阅读说明：本技术 键合头系统及键合机 (Bonding head system and bonding machine ) 是由 常亮 李岗 孙彬 徐品烈 种宝春 张彩山 于 2021-07-26 设计创作，主要内容包括：本申请提供了一种键合头系统及键合机,涉及键合设备领域,键合头系统包括劈刀,劈刀被设置为沿着竖直方向延伸；下连杆；上连杆,与下连杆间隔设置,并被设置为与超声波发生构件同步运动；第一侧连杆和第二侧连杆,第一侧连杆和第二侧连杆二者中任一者的两端分别与上连杆和下连杆铰接；驱动构件,用于驱动超声波发生构件下降。在劈刀竖直设置的基础上,利用铰接设置的上连杆、下连杆、第一侧连杆和第二侧连杆,将劈刀靠近键合面的过程以及劈刀抵接于键合面的过程中可能出现的劈刀滑移转移到下连杆,从而有效地避免滑移对键合过程的诸多不良影响,同时还避免了滑移使劈刀与垂直方向产生的偏角,因此有效地提高了键合质量。(The application provides a bonding head system and a bonding machine, which relate to the field of bonding equipment, wherein the bonding head system comprises a riving knife, and the riving knife is arranged to extend along the vertical direction; a lower connecting rod; an upper link spaced apart from the lower link and configured to move in synchronization with the ultrasonic wave generating member; the two ends of either one of the first side connecting rod and the second side connecting rod are respectively hinged with the upper connecting rod and the lower connecting rod; and a driving member for driving the ultrasonic wave generating member to descend. On the basis that the riving knife is vertically arranged, the upper connecting rod, the lower connecting rod, the first side connecting rod and the second side connecting rod which are hinged are utilized to transfer the riving knife which is possibly generated in the process that the riving knife is close to the bonding surface and the process that the riving knife is abutted against the bonding surface to the lower connecting rod, so that a plurality of adverse effects on the bonding process caused by sliding are effectively avoided, meanwhile, the deviation angle between the riving knife and the vertical direction caused by sliding is also avoided, and the bonding quality is effectively improved.)

1. A bond head system comprising an ultrasonic generating member and a riving knife coupled to an output of the ultrasonic generating member, wherein the riving knife is configured to extend in a vertical direction, the bond head system further comprising:

a lower connecting rod;

an upper link spaced apart from the lower link and configured to move in synchronization with the ultrasonic wave generating member;

the two ends of either one of the first side connecting rod and the second side connecting rod are respectively hinged with the upper connecting rod and the lower connecting rod;

a driving member for driving the ultrasonic generating member to descend.

2. The bond head system as recited in claim 1, wherein the upper link, the lower link, the first side link, and the second side link collectively enclose a parallelogram; the bond head system further comprises:

the bonding head moving seat is connected with the ultrasonic generating component and the upper connecting rod;

the bonding head fixed seat is connected with the driving component and the lower connecting rod;

and the elastic component comprises a first part connected with the bonding head movable seat and a second part connected with the bonding head fixed seat.

3. The bond head system as recited in claim 2,

the bond head moving seat is provided with a first gap, the elastic component comprises a third part extending between the first part and the second part, the third part penetrates through the first gap, and the second part is connected to the upper end face of the bond head moving seat.

4. The bond head system as recited in claim 2,

and a second gap part is formed on the bonding head fixed seat, and part of the second part is suspended above the second gap part or in the second gap part.

5. The bond head system as recited in claim 2, wherein the bond head nest further comprises:

a cross member, the drive member being disposed to the cross member;

a support member removably mounted to the cross member, a portion of the second portion being defined between the cross member and the support member.

6. The bond head system as recited in claim 5,

the bond head stationary mount further comprises a longitudinal member coupled to the transverse member, the bond head system further comprises a first contact member disposed on the longitudinal member and a second contact member disposed on the bond head movable mount;

defining a relative position state of both the first contact member and the second contact member as a first relative position state in a state where the bond head system is not in operation;

the first contact point member and the second contact point member are both provided to be switched from the first relative position state to a second relative position state different from the first relative position state to operate both the driving member and the ultrasonic wave generating member.

7. The bond head system as recited in claim 6,

the first relative position state is set such that both the first contact member and the second contact member are separated from each other, the first contact member is located above the second contact member, and the second relative position state is set such that the first contact member and the second contact member are in contact with each other; or

The first relative position state is set such that both the first contact member and the second contact member are in contact with each other, the first contact member is located below the second contact member, and the second relative position state is set such that the first contact member and the second contact member are separated from each other.

