阅读说明：本技术 固晶流水线 (Die bonding assembly line ) 是由 邓应铖 曾逸 于 2021-07-13 设计创作，主要内容包括：本发明涉及一种固晶流水线。固晶流水线包括基板传送机构、搬运机构和固晶设备；基板传送机构用于传送待要固晶的目标基板；固晶设备的数量为多个,且多个固晶设备沿基板传送机构的传送方向依次分布在基板传送机构的侧方；搬运机构用于在基板传送机构和每个固晶设备之间搬运目标基板；每个固晶设备能向被搬运至该固晶设备上的目标基板上转移安装多种晶片。与现有技术中需要在基板传送机构和多个固晶设备进行多次搬运过程的技术方案相比,本发明中的固晶流水线只需要一次搬运过程,减少了固晶工艺过程中的非晶片转移安装环节的时间消耗,可以提高工艺效率；同时,省去了在多个固晶设备之间的多次搬运的工艺环节,也相应减少了工艺错误出现的概率。(The invention relates to a die bonding assembly line. The die bonding assembly line comprises a substrate conveying mechanism, a carrying mechanism and die bonding equipment; the substrate conveying mechanism is used for conveying a target substrate to be subjected to die bonding; the number of the die bonding equipment is multiple, and the die bonding equipment is sequentially distributed on the side of the substrate conveying mechanism along the conveying direction of the substrate conveying mechanism; the conveying mechanism is used for conveying the target substrate between the substrate conveying mechanism and each die bonding device; each die bonding apparatus can transfer and mount a plurality of kinds of wafers to the target substrate carried to the die bonding apparatus. Compared with the technical scheme that multiple carrying processes are required to be carried out on the substrate conveying mechanism and the multiple die bonder equipment in the prior art, the die bonder assembly line only needs one carrying process, so that the time consumption of a non-crystal wafer transfer installation link in the die bonder technological process is reduced, and the technological efficiency can be improved; meanwhile, the process links of multiple times of conveying among a plurality of die bonder equipment are omitted, and the probability of occurrence of process errors is correspondingly reduced.)

1. A die bonding assembly line is characterized by comprising a substrate conveying mechanism, a carrying mechanism and die bonding equipment;

the substrate conveying mechanism is used for conveying a target substrate to be subjected to die bonding; the number of the die bonding equipment is multiple, and the die bonding equipment is sequentially distributed on the side of the substrate conveying mechanism along the conveying direction of the substrate conveying mechanism;

the conveying mechanism is used for conveying the target substrate between the substrate conveying mechanism and each die bonder;

each die bonding equipment can transfer and mount various wafers to the target substrate conveyed to the die bonding equipment.

2. The die bonding line of claim 1, wherein a plurality of die bonding apparatuses are distributed on both sides of the substrate conveying mechanism.

3. The die bonding line of claim 1, wherein each group of wafer bit cells on the target substrate transported on the substrate transport mechanism comprises n wafer bits; n is not less than 2 and is an integer;

each die bonding device can transfer and mount n wafers to a target substrate conveyed to the die bonding device, and the n wafers correspond to n wafer positions in each wafer position unit group on the target substrate one by one.

4. The die bonding line of claim 3, wherein each wafer bit cell group on the target substrate conveyed on the substrate conveying mechanism comprises a red wafer bit, a green wafer bit, and a blue wafer bit;

each die bonder can transfer and mount three kinds of wafers to a target substrate conveyed to the die bonder, wherein the three kinds of wafers are respectively a red LED chip, a green LED chip and a blue LED chip.

5. The die bonding line of claim 1, wherein the substrate conveying mechanism is a conveyor belt.

6. The die bonding assembly line of any one of claims 1 to 5, wherein the die bonding equipment comprises a carrying platform, a wafer disc and a swing arm;

the carrying platform is used for carrying a target substrate carried by the carrying mechanism, and a first driving mechanism is arranged on the carrying platform and used for driving the target substrate placed on the carrying platform to move so as to enable each wafer contained in one wafer position unit group on the target substrate to move to a wafer fixing station;

the number of the wafer disks is multiple, each wafer disk is used for placing wafers, and the wafers placed on at least one wafer disk are different from those placed on other wafer disks;

the number of the swing arms is multiple, each swing arm corresponds to one wafer disc, and the swing arms respectively correspond to a plurality of wafer positions in one wafer position unit group of the target substrate;

each swing arm is provided with a second driving mechanism, and each second driving mechanism is used for driving the corresponding swing arm to sequentially move from the wafer disc corresponding to the swing arm to the die bonding station and from the die bonding station to the wafer disc corresponding to the swing arm;

the swing arms are used for taking wafers at the corresponding wafer disks respectively and transferring the wafers to corresponding wafer positions of a wafer position unit group located at a wafer fixing station on a target substrate in sequence at the wafer fixing station.

