阅读说明：本技术 弹性导线、可拉伸电子产品及弹性导线的制备方法 (Elastic lead, stretchable electronic product and preparation method of elastic lead ) 是由 严鑫洋 于 2020-04-21 设计创作，主要内容包括：本发明提供一种弹性导线、可拉伸电子产品及弹性导线的制备方法。本发明的弹性导线包括基底及部分固定于基底上的导电组件；基底具有至少两个刚性区及至少一个弹性区,刚性区和弹性区交替设置；导电组件包括第一导电元件及第二导电元件,至少两个刚性区包括第一刚性区及第二刚性区,第一导电元件的一端固定于第一刚性区,且自第一刚性区向第二刚性区的方向延伸,第二导电元件的一端固定于第二刚性区,且自第二刚性区向第一刚性区的方向延伸,部分层叠于第一导电元件背离基底的表面,并与第一导电元件电连接；当弹性导线被拉伸时,第一导电元件及第二导电元件向相背方向移动。本发明的弹性导线拉伸率高、阻抗稳定、损耗功率低。(The invention provides an elastic lead, a stretchable electronic product and a preparation method of the elastic lead. The elastic lead comprises a substrate and a conductive component, wherein part of the conductive component is fixed on the substrate; the substrate is provided with at least two rigid areas and at least one elastic area, and the rigid areas and the elastic areas are alternately arranged; the conductive assembly comprises a first conductive element and a second conductive element, the at least two rigid regions comprise a first rigid region and a second rigid region, one end of the first conductive element is fixed on the first rigid region and extends from the first rigid region to the second rigid region, one end of the second conductive element is fixed on the second rigid region and extends from the second rigid region to the first rigid region, and part of the second conductive element is stacked on the surface of the first conductive element, which is far away from the substrate, and is electrically connected with the first conductive element; when the elastic lead is stretched, the first conductive element and the second conductive element move in opposite directions. The elastic lead has high tensile rate, stable impedance and low power loss.)

1. An elastic lead, comprising: the device comprises a substrate and a conductive component partially fixed on the substrate; the substrate is provided with at least two rigid zones and at least one elastic zone, and the rigid zones and the elastic zones are alternately arranged; the conductive assembly comprises a first conductive element and a second conductive element, the at least two rigid regions comprise a first rigid region and a second rigid region, one end of the first conductive element is fixed to the first rigid region, the first conductive element extends from the first rigid region to the second rigid region, one end of the second conductive element is fixed to the second rigid region, the second conductive element extends from the second rigid region to the first rigid region, part of the second conductive element is stacked on the surface, away from the substrate, of the first conductive element, and the first conductive element is electrically connected with the second conductive element; when the elastic lead is stretched, the first conductive element and the second conductive element move in opposite directions.

2. The elastic lead of claim 1, wherein the conductive assembly further comprises a third conductive element overlying the second conductive element; a third conductive element is slidable relative to the second conductive element, the third conductive element configured to conduct the first conductive element and the second conductive element when the first conductive element and the second conductive element move in opposite directions.

3. The elastic lead of claim 2, further comprising an elastic member; the elastic member seals a portion of the first conductive element, a portion of the second conductive element, and the third conductive element between the substrate and the elastic member.

4. The elastic lead according to claim 2, wherein the first conductive element comprises a first substrate and a first lead, one end of the first substrate is fixed to the first rigid region, the first substrate extends from the first rigid region to the second rigid region, and the first lead is disposed on a surface of the first substrate facing away from the base; the second conductive element comprises a second substrate and a second lead, one end of the second substrate is fixed in the second rigid area, the second substrate extends from the second rigid area to the first rigid area, the second lead is arranged on the surface of the second substrate at least departing from the base, and the first lead and the second lead are partially laminated; the third conductive element comprises a third substrate and a third conductive wire, wherein the third conductive wire is arranged on the surface, facing the base, of the third substrate and is used for conducting the first conductive wire and the second conductive wire when the first conductive wire and the second conductive wire move in opposite directions.

5. The elastic lead according to claim 1, wherein the first conductive element comprises a first substrate and a first lead, one end of the first substrate is fixed to the first rigid region, the first substrate extends from the first rigid region to the second rigid region, and the first lead is disposed on a surface of the first substrate facing away from the base; the second conductive element comprises a second substrate and a second lead, one end of the second substrate is fixed in the second rigid area, the second substrate extends from the second rigid area to the first rigid area, the second lead is arranged on the surface, facing the base, of the second substrate, and the first lead and the second lead are at least partially laminated.

6. The elastic lead according to claim 4 or 5, wherein the length of the overlapping portion of the first lead and the second lead is 10% or more of the distance between the first rigid region and the second rigid region.