8. The bond head system as recited in claim 6, further comprising:

and the wire feeding mechanism and the riving knife heating mechanism are both connected with the bonding head movable seat, and work when the first contact component and the second contact component are switched from the first relative position state to the second relative position state.

9. The bond head system as recited in claim 6, further comprising:

a handle and a guide member extending in a vertical direction and engaged with the longitudinal member, the handle being connected with the longitudinal member;

a sensing member and a detecting member respectively provided to a first one and a second one of the bond head moving mount and the traverse member, the sensing member and the detecting member being disposed to be staggered with each other in a state where the bond head system is not operated, the detecting member being disposed to be sensed by the sensing member in a state where the ultrasonic wave generating member is lowered;

the prompting component and the control mechanism are electrically connected with each other, and the control mechanism and the sensing component are electrically connected with each other.

10. A bonding machine characterized in that it comprises a bond head system as claimed in any one of claims 1 to 9.

Technical Field

The application relates to the field of bonding equipment, in particular to a bonding head system and a bonding machine.

Background

A bonding apparatus such as a wire bonding machine is an apparatus that electrically connects a wire to a semiconductor chip and a pin using ultrasonic waves, pressure, and temperature. In the bonding process, the lead is contacted with the bonding pad metal and generates interatomic diffusion under the combined action of ultrasonic energy, pressure and heat so as to achieve the purpose of bonding. The bonding head is a device used for implementing a pressure welding function on a bonding machine, and ultrasound and pressure in the bonding process are provided by the bonding head and are core components of the pressure welding machine. In order to achieve good bonding quality, the cleaver on the bonding head is always kept perpendicular to the bonding surface.

Existing bond heads typically employ an axially rotating structure to drive the riving knife, i.e., the riving knife is pivoted about an axis of rotation. The driving structure enables the riving knife to walk through an arc-shaped or approximately arc-shaped track in the downward movement process, and further certain slippage is generated in the front and back directions of the riving knife, and the slippage can damage the shape and bonding strength of a bonding point.

Disclosure of Invention

In view of the above, an object of the present application is to provide a bond head system and a bonding machine, so as to solve the above technical problems.

In a first aspect, the present application provides a bond head system comprising an ultrasonic generating member and a riving knife connected to an output end of the ultrasonic generating member, the riving knife being configured to extend in a vertical direction, the bond head system further comprising:

a lower connecting rod;

an upper link spaced apart from the lower link and configured to move in synchronization with the ultrasonic wave generating member;

the two ends of either one of the first side connecting rod and the second side connecting rod are respectively hinged with the upper connecting rod and the lower connecting rod;

a driving member for driving the ultrasonic generating member to descend.

Preferably, the upper link, the lower link, the first side link and the second side link together enclose a parallelogram; the bond head system further comprises:

the bonding head moving seat is connected with the ultrasonic generating component and the upper connecting rod;

the bonding head fixed seat is connected with the driving component and the lower connecting rod;

and the elastic component comprises a first part connected with the bonding head movable seat and a second part connected with the bonding head fixed seat.

The linkage bars are enclosed into a parallelogram, so that the upper linkage bar and the lower linkage bar are parallel, and the slippage transferred to the lower linkage bar is also horizontally performed, and the horizontal slippage is beneficial to direct measurement, so that the position adjustment or the component replacement of the bonding head system can be adaptively performed according to different working conditions. In another aspect of the above solution, the elastic member firstly plays a role of maintaining, and the maintaining role mainly lies in balancing the gravity of the movable base of the bond head, the ultrasonic generating member and the riving knife by using the self elastic restoring force, so that the upper and lower connecting rods are kept at an interval; then, the elastic component also plays a role of resetting the ultrasonic wave generating component and the cleaver by utilizing the self elastic restoring force.

Preferably, the bond head movable mount is formed with a first cutout, the elastic member includes a third portion extending between the first portion and the second portion, the third portion penetrates through the first cutout, and the second portion is connected to an upper end surface of the bond head movable mount.

Preferably, the bonding head is fixedly provided with a second gap, and a part of the second portion is suspended above or in the second gap.

Preferably, the bond head mount further comprises:

a cross member, the drive member being disposed to the cross member;

a support member removably mounted to the cross member, a portion of the second portion being defined between the cross member and the support member.

