阅读说明：本技术 固晶机械臂及固晶设备 (Die bonding mechanical arm and die bonding equipment ) 是由 邓应铖 曾逸 于 2021-07-13 设计创作，主要内容包括：本发明涉及一种固晶机械臂及固晶设备。固晶机械臂包括基体和第一驱动机构,第一驱动机构用于驱动基体在用于放置晶圆的晶圆盘和用于放置目标基板的载台之间移动；基体上设置有多个固晶头,多个固晶头排列成m行n列；每个固晶头包括升降机构和吸咀,吸咀设置在所述升降机构上,吸咀能够吸取晶片能取放晶片,以及将晶片固定在固晶头上。上述固晶机械臂,能够在晶圆盘处从放置在晶圆盘上的晶圆上一次性地取多个晶片,暂存到多个固晶头上,并一次性地将多个固晶头上暂存的多个晶片转移安装到放置在载台上的目标基板上。其固晶效率高；并且,固晶效率的提高并不是单纯依赖固晶机械臂的数量的增加实现的,固晶效率所能达到的上限更高。(The invention relates to a die bonding mechanical arm and die bonding equipment. The die bonding mechanical arm comprises a base body and a first driving mechanism, wherein the first driving mechanism is used for driving the base body to move between a wafer disc for placing a wafer and a carrying platform for placing a target substrate; a plurality of die bonding heads are arranged on the substrate, and the die bonding heads are arranged into m rows and n columns; each die bonding head comprises a lifting mechanism and a suction nozzle, the suction nozzle is arranged on the lifting mechanism, and the suction nozzle can suck the wafer and can take and place the wafer and fix the wafer on the die bonding head. The die bonding mechanical arm can take a plurality of chips from a wafer placed on the wafer disc at one time at the wafer disc, temporarily store the chips on a plurality of die bonding heads, and transfer and mount the chips temporarily stored on the die bonding heads on a target substrate placed on the carrying platform at one time. The die bonding efficiency is high; in addition, the improvement of the die bonding efficiency is not realized by only depending on the increase of the number of die bonding mechanical arms, and the upper limit of the die bonding efficiency is higher.)

1. The die bonding mechanical arm is characterized by comprising a base body and a first driving mechanism, wherein the first driving mechanism is used for driving the base body to move between a wafer disc for placing a wafer and a carrying platform for placing a target substrate;

the substrate is provided with a plurality of die attach heads which are arranged into m rows and n columns; wherein m is more than or equal to 1, n is more than or equal to 2, and m and n are integers;

each die-bonding head comprises a lifting mechanism and a suction nozzle, the suction nozzle is arranged on the lifting mechanism, the lifting mechanism is used for driving the suction nozzle to lift, and the suction nozzle can suck a wafer.

2. The die bonding robot arm of claim 1, wherein the first driving mechanism is mounted on a mounting frame, the mounting frame having a first area corresponding to the wafer plate and a second area corresponding to the stage;

the first driving mechanism drives the substrate to move between the first area and the second area.

3. The die bonding mechanical arm according to claim 2, wherein a slide rail is arranged on the mounting frame; the base body comprises a mounting plate which is arranged on the slide rail and can slide along the slide rail; the first driving mechanism is used for driving the mounting plate to move along the sliding rail.

4. The die bonding mechanical arm according to claim 2, wherein a primary slide rail extending along a first direction is arranged on the mounting frame, a sliding platform is arranged on the primary slide rail, and a secondary slide rail extending along a second direction is arranged on the sliding platform;

the base body comprises a mounting plate which is arranged on the secondary slide rail and can slide along the secondary slide rail; the first driving mechanism is used for driving the mounting plate to move along the secondary sliding rail and driving the sliding platform to move along the primary sliding rail.

