an exemplary method for fabricating an HBT having emitter mesas arranged in a grid structure, according to certain aspects of the present disclosure.

Detailed Description

The detailed description set forth below in connection with the appended drawings is intended as a description of various aspects and is not intended to represent the only aspects in which the concepts described herein may be practiced. The detailed description includes specific details for the purpose of providing an understanding of the various concepts. It will be apparent, however, to one skilled in the art that these concepts may be practiced without these specific details. In some instances, well-known structures and components are shown in block diagram form in order to avoid obscuring such concepts.

The base-collector capacitance (Cbc) of an HBT is a very critical limitation on its power gain, especially at high frequencies. Conventional HBTs typically arrange the emitter mesa in a stripe pattern, resulting in a high Cbc. Figure 1 illustrates a top view of an exemplary HBT having a stripe layout. HBT 100 includes a collector mesa 102 and a base mesa 104 on collector mesa 102. HBT 100 also includes base metal strip 114 on base mesa 104 to provide a connection to the base. An emitter mesa comprised of a plurality of stripes 106 is located on the base mesa 104. To accommodate more base metal or larger emitter mesas, more base metal 114 may be interleaved with emitter mesa stripes 106. Additionally, HBT 100 further comprises a plurality of emitter metals 116 on the plurality of emitter mesa strips 106 to provide electrical connections to the emitter. One or more collector metals 112 are placed on the collector mesa 102 to provide electrical connection to the collector.

FIG. 2 illustrates an exemplary cross-section of FIG. 1 along line A-A'. Cross section 200 includes collector mesa 102, base mesa 104 on collector mesa 102, and emitter mesa 106 on base mesa 104. One or more strips of base metal 114, one or more strips of emitter metal 116, and one or more strips of collector metal 112 are placed (e.g., by a deposition process) on base mesa 104, emitter mesa 106, and collector mesa 102, respectively.

Although each of the collector mesa, base mesa, and emitter mesa are illustrated as a single layer in cross-section 200, it should be understood that each layer may include multiple sub-layers. Figure 3 illustrates an exemplary cross section of an NPN HBT. NPN HBT300 includes collector mesa 302, base mesa 304, and emitter mesa 306. In this example, the collector mesa includes two sublayers: a semi-insulating GaAs substrate 302A and an N + GaAs subcollector 302B. Similarly, in this example, base mesa 304 also includes a plurality of sublayers: the first InGaP etch stop layer 304A, N-GaAs collector 304B, P + GaAs base 304C and the second InGaP etch stop layer 304D. N + GaAs subcollector 302B, first InGaP etch stop layer 304A, and N-GaAs collector 304B form the collector of HBT 300. NPN HBT300 further comprises one or more strips of base metal 314, one or more strips of emitter metal 316, and one or more strips of collector metal 312 respectively disposed (e.g., by a deposition process) on base mesa 304, emitter mesa 306, and collector mesa 302.

The layout and structure shown in fig. 1 has a larger base-collector junction area for any given emitter mesa area (set by the required current output RF power). The resulting larger Cbc affects the power gain and efficiency of the HBT. In accordance with certain aspects of the present disclosure, to reduce the base-collector junction area and Cbc, emitter mesas may be arranged in a grid structure along with associated emitter metal. The openings of the grid may be shaped in a rectangular or hexagonal or other suitable manner. A metal pick-up (pickup) for the HBT base is arranged inside the grid opening. The structure may further comprise an optional base metal ring surrounding the emitter mesh to further reduce the base resistance. The optional base metal provides additional optimization space, trading off the base resistance (Rb) against Cbc. An optional base metal ring interconnects the base metal dots inside the emitter mesh openings. The structure reduces the base mesa area/emitter mesa area ratio to below 1.8. Additionally, the structure achieves over a 25% performance improvement over the structure shown in FIG. 1.