Preferably, the bond head stationary mount further comprises a longitudinal member connected to the transverse member, and the bond head system further comprises a first contact member disposed on the longitudinal member and a second contact member disposed on the bond head movable mount;

defining a relative position state of both the first contact member and the second contact member as a first relative position state in a state where the bond head system is not in operation;

the first contact point member and the second contact point member are both provided to be switched from the first relative position state to a second relative position state different from the first relative position state to operate both the driving member and the ultrasonic wave generating member.

The above-mentioned "rest state of the bond head system" is understood to include a state in which the riving knife of the bond head system does not contact the bonding surface.

Preferably, the first relative positional state is set such that both the first contact member and the second contact member are separated from each other, the first contact member is located above the second contact member, and the second relative positional state is set such that the first contact member and the second contact member are in contact with each other; or

The first relative position state is set such that both the first contact member and the second contact member are in contact with each other, the first contact member is located below the second contact member, and the second relative position state is set such that the first contact member and the second contact member are separated from each other.

Preferably, the bond head system further comprises:

and the wire feeding mechanism and the riving knife heating mechanism are both connected with the bonding head movable seat, and work when the first contact component and the second contact component are switched from the first relative position state to the second relative position state.

Preferably, the bond head system further comprises:

a handle and a guide member extending in a vertical direction and engaged with the longitudinal member, the handle being connected with the longitudinal member;

a sensing member and a detecting member respectively provided to a first one and a second one of the bond head moving mount and the traverse member, the sensing member and the detecting member being disposed to be staggered with each other in a state where the bond head system is not operated, the detecting member being disposed to be sensed by the sensing member in a state where the ultrasonic wave generating member is lowered;

the prompting component and the control mechanism are electrically connected with each other, and the control mechanism and the sensing component are electrically connected with each other.

In a second aspect, the present application provides a bonding machine comprising a bond head system as described above.

In the bonding head system provided by the application, on the basis that the riving knife is vertically arranged, the upper connecting rod, the lower connecting rod, the first side connecting rod and the second side connecting rod which are arranged in an articulated mode are utilized, the riving knife which is possibly generated in the process that the riving knife is close to the bonding surface and the riving knife is abutted to the bonding surface is transferred to the lower connecting rod in a sliding mode, therefore, a plurality of adverse effects on the bonding process due to the sliding are effectively avoided, meanwhile, the deviation angle generated by the riving knife and the vertical direction due to the sliding is also avoided, and therefore the bonding quality is effectively improved.

In order to make the aforementioned objects, features and advantages of the present application more comprehensible, preferred embodiments accompanied with figures are described in detail below.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained from the drawings without inventive effort.

Fig. 1 shows a schematic view of an isometric view of a bond head system;

FIG. 2 shows a schematic view of the bond head system with parts omitted;

fig. 3 shows a further schematic view of the bond head system with parts omitted;

FIG. 4 shows another schematic view of the bond head system with parts omitted;

FIG. 5 shows a schematic view of the linkage mechanism and the remaining components;

fig. 6 shows a schematic illustration of an isometric view of the bond head system further marked on the basis of fig. 1.

Reference numerals:

1-a seat mechanism; 101-fixing a bonding head; 102-a bond head moving seat; 103-detecting plate; 104-welding the rotating arm; 105-a bond head swing mount; 106-lower support plate;

2-a bonding mechanism; 201-ultrasonic transducer; 202-a cleaver;

3-a linkage mechanism; 301-upper link; 302-side link; 303-flexible spring plate;

4-a pressure control mechanism; 401-ball contact mount; 402-ball contacts; 403-flat contacts; 404-a photosensor; 405-a voice coil motor;

5-a wire feeding mechanism; 501-step motor; 502-cam tension spring; 503-rotating the cam; 504-spool support arms; 505-small spool; 506-a transfer arm; 507-a wire passing pipe frame; 508-a wire clamp assembly;

6-a riving knife heating mechanism; 601-heating tube holder; 602-heating wire.

Detailed Description

The technical solutions of the present application will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.

In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present application.

As shown in fig. 1 to 6, the bond head system provided by the present embodiment includes a seat mechanism 1, a bonding mechanism 2, a link mechanism 3, a pressure control mechanism 4, a wire feeding mechanism 5 and a riving knife heating mechanism 6, and the structure and the operation principle of the foregoing mechanisms will be described in detail below.