7. The spring wire of claim 4 or 5 wherein the first wire element further comprises a first conductive contact electrically connected to the first wire, the first conductive contact being located on a surface of the first substrate facing away from the base for electrically connecting an electronic component.

8. The spring wire of claim 4 or 5 wherein the second wire element further comprises a second conductive contact electrically connected to the second wire, the second conductive contact being located on a surface of the second substrate facing away from or toward the base for electrically connecting an electronic component.

9. The elastic lead according to claim 4, wherein the first lead has a width of 1mm to 10mm and a thickness of 50 μm to 500 μm; the width of the second conducting wire is 1mm-10mm, and the thickness of the second conducting wire is 50 μm-500 μm; the width of the third conducting wire is 1mm-10mm, and the thickness of the third conducting wire is 50 μm-500 μm.

10. A stretchable electronic product comprising the elastic conductive wire according to any one of claims 1 to 9.

11. A method for preparing an elastic lead is characterized by comprising the following steps:

preparing a substrate comprising at least two rigid zones and at least one elastic zone arranged alternately; the at least two rigid regions comprise a first rigid region and a second rigid region;

preparing a conductive assembly, wherein the conductive assembly comprises a first conductive element, a second conductive element and a third conductive element;

fixing one end of the first conductive element to a first rigid region, extending the first conductive element from the first rigid region to the second rigid region, fixing one end of a second conductive element to a second rigid region, extending the second conductive element from the second rigid region to the first rigid region, partially laminating the first conductive element on the surface of the substrate away from the substrate, and electrically connecting the first conductive element and the second conductive element;

stacking the third conductive element on a surface of the second conductive element facing away from the substrate;

preparing an elastic member to seal a portion of the first conductive element, a portion of the second conductive element, and the third conductive element between the substrate and the elastic member.

Technical Field

The invention relates to the field of conductive cables, in particular to an elastic lead, a stretchable electronic product and a preparation method of the elastic lead.

Background

The existing elastic lead applied to high-stretching-rate electronic products mainly has two schemes, one scheme is that a stretchable nano-silver conductive circuit is directly printed on an elastic substrate, and an electronic element is fixed on the conductive circuit to realize stretchable conductive connection; however, the nano-silver wire is stretched along with the stretching of the elastic substrate, so that the nano-silver conductive circuit has extremely unstable impedance and poor reliability, and when the circuit is stretched, the circuit is easily broken due to large impedance change. The other scheme is that a liquid metal conducting circuit is packaged in an elastic substrate, a solid contact electrode is arranged on the liquid metal circuit, and an electronic element is fixed on the contact electrode to realize stretchable conducting connection. Therefore, there is a need for an elastic wire with constant or small change in wire impedance during stretching and simple manufacturing process.

Disclosure of Invention

In view of the above, embodiments of the present invention provide an elastic conductive wire, which has a high stretch ratio, and when stretched, the conductive wire has stable impedance and low power loss.

In addition, the invention also provides a stretchable electronic product.

In addition, the invention also provides a preparation method of the elastic lead.

The embodiment of the invention provides an elastic lead, which comprises: the device comprises a substrate and a conductive component partially fixed on the substrate; the substrate is provided with at least two rigid zones and at least one elastic zone, and the rigid zones and the elastic zones are alternately arranged; the conductive assembly comprises a first conductive element and a second conductive element, the at least two rigid regions comprise a first rigid region and a second rigid region, one end of the first conductive element is fixed to the first rigid region, the first conductive element extends from the first rigid region to the second rigid region, one end of the second conductive element is fixed to the second rigid region, the second conductive element extends from the second rigid region to the first rigid region, part of the second conductive element is stacked on the surface, away from the substrate, of the first conductive element, and the first conductive element is electrically connected with the second conductive element; when the elastic lead is stretched, the first conductive element and the second conductive element move in opposite directions.

Further, the conductive assembly further comprises a third conductive element stacked on the second conductive element; a third conductive element is slidable relative to the second conductive element, the third conductive element configured to conduct the first conductive element and the second conductive element when the first conductive element and the second conductive element move in opposite directions.

Further, the elastic lead also comprises an elastic piece; the elastic member seals a portion of the first conductive element, a portion of the second conductive element, and the third conductive element between the substrate and the elastic member.

Further, the first conductive element includes a first substrate and a first conductive line, one end of the first substrate is fixed to the first rigid region, the first substrate extends from the first rigid region to the second rigid region, and the first conductive line is disposed on a surface of the first substrate away from the base; the second conductive element comprises a second substrate and a second lead, one end of the second substrate is fixed in the second rigid area, the second substrate extends from the second rigid area to the first rigid area, the second lead is arranged on the surface of the second substrate at least departing from the base, and the first lead and the second lead are partially laminated; the third conductive element comprises a third substrate and a third conductive wire, wherein the third conductive wire is arranged on the surface, facing the base, of the third substrate and is used for conducting the first conductive wire and the second conductive wire when the first conductive wire and the second conductive wire move in opposite directions.