7. The die bonding assembly line of claim 6, wherein an image acquisition device is arranged at the die bonding station and used for acquiring an image of a target substrate.

8. The die bonding assembly line of claim 6, wherein the die bonding equipment further comprises a control mechanism for controlling the plurality of second driving mechanisms, and the control mechanism controls the swing arms to sequentially reach corresponding wafer positions in the wafer position unit groups of the die bonding stations on the target substrate under the driving of the corresponding second driving mechanisms.

Technical Field

The invention relates to the field of semiconductor technology and equipment, in particular to a die bonding assembly line.

Background

The die bonder is a key device in an LED packaging production line, and is used for transferring and mounting LED chips on a wafer to LED chip mounting positions on an LED board (e.g., a Mini LED display panel or a Micro LED display panel). Generally, when a die bonding process is performed, a die bonding assembly line is formed by a plurality of die bonding machines, and assembly line operation is performed to improve process efficiency.

The existing die bonder assembly line for the LED packaging production line is generally provided with a plurality of groups of die bonder on two sides of a conveyor belt, wherein each group of die bonder is used for transferring an LED chip of one color to an LED board. As shown in fig. 1, 3 sets of die bonder are respectively disposed at both sides of the conveyor belt 1, and each set has 2 die bonders. Specifically, the three die bonder sets are a die bonder 2 for transferring red LED chips onto an LED board, a die bonder 3 for transferring green LED chips onto an LED board, and a die bonder 4 for transferring blue LED chips onto an LED board, respectively.

When the die bonder assembly line works, the LED plate conveyed on the conveyor belt 1 firstly reaches the die bonder 2, at the moment, the LED plate is conveyed to a carrying platform of the die bonder 2 from the conveyor belt 1 through the conveying mechanism, and then the die bonder 2 transfers and installs the red LED chip on the LED plate; thereafter, the LED board on which the red LED chip is mounted is conveyed onto the conveyor belt 1 again; the conveyor belt 1 conveys the LED chips to a die bonder 3, at the moment, the LED chips are conveyed to a carrying platform of the die bonder 3 from the conveyor belt 1 through another conveying mechanism, and then the die bonder 3 transfers and installs the green LED chips on the LED chips; then, the LED board on which the green LED chips are mounted is conveyed onto the conveyor belt 1 again; the conveyor belt 1 conveys the LED chip to a die bonder 4, at the moment, the LED chip is conveyed to a carrying platform of the die bonder 4 from the conveyor belt 1 through another conveying mechanism, and then the die bonder 4 transfers and installs the blue LED chip on the LED chip; thereafter, the LED board on which the blue LED chips are mounted is conveyed onto the conveyor 1 again, and the LED board is conveyed by the conveyor 1 to a position where the next step is performed.

The existing die bonding assembly line has the following technical problems:

in the die bonding assembly line, if the red LED chips, the green LED chips and the blue LED chips are to be transferred and mounted, the LED board needs to be transported between the conveyor belt 1 and the die bonding machine many times, and the substrate needs to be aligned in each transportation process. On one hand, a large amount of time is consumed for links except for transferring and mounting the LED chip, and the process efficiency is reduced; on the other hand, too many process links are easy to cause process errors.

Disclosure of Invention

The invention provides a die bonding assembly line, which aims to solve the technical problems that the prior die bonding assembly line needs to carry substrates for many times when a die bonding process is carried out, the process efficiency is influenced, and process errors are easy to occur.

The invention provides a die bonding assembly line which comprises a substrate conveying mechanism, a carrying mechanism and die bonding equipment; the substrate conveying mechanism is used for conveying a target substrate to be subjected to die bonding; the number of the die bonding equipment is multiple, and the die bonding equipment is sequentially distributed on the side of the substrate conveying mechanism along the conveying direction of the substrate conveying mechanism; the conveying mechanism is used for conveying the target substrate between the substrate conveying mechanism and each die bonder; each die bonding equipment can transfer and mount various wafers to the target substrate conveyed to the die bonding equipment.