5. A die bonding apparatus, comprising the die bonding robot arm according to any one of claims 1 to 4.

6. The die bonding apparatus according to claim 5, wherein the die bonding apparatus comprises a carrier and a wafer plate;

the number of the die bonding mechanical arms is multiple, and each die bonding mechanical arm is provided with a wafer disc corresponding to the die bonding mechanical arm;

the first driving mechanisms of the die bonding mechanical arms are arranged on one mounting frame, and the first driving mechanisms of the die bonding mechanical arms respectively drive the base bodies of the die bonding mechanical arms to move between the wafer disc and the carrying platform which respectively correspond to the base bodies.

7. The die bonding apparatus according to claim 6, wherein the number of the wafer disks is one or more, and at least one wafer disk has a plurality of die bonding mechanical arms corresponding to the wafer disk; and the moving paths of the die bonding mechanical arms corresponding to one wafer disc between the wafer disc and the carrying platform are not coincident.

8. The die bonding equipment according to any one of claims 5 to 7, wherein a first image acquisition device is arranged at the die bonding station on the carrying platform and the die taking station of each wafer disk.

9. The die bonding apparatus according to any one of claims 5 to 7, further comprising a stage driving mechanism for driving a target substrate placed on the stage to move.

10. The die bonding apparatus according to claim 5, further comprising a second image acquisition device for acquiring an image of the sucked wafer after the suction nozzle sucks the wafer;

each die bonding head also comprises a rotating mechanism; the rotating mechanism can drive the suction nozzle to rotate so as to correct the angle of the wafer sucked by the suction nozzle.

Technical Field

The invention relates to the field of die bonding of semiconductor wafers, in particular to a die bonding mechanical arm and die bonding equipment comprising the die bonding mechanical arm.

Background

The die bonder is a key device in an LED packaging production line, and is used for transferring and mounting LED chips on a wafer to LED chip mounting positions on an LED board (e.g., a Mini LED display panel or a Micro LED display panel).

The existing die bonder mainly comprises a carrying platform, a wafer disc and a swing arm. Wherein, the microscope carrier is used for placing a substrate, such as an LED board on which an LED chip is required to be mounted. The wafer tray is used for placing wafers, such as wafers with red LED chips, wafers with green LED chips, wafers with blue LED chips and the like. The swing arm can move back and forth between the wafer disc and the carrying platform, and the swing arm takes chips on the wafer, such as red LED chips, green LED chips, blue LED chips and the like, from the wafer at the wafer disc; at the stage, a swing arm transfer mounts the retrieved wafer onto a substrate placed on the stage.

In the existing die bonder, the swing arm can only take one chip at the wafer tray every time, namely, only one chip can be transferred and mounted on the substrate in each process, so that the efficiency is low. In order to improve the efficiency of the die bonding process, a plurality of swing arms are used to simultaneously transfer the mounting wafer to the substrate on the same carrier, but the improvement efficiency is limited. The reason for this is that, on the one hand, the space around each stage is limited, and the number of swing arms cannot be increased without limit; moreover, the movement of each swing arm between the wafer tray and the carrier is realized by rotation, so that the space occupied by one swing arm is large, and the number of the swing arms which can be placed around one carrier is further limited; on the other hand, increasing the number of swing arms means increasing the cost, and the cost factor also limits the feasibility of increasing the efficiency by increasing the number of swing arms.

In view of the above, there is a need in the art for a feasible and efficient die bonding solution and die bonding apparatus.

Disclosure of Invention

The invention provides a die bonding mechanical arm and die bonding equipment, which are used for solving the technical problem that a feasible die bonding scheme with high die bonding efficiency is lacked in the prior art.

The invention provides a die bonding mechanical arm which comprises a base body and a first driving mechanism, wherein the first driving mechanism is used for driving the base body to move between a wafer disc for placing a wafer and a carrying platform for placing a target substrate; the substrate is provided with a plurality of die attach heads which are arranged into m rows and n columns; wherein m is more than or equal to 1, n is more than or equal to 2, and m and n are integers; each die-bonding head comprises a lifting mechanism and a suction nozzle, the suction nozzle is arranged on the lifting mechanism, the lifting mechanism is used for driving the suction nozzle to lift, and the suction nozzle can suck a wafer.