Further, the first conductive element includes a first substrate and a first conductive line, one end of the first substrate is fixed to the first rigid region, the first substrate extends from the first rigid region to the second rigid region, and the first conductive line is disposed on a surface of the first substrate away from the base; the second conductive element comprises a second substrate and a second lead, one end of the second substrate is fixed in the second rigid area, the second substrate extends from the second rigid area to the first rigid area, the second lead is arranged on the surface, facing the base, of the second substrate, and the first lead and the second lead are at least partially laminated.

Further, the length of the overlapping portion of the first lead and the second lead is 10% or more of the distance between the first rigid region and the second rigid region.

Further, the first lead element further comprises a first conductive contact electrically connected with the first lead, and the first conductive contact is located on the surface of the first substrate, which faces away from the base, and is used for electrically connecting the electronic component.

Further, the second lead element further comprises a second conductive contact electrically connected with the second lead, and the second conductive contact is located on the surface of the second substrate facing away from or facing the base and used for electrically connecting the electronic component.

Further, the width of the first conducting wire is 1mm-10mm, and the thickness of the first conducting wire is 50 μm-500 μm; the width of the second conducting wire is 1mm-10mm, and the thickness of the second conducting wire is 50 μm-500 μm; the width of the third conducting wire is 1mm-10mm, and the thickness of the third conducting wire is 50 μm-500 μm.

The embodiment of the invention also provides a stretchable electronic product which comprises the elastic lead.

The embodiment of the invention also provides a preparation method of the elastic lead, which comprises the following steps:

preparing a substrate comprising at least two rigid zones and at least one elastic zone arranged alternately; the at least two rigid regions comprise a first rigid region and a second rigid region;

preparing a conductive assembly, wherein the conductive assembly comprises a first conductive element, a second conductive element and a third conductive element;

fixing one end of the first conductive element to a first rigid region, extending the first conductive element from the first rigid region to the second rigid region, fixing one end of a second conductive element to a second rigid region, extending the second conductive element from the second rigid region to the first rigid region, partially laminating the first conductive element on the surface of the substrate away from the substrate, and electrically connecting the first conductive element and the second conductive element;

stacking the third conductive element on a surface of the second conductive element facing away from the substrate;

preparing an elastic member to seal a portion of the first conductive element, a portion of the second conductive element, and the third conductive element between the substrate and the elastic member.

Therefore, the elastic lead comprises a substrate with two rigid areas and at least one elastic area, and a first conductive element and a second conductive element which are arranged on the substrate and respectively fixed on the first rigid area and the second rigid area, wherein the first conductive element and the second conductive element are partially overlapped and electrically connected. When the elastic lead is stretched, the first rigid region and the second rigid region move in the opposite directions, the elastic region is stretched, so that the first conductive element and the second conductive element are driven to move in the opposite directions, the first conductive element and the second conductive element are always electrically connected, the elastic region can ensure that the elastic lead has higher stretching rate, and in addition, because the widths of the first conductive element and the second conductive element are unchanged during stretching, the impedance of the elastic lead is stable, and the power loss is low.

Drawings

To more clearly illustrate the structural features and effects of the present invention, a detailed description is given below with reference to the accompanying drawings and specific embodiments.

Fig. 1 is a schematic view of an overall structure of an elastic lead according to an embodiment of the present invention.

Fig. 2 is a schematic diagram of an exploded structure of the elastic lead wire of the embodiment of fig. 1 of the present invention.

Fig. 3 is a schematic diagram of an exploded structure of an elastic wire according to still another embodiment of the present invention.

Fig. 4 is a schematic diagram of an exploded structure of an elastic wire according to still another embodiment of the present invention.

Fig. 5 is a schematic view of another direction of the elastic lead according to the embodiment of fig. 4.

Fig. 6 is an exploded view of an elastic lead according to an embodiment of the present invention.

Fig. 7 is a schematic view of another direction of the elastic lead according to the embodiment of fig. 6 of the present invention.

Fig. 8 is an exploded view of a stretchable electronic product according to an embodiment of the present invention.

Fig. 9 is an exploded view of a stretchable electronic product according to an embodiment of the present invention.

Fig. 10 is an exploded view of a stretchable electronic product according to another embodiment of the present invention.

DETAILED DESCRIPTION OF EMBODIMENT (S) OF INVENTION

The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, shall fall within the scope of protection of the present invention.

