阅读说明：本技术 一种新型贴片式倾斜滚珠开关及其集成压合生产工艺 (Novel patch type inclined ball switch and integrated pressing production process thereof ) 是由 忽鹏飞 于 2019-12-04 设计创作，主要内容包括：本发明涉及一种新型贴片式倾斜滚珠开关及其集成压合生产工艺,包括上盖板、中板、角度卡位板和导电滚珠,上盖板内侧设有第一金属导电层,第一金属导电层有1个形成单方向感应结构或有2个形成双方向感应结构或有多个形成多方向感应结构,中板中心处设有用于放置导电滚珠的大圆孔,大圆孔内壁、中板表面设有第二金属导电层,角度卡位板中心处设有用于限位导电滚珠的小圆孔,本发明新型贴片式倾斜滚珠结构新颖,上盖板的第一金属导电层结构形式多样,使开关可以有单方向、双方向、多方向的检测功能,功能齐全满足要求,而且采用集成压合生产工艺可实现大批量生产贴片式倾斜滚珠开关,提高生产效率,降低成本,实用性强,为产品提供更好竞争优势。(The invention relates to a novel chip type inclined ball switch and an integrated pressing production process thereof, which comprises an upper cover plate, a middle plate, an angle clamping plate and conductive balls, wherein a first metal conductive layer is arranged at the inner side of the upper cover plate, 1 or 2 or more than two sensing structures are formed to form a unidirectional sensing structure, a plurality of sensing structures are formed to form multiple directions, a large round hole for placing the conductive balls is arranged at the center of the middle plate, a second metal conductive layer is arranged on the inner wall of the large round hole and the surface of the middle plate, and a small round hole for limiting the conductive balls is arranged at the center of the angle clamping plate. The production efficiency is improved, the cost is reduced, the practicability is high, and better competitive advantage is provided for products.)

1. The utility model provides a novel SMD slope ball switch which characterized in that: including the upper cover plate, the medium plate, angle screens board and electrically conductive ball, the upper cover plate lid closes in the medium plate top, the upper cover plate inboard is equipped with first metal conducting layer, first metal conducting layer has 1 formation folk prescription to respond to the structure or has 2 formation bidirectional response structures or has a plurality of multidirectional response structures of formation, medium plate center department is equipped with the great circle hole that is used for placing electrically conductive ball, great circle hole diameter is greater than electrically conductive ball diameter, the great circle hole inner wall, the medium plate surface is equipped with second metal conducting layer, the angle screens board is closed to medium plate below, angle screens board center department is equipped with the small circle hole that is used for spacing electrically conductive ball, the small circle hole is for not switching on the blind hole, small circle hole diameter is less than electrically conductive ball diameter, the small circle hole inner wall, angle screens board surface is equipped with third metal conducting layer, the angle screens board outside is.

2. The novel patch type tilt ball switch according to claim 1, wherein: the shape of the first metal conductive layer is semi-annular when 1 of the first metal conductive layers is provided.

3. The novel patch type tilt ball switch according to claim 1, wherein: the first metal conductive layer has a shape of [ shape ] when 2.

4. The novel patch type tilt ball switch according to claim 3, wherein: the first metal conductive layers are independent of each other in 2 or are electrically connected to each other through a wire.

5. The novel patch type tilt ball switch according to claim 1, wherein: the first metal conductive layers are arranged around the central axis of the small round hole in an equal circumference mode.

6. The novel patch type tilt ball switch according to claim 1, wherein: the first metal conductive layers are independent from each other and are not connected to each other by wires or are connected to each other by wires.

7. The novel patch type tilt ball switch according to claim 1, wherein: the bottom section of the small round hole is conical.

8. The utility model provides a novel SMD slope ball switch which characterized in that: including the upper cover plate, the medium plate, angle screens board and electrically conductive ball, the upper cover plate lid closes in the medium plate top, the upper cover plate inboard is equipped with first metal conducting layer, medium plate center department is equipped with the big round hole that is used for placing electrically conductive ball, big round hole diameter is greater than electrically conductive ball diameter, big round hole inner wall, the medium plate surface is equipped with second metal conducting layer, medium plate below lid closes angle screens board, angle screens board center department is equipped with the small circle hole that is used for spacing electrically conductive ball, the small circle hole is for not switching on the blind hole, small circle hole diameter is less than electrically conductive ball diameter, small circle downthehole wall, angle screens board surface is equipped with the third metal conducting layer, the third metal conducting layer has 1 formation folk prescription to response structure or has 2 formation bidirectional response structure or has a plurality of multidirectional response structures of formation, the angle screens board outside is equipped with the.