The first driving mechanism is arranged on a mounting frame, and the mounting frame is provided with a first area corresponding to the wafer disc and a second area corresponding to the carrying platform; the first driving mechanism drives the substrate to move between the first area and the second area.

The mounting rack is provided with a slide rail; the base body comprises a mounting plate which is arranged on the slide rail and can slide along the slide rail; the first driving mechanism is used for driving the mounting plate to move along the sliding rail.

The mounting frame is provided with a first-stage sliding rail extending along a first direction, the first-stage sliding rail is provided with a sliding platform, and the sliding platform is provided with a second-stage sliding rail extending along a second direction; the base body comprises a mounting plate which is arranged on the secondary slide rail and can slide along the secondary slide rail; the first driving mechanism is used for driving the mounting plate to move along the secondary sliding rail and driving the sliding platform to move along the primary sliding rail.

The die bonding equipment provided by the invention comprises the die bonding mechanical arm.

The die bonding equipment comprises a carrying platform and a wafer disc; the number of the die bonding mechanical arms is multiple, and each die bonding mechanical arm is provided with a wafer disc corresponding to the die bonding mechanical arm; the first driving mechanisms of the die bonding mechanical arms are arranged on one mounting frame, and the first driving mechanisms of the die bonding mechanical arms respectively drive the base bodies of the die bonding mechanical arms to move between the wafer disc and the carrying platform which respectively correspond to the base bodies.

The number of the wafer disks is one or more, and at least one wafer disk is provided with a plurality of wafer fixing mechanical arms corresponding to the wafer disks; and the moving paths of the die bonding mechanical arms corresponding to one wafer disc between the wafer disc and the carrying platform are not coincident.

And a first image acquisition device is arranged at the die bonding station on the carrying platform and the die taking station of each wafer disc.

The die bonding equipment further comprises a stage driving mechanism, and the stage driving mechanism is used for driving a target substrate placed on the stage to move.

The die bonding equipment comprises a second image acquisition device, wherein the second image acquisition device is used for acquiring the image of the sucked wafer after the suction nozzle sucks the wafer; each die bonding head also comprises a rotating mechanism; the rotating mechanism can drive the suction nozzle to rotate so as to correct the angle of the wafer sucked by the suction nozzle.

Compared with the prior art, the die bonding mechanical arm and the die bonding equipment provided by the embodiment of the invention have the following advantages:

the die bonding mechanical arm provided by the embodiment of the invention has the advantages that the substrate is provided with the plurality of die bonding heads, the plurality of die bonding heads are arranged in an array form of m rows and n rows (at least 1 row and 2 rows), when the die bonding mechanical arm carries out a die bonding process, each die bonding head can independently descend to the position corresponding to a wafer placed on a wafer disc, the wafer is sucked through the suction nozzle, so that the plurality of die bonding heads can take the plurality of wafers at one time and temporarily store the wafers on the plurality of die bonding heads, and at the carrying platform, the die bonding mechanical arm can sequentially transfer and mount the plurality of temporarily stored wafers on the plurality of die bonding heads on a target substrate placed on the carrying platform. Compared with the scheme that only one wafer is transferred and mounted to the target substrate during each movement between the wafer disc and the target substrate in the prior art, the wafer fixing mechanical arm provided by the embodiment of the invention has high wafer fixing efficiency; in addition, the improvement of the die bonding efficiency is not realized by only depending on the increase of the number of die bonding mechanical arms, so that a lot of space is not occupied, and the die bonding efficiency is not greatly limited by the size of the space, so that the upper limit of the die bonding efficiency is higher.

