阅读说明：本技术 一种高速宽带微波光发射模块 (High-speed broadband microwave light emission module ) 是由 廖传武 王志文 纪超 刘兆东 于 2020-04-19 设计创作，主要内容包括：本发明属于微波光电子应用行业,涉及射频信号转光信号传输,具体涉及一种高速宽带微波光发射模块。该模块包括微波连接端口、模块主体、光电转换芯片、电路板、热电制冷器、光纤连接部分和电路接口；光纤连接部分包括FC/APC连接头和尾纤,尾纤固定到模块主体外壳上,与光电转换芯片连接；光电转换芯片、电路板和热电制冷器设于模块主体内部,光电转换芯片安装在电路板上,电路板位于热电制冷器上。本发明实现高频和宽频微波信号远距离传输,解决了中高频段微波信号的传输。本发明集成了热电制冷系统确保工业级应用,采用了微波转光电信号核心技术实现低损耗超宽带传输,产品性能达到国际先进水平。(The invention belongs to the microwave photoelectron application industry, relates to radio frequency signal-to-light signal transmission, and particularly relates to a high-speed broadband microwave light emitting module. The module comprises a microwave connecting port, a module main body, a photoelectric conversion chip, a circuit board, a thermoelectric refrigerator, an optical fiber connecting part and a circuit interface; the optical fiber connecting part comprises an FC/APC connector and a tail fiber, and the tail fiber is fixed on the module main body shell and connected with the photoelectric conversion chip; the photoelectric conversion chip, the circuit board and the thermoelectric refrigerator are arranged in the module main body, the photoelectric conversion chip is installed on the circuit board, and the circuit board is located on the thermoelectric refrigerator. The invention realizes the long-distance transmission of high-frequency and wide-frequency microwave signals and solves the problem of the transmission of microwave signals in medium and high frequency bands. The invention integrates a thermoelectric refrigeration system to ensure industrial application, adopts the core technology of converting microwave into optical signal to realize low-loss ultra-wideband transmission, and the product performance reaches the international advanced level.)

1. A high-speed broadband microwave light emitting module is characterized by comprising a microwave connecting port (2), a module main body, a photoelectric conversion chip (7), a circuit board, a thermoelectric refrigerator (8), an optical fiber connecting part and a circuit interface (6);

the module main body comprises a bottom plate (4) and a shell, and four corners of the bottom plate (4) are respectively provided with a fixing hole (3) for fixing the whole module main body; the bottom plate (4) is provided with a plurality of circuit interfaces (6) on one side and a microwave connecting port (2) on the other side; the photoelectric conversion chip (7), the circuit board and the thermoelectric refrigerator (8) are positioned in the shell, the photoelectric conversion chip (7) is installed on the circuit board, the thermoelectric refrigerator (8) is fixed on the bottom plate (4), and the circuit board is fixed on the thermoelectric refrigerator (8) to cool the circuit board;

the circuit board comprises a ceramic substrate, a gold-plated circuit, a matching resistor, an inductor and a thermistor; the gold-plated circuit comprises a signal transmission circuit, a bias current loading circuit and a temperature monitoring circuit, wherein the signal transmission circuit and the bias current loading circuit are connected in parallel, and the temperature monitoring circuit is an independent circuit; the signal transmission circuit is used for connecting the microwave connection port (2) and the photoelectric conversion chip (7), and the matching resistor is connected in series in the signal transmission circuit to realize the communication signal transmission function; the bias current loading circuit is used for connecting an inductor and a circuit interface (6), the inductor is connected in the bias current loading circuit in series, and the function of loading the bias current for the photoelectric conversion chip (7) is realized; the temperature monitoring circuit is used for connecting the thermistor and the circuit interface (6) to realize a temperature monitoring function;

the inner end of the microwave connecting port (2) is connected with a signal transmission circuit of the circuit board through a gold wire, and the outer end of the microwave connecting port is connected with external communication equipment to realize signal transmission; the inner end of the circuit interface (6) is connected with the bias current loading circuit and the temperature monitoring circuit of the circuit board through gold wires, and the outer end of the circuit interface is connected with the circuit board of the user side to play a role in power-up;

the optical fiber connecting part comprises an FC/APC connector (1) and a tail fiber (5); the tail fiber (5) penetrates into the shell of the module body and is connected with the photoelectric conversion chip (7), and the FC/APC connector (1) is connected with an optical port of external communication equipment to realize photoelectric conversion.