Referring to fig. 1 and fig. 2, an elastic lead 100 according to an embodiment of the present invention includes: a substrate 10 and a conductive element 30 partially fixed on the substrate 10. The substrate 10 has at least two rigid regions 11 and at least one elastic region 13, and the rigid regions 11 and the elastic regions 13 are alternately arranged. The conductive assembly 30 includes a first conductive element 31 and a second conductive element 33, the at least two rigid regions 11 include a first rigid region 11a and a second rigid region 11b, one end of the first conductive element 31 is fixed to the first rigid region 11a, the first conductive element 31 extends from the first rigid region 11a to the second rigid region 11b, one end of the second conductive element 33 is fixed to the second rigid region 11b, the second conductive element 33 extends from the second rigid region 11b to the first rigid region 11a, and is partially laminated on the surface of the first conductive element 31 facing away from the substrate 10 and electrically connected to the first conductive element 31; when the elastic lead 100 is stretched, the first conductive element 31 and the second conductive element 33 move in opposite directions.

Specifically, the substrate 10 may be formed by stepwise curing using monomers of a rigid polymer and monomers of an elastic polymer. In one embodiment, the rigid region 11 may be formed by polymerizing Polydimethylsiloxane (PDMS), and the elastic region 13 may be formed by polymerizing silicone monomers. It should be understood that the rigid region 11 of the present invention can also be made by polymerizing other monomers of polymers that are rigid after polymerization, or by using rigid materials other than polymers. The elastic region 13 of the substrate 10 of the present invention may also be made of other polymeric monomers that are polymerized to be elastic, and may also be composed of other elastic structures having greater elongation. The present invention is not particularly limited with respect to the specific composition and material of the rigid region 11 and the elastic region 13.

The term "rigid polymer" as used herein means a polymer which is rigid in the material produced by polymerizing monomers.

The term "elastomeric polymer" as used herein refers to a polymer which is elastomeric in the material produced by the polymerization of the monomers.

Specifically, the number of the rigid regions 11 and the elastic regions 13 alternately disposed on the substrate 10 may be adjusted according to the length of the elastic wire 100. In addition, the crosslinking density of the elastic region 13 may be adjusted according to the elongation rate required in the use environment of the elastic conductive wire 100, so as to change the elongation rate of the elastic region 13.

Specifically, in some embodiments, the elastic lead 100 includes at least one set of conductive elements 30, and when there are at least two sets of conductive elements 30, the sets of conductive elements 30 are electrically connected.

In some embodiments, the elastic lead 100 further comprises an elastic member 50; the elastic member 50 seals a portion of the first conductive element 31 and a portion of the second conductive element 33 between the substrate 10 and the elastic member 50. The elastic member 50 may serve as an insulation function and may also make the connection between the first conductive element 31 and the second conductive element 33 more stable.

The elastic conductive wire 100 of the present invention includes a substrate 10 having two rigid regions 11 and at least one elastic region 13, and a first conductive element 31 and a second conductive element 33 disposed on the substrate 10 and respectively fixed to the first rigid region 11a and the second rigid region 11b, wherein the first conductive element 31 and the second conductive element 33 are partially overlapped and electrically connected. When the elastic lead 100 is stretched, the first rigid region 11a and the second rigid region 11b move in opposite directions, and the elastic region 13 is stretched, so as to drive the first conductive element 31 and the second conductive element 33 to move in opposite directions, and the first conductive element 31 and the second conductive element 33 are electrically connected all the time, and the elastic region 13 can ensure that the elastic lead 100 has a high stretching ratio, and in addition, when the first conductive element 31 and the second conductive element 33 move in opposite directions, the conductive elements are not thinned due to stretching like a liquid lead, so that the impedance of the elastic lead 100 is stable, and the power loss is low.

Referring to fig. 3, the embodiment of fig. 3 is different from the embodiment of fig. 1 in that the conductive assembly 30 of the embodiment of fig. 3 further includes a third conductive element 35 stacked on the second conductive element 33. A third conductive element 35 is slidable relative to the second conductive element 33, the third conductive element 35 being configured to conduct the first conductive element 31 and the second conductive element 33 when the first conductive element 31 and the second conductive element 33 are moved in opposite directions. The third conductive element 35 is disposed on the second conductive element 33, and when the first conductive element 31 and the second conductive element 33 move in opposite directions and are separated from each other, the third conductive element 35 can also conduct the first conductive element 31 and the second conductive element 33, so as to increase the stretch ratio of the elastic lead 100, and further increase the stability of conducting the first conductive element 31 and the second conductive element 33.

In some embodiments, the elastic lead 100 further comprises an elastic member 50; the elastic member 50 seals a portion of the first conductive element 31, a portion of the second conductive element 33, and a portion of the third conductive element 35 between the substrate 10 and the elastic member 50. The elastic member 50 can perform an insulating function and can also make the connection between the first conductive element 31, the second conductive element 33 and the third conductive element 35 more stable.