The die bonding equipment provided by the embodiment of the invention comprises the die bonding mechanical arm, can take a plurality of chips from a wafer placed on a wafer disc at one time at the wafer disc and temporarily store the chips on a plurality of die bonding heads, and can transfer and mount the chips temporarily stored on the die bonding heads on a target substrate placed on a carrying platform at one time at the carrying platform. Compared with the scheme that only one wafer is transferred and mounted on the target substrate in each movement between the wafer disc and the target substrate in the prior art, the die bonding equipment provided by the embodiment has high die bonding efficiency; in addition, the improvement of the die bonding efficiency is not realized by only depending on the increase of the number of die bonding mechanical arms, so that a lot of space is not occupied, and the die bonding efficiency is not greatly limited by the size of the space, so that the upper limit of the die bonding efficiency is higher.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention.

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without inventive exercise.

Fig. 1 is a schematic structural diagram of a die bonding mechanical arm applied to die bonding equipment according to embodiment 1 of the present invention;

FIG. 2 is a schematic structural view of the die bonding robot arm shown in FIG. 1;

fig. 3 is a schematic structural diagram of a die bonding mechanical arm applied to die bonding equipment according to embodiment 2 of the present invention;

FIG. 4 is a schematic structural diagram of the die bonding robot (removing the mounting frame) shown in FIG. 3;

fig. 5 is a schematic structural diagram of a die bonding apparatus provided in embodiment 3 of the present invention.

In the figure:

10-die bonding mechanical arm; 20-wafer disks; 30-a stage; 40-a mounting frame; 50-a first image capture device; 60-a second image acquisition device;

11-a substrate;

110-die attach head; 111-a mounting plate; 112-a second drive mechanism;

400-a slide rail; 401 — sliding platform.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.

Embodiments of the die bonding robot and the die bonding apparatus provided by the present invention are described below with reference to the accompanying drawings.

(1) Embodiment 1 of die bonding robot arm

In the present embodiment, as shown in fig. 1 and 2, the die bonding robot arm 10 includes a base 11 and a first driving mechanism. The first driving mechanism is for driving the base body 11 to move between the wafer tray 20 for placing the wafer and the stage 30 for placing the target substrate. A plurality of die attach heads 110 are arranged on the substrate 11, and the die attach heads 110 are arranged in m rows and n columns; wherein m is more than or equal to 1, n is more than or equal to 2, and m and n are integers. Each die bonding head 110 comprises a lifting mechanism and a suction nozzle, the suction nozzle is arranged on the lifting mechanism, the lifting mechanism is used for driving the suction nozzle to lift, and the suction nozzle can suck a wafer.

In the above die bonding robot arm provided by this embodiment, the plurality of die bonding heads 110 are disposed on the substrate 11, and the plurality of die bonding heads 110 are arranged in an array form of m rows and n rows (at least, 1 row and 2 rows), when the die bonding robot arm 10 performs the die bonding process, each die bonding head can independently descend to a position corresponding to a wafer placed on the wafer tray 20, and suck the wafer through the suction nozzle, so that the plurality of die bonding heads can take a plurality of wafers at a time and temporarily store the wafers on the plurality of die bonding heads 110, and at the stage 30, the die bonding robot arm 10 can transfer and mount the plurality of wafers temporarily stored on the plurality of die bonding heads 110 onto a target substrate placed on the stage 30 at a time. Compared with the scheme that only one wafer is transferred and mounted on the target substrate in each movement between the wafer disc and the target substrate in the prior art, the die bonding mechanical arm provided by the embodiment has high die bonding efficiency; in addition, the improvement of the die bonding efficiency is not realized by only depending on the increase of the number of die bonding mechanical arms, so that a lot of space is not occupied, and the die bonding efficiency is not greatly limited by the size of the space, so that the upper limit of the die bonding efficiency is higher.

Referring to fig. 2, in the present embodiment, m takes a value of 1, and n takes a value of 5, that is, five die attach heads 110 are disposed on the substrate 11, and the five die attach heads 110 are arranged in a row. Each die bonding head 110 can pick up and temporarily store one wafer, so that the substrate 11 of the die bonding robot provided in this embodiment can mount five wafers onto the target substrate at the same time.