2. A high-speed broadband microwave optical transmission module according to claim 1, characterized in that the photoelectric conversion chip (7) is a multiple quantum well distributed chip.

Technical Field

The invention belongs to the microwave photoelectron application industry, relates to radio frequency signal-to-light signal transmission, and particularly relates to a high-speed broadband microwave light emitting module.

Background

As an emerging technology, optical fiber communication has a fast development speed in recent years, and a wide application range, which is rare in communication history, is also an important mark of the world new technology revolution and a main transmission tool of various information in the future information society. The low loss and broadband capability of the optoelectronic system are very beneficial to the transmission and processing of microwave signals, and the development of broadband optoelectronic devices will accelerate the application thereof. Microwave photoelectrons have gained high attention from the international academia in nearly 20 years. Many functions which are difficult to realize by microwave, such as ultra-bandwidth, extremely low loss, integration and miniaturization, are possible by introducing the technology of photoelectrons. However, high-frequency microwaves have a large loss when transmitted over a long distance, and the frequency expansion to high frequencies is limited. At present, the main microwave transmission systems in the market are also focused on low-frequency short-distance transmission through cables, and the application range is greatly limited.

Disclosure of Invention

In order to solve the above problems, the present invention provides a high-frequency broadband microwave signal-to-light signal transmitter, which realizes the long-distance transmission of high-frequency and broadband microwave signals, thereby solving the transmission of medium-high frequency band microwave signals.

The technical scheme of the invention is as follows:

a high-speed broadband microwave light emission module comprises a microwave connection port 2, a module main body, a photoelectric conversion chip 7, a circuit board, a thermoelectric refrigerator 8, an optical fiber connection part and a circuit interface 6;

the module main body comprises a bottom plate 4 and a shell, and four corners of the bottom plate 4 are respectively provided with a fixing hole 3 for fixing the whole module main body; one side of the bottom plate 4 is provided with a plurality of circuit interfaces 6, and the other side is provided with a microwave connecting port 2; the photoelectric conversion chip 7, the circuit board and the thermoelectric refrigerator 8 are positioned in the shell, the photoelectric conversion chip 7 is arranged on the circuit board, the thermoelectric refrigerator 8 is fixed on the bottom plate 4, and the circuit board is fixed on the thermoelectric refrigerator 8 so as to cool the circuit board;

the circuit board comprises a ceramic substrate, a gold-plated circuit, a matching resistor, an inductor and a thermistor, and realizes the function of transmitting a communication signal from a microwave connection port to the photoelectric conversion chip; the gold-plated circuit comprises a signal transmission circuit, a bias current loading circuit and a temperature monitoring circuit, wherein the signal transmission circuit and the bias current loading circuit are connected in parallel, and the temperature monitoring circuit is an independent circuit; the signal transmission circuit is used for connecting the microwave connection port 2 and the photoelectric conversion chip 7, and the matching resistor is connected in series in the signal transmission circuit to realize a communication signal transmission function; the bias current loading circuit is used for connecting an inductor and the circuit interface 6, and the inductor is connected in series in the bias current loading circuit to realize the function of loading the bias current for the photoelectric conversion chip 7; the temperature monitoring circuit is used for connecting the thermistor and the circuit interface 6 to realize the temperature monitoring function. The function of transmitting the communication signal from the microwave connection port to the photoelectric conversion chip is realized through the optimized circuit connection relation.

The inner end of the microwave connecting port 2 is connected with a signal transmission circuit of the circuit board through a gold wire, and the outer end of the microwave connecting port is connected with external communication equipment to realize signal transmission; the inner end of the circuit interface 6 is connected with a bias current loading circuit and a temperature monitoring circuit of the circuit board through gold wires, and the outer end of the circuit interface is connected with the circuit board of the user side to play a role of power-up;

the optical fiber connecting part comprises an FC/APC connector 1 and a tail fiber 5; the tail fiber 5 penetrates into the shell of the module body and is connected with the photoelectric conversion chip 7, and the FC/APC connector 1 is connected with an optical port of external communication equipment to realize photoelectric conversion.

The photoelectric conversion chip 7 is a multi-quantum well distributed chip.