For the description of the same parts in the embodiment of fig. 1, please refer to the embodiment of fig. 1, which is not repeated herein.

Referring to fig. 4 and 5, in other embodiments, the elastic lead 100 according to an embodiment of the present invention includes: a substrate 10 and a conductive element 30 partially fixed on the substrate 10. The substrate 10 has at least two rigid regions 11 and at least one elastic region 13, and the rigid regions 11 and the elastic regions 13 are alternately arranged. The conductive assembly 30 includes a first conductive element 31 and a second conductive element 33, the at least two rigid regions 11 include a first rigid region 11a and a second rigid region 11b, one end of the first conductive element 31 is fixed to the first rigid region 11a, the first conductive element 31 extends from the first rigid region 11a to the second rigid region 11b, one end of the second conductive element 33 is fixed to the second rigid region 11b, the second conductive element 33 extends from the second rigid region 11b to the first rigid region 11a, and is partially laminated on the surface of the first conductive element 31 facing away from the substrate 10 and electrically connected to the first conductive element 31; when the elastic lead 100 is stretched, the first conductive element 31 and the second conductive element 33 move in opposite directions.

Specifically, the first conductive element 31 includes a first substrate 311 and a first conductive line 313, one end of the first substrate 311 is fixed to the first rigid region 11a, the first substrate 311 extends from the first rigid region 11a to the second rigid region 11b, and the first conductive line 313 is disposed on a surface of the first substrate 311 away from the base 10. The second conductive element 33 includes a second substrate 331 and a second conductive line 333, one end of the second substrate 331 is fixed to the second rigid region 11b, the second substrate 331 extends from the second rigid region 11b to the first rigid region 11a, the second conductive line 333 is disposed on a surface of the second substrate 331 facing the base 10, and the first conductive line 313 and the second conductive line 333 are at least partially stacked. This makes it possible to make the first conductive element 31 and the second conductive element 33 conductive and to make them conductive at a constant elongation.

In some embodiments, the length of the overlapping portion of the first conductive line 313 and the second conductive line 333 is 10% or more of the distance between the first rigid region 11a and the second rigid region 11 b. Specifically, the length of the overlapping portion of the first conductive line 313 and the second conductive line 333 is 10%, 20%, 30%, 40%, 50%, 60%, 70%, 80%, 90%, or 100% of the distance between the first rigid region 11a and the second rigid region 11 b. This allows the elastic conductive wire 100 to have a high elongation rate while the first conductive member 31 and the second conductive member 33 are conducted at the high elongation rate.

In some embodiments, the first conductive element 31 and the second conductive element 33 overlap by a length commensurate with the magnitude of the elastic region 13 being stretchable. Therefore, the situation that when the stretch ratio of the elastic region 13 is too large and the overlapping length of the first conductive element 31 and the second conductive element 33 is too small, the first conductive element 31 and the second conductive element 33 are separated to cause an open circuit can be avoided.

In some embodiments, the first conductive line 313 has a width of 1mm to 10mm and a thickness of 50 μm to 500 μm. That is, the width of the first conductive line 313 may be any value between 1mm and 10mm, for example: 1mm, 2mm, 3mm, 4mm, 5mm, 6mm, 7mm, 8mm, 9mm, or 10mm, etc. The thickness of the first conductive line 313 may be any number between 50 μm and 500 μm, for example: 50 μm, 80 μm, 100 μm, 150 μm, 200 μm, 250 μm, 300 μm, 350 μm, 4000 μm, 450 μm, or 500 μm, or the like.

In some embodiments, the second wire 333 has a width of 1mm to 10mm and a thickness of 50 μm to 500 μm. That is, the width of the second wire 333 may be any value between 1nm and 10nm, for example: 1mm, 2mm, 3mm, 4mm, 5mm, 6mm, 7mm, 8mm, 9mm, or 10mm, etc. The thickness of the second wire 333 may be any number between 50 μm and 500 μm, for example: 50 μm, 80 μm, 100 μm, 150 μm, 200 μm, 250 μm, 300 μm, 350 μm, 4000 μm, 450 μm, or 500 μm, or the like.

In some embodiments, the first lead element 31 further includes a first conductive contact 315 electrically connected to the first lead 313, and the first conductive contact 315 is located on a surface of the first substrate 311 facing away from the base 10 for electrically connecting electronic components.

In some embodiments, the second lead element 33 further comprises a second conductive contact 335 electrically connected to the second lead 333, the second conductive contact 335 being located on a surface of the second substrate 331 facing away from or towards the base 10 for electrically connecting electronic components.

In some embodiments, the first and second conductive contacts 315, 335 are used to electrically connect and provide a sensor, a communication module, a power module, a control module, a memory module, or other electronic component.