Referring first to fig. 1, a seat mechanism 1 is used for installing the rest of the mechanisms, a bonding mechanism 2 is used for realizing the bonding function of a bond head system, a link mechanism 3 is used for eliminating the slippage of a riving knife 202 in the bonding mechanism 2, a pressure control mechanism 4 is used for controlling the bonding pressure, and a wire feeding mechanism 5 and a riving knife heating mechanism 6 are respectively used for feeding wires and heating the riving knife 202. These mechanisms will be described in more detail below based on the general description herein.

Referring first to fig. 2 and 3 and particularly to fig. 3, in an embodiment, the bonding mechanism 2 includes an ultrasonic transducer 201 and a chopper 202, wherein the ultrasonic transducer 201 may be in a rod shape, the chopper 202 may be disposed at one end of the ultrasonic transducer 201, for example, by using a screw or a bolt, and the other end of the ultrasonic transducer 201 is held on the bond head moving base 102. Specifically, the bond head kinematic seat 102 may include a main body formed with a recess that accommodates a portion of one end of the ultrasonic transducer 201, and a pressing plate also formed with a recess that is provided on the main body, that is, on the outer side of one end of the ultrasonic transducer 201, whereby the recess of the pressing plate also accommodates a portion of one end of the ultrasonic transducer 201, which in turn allows the ultrasonic transducer 201 to be held to the bond head kinematic seat 102.

Further, as an example, the rod-shaped ultrasonic transducer 201 may be further formed in a solid body shape, such as that shown in fig. 3, including a circular table portion and a cylindrical portion connected to each other, wherein the riving knife 202 may be disposed at a small diameter end of the circular table portion, and the riving knife 202 may be disposed perpendicular to an axis of the ultrasonic transducer 201, and in the present embodiment, the riving knife 202 is further disposed to extend in a vertical direction. Further, both the welding rotor arm 104 and the bond head swing mount 105 are also connected to the main body of the bond head swing mount 102, and both may be arranged to have the same or substantially the same extending direction as the axial direction of the ultrasonic transducer 201, thereby being used for mounting the wire feeding mechanism 5 described below, which will be mentioned in the following description.

Still referring to fig. 2 and 3, the bond head moving seat 102 is connected to the lower support plate 106 via the linkage 3, that is, the lower support plate 106 supports the bond head moving seat 102 via the linkage 3, and fig. 2 and 3 illustrate the positional relationship between the bond head moving seat 102 and the lower support plate 106 in the case where the linkage 3 is omitted. On the basis of this, referring to fig. 5, the link mechanism 3 includes two sets of parallelogram links respectively disposed at two opposite side portions of the lower support plate 106, and the direction determined by the two side portions is perpendicular to the axial direction of the ultrasonic transducer 201, and fig. 5 shows a view of the parallelogram link at one side portion, and the structure and arrangement of the set of parallelogram links will be described in detail below.

As shown in fig. 5, the parallelogram link includes four bars hinged in sequence, and thus, the parallelogram link is formed as a substantially parallelogram frame. The four rods include an upper link 301 and a lower link (not shown) opposite to each other, both of which are horizontally disposed, and two side links 302 opposite to each other. Further, the upper link 301 and the two side links 302 may be hinged by using a pin, and the lower link and the two side links 302 may also be hinged by using a pin. In the embodiment, the two pins located at the upper side are embedded in the bond head moving seat 102, and the two pins located at the lower side are embedded in one of the two sides of the lower support plate 106, so that the motion states of the upper link 301 and the bond head moving seat 102 are the same, and the motion states of the lower link and the lower support plate 106 are the same.

Further, the structure and arrangement of the set of non-illustrated parallelogram links on the other side of the lower support plate 106 opposite to the set of parallelogram links shown in fig. 5 are the same as those mentioned in the above description, and will not be described again here.

Still referring to fig. 5, the linkage mechanism 3 further comprises a flexible spring 303, which flexible spring 303 may be formed, for example, in a continuous bent structure, and comprises a substantially "C" shaped portion comprising two plate portions facing each other and an extension portion connecting both. Wherein the extending portion penetrates through a through hole (the through hole is shown in fig. 2) pre-opened in the bond head moving seat 102, so that the upper plate portion of the two plate portions facing each other can be connected to the upper end surface of the bond head moving seat 102. Further, a lower plate portion of the two plate portions facing each other may be press-fitted between the lower support plate 106 and the bond head anchor 101, which is further illustrated in fig. 4, that is, the lower support plate 106 may be mounted to the bond head anchor 101, for example, using two bolts, and press-fitted to the bond head anchor 101.