Wherein, a plurality of solid crystal equipment distribute in the both sides of base plate transport mechanism.

Each wafer bit unit group on the target substrate transmitted by the substrate transmission mechanism comprises n wafer bits; n is not less than 2 and is an integer; each die bonding device can transfer and mount n wafers to a target substrate conveyed to the die bonding device, and the n wafers correspond to n wafer positions in each wafer position unit group on the target substrate one by one.

Each wafer bit unit group on the target substrate conveyed on the substrate conveying mechanism comprises a red wafer bit, a green wafer bit and a blue wafer bit; each die bonder can transfer and mount three kinds of wafers to a target substrate conveyed to the die bonder, wherein the three kinds of wafers are respectively a red LED chip, a green LED chip and a blue LED chip.

Wherein, the substrate conveying mechanism is a conveyor belt.

The die bonding equipment comprises a carrying platform, a die disc and a swing arm; the carrying platform is used for carrying a target substrate carried by the carrying mechanism, and a first driving mechanism is arranged on the carrying platform and used for driving the target substrate placed on the carrying platform to move so as to enable each wafer contained in one wafer position unit group on the target substrate to move to a wafer fixing station; the number of the wafer disks is multiple, each wafer disk is used for placing wafers, and the wafers placed on at least one wafer disk are different from those placed on other wafer disks; the number of the swing arms is multiple, each swing arm corresponds to one wafer disc, and the swing arms respectively correspond to a plurality of wafer positions in one wafer position unit group of the target substrate; each swing arm is provided with a second driving mechanism, and each second driving mechanism is used for driving the corresponding swing arm to sequentially move from the wafer disc corresponding to the swing arm to the die bonding station and from the die bonding station to the wafer disc corresponding to the swing arm; the swing arms are used for taking wafers at the corresponding wafer disks respectively and transferring the wafers to corresponding wafer positions of a wafer position unit group located at a wafer fixing station on a target substrate in sequence at the wafer fixing station.

The die bonding station is provided with an image acquisition device, and the image acquisition device is used for acquiring an image of a target substrate.

The die bonding equipment further comprises a control mechanism for controlling the plurality of second driving mechanisms, and the control mechanism controls the swing arms to sequentially reach corresponding wafer positions in the wafer position unit groups of the die bonding stations on the target substrate under the driving of the corresponding second driving mechanisms.

Compared with the prior art, the technical scheme provided by the embodiment of the invention has the following advantages:

in the die bonding line provided by the embodiment of the invention, when a die bonding process is carried out, firstly, a target substrate is conveyed to a position corresponding to the die bonding equipment by the substrate conveying mechanism, then, the target substrate is conveyed to the die bonding equipment from the substrate conveying mechanism by the conveying mechanism, then, various wafers are transferred and mounted on the target substrate by the die bonding equipment, and then, the target substrate on which various wafers are transferred and mounted is conveyed to the substrate conveying mechanism from the die bonding equipment by the conveying mechanism. In the above process, only one transfer process (including the transfer of the target substrate from the substrate transfer mechanism to the die bonding apparatus and the transfer of the target substrate from the die bonding apparatus to the substrate transfer mechanism) is required, and only one alignment process (i.e., the detection of whether the position of the target substrate is accurate and not shifted after the target substrate is transferred from the substrate transfer mechanism to the die bonding apparatus) is required during the position transfer process caused by the transfer. Compared with the technical scheme that multiple carrying processes are required to be carried out on the substrate conveying mechanism and the multiple die bonder equipment in the prior art, the die bonder assembly line in the embodiment of the invention only needs one carrying process, so that the time consumption of a non-crystal wafer transfer installation link in the die bonder technological process is reduced, and the technological efficiency can be improved; meanwhile, the process links of multiple times of conveying among a plurality of die bonder equipment are omitted, and the probability of occurrence of process errors is correspondingly reduced.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention.

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without inventive exercise.

FIG. 1 is a schematic diagram of a conventional die bonding line;

FIG. 2 is a schematic diagram of a die bonding assembly line according to an embodiment of the present invention;

FIG. 3 is a schematic top view of the die attach apparatus shown in FIG. 2;

FIG. 4 is a schematic perspective view of the die bonding apparatus shown in FIG. 2;

fig. 5 is a schematic structural diagram of a swing arm and a wafer tray in the die bonding apparatus shown in fig. 2.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.