Referring to fig. 1 and 2, the first drive mechanism is mounted on a mounting block 40, the mounting block 40 having a first area corresponding to the wafer plate 20 and a second area corresponding to the stage 30. The first drive mechanism drives the substrate 11 between the first region and the second region. In fig. 2, specifically, the first region is two side edge regions of the mounting frame 40, and the second region is a middle region of the mounting frame 40.

Specifically, the mounting bracket 40 is provided with a slide rail 400, and a section of the slide rail 400 extends from the first region to the second region; the slide rail 400 may have other extension sections besides the block section, for example, two end points of the block section extend outward by a predetermined distance. The base body 11 includes a mounting plate 111 provided on the slide rail 400 and slidable along the slide rail 400, and the plurality of die attach heads 110 are mounted on the mounting plate 111. The first driving mechanism is connected to the mounting plate 111 and is configured to drive the mounting plate 111 to move along the slide rail 400, so that the plurality of die attach heads 110 mounted on the mounting plate 111 can move between the first area and the second area.

Referring to fig. 2, a second driving mechanism 112 is disposed on the substrate 11, and the second driving mechanism 112 is used for driving the plurality of die attach heads 110 to move up and down integrally. When the die bonding heads 110 pick up chips from the wafers placed on the wafer tray 20, the second driving mechanism 112 drives the plurality of die bonding heads 110 to move in the wafer direction, each die bonding head 110 can pick up chips from the wafers by suction through a suction nozzle in a negative pressure suction manner, and after the chips are picked up, the second driving mechanism 112 drives the plurality of die bonding heads 110 to move in a direction away from the wafers. When the die attach head 110 transfers and mounts the wafer temporarily stored on the die attach head 110 to the target substrate on the stage 30, the second driving mechanism 112 drives the plurality of die attach heads 110 to move toward the target substrate, and transfers the temporarily stored wafer to the target substrate after the wafer is moved to the target substrate, and after the wafer is transferred to the target substrate, the second driving mechanism 112 drives the wafer to be away from the target substrate.

In addition, the present invention can be implemented by simply changing the embodiment 1 as an alternative embodiment to the embodiment 1. In an alternative embodiment of embodiment 1, the second driving mechanism 112 can also individually drive each die-bonding head 110 to move up and down. In this case, the second driving mechanism 112 may specifically include a plurality of sub-driving units, each sub-driving unit is substantially a lifting mechanism of the die bonding head 110, and each sub-driving unit is connected to the suction nozzle of one die bonding head 110, so as to independently drive each die bonding head 110 to perform lifting movement.

(2) Embodiment 2 of die bonding robot arm

In this embodiment, the slide rails provided on the mounting rack 40 are different from those in embodiment 1, specifically, referring to fig. 3 and 4, the mounting rack 40 is provided with a primary slide rail (not shown in the figure and shielded by the slide platform 401) extending along a first direction, the primary slide rail is provided with the slide platform 401, and the slide platform 401 is provided with a secondary slide rail (not shown in the figure and shielded by the mounting plate 111) extending along a second direction. The base body 11 includes a mounting plate 111 provided on the secondary slide rail and capable of sliding along the secondary slide rail. The first driving mechanism is connected to the mounting plate 111, and is configured to drive the mounting plate 111 to move along the second-stage slide rail, and drive the sliding platform 401 to move along the first-stage slide rail.

In this embodiment, the first driving mechanism can drive the substrate 11 to move in the first direction, and can also drive the substrate 11 to move in the second direction, so that the moving path of the substrate 11 between the wafer disk 20 and the stage 30 can be different from the straight line between the wafer disk 20 and the stage 30 in embodiment 1, and the moving path can be varied.

In practical use, a plurality of non-coincident movement paths can be planned between one wafer disk 20 and one stage 30, and the substrates 11 of the plurality of die bonding robots 10 can move between the wafer disk 20 and the stage 30 according to the plurality of movement paths, so that the plurality of die bonding robots 10 can actually take wafers from wafers placed on the same wafer disk 20, move to the stage, and transfer and mount the wafers onto target substrates. Of course, it is also possible to plan a plurality of non-coincident movement paths between one wafer disk 20 and a plurality of stages 30, so that a plurality of wafer bonding robots 10 take wafers from wafers placed on the same wafer disk 20 and transfer the wafers to target substrates mounted on different stages, respectively.