The invention has the beneficial effects that:

the invention designs an ultra-wideband microwave light emitting module with the working frequency of 2 GHz-18 GHz by adopting a multi-quantum well distributed feedback laser based on a microwave signal optical fiber transmission (RoF) technology. The gain of-28 dB is satisfied in the whole frequency range, the gain flatness is better than +/-2 dB and the index requirement of input/output standing wave ratio is less than 2, the engineering requirement is met, the application of the digital photoelectronic device in analog communication is realized, and the application range is wide. Wherein part of the indicators are superior to the user requirements and reach and exceed the international first-class level.

The invention solves the technical difficulty that the high-speed broadband microwave signals can only be transmitted in short distance originally, realizes wide microwave signal coverage range and high transmission efficiency and low cost, and forcefully promotes the quick interconnection and intercommunication of related microwave communication industries by transmitting the microwave signals through the optical fibers.

The invention integrates a thermoelectric refrigeration system to ensure industrial application, adopts the core technology of converting microwave into optical signal to realize low-loss ultra-wideband transmission, and the product performance reaches the international advanced level.

Drawings

FIG. 1 is a top view of a high-speed broadband microwave optical transmission module according to the present invention;

fig. 2 is a front view of a high-speed broadband microwave optical transmission module according to the present invention.

In the figure: 1FC/APC connector; 2 microwave connection port; 3, fixing holes; 4, a bottom plate; 5, tail fiber;

6, a circuit interface; 7 photoelectric conversion chip; 8 thermoelectric refrigerator.

Detailed Description

In order to clearly explain the contents of the technical solutions of the present invention, the technical solutions are further described in detail with reference to the accompanying drawings and the detailed description.

As shown in fig. 1 and 2, a high-speed broadband microwave optical transmission module includes a microwave connection port 2, a module main body (a chassis 4 and a housing), a photoelectric conversion chip 7, a circuit board, a thermoelectric refrigerator 8, an optical fiber connection section (an FC/APC connector 1 and a pigtail 5), and a circuit interface 6.

The bottom plate 4 is a rectangular bottom plate, four corners of the bottom plate 4 are respectively provided with a fixing hole 3, the diameter of the fixing hole is 2.70mm, and the fixing hole is used for fixing the whole module main body and is convenient to install and fix; one side of the bottom plate 4 is provided with a circuit interface 6, and the other side is provided with a microwave connecting port 2; the shell can be compatible with the size of a mainstream photoelectric conversion module; the FC/APC connector 1 is connected with an optical port of external communication equipment, and the tail fiber 5 penetrates through the shell of the module body and is connected with the photoelectric conversion chip 7; the circuit board, the photoelectric conversion chip 7 and the thermoelectric refrigerator 8 are arranged in the shell of the module main body, the thermoelectric refrigerator 8 is fixed on the bottom plate 4, the photoelectric conversion chip 7 is installed on the circuit board, and the circuit board is arranged on the thermoelectric refrigerator 8.

The microwave connection port 2 adopts a compatible SMA connector, so that the microwave signal can be conveniently and directly connected. Wherein SMA connector and shell make integrated structure, effectively avoid the not hard up loss or the reflection that leads to the signal in the connection process.

Compatible mainstream photoelectric conversion module size of shell, including bottom plate 4 and shell, fixed orifices 3 are established respectively in 4 four corners of bottom plate, and the diameter of fixed orifices 3 is 2.70 mm.

The photoelectric conversion chip 7 is installed on a ceramic substrate of the circuit board, the circuit board is integrally placed above a thermoelectric cooler (TEC)8, and real-time temperature monitoring and compensation are carried out on the photoelectric conversion chip 7 through a peripheral circuit, so that the photoelectric conversion chip 7 always keeps set temperature working, the photoelectric conversion chip is not influenced by external environment temperature change, and the photoelectric core is guaranteed to work at normal temperature.

The tail fiber 5 is fixed on the shell by adopting laser spot welding, and the joint adopts the FC/APC connector 1, so that the form is convenient, and a user can be conveniently and directly connected to the optical fiber link.

Performance evaluation: the result of the invention meets all indexes and reaches the international first-class level after the user detailed evaluation. The main criteria are described in table 1 below.

TABLE 1 high-speed broadband microwave optical transmission module Performance index