(1) Embodiments of die attach line

In the present embodiment, as shown in fig. 2, the die bonding line includes a substrate conveying mechanism 10, a conveying mechanism (not shown), and a die bonding apparatus 20. The substrate transfer mechanism 10 is used for transferring a target substrate to be die-bonded. The number of the die bonding apparatuses 20 is plural, and the plural die bonding apparatuses 20 are sequentially distributed on the side of the substrate conveying mechanism 10 along the conveying direction of the substrate conveying mechanism 10. The conveying mechanism is used for conveying the target substrate between the substrate conveying mechanism 10 and each die bonding equipment 20; each die bonding apparatus 20 can transfer and mount a plurality of kinds of wafers onto a target substrate carried to the die bonding apparatus 20.

In the die bonding line according to the present embodiment, when performing the die bonding process, the target substrate is first transferred to a position corresponding to the die bonding apparatus 20 by the substrate transfer mechanism 10, then the target substrate is transferred from the substrate transfer mechanism 10 to the die bonding apparatus 20 by the transfer mechanism, then the multiple types of wafers are transferred and mounted on the target substrate by the die bonding apparatus 20, and then the target substrate on which the multiple types of wafers are transferred and mounted is transferred from the die bonding apparatus 20 to the substrate transfer mechanism 10 by the transfer mechanism. In the above process, only one transfer process (including the transfer of the target substrate from the substrate transfer mechanism 10 to the die bonding apparatus 20 and the transfer of the target substrate from the die bonding apparatus 20 to the substrate transfer mechanism 10 again) is required, and only one alignment process (i.e., the detection of whether the position of the target substrate is accurate and not shifted after the target substrate is transferred from the substrate transfer mechanism 10 to the die bonding apparatus 20) is required during the position transfer caused by the transfer. Compared with the technical scheme that multiple carrying processes need to be carried out on the substrate conveying mechanism and the multiple die bonder in the prior art, the die bonder assembly line in the embodiment only needs one carrying process, so that the time consumption of a non-crystal wafer transfer installation link in the die bonder technological process is reduced, and the technological efficiency can be improved; meanwhile, the process links of multiple times of conveying among a plurality of die bonder equipment are omitted, and the probability of occurrence of process errors is correspondingly reduced.

Specifically, the substrate conveyance mechanism 10 may be a conveyor belt. Of course, the substrate conveying mechanism 10 may be any other device having a function of conveying an article, other than the conveyor belt.

Referring to fig. 2, in the present embodiment, the plurality of die attach devices 20 are distributed on two sides of the substrate transport mechanism 10, so that the number of die attach devices 20 performing die attach processes matched with the substrate transport mechanism 10 can be increased, and more die attach devices 20 perform die attach processes simultaneously, thereby improving the die attach process efficiency. Specifically, in the die bonding process, the substrate transfer mechanism 10 may transfer a plurality of target substrates to positions corresponding to the plurality of die bonding apparatuses 20 located on both sides of the substrate transfer mechanism 10, respectively, transfer the target substrates from the substrate transfer mechanism 10 to the die bonding apparatuses 20 by the corresponding transfer mechanisms, and transfer the target substrates from the die bonding apparatuses 20 to the substrate transfer mechanism 10 after the die bonding apparatuses 20 complete the wafer transfer and mounting.

Each wafer bit unit group on the target substrate transferred on the substrate transfer mechanism 10 includes n wafer bits; n is not less than 2 and is an integer; each die bonding apparatus 20 can transfer and mount n kinds of wafers to the target substrate transported to the die bonding apparatus 20, and the n kinds of wafers correspond to n kinds of wafer sites in each wafer site unit group on the target substrate one to one. Specifically, each wafer bit cell group on the target substrate transferred on the substrate transfer mechanism 10 includes a red wafer bit, a green wafer bit, and a blue wafer bit; each die bonding apparatus 20 can transfer and mount three kinds of wafers, which are a red LED chip, a green LED chip, and a blue LED chip, to the target substrate that is carried onto the die bonding apparatus 20. As described in the background section, in the conventional die bonding assembly line, when a die bonding process is performed on an RGB substrate, three die bonding machines are required to mount a red LED chip, a green LED chip, and a blue LED chip on the RGB substrate, respectively, and a conveyor belt and a plurality of die bonding machines are required to carry the RGB substrate for multiple times; in this embodiment, the red LED chips, the green LED chips and the blue LED chips are transferred to the target substrate in only one die bonder 20, and the target substrate is not required to be transported and conveyed between the die bonder 20 by the substrate transport mechanism 10 and the transport mechanism.