The other parts not mentioned in this embodiment are the same as those in embodiment 1, and are not described herein again.

In summary, in the die bonding robot arm provided by the above embodiment of the present invention, the substrate 11 is provided with the plurality of die bonding heads 110, and the plurality of die bonding heads 110 are arranged in an array form of m rows and n columns (at least, 1 row and 2 columns), when the die bonding robot arm 10 performs the die bonding process, each die bonding head 110 can independently descend to a position corresponding to a wafer placed on the wafer tray 20, and suck the wafer through the suction nozzle, so that the plurality of die bonding heads 110 can suck the plurality of wafers at one time and temporarily store the plurality of wafers on the plurality of die bonding heads 110, and at the stage 30, the die bonding robot arm 10 can transfer and mount the plurality of wafers temporarily stored on the plurality of die bonding heads 110 onto a target substrate placed on the stage 30 at one time. Compared with the scheme that only one wafer is transferred and mounted on the target substrate during each movement between the die bonding disk and the target substrate in the prior art, the die bonding mechanical arm provided by the embodiment has high die bonding efficiency; in addition, the improvement of the die bonding efficiency is not realized by only depending on the increase of the number of die bonding mechanical arms, so that a lot of space is not occupied, and the die bonding efficiency is not greatly limited by the size of the space, so that the upper limit of the die bonding efficiency is higher.

(3) Example 1 of die bonder

In the present embodiment, the die bonding apparatus includes the die bonding robot 10 provided in the above-described embodiment of the die bonding robot, the wafer plate 20, and the stage 30.

Referring to fig. 1, the die bonding robot 10 is provided in a plurality, and each die bonding robot 10 has a corresponding wafer tray 20. Specifically, the number of the die bonding mechanical arms 10 is equal to the number of the wafer disks 20, and the wafer bonding mechanical arms correspond to the wafer disks one by one. The first driving mechanisms of the die bonding robots 10 are mounted on one mounting frame 40, and the first driving mechanisms of the die bonding robots 10 respectively drive the base bodies 11 of the die bonding robots 10 to move between the wafer disks 20 and the stages 30 corresponding to the base bodies. When the die bonding process is performed, the plurality of die bonding robots 10 simultaneously transfer the wafers to the target substrate on the carrier 30, so that the time required for filling the wafer sites on the target substrate with the wafers is shortened, and higher die bonding efficiency is realized.

In this embodiment, the die bonding apparatus further includes a stage driving mechanism and a wafer driving mechanism, wherein the stage driving mechanism is configured to drive the target substrate placed on the stage 30 to move, so that the wafer position of the wafer to be mounted on the target substrate is located at the die bonding station. The wafer driving mechanism is used for driving the wafers placed on the wafer tray 20 to move, and the chips to be mounted on the wafers are positioned at the wafer taking station.

In this embodiment, a first image acquisition device 50 is disposed at the die bonding station on the stage 30 and the die taking station of each wafer disk 20, and the first image acquisition device 50 is configured to acquire images of the die bonding station and the die taking station, and according to the images acquired by the first image acquisition device 50, it can be determined whether the position of the target substrate on the stage 30 is moved in place, and whether the wafer placed on the wafer disk 20 is moved in place. Specifically, the first image capturing device 50 may be a CCD camera, and the captured image thereof may refer to not only a still picture but also dynamic video information or a surveillance video picture captured and transmitted in real time.

(4) Example 2 of die bonding apparatus

In the present embodiment, unlike the above embodiment 1, referring to fig. 3 and 4, the number of the wafer disks 20 is plural, and at least one of the plural wafer disks 20 has plural die bonding robots 10 corresponding thereto. The movement paths of the plurality of die bonding robots 10 corresponding to one wafer disk 20 between the wafer disk 20 and the stage 30 do not overlap.