In this way, the arrangement of the flexible spring 303 enables the gravity of the components such as the ultrasonic transducer 201, the riving knife 202, and the bond head moving seat 102 to be balanced, that is, the gravity of each component in the same motion state as the upper link 301 is balanced by the elastic force of the flexible spring 303, which enables the upper link 301 and the lower link included in any one of the two sets of parallelogram links to maintain a certain interval, and the interval ensures that the upper link 301 can have a space for further descending, so that the riving knife 202 applies pressure to the bond surface, which will be described later.

Referring to fig. 4, as mentioned above, the lower support plate 106 is mounted to the bond head mount 101, and specifically, the bond head mount 101 may include a horizontal plate portion arranged horizontally and a vertical plate portion connected to the horizontal plate portion, and the lower support plate 106 is connected to a side portion of the horizontal plate portion away from the vertical plate portion. The horizontal plate part is provided with a through hole, and the through hole and the flexible spring piece 303 are arranged in a position relation so that the part, which is not pressed, of the lower plate part of the flexible spring piece 303 is suspended, thereby reserving a deformation space for the flexible spring piece 303 and effectively improving the utilization rate of the flexible spring piece 303.

Further, in an embodiment, the pressure control system may include a ball contact mount 401, a ball contact 402, a flat contact 403, a photosensor 404, and a voice coil motor 405. Here, the horizontal plate portion where the voice coil motor 405 is provided may have, for example, a cylindrical groove portion formed on the upper end surface of the horizontal plate portion, and the voice coil motor 405 may be mounted in the groove portion, as shown in fig. 2. Further, the photosensor 404 is provided at the horizontal plate portion, for example, two photosensors 404 are provided adjacent to each other in the axial direction of the ultrasonic transducer 201, and the function of the photosensor 404 will be explained also in the following description.

On this basis, still referring to fig. 4, the arrangement of the ball contact mount 401, the ball contact 402 and the plane contact 403 will be further described below. In an embodiment, the ball contact mount 401 is mounted to the vertical plate portion of the bond head stator 101, and the ball contact mount 401 may be formed as a plate and formed with a kidney-shaped hole, for example, two kidney-shaped holes, as an example. Correspondingly, the vertical plate portion may be formed with threaded holes corresponding to the two waist-shaped holes, so that the ball contact mounting seat 401 may be mounted to the vertical plate portion through bolts, and the height of the ball contact mounting seat 401 may be adjusted by means of the waist-shaped holes. Further, the ball contact 402 may be mounted to the ball contact mount 401.

Further, as shown in fig. 4, a portion of the bond head moving seat 102 is also shown, and in an embodiment, the flat contact 403 is disposed on the portion of the bond head moving seat 102 shown in fig. 4, for example, on an upper end surface of the portion, and a position of the flat contact 403 and a position of the ball contact 402 correspond to each other in the vertical direction, so that the flat contact 403 and the ball contact 402 can contact and disengage from each other when the bond head moving seat 102 and the bond head moving seat 101 move relatively in the vertical direction, and the ball contact 402 and the flat contact 403 are in a disengaged state when the bond head system is not performing a bonding operation.

Referring to fig. 6, in an embodiment, the wire feeding mechanism 5 may adopt an existing structure, and fig. 6 schematically shows a conventional wire feeding mechanism 5, and the wire feeding mechanism 5 includes a stepping motor 501, a cam tension spring 502, a rotating cam 503, a spool support arm 504, a small spool 505, an adapter arm 506, a wire passing pipe frame 507, and a wire clamp assembly 508. As a conventional structure, the connection relationship of the respective members of the wire feeding mechanism 5 will be briefly described below. In an embodiment, the cam may be driven by a stepping motor 501, the cam is engaged with the welding rotating arm 104, and the welding rotating arm 104 is hinged to the main body of the bond head moving seat 102, so that the cam intermittently abuts against the welding rotating arm 104 during the rotation, thereby swinging the welding rotating arm 104. The bond swing seat 105 may be fixedly connected to the main body of the bond swing seat 102, the bond swing seat 105 may be configured to mount a bobbin support arm 504, a small bobbin 505 is mounted at a distal end of the bobbin support arm 504, and the small bobbin 505 is configured to accommodate a gold wire required for a bonding process. On this basis, the adapter arm 506 is disposed at the end of the welding rotating arm 104, the wire clamp assembly 508 is mounted on the adapter arm 506, and the wire passing pipe frame 507 is disposed at the end of the bond head swing seat 105.