Figure 4 illustrates an exemplary implementation of an HBT having emitter mesas arranged in a mesh structure according to certain aspects of the present disclosure. HBT 400 includes a collector mesa 402, a base mesa 404 on collector mesa 402, and an emitter mesa 406 on base mesa 404. Emitter mesas 406 are arranged in a grid-like structure. Emitter mesa 406 has a plurality of openings 410. The plurality of openings 410 provide windows for placement of a plurality of base metals 414 and connection to base mesa 404. The plurality of base metals 414 are connected and electrically coupled to each other by another metal layer (or layers) (not shown).

The plurality of openings 410 may be any shape, such as square (as shown in fig. 4), rectangular, hexagonal, and the like. Each of the plurality of openings 410 may vary in size and/or shape. The plurality of openings 410 may be the same size and/or the same shape to facilitate design and/or for high packing density. Each of the plurality of openings 410 is large enough to accommodate base metal 414 inside the opening, thereby including the size of each of the plurality of base metals 414 themselves and the necessary spacing between each of the plurality of base metals 414 and emitter mesa 406. Accordingly, the minimum size of the plurality of openings 410 is limited by the process technology used. Similarly, the spacing between one of the plurality of openings 410 and an adjacent one of the plurality of openings 410 is also a design choice where the minimum spacing is limited by the process technology used. However, the spacing may be any size greater than or equal to the minimum allowed by the process technology.

Different applications require different sizes of HBTs. For example, if an HBT is used as a power amplifier, the size of the HBT is selected to meet certain output power requirements. The grid-like emitter mesa structure provides flexibility in selecting the dimensions of the HBT and the arrangement of the collector, base and emitter. The number of openings 310 may vary and may be any integer number. For example, four openings may be arranged in a 2x2 array. There may be more or less than four openings, including 1 opening. The arrangement of the plurality of openings 310 is flexible and is not limited to a square array. Other arrays are possible (such as 2x2, 3x3, or 3x1 arrays, for example). By arranging the emitter mesas of the HBTs in a grid structure (e.g., with a plurality of openings), the packing density can be improved. The base mesa area/emitter mesa area ratio may be reduced to less than 1.8.

HBT 400 further comprises one or more emitter metals (not shown) on emitter mesa 406. The emitter metal may completely or partially cover the emitter mesa 406. HBT 400 also includes one or more collector metals 412 on collector mesa 402 to provide a connection to the collector of HBT 400.

To further reduce the base resistance, an optional base metal may be provided around the emitter mesa. Figure 5 illustrates an exemplary implementation of an HBT in which the emitter mesas of the HBT are arranged in a grid structure with optional base metal surrounding the emitter mesas. HBT 500, like HBT 400, includes a collector mesa 502, a base mesa 504 on collector mesa 502, and an emitter mesa 506 on base mesa 504. The emitter mesas 506 are arranged in a grid-like structure. The emitter mesa 506 has a plurality of openings 510. The plurality of openings 510 provide windows for placement of a plurality of base metals 514 and connection to the base mesa 504. The plurality of base metals 514 are connected by another metal layer (or layers) (not shown) and electrically coupled to each other. An emitter metal (not shown) is on the emitter mesa 506. The emitter metal may completely or partially cover the emitter mesa 506. HBT 500 also includes one or more collector metals 512 on collector mesa 502 to provide a connection to the collector of HBT 500.

Additionally, HBT 500 further comprises optional base metal 524 surrounding emitter mesa 506. The optional base metal 524 may be in the shape of a circular ring (as shown in fig. 5), or may be one or more metal strips (not shown). Optional base metal 524 is an extrinsic base metal outside the grid of emitter mesas. The optional base metal 524 is connected to the plurality of base metals 514 by another metal layer (or layers) (not shown) such that the optional base metal 524 and the plurality of base metals 514 are electrically coupled. Optional base metal 524 results in a lower base resistance (Rb), but may increase Cbc. This provides additional optimization space that can be traded off between Rb and Cbc.