In the present embodiment, one wafer plate 20 corresponds to a plurality of die bonding robots 10, that is, a plurality of die bonding robots 10 share one wafer plate 20, and take out wafers from wafers placed on the wafer plate 20 and transfer the wafers onto target substrates on one or different stages 30. Since the moving paths of the die bonding mechanical arms 10 between the wafer plate 20 and the carrier 30 are not coincident, the die bonding mechanical arms 10 do not interfere with each other when taking chips from the wafer placed on the wafer plate 20. Compared with embodiment 1, in the die bonding apparatus of the present embodiment, the number of wafer disks 20 configured may be reduced, and the number of first image capturing devices 50 for imaging the wafer taking stations of the wafer disks 20 may also be reduced, so that the cost of the die bonding apparatus may be significantly reduced.

The other parts not mentioned in this embodiment are the same as those in embodiment 1, and are not described herein again.

In the present embodiment, the number of the wafer disks 20 may be one, the wafer disk 20 may have a plurality of die bonding robots 10 corresponding thereto, and the movement paths of the plurality of die bonding robots 10 corresponding to the wafer disk 20 between the wafer disk 20 and the stage 30 do not overlap.

(5) Example 3 of die bonder

In this embodiment, the difference from the above embodiments 1 and 2 is that, as shown in fig. 5, the die bonding apparatus further includes a second image capturing device 60, and each die bonding head 110 of the die bonding robot further includes a rotating mechanism.

The second image pickup device 60 is used to pick up images of the plurality of sucked wafers after the plurality of suction nozzles suck the wafers. Specifically, the image capturing mechanism may be a CCD camera or the like, and the captured image may be a static photo, a dynamic video information, or a real-time video monitoring picture. According to the image acquired by the image acquisition mechanism, after the suction nozzle sucks the wafer, the angle of the sucked wafer on the suction nozzle can be judged, and the angle is evaluated to determine whether the angle of the wafer is an angle capable of being accurately aligned to a target substrate mounted on the stage 30.

The rotating mechanism is connected with the suction nozzle and can drive the suction nozzle to rotate. When the angle of each wafer is determined not to meet the requirement of accurate alignment and installation on the target substrate according to the image acquired by the second image acquisition device, the rotating mechanism can be controlled to drive the suction nozzle to rotate, so that the angle of the wafer sucked by the suction nozzle is corrected, and the angle of the wafer is corrected to meet the requirement of accurate alignment and installation on the target substrate. Compared with the above embodiments 1 and 2, in this embodiment, the accuracy of aligning and mounting the wafer on the target substrate is higher, and the deviation occurring in the wafer mounting process is reduced.

The other parts not mentioned in this embodiment are the same as those in embodiments 1 and 2, and are not described again here.

In summary, the die bonding apparatus provided by the above embodiments of the present invention includes the die bonding robot provided by the above embodiments of the die bonding robot, which is capable of taking a plurality of dies from a wafer placed on the wafer plate 20 at a time at the wafer plate 20, temporarily storing the plurality of dies on the plurality of die bonding heads 110, and transferring and mounting the plurality of dies temporarily stored on the plurality of die bonding heads 110 at a time at the stage 30 onto a target substrate placed on the stage 30. Compared with the scheme that only one wafer is transferred and mounted on the target substrate in each movement between the wafer disc and the target substrate in the prior art, the die bonding equipment provided by the embodiment has high die bonding efficiency; in addition, the improvement of the die bonding efficiency is not realized by only depending on the increase of the number of die bonding mechanical arms, so that a lot of space is not occupied, and the die bonding efficiency is not greatly limited by the size of the space, so that the upper limit of the die bonding efficiency is higher.

It is noted that, in this document, relational terms such as "first" and "second," and the like, may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

The foregoing are merely exemplary embodiments of the present invention, which enable those skilled in the art to understand or practice the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.