阅读说明：本技术 一种用于印刷线路板的转印法油墨加工工艺 (Transfer printing ink processing technology for printed circuit board ) 是由 韩少华 王健 孙彬 沈洪 李晓华 于 2019-11-19 设计创作，主要内容包括：本发明公开了一种用于印刷线路板的转印法油墨加工工艺,涉及印刷油墨技术领域,包括以下步骤：Sp1：取一定长度的离型纸类物品,将油墨按照印刷线路板的油墨印刷区域印刷在离型纸类物品上；Sp2：经过处理制作成膜状油墨,将带有膜状油墨的离型纸类物品卷起,方便生产；Sp3：在印刷线路板的油墨开窗边缘设置挡板,按照印刷线路板油墨印刷区域和边缘挡板位置将经过处理后的膜状油墨套在印刷线路板上；本发明通过在印刷线路板的油墨开窗区域边缘设置挡板,并且油墨经过处理后得到了膜状油墨,大大提高油墨转印的精准度,可以在制作膜状油墨阶段制作出各种厚度的膜状油墨,采用转印的加工工艺,使产品的弯折性能得到了很大的提升。(The invention discloses a transfer printing ink processing technology for a printed circuit board, which relates to the technical field of printing ink and comprises the following steps: sp 1: taking a release paper article with a certain length, and printing ink on the release paper article according to an ink printing area of a printed circuit board; sp 2: the film-shaped ink is prepared by processing, and the release paper articles with the film-shaped ink are rolled up, so that the production is convenient; sp 3: arranging a baffle plate at the edge of an ink window of the printed circuit board, and sleeving the processed film-shaped ink on the printed circuit board according to the ink printing area and the edge baffle plate of the printed circuit board; according to the invention, the baffle is arranged at the edge of the ink windowing area of the printed circuit board, and the ink is processed to obtain the film-shaped ink, so that the accuracy of ink transfer printing is greatly improved, the film-shaped ink with various thicknesses can be manufactured in the film-shaped ink manufacturing stage, and the bending performance of the product is greatly improved by adopting the transfer printing processing technology.)

1. A transfer printing ink processing technology for a printed circuit board is characterized by comprising the following steps:

sp 1: taking a release paper article with a certain length, and printing ink on the release paper article according to an ink printing area of a printed circuit board;

sp 2: the film-shaped ink is prepared by processing, and the release paper articles with the film-shaped ink are rolled up, so that the production is convenient;

sp 3: arranging a baffle plate at the edge of an ink window of the printed circuit board, and sleeving the processed film-shaped ink on the printed circuit board according to the ink printing area and the edge baffle plate of the printed circuit board;

sp 4: and heating to cure the ink to finish the processing.

2. The process of claim 1, wherein the ink has a thickness in the range of 5um to 50 um.

3. The transfer printing ink processing technology for the printed circuit board according to claim 2, wherein the thickness tolerance range of the ink is ± 5 um.

4. The transfer printing ink processing technology for the printed circuit board according to claim 1, wherein the position tolerance range of the ink is ± 50 um.

5. A process according to claim 1, wherein the ink is of the solid or liquid ink type.

Technical Field

The invention relates to the technical field of printing ink, in particular to a transfer printing method ink processing technology for a printed circuit board.

Background

With the rapid development of the current society, electronic products have occupied an important position in the life of people, the requirements of people on the electronic products are not only on the level of daily use, and people pursue high quality, high performance and new styles of the electronic products. Therefore, the printed circuit board industry is more inclined to the development of products with good bending performance, light weight, thinness, shortness and smallness. Meanwhile, how to produce a more precise circuit with good bending performance, light weight, thinness, shortness and smallness becomes a big problem, most of the printed circuit board industries improve the bending performance of the product through an ink printing process, and the printed circuit boards are: the support is an important electronic component, is a support of an electronic component, and is a carrier for electrical connection of the electronic component. Because it is made by adopting electronic printing technique, so it is called as printed circuit board, at present, the most widely used technique is to print the ink placed on the printing screen on the circuit board by using the force of scraper, the basic operation steps are that the screen manufacturer can draw the corresponding pattern on the screen according to the provided pattern, so as to make it possible to leak the ink in the designated area; installing a printing screen on a machine table; adding the diluted, proportioned and stirred ink onto a screen plate of a machine table; and scraping the ink by a scraper to enable the ink to be printed in a specified area of the circuit board, baking after printing is finished, and solidifying the ink.