In some embodiments, the elastic lead 100 further comprises an elastic member 50; the elastic member 50 seals a portion of the first conductive element 31 and a portion of the second conductive element 33 between the substrate 10 and the elastic member 50. The elastic member 50 can perform an insulating function and can also make the connection between the first conductive element 31 and the second conductive element 33 more stable.

In some embodiments, when at least one of the first and second conductive contacts 315 and 335 is provided with an electronic component, the elastic member 50 may also encapsulate the electronic component provided on the first and second conductive contacts 315 and 335 together between the elastic member 50 and the substrate 10.

For the description of the same parts in the above embodiments, please refer to the above embodiments, which are not described herein again.

Referring to fig. 6 and 7, in other embodiments, the elastic lead 100 according to an embodiment of the present invention includes: a substrate 10 and a conductive element 30 partially fixed on the substrate 10. The substrate 10 has at least two rigid regions 11 and at least one elastic region 13, and the rigid regions 11 and the elastic regions 13 are alternately arranged. The conductive assembly 30 includes a first conductive element 31 and a second conductive element 33, the at least two rigid regions 11 include a first rigid region 11a and a second rigid region 11b, one end of the first conductive element 31 is fixed to the first rigid region 11a, the first conductive element 31 extends from the first rigid region 11a to the second rigid region 11b, one end of the second conductive element 33 is fixed to the second rigid region 11b, the second conductive element 33 extends from the second rigid region 11b to the first rigid region 11a, and is partially laminated on the surface of the first conductive element 31 facing away from the substrate 10 and electrically connected to the first conductive element 31; when the elastic lead 100 is stretched, the first conductive element 31 and the second conductive element 33 move in opposite directions. The conductive assembly 30 further includes a third conductive element 35 stacked on the second conductive element 33. A third conductive element 35 is slidable relative to the second conductive element 33, the third conductive element 35 being configured to conduct the first conductive element 31 and the second conductive element 33 when the first conductive element 31 and the second conductive element 33 are moved in opposite directions.

Specifically, the first conductive element 31 includes a first substrate 311 and a first conductive line 313, one end of the first substrate 311 is fixed to the first rigid region 11a, the first substrate 311 extends from the first rigid region 11a to the second rigid region 11b, and the first conductive line 313 is disposed on a surface of the first substrate 311 away from the base 10.

In some embodiments, the first conductive line 313 has a width of 1mm to 10mm and a thickness of 50 μm to 500 μm. That is, the width of the first conductive line 313 may be any value between 1mm and 10mm, for example: 1mm, 2mm, 3mm, 4mm, 5mm, 6mm, 7mm, 8mm, 9mm, or 10mm, etc. The thickness of the first conductive line 313 may be any number between 50 μm and 500 μm, for example: 50 μm, 80 μm, 100 μm, 150 μm, 200 μm, 250 μm, 300 μm, 350 μm, 4000 μm, 450 μm, or 500 μm, or the like.

In some embodiments, the first lead element 31 further includes a first conductive contact 315 electrically connected to the first lead 313, and the first conductive contact 315 is located on a surface of the first substrate 311 facing away from the base 10 for electrically connecting electronic components.

Specifically, the second conductive element 33 includes a second substrate 331 and a second conductive line 333, one end of the second substrate 331 is fixed to the second rigid region 11b, the second substrate 331 extends from the second rigid region 11b to the first rigid region 11a, the second conductive line 333 is disposed on at least a surface of the second substrate 331 away from the base 10, and the first conductive line 313 and the second conductive line 333 are partially stacked. Specifically, in some embodiments, the second conductive line 333 may be disposed on a surface of the second substrate 331 facing away from the base 10, and the second conductive line 333 may also be disposed on a surface of the second substrate 331 facing towards and facing away from the base 10.

In some embodiments, the second wire 333 has a width of 1mm to 10mm and a thickness of 50 μm to 500 μm. That is, the width of the second wire 333 may be any value between 1nm and 10nm, for example: 1mm, 2mm, 3mm, 4mm, 5mm, 6mm, 7mm, 8mm, 9mm, or 10mm, etc. The thickness of the second wire 333 may be any number between 50 μm and 500 μm, for example: 50 μm, 80 μm, 100 μm, 150 μm, 200 μm, 250 μm, 300 μm, 350 μm, 4000 μm, 450 μm, or 500 μm, or the like.

In some embodiments, the second lead element 33 further comprises a second conductive contact 335 electrically connected to the second lead 333, the second conductive contact 335 being located on a surface of the second substrate 331 facing away from the base 10 for electrically connecting electronic components.

Specifically, the third conductive element 35 includes a third substrate 351 and a third conductive line 353, and the third conductive line 353 is disposed on a surface of the third substrate 351 facing the base 10 and is used for conducting the first conductive line 313 and the second conductive line 333 when the first conductive line 313 and the second conductive line 333 move in opposite directions.