Specifically, referring to fig. 3 to 5, the die bonder apparatus 20 includes a stage (not shown), a wafer plate 21, and a swing arm 22. The stage is used for carrying a target substrate (not shown in the figure), and the stage is provided with a first driving mechanism (not shown in the figure), wherein the first driving mechanism is used for driving the target substrate placed on the stage to move, so that each wafer contained in one wafer position unit group on the target substrate moves to the wafer fixing station. Specifically, the first driving mechanism can drive the target substrate to move, so that different wafer bit unit groups on the target substrate are located at the die bonding station.

Specifically, the first driving mechanism includes two sub-driving mechanisms for driving the target substrate to move in two mutually perpendicular directions within a horizontal plane, respectively; through the two sub-driving mechanisms, the first driving mechanism can drive the target substrate to move at any position in the horizontal plane, so that each wafer position contained in any wafer position unit group on the target substrate is positioned at a die bonding station.

The number of the wafer disks 21 is multiple, each wafer disk 21 is used for placing a wafer, and at least one wafer disk 21 is placed with a different wafer from other wafer disks 21. Specifically, each wafer tray 21 is provided with an ejector pin mechanism for ejecting a chip in a wafer placed on the wafer tray 21, so that the lifted chip can be taken out when the swing arm 22 moves to the wafer tray 21.

The number of the swing arms 22 is plural, each swing arm 22 corresponds to one wafer disk 21, and the plural swing arms 22 respectively correspond to plural wafer bits in one wafer bit unit group of the target substrate. Each swing arm 22 is provided with a second driving mechanism 23, and each second driving mechanism 23 is used for driving the corresponding swing arm 22 to move from the wafer disc 21 corresponding to the swing arm 22 to the die bonding station in sequence and from the die bonding station to the wafer disc 21 corresponding to the swing arm 22. The swing arms 22 are used for taking the chips from the corresponding wafer trays 21 and transferring the chips to the corresponding chip sites of a chip site unit group on the target substrate in sequence at the die bonding station. Specifically, each swing arm 22 has, in addition to the second drive mechanism 23, another drive mechanism for driving the swing arm 22 to move in the vertical direction; when the swing arm 22 reaches the wafer disk 21 to pick up the wafer, the swing arm 22 is driven by the driving mechanism to move in the vertical direction, and the wafer lifted by the ejector pin mechanism is transferred to the swing arm 22, so that the wafer is picked up.

The die bonding equipment comprises a carrier, wherein a first driving mechanism is arranged on the carrier, and a target substrate placed on the carrier can be moved through the first driving mechanism, so that different wafer bit cell groups on the target substrate are moved to a die bonding station. The number of the swing arms 22 is multiple, each swing arm 22 corresponds to one wafer disk 21 and corresponds to one wafer position in one wafer position unit group on the target substrate, and each swing arm 22 can be driven by a corresponding second driving mechanism to move to the wafer disk 21 corresponding to the swing arm 22, pick up a wafer at the wafer disk 21, and move to a die bonding station on the carrier under the driving of the second driving mechanism, so as to transfer and mount the wafer to the wafer position corresponding to the swing arm 22 in the wafer position unit group on the target substrate and located at the die bonding station. In the plurality of wafer disks 21, at least one wafer disk 21 is different from the other wafer disks 21 in wafer placement, that is, the plurality of wafer disks 21 are different in wafer placement with at least two different types of chips. The number of the types of wafers placed on the plurality of wafer disks 21 and the type of the wafer placed on each wafer disk 21 can be set as required, so that each swing arm 22 can pick up the wafer at the wafer disk 21 corresponding to the swing arm 22, and the picked wafer is the same as the type of the wafer to be placed at the wafer position corresponding to the swing arm 22. In this case, when each wafer site included in one wafer site unit group on the target substrate is located at the die bonding station, the plurality of swing arms 22 may take one wafer at each corresponding wafer disk 21 and transfer and mount the taken one wafer to each wafer site in the wafer site unit group at the die bonding station, respectively, during which the target substrate does not need to be moved by the first driving mechanism. After the transfer installation of the wafers in each wafer position included in one wafer position unit group on the target substrate is completed, the target substrate needs to be moved by the first driving mechanism to a position where each wafer position in the next wafer position unit group on the target substrate is located at the die bonding station, and then the swing arms 22 transfer and install the corresponding wafer to each wafer position in the wafer position unit group. And repeating the process to finish the transfer installation of the wafers of all wafer positions on the target substrate.