However, the current printing ink technology is influenced by the screen mesh number, the scraper hardness, the scraper angle and other factors, the ink thickness cannot be thinner, the service life of the screen is limited, a new screen needs to be maintained and purchased at regular intervals, manpower and capital are consumed, the cost is increased, the printing ink needs to be placed on the screen and exposed in the air during printing, drying is accelerated, the condition of screen blocking is easily caused, the production efficiency is reduced, the cost is increased, the pressure and the angle of the scraper are difficult to control, the conditions of uneven color, uneven thickness and the like are often caused, overflow is easily caused at the edge of the printing ink, and the machine is lifted to finish printing.

Disclosure of Invention

The invention aims to provide a transfer printing ink processing technology for a printed circuit board, and aims to solve the problems that the prior printing ink technology is influenced by factors such as screen mesh number, scraper hardness, scraper angle and the like, the thickness of the printing ink cannot be thinner, the service life of a screen is limited, a new screen needs to be maintained and purchased periodically, manpower and capital are consumed, the cost is increased, the printing ink needs to be placed on the screen and exposed in the air during printing, drying is accelerated, the condition of screen blocking is easy to generate, the production efficiency is reduced, the cost is increased, the pressure and the angle of a scraper are difficult to control, the conditions of uneven color, uneven thickness and the like are often caused, overflow is easy to generate at the edge of the printing ink, and printing is finished by lifting a machine table.

In order to achieve the purpose, the invention provides the following technical scheme:

a transfer printing ink processing technology for a printed circuit board comprises the following steps:

sp 1: taking a release paper article with a certain length, and printing ink on the release paper article according to an ink printing area of a printed circuit board;

sp 2: the film-shaped ink is prepared by processing, and the release paper articles with the film-shaped ink are rolled up, so that the production is convenient;

sp 3: arranging a baffle plate at the edge of an ink window of the printed circuit board, and sleeving the processed film-shaped ink on the printed circuit board according to the ink printing area and the edge baffle plate of the printed circuit board;

sp 4: and heating to cure the ink to finish the processing.

As a further scheme of the invention: the thickness range of the ink is 5um-50 um.

As a further scheme of the invention: the thickness tolerance range of the ink is +/-5 um.

As a further scheme of the invention: the position tolerance range of the ink is +/-50 um.

As a further scheme of the invention: the type of ink is solid or liquid ink type.

Compared with the prior art, the invention has the beneficial effects that:

according to the invention, the baffle is arranged at the edge of the printing ink windowing area of the printed circuit board, and the printing ink is processed to obtain the membrane-shaped printing ink, so that the printing ink transfer printing precision is greatly improved, the width of the membrane-shaped printing ink can be set according to the width of a spliced board of the printed circuit, the printing ink is suitable for various types and types of widths, membrane-shaped printing inks with various thicknesses can be manufactured in the membrane-shaped printing ink manufacturing stage, and further, various printing ink thicknesses are met.

Drawings

FIG. 1 is a schematic representation of the present invention before ink transfer;

FIG. 2 is a schematic illustration of an ink transfer process according to the present invention;

FIG. 3 is a schematic representation of the ink of the present invention after transfer;

FIG. 4 is a schematic view of a film ink of the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1 to 4, in an embodiment of the present invention, a transfer printing ink processing process for a printed circuit board includes the following steps:

sp 1: taking a release paper article with a certain length, and printing ink on the release paper article according to an ink printing area of a printed circuit board;

sp 2: the film-shaped ink is prepared by processing, and the release paper articles with the film-shaped ink are rolled up, so that the production is convenient;

sp 3: arranging a baffle plate at the edge of an ink window of the printed circuit board, and sleeving the processed film-shaped ink on the printed circuit board according to the ink printing area and the edge baffle plate of the printed circuit board;

sp 4: and heating to cure the ink to finish the processing.

The thickness range of printing ink is 5um-50um, the thickness tolerance range of printing ink is 5um, the position tolerance range of printing ink is 50um, the type of printing ink is solid-state or liquid printing ink type.

The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention are equivalent to or changed within the technical scope of the present invention.