In some embodiments, the third conductive lines 353 have a width of 1mm to 10mm and a thickness of 50 μm to 500 μm. That is, the width of the third wire 353 may be any value between 1nm and 10nm, for example: 1mm, 2mm, 3mm, 4mm, 5mm, 6mm, 7mm, 8mm, 9mm, or 10mm, etc. The thickness of the third conductive line 353 may be any number between 50 μm and 500 μm, for example: 50 μm, 80 μm, 100 μm, 150 μm, 200 μm, 250 μm, 300 μm, 350 μm, 4000 μm, 450 μm, or 500 μm, or the like.

In some embodiments, the elastic lead 100 further comprises an elastic member 50; the elastic member 50 seals a portion of the first conductive element 31, a portion of the second conductive element 33, and a portion of the third conductive element 35 between the substrate 10 and the elastic member 50. The elastic member 50 can perform an insulating function and can also make the connection between the first conductive element 31, the second conductive element 33 and the third conductive element 35 more stable.

For the description of the same parts in the above embodiments, please refer to the above embodiments, which are not described herein again.

Referring to fig. 8, an embodiment of the invention further provides a stretchable electronic product 200 including the elastic lead 100 according to the above embodiment of the invention.

Referring to fig. 9, fig. 9 is a stretchable electronic product 200 according to an embodiment of the present invention, which includes a first electronic component 210, a second electronic component 230, and a third electronic component 250 of the elastic lead 100 according to the above embodiment of the present invention. The elastic wire 100 includes: a substrate 10 and two sets of conductive elements 30 partially fixed on the substrate 10. The substrate 10 includes three rigid regions 11 and four elastic regions 13 alternately arranged. The two sets of conductive elements 30 are a first set of conductive elements and a second set of conductive elements, respectively. The first set of conductive components and the second set of conductive components are electrically connected. The first and second sets of conductive components each include a first conductive element 31, a second conductive element 33, and a third conductive element 35. The second conductive element 33 of the first set of conductive elements shares a substrate with the first conductive element 31 of the second set of conductive elements. The first wires 313 of the two sets of wire assemblies 30 are disposed on the surface of the first substrate 311 facing away from the base 10, the second wires 333 are disposed on the surface of the second substrate 331 facing away from the base 10, and the third wires 353 are disposed on the surface of the third substrate 351 facing the base 10. The first electronic component 210 is disposed on a surface of the first substrate 311 of the first group of conductive elements facing away from the base 10, and is electrically connected to the first conductive line 313 of the first group of conductive elements. The second electronic component 230 is disposed on a surface of the second substrate 331 of the first group of conductive elements, which faces away from the base 10, and is electrically connected to the second conductive lines 313 of the first group of conductive elements and the first conductive lines 313 of the second group of conductive elements, respectively. The third electronic component 250 is disposed on the surface of the second substrate 331 of the second set of conductive elements facing away from the base 10, and is electrically connected to the second conductive lines 333 of the second set of conductive elements.

Specifically, the first electronic component 210, the second electronic component 230, and the third electronic component 250 may be, but not limited to, chips such as a sensor, a communication module, a power module, a control module, a memory module, or other electronic components.

Specifically, the electronic product 200 includes, but is not limited to, stretchable wrist bands, bracelets, clothing, or other products that can be health and motion detected, etc.

Referring to fig. 10, a stretchable electronic product 200 according to another embodiment of the present invention includes the elastic lead 100, the first electronic component 210, the second electronic component 230, and the third electronic component 250 according to the above embodiment of the present invention. The elastic wire 100 includes: a substrate 10 and two sets of conductive elements 30 partially fixed on the substrate 10. The substrate 10 includes three rigid regions 11 and four elastic regions 13 alternately arranged. The two sets of conductive elements 30 are a first set of conductive elements and a second set of conductive elements, respectively. The first set of conductive components and the second set of conductive components are electrically connected. The first and second sets of conductive components each include a first conductive element 31, a second conductive element 33, and a third substrate 351. The second conductive element 33 of the first set of conductive elements shares a common substrate with the second conductive element 33 of the second set of conductive elements. The first conductive wires 313 of the two sets of conductive wire assemblies 30 are disposed on the surface of the first substrate 311 facing away from the base 10, and the second conductive wires 333 are disposed on the surface of the second substrate 331 facing towards the base 10. The first electronic component 210 is disposed on a surface of the first substrate 311 of the first group of conductive elements facing away from the base 10, and is electrically connected to the first conductive line 313 of the first group of conductive elements. The second electronic component 230 is disposed on the surface of the second substrate 331 of the first group of conductive elements facing the base 10, and is electrically connected to the second conductive lines 313 of the first group of conductive elements and the first conductive lines 313 of the second group of conductive elements, respectively. The third electronic component 250 is disposed on the surface of the second substrate 331 of the second set of conductive elements facing the base 10, and is electrically connected to the second conductive line 333 of the second set of conductive elements.