Fig. 6 illustrates an exemplary cross-section along line B-B' of fig. 5, in accordance with certain aspects of the present disclosure. Cross section 600 includes collector mesa 502, base mesa 504 on collector mesa 502, and emitter mesa 506 on base mesa 504. Cross section 600 also includes an optional base metal 524.

Although each of the collector mesa, base mesa, and emitter mesa are illustrated as a single layer in cross-section 600, it should be understood that each layer may include multiple sub-layers, similar to cross-section 300 in fig. 3. For example, in an NPN HBT, collector mesa 502 may comprise an intrinsic or lightly doped GaAs substrate and an N + GaAs subcollector. The collector metal may be connected to the N + GaAs subcollector and electrically coupled to the collector of the HBT. The emitter mesa may include an intrinsic InGaAs sub-layer followed by a lightly N-doped (e.g., 5E17) InGaP layer and a highly N + -doped (e.g., 1E19) InGaAs layer.

Figure 7 illustrates another exemplary implementation of an HBT having emitter mesas arranged in a mesh structure according to certain aspects of the present disclosure. HBT 700 is similar to HBT300 but has a different emitter mesa mesh structure. HBT 700 includes a collector mesa 702, a base mesa 704 on collector mesa 702, and an emitter mesa 706 on base mesa 704. The emitter mesas 706 are arranged in a mesh-like structure. Emitter mesa 706 has a plurality of openings 710. A plurality of openings 710 provide windows for placement of a plurality of base metals 714 and connection to base mesa 704. The plurality of base metals 714 are connected and electrically coupled to each other by another metal layer (or layers) (not shown). An emitter metal (not shown) is on emitter mesa 706. The emitter metal may completely or partially cover the emitter mesa 706. HBT 700 also includes one or more collector metals 712 on collector mesa 702 to provide a connection to the collector of HBT 700.

Unlike emitter mesa 400, in which plurality of openings 410 are square, plurality of openings 710 are hexagonal. The hexagonal shape provides a higher packing density than the square shape, resulting in a smaller area for the HBT at the same output power. In addition to the hexagonal openings, the plurality of base metals 714 may be hexagonal in shape to maximize connection to the base and reduce base resistance.

Similar to HBT in fig. 5 and 6, HBT 700 may include an optional base metal (not shown) surrounding emitter mesa 706. The optional base metal may be in the shape of a circular ring (as shown in fig. 5) or may comprise one or more metal strips. The optional base metal is connected to the plurality of base metals 714 via another metal layer (or layers) (not shown) such that the optional base metal and the plurality of base metals 714 are electrically coupled.

Figures 8 a-8 g illustrate an exemplary process flow for fabricating an HBT. Figure 8a shows a starting wafer with the required epitaxial stack. The wafer includes a collector mesa stack 852, a base mesa stack 854, and an emitter mesa stack 856. The collector mesa stack 852, the base mesa stack 854, and the emitter mesa stack 856 are defined as they are the starting stacks for the collector mesa, the base mesa, and the emitter mesa, respectively, of the HBT. Each of the collector mesa stack 852, the base mesa stack 854, and the emitter mesa stack 856 may include a plurality of sublayers. For example, collector mesa stack 852 includes a layer of semi-insulating substrate 802A (e.g., comprising intrinsic GaAs) and a layer of subcollector 802B (e.g., comprising N + GaAs). Base mesa stack 854 includes a first etch stop layer 804A (e.g., comprising InGaP), a collector layer 804B (e.g., comprising N-GaAs), a base layer 804C (e.g., comprising P + GaAs), and a second etch stop layer 804D (e.g., comprising InGaP). Figure 8b illustrates a portion of the wafer after the placement of the HBT's emitter metal. One or more emitter metals 816 on emitter mesa stack 856 are patterned and defined (e.g., lithographically patterned and etched). Fig. 8c illustrates a portion of the wafer after the emitter mesa is patterned by etching the emitter mesa stack 856. Emitter metal stack 856 is patterned and etched to form the desired pattern as emitter mesa 806. The emitter mesa 806 can be formed in a variety of shapes, including the shapes shown in fig. 4, 5, and 7. In fig. 8d, the base metal 814 is patterned and defined on the base mesa stack 854. The second etch stop layer 804D is patterned and etched such that the base metal 814 contacts the collector layer 804C. Figure 8e illustrates the structure after the base mesa is formed. The base mesa stack 854 is patterned and etched to form the base mesa 804 (including patterning and etching the layers 804A-804D). In fig. 8f, one or more collector metals 812 are patterned and defined on the collector mesa stack 852. Finally, as shown in figure 8g, an implant isolation ring 822 may surround the HBT. The implant isolation ring defines the collector mesa 802 and forms the boundary of the HBT.