Specifically, in the present embodiment, the number of the wafer disks 21 is three, and the three wafer disks are respectively used for placing three different wafers, namely, a wafer with red LED chips, a wafer with green LED chips, and a wafer with blue LED chips. One wafer bit cell group on the target substrate has three wafer bits, which respectively require the transfer of mounted wafers as red LED chips, green LED chips, and blue LED chips. The number of the swing arms 22 is three, and the three swing arms correspond to the three wafer disks 21 respectively, and correspond to three wafer positions included in one wafer position unit group on the target substrate respectively. When each chip position included in one chip position unit group on the target substrate is located at a die bonding station, the first swing arm 22 is used for taking a red LED chip at a wafer disc 21 where a wafer with the red LED chip is placed, and transferring and installing the taken red LED chip to the chip position where the red LED chip is required to be placed in the die bonding station unit group on the target substrate at the die bonding station; the second swing arm 22 is used for taking the green LED chip from the wafer tray 21 on which the wafer with the green LED chip is placed, and transferring and mounting the taken green LED chip to a wafer position on the target substrate, where the green LED chip is required to be placed, in the die bonding position unit group at the die bonding station; the third swing arm 22 is used for taking the blue LED chips from the wafer tray 21 on which the wafer with the blue LED chips is placed, and transferring and mounting the taken blue LED chips to the wafer positions on the target substrate in the die bonding position unit group where the blue LED chips are required to be placed at the die bonding position.

In this embodiment, an image acquisition device 24 is disposed at the die bonding station, and the image acquisition device 24 is used for acquiring an image of the target substrate. The image of the target substrate acquired by the image acquisition device 24 may be used to determine whether the target substrate after movement satisfies that each wafer position included in the next wafer position unit group is located in the die bonding station after the first driving mechanism drives the target substrate to move. If the position of the target substrate is not satisfied, the position of the target substrate needs to be further adjusted, for example, the target substrate is driven to move continuously by the first driving mechanism. If the wafer position is satisfied, the swing arms 22 can respectively transfer and mount the corresponding wafer to each wafer position in the wafer position unit group positioned at the die bonding station.

It should be noted that the image captured by the image capturing device 24 may include not only a photograph, but also a dynamic video, and may also be continuous, real-time video monitoring information.

In order to improve the process efficiency, the die bonding equipment further comprises a control mechanism for controlling the plurality of second driving mechanisms 23, and the control mechanism controls the two swing arms 22 which continuously reach the die bonding station under the driving of the corresponding second driving mechanisms 23 to reach the die bonding station.

As described above, in the die bonding line according to the present invention, when performing the die bonding process, the target substrate is first transferred to a position corresponding to the die bonding apparatus 20 by the substrate transfer mechanism 10, then the target substrate is transferred from the substrate transfer mechanism 10 to the die bonding apparatus 20 by the transfer mechanism, then the plurality of types of wafers are transferred and mounted on the target substrate by the die bonding apparatus 20, and then the target substrate on which the plurality of types of wafers are transferred and mounted is transferred from the die bonding apparatus 20 to the substrate transfer mechanism 10 by the transfer mechanism. In the above process, only one transfer process (including the transfer of the target substrate from the substrate transfer mechanism 10 to the die bonding apparatus 20 and the transfer of the target substrate from the die bonding apparatus 20 to the substrate transfer mechanism 10 again) is required, and only one alignment process (i.e., the detection of whether the position of the target substrate is accurate and not shifted after the target substrate is transferred from the substrate transfer mechanism 10 to the die bonding apparatus 20) is required during the position transfer caused by the transfer. Compared with the technical scheme that multiple carrying processes need to be carried out on the substrate conveying mechanism and the multiple die bonder in the prior art, the die bonder assembly line in the embodiment only needs one carrying process, so that the time consumption of a non-crystal wafer transfer installation link in the die bonder technological process is reduced, and the technological efficiency can be improved; meanwhile, the process links of multiple times of conveying among a plurality of die bonder equipment are omitted, and the probability of occurrence of process errors is correspondingly reduced.

It is noted that, in this document, relational terms such as "first" and "second," and the like, may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

The foregoing are merely exemplary embodiments of the present invention, which enable those skilled in the art to understand or practice the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.