Still referring to fig. 5, similarly, in the embodiment, the riving knife heating mechanism 6 may also adopt an existing structure, which may further include a heating pipe bracket 601 and a heating wire 602, the heating pipe bracket 601 may be disposed on the main body of the bond head moving seat 102 to provide a support for the heating wire 602, and a distal end of the heating wire 602 may be disposed around the outer side of the riving knife 202 to heat the riving knife 202.

Based on the above-described features, the bond head system further includes a driving portion, not shown in the drawings, connected to the bond head base 101 (e.g., the vertical plate portion of the bond head base 101), where the driving portion may be an automated driving device, such as a relatively precise ball screw mechanism, or may be a handle for manual force application operation, and the operation process of the bond head system will be specifically described below by taking the handle as an example.

At the stage when the riving knife 202 does not contact the bonding surface (the bonding surface is, for example, a pad plane on the chip), the whole structure shown in fig. 6 of the whole bond head system is lowered by manually driving the handle, which may be realized by, for example, a guide rail (not shown in the figure) disposed outside the vertical plate portion of the bond head stator 101. Since the riving knife 202 is disposed in the vertical direction, the riving knife 202 is always vertically downward at a stage where it does not contact the bonding surface. Then, the riving knife 202 will contact the bonding surface, and as the handle continues to descend, the riving knife 202 will apply a certain pressure to the bonding surface, and since the bond head fixed seat 101 and the bond head movable seat 102 are substantially connected via the flexible spring 303, the flexible spring 303 will deform at this time, thereby allowing the bond head fixed seat 101 to continue to move downward, and further allowing the flat contact 403 and the ball contact 402 to contact each other, and conducting the circuit. The circuit described here includes the operation circuit of the voice coil motor 405, the operation circuit of the ultrasonic transducer 201, the operation circuit of the stepping motor 501, and the operation circuit of the heating wire 602.

On the basis, the voice coil motor 405 starts to work because the working circuit is conducted, and applies a vertical downward force to the bond head moving seat 102, so that the bond head moving seat 102 descends, the riving knife 202 presses down the bonding surface, meanwhile, the ultrasonic transducer 201 and the heating wire 602 work to complete bonding, and then the wire feeding mechanism 5 continues to feed wires. In this process, the possible horizontal slippage of the bond head moving seat 102 together with the riving knife 202 and the like is transferred to the bond head stationary seat 101 via the two sets of parallelogram links of the linkage mechanism 3, that is, the upper link 301 performs a descending motion in any one set of parallelogram links, while all the possible slippage that may occur in the bond head moving seat 102 is transferred to the lower link, that is, the bond head stationary seat 101, and such slippage is allowed to occur in the bond head stationary seat 101 due to the arrangement of the flexible spring 303 above. In the example of fig. 1 to 6, taking fig. 6 as an example, the bond head anchor 101 may be understood as sliding leftward. Therefore, no matter during the process of moving the riving knife 202 to the bonding surface or during the process of bonding, the riving knife 202 can always be ensured to be vertically downward, and no transverse slip occurs during the bonding process, which ensures the bonding quality.

Further, the bond head moving seat 102 is further provided with a detection plate 103, the position of the detection plate 103 is set not to shield any one of the two photosensors 404 in a state where the bond head fixed seat 101 is not slid, and the bond head fixed seat 101 shields one of the two photosensors 404 after the bond head fixed seat 101 is slid. On the basis, the bond head system can further comprise a control mechanism and an alarm, the photoelectric sensor 404 and the alarm can be electrically connected with the control mechanism, and when the photoelectric sensor 404 is shielded by the detection plate 103, the alarm can give a prompt so as to prompt that bonding is completed. Due to the arrangement of the two photoelectric sensors 404, the detection range of the photoelectric sensors 404 is wider, and the adaptive capacity to different bonding scenes is improved.

The above description is only a preferred embodiment of the present application, and not intended to limit the scope of the present application, and all changes that can be made in the details of the description and drawings, or directly/indirectly implemented in other related technical fields, are intended to be embraced therein without departing from the spirit of the present application.