Figure 9 illustrates an exemplary method for fabricating an HBT having emitter mesas arranged in a grid structure, according to certain aspects of the present disclosure. The following description of the method 900 and the process flow diagram provided in fig. 9 are merely illustrative examples and are not intended to require or imply that the operations of the various aspects must be performed in the order presented.

HBT fabrication method 900 begins with a wafer having the desired epitaxial stack. At 902, a wafer having a desired epitaxial stack, including a collector mesa stack (e.g., collector mesa stack 852), a base mesa stack (e.g., base mesa stack 854), and an emitter mesa stack (e.g., emitter mesa stack 856) is provided. Each mesa stack may include a plurality of sub-layers. For example, for an NPN HBT, the collector mesa stack may include an intrinsic GaAs semi-insulating substrate layer (e.g., semi-insulating substrate 802A) and an N + GaAs subcollector layer (e.g., subcollector 802B). The base mesa stack can include a first InGaP etch stop layer (e.g., etch stop layer 804A), an N-GaAs collector layer (e.g., collector layer 804B), a P + GaAs base layer (e.g., base layer 804C), and a second InGaP etch stop layer (e.g., etch stop layer 804D).

At 904, one or more emitter metals (e.g., emitter metals 516 or 816) are placed on the emitter mesa stack.

At 906, the emitter mesa is patterned and formed by an appropriate process such as etching. The emitter mesa includes a plurality of openings, for example, a plurality of openings 410, 510, or 710. The plurality of openings may be any shape, such as square (as shown in FIG. 4), rectangular, hexagonal (as shown in FIG. 7), and the like. The size and/or shape of each of the plurality of openings may be different or may be the same. Each of the plurality of openings is large enough to accommodate the base metal (e.g., base metal 414, 514, or 714), including the size of the base metal itself and the necessary spacing between the base metal and the emitter mesa. Therefore, the minimum size of the plurality of openings is limited by the process technology used. Similarly, the spacing between one opening and an adjacent opening is also a design choice and the minimum is limited by the process technology used.

At 908, a plurality of base metals, such as a plurality of base metals 414, 514, or 714, are provided in the plurality of openings. A plurality of base metals are located on the base mesa stack and provide a connection to the base of the HBT. The plurality of base metals may have the same shape as the plurality of openings. The plurality of base metals are connected by another metal layer (or layers) and electrically coupled to each other.

At 910, an optional base metal (extrinsic base metal) (e.g., base metal 524) may be placed on the base mesa stack and connected to the base metal in the plurality of openings. The optional base metal surrounds the emitter mesa and can create a smaller base resistance. The optional base metal is electrically coupled to the plurality of base metals through another metal layer (or layers).

At 912, a base mesa, e.g., base mesa 404, 504, 704, or 804, is patterned and formed by a process such as etching.

At 914, one or more collector metals (e.g., collector metals 412, 512, 712, or 812) are placed on the collector mesa stack.

Furthermore, the collector mesa may be further defined by placing an isolation ring in the collector mesa stack. The isolation ring also forms the boundary of the HBT.

The previous description of the disclosure is provided to enable any person skilled in the art to make or use the disclosure. Various modifications to the disclosure will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other variations without departing from the spirit or scope of the disclosure. Thus, the present disclosure is not intended to be limited to the examples described herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.