Specifically, the first electronic component 210, the second electronic component 230, and the third electronic component 250 may be, but not limited to, chips such as a sensor, a communication module, a power module, a control module, a memory module, or other electronic components.

Specifically, the electronic product 200 includes, but is not limited to, stretchable wrist bands, bracelets, clothing, or other products that can be health and motion detected, etc.

The embodiment of the invention also provides a preparation method of the elastic lead, which comprises the following steps:

s301, preparing a substrate 10, wherein the substrate 10 includes at least two rigid regions 11 and at least one elastic region 13 alternately arranged; the at least two rigid regions 11 include a first rigid region 11a and a second rigid region 11 b;

specifically, the substrate 10 is obtained by performing a step-curing process using a monomer of a rigid polymer and a monomer of an elastic polymer, and more specifically, a rigid region 11 is formed by performing a polymerization process using Polydimethylsiloxane (PDMS), and a silicone elastic region 13 is formed by performing a polymerization process using a silicone monomer. It should be understood that the rigid region 11 of the present invention can also be made by polymerizing other monomers of polymers that are rigid after polymerization, or by using rigid materials other than polymers. The elastic region 13 of the substrate 10 of the present invention may also be made of other polymeric monomers that are polymerized to be elastic, and may also be composed of other elastic structures having greater elongation. The present invention is not particularly limited with respect to the specific composition and material of the rigid region 11 and the elastic region 13.

S302, preparing a conductive assembly 30, wherein the conductive assembly 30 comprises a first conductive element 31 and a second conductive element 33;

specifically, the first conductive element 31 is obtained by preparing the first conductive line 313 and the first conductive contact 315 on the first substrate 311 by printing, plating, spin coating, electroplating, or the like. The second conductive element 33 is obtained by preparing a second conductive line 333 and a second conductive contact 335 on the second substrate 331 by printing, plating, spin coating, plating, or the like.

In some embodiments, the first substrate 311 and the second substrate 331 are non-stretchable flexible materials that can withstand high temperatures above 150 °, such as polyethylene terephthalate (PET), Polyimide (PI), and the like. In some embodiments, the first conductive line 313 and the first conductive contact 315 are made of nano-silver paste. The nano silver glue is a material formed by mixing nano silver and glue.

In some embodiments, the conductive assembly 30 further includes a third conductive element 35; at this time, the preparing the conductive assembly 30 further includes preparing a third conductive element 35.

Specifically, the third conductive element 35 is obtained by preparing the third wire 353 on the third substrate 351 by printing, plating, spin coating, electroplating, or the like.

S303, fixing one end of the first conductive element 31 to the first rigid region 11a, wherein the first conductive element 31 extends from the first rigid region 11a to the second rigid region 11b, fixing one end of the second conductive element 33 to the second rigid region 11b, wherein the second conductive element 33 extends from the second rigid region 11b to the first rigid region 11a, and is partially laminated on the surface of the first conductive element 31 facing away from the substrate 10, and is electrically connected to the first conductive element 31.

Specifically, the first conductive element 31 and the second conductive element 33 may be fixed by glue, and more specifically, may be fixed by high temperature curing glue. The term "high temperature curing glue" refers to glue that can be cured by chemical reaction, such as polymerization, under high temperature conditions.

When the conductive assembly 30 further includes a third conductive element 35, step S303 further includes stacking the third conductive element 35 on a surface of the second conductive element 33 facing away from the substrate 10.

Specifically, the third conductive element 35 obtained in step S302 is directly stacked on the surface of the second conductive element 33 facing away from the substrate 10. More specifically, the third conductive member 35 is stacked at a position opposite to the second wire 333.

In some embodiments, the method of making an elastic lead of the present invention further comprises:

s304, preparing an elastic member 50 to seal a portion of the first conductive element 31, a portion of the second conductive element 33, and a portion of the third conductive element 35 between the substrate 10 and the elastic member 50.

Specifically, the elastic member 50 is prepared on a side of the third conductive element 35 facing away from the substrate 10, so as to encapsulate the first conductive wire 313, the second conductive wire 333, and the third conductive wire 335 between the substrate 10 and the elastic member 50, exposing the first conductive contact 315 and the first conductive contact 335.

In some embodiments, the material of the elastic member 50 may be, but is not limited to, an elastic material such as silicone. The elastic member 50 may be prepared by various coating processes such as spin coating and spray coating.

While the invention has been described with reference to specific embodiments, the invention is not limited thereto, and various equivalent modifications and substitutions can be easily made by those skilled in the art within the technical scope of the invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.