9. A novel integrated pressfitting production technology of a patch type inclined ball switch is characterized in that: comprises the following steps of (a) carrying out,

① pressing the angle clamping plate and the middle plate into a whole, wherein the small round hole of the angle clamping plate and the big round hole of the middle plate are coaxially overlapped;

② placing the conductive ball into the big round hole of the angle clamping plate, the bottom of the conductive ball can be movably embedded into the angle clamping groove, the small big round hole forms a limit step, and the small big round hole and the big round hole are combined to form the limit step;

③ the upper cover plate is integrated on the middle plate by pressing, and the first metal conductive layer is located on the inner side.

Technical Field

The invention relates to the field of surface-mounted ball switches, in particular to a novel surface-mounted inclined ball switch and an integrated pressing production process thereof.

Background

Ball class slope sensing switch changes the on-off state of switch and then transmits the response result to circuit arrangement product through the change of ball response inclination, is often used for realizing trigger circuit, and the slope response awakens functions such as motion detection, if: all kinds of intelligent digital electronic product, the electrical apparatus prevents the function of inclining, a controller, the remote controller rocks the start, intelligence is dressed, electronic watch, the pedometer, automotive electronics, intelligent furniture, door and window device, intelligent electronic toy, the LED lamp, automatic tilting device, the gas table, intelligent well lid, and the slope response of all kinds of control angle or the circuit conversion trigger function under the inspection protection is used, current ball class tilt switch structure is single relatively, can not realize multiple functions, it is limited to detect the direction, the productivity is inefficient, and life is not enough, and is large in size, can not satisfy the operation requirement that can formulate more angles in a flexible way.

Disclosure of Invention

Aiming at the technical problems of single structure, small function, low productivity and efficiency and the like in the prior art, the invention provides a novel patch type inclined ball switch and a production process thereof, and the specific technical scheme is as follows:

the utility model provides a novel SMD slope ball switch, the loach board comprises an upper cover plate, the medium plate, angle screens board and conductive ball, the loach board lid closes in the medium plate top, the upper cover inboard is equipped with first metal conducting layer, first metal conducting layer has 1 formation folk prescription to respond to the structure or has 2 formation bidirectional response structures or have a plurality of multidirectional response structures of formation, medium plate center department is equipped with the big round hole that is used for placing conductive ball, big round hole diameter is greater than conductive ball diameter, big round hole inner wall, the medium plate surface is equipped with second metal conducting layer, the medium plate below lid closes the angle screens board, angle screens board center department is equipped with the small circle hole that is used for spacing conductive ball, little round hole is the blind hole that does not switch on, small circle hole diameter is less than conductive ball diameter, small circle downthehole wall, angle screens board surface is equipped with third metal conducting layer, the angle screens board outside is equipped.

In a preferred embodiment of the present invention, the first metal conductive layer has a shape of a half loop when 1 of the first metal conductive layers is present.

In a preferred embodiment of the present invention, the first metal conductive layer has a shape of [ shape ] when 2 first metal conductive layers are provided.

In a preferred embodiment of the present invention, the first metal conductive layers are 2 independent of each other and are not electrically connected to each other or are electrically connected to each other through a wire.

In a preferred embodiment of the present invention, the first metal conductive layer has a plurality of first metal conductive layers arranged around the central axis of the small circular hole.

In a preferred embodiment of the present invention, the first metal conductive layers are independent of each other and are electrically connected to each other or are electrically connected to each other through a conductive wire.

In a preferred embodiment of the present invention, the bottom of the small round hole has a conical cross section.

A novel integrated pressing production process of a patch type inclined ball switch comprises the following steps,

① pressing the angle clamping plate and the middle plate into a whole, wherein the small round hole of the angle clamping plate and the big round hole of the middle plate are coaxially overlapped;

② placing the conductive ball into the big round hole of the angle clamping plate, the bottom of the conductive ball can be movably embedded into the angle clamping groove, the small big round hole forms a limit step, and the small big round hole and the big round hole are combined to form the limit step;

③ the upper cover plate is integrated on the middle plate by pressing, and the first metal conductive layer is located on the inner side.

The invention has the beneficial effects that: compared with the traditional ball switch, the novel patch type inclined ball switch is novel in structural design, the first metal conducting layer of the upper cover plate is various in structural form, the switch can have a unidirectional, bidirectional and multidirectional detection function, the functions are complete, the requirements are met, the patch type inclined ball switch can be produced in a large scale by adopting an integrated pressing production process, the production efficiency is improved, the cost is reduced, the practicability is high, and better competitive advantages are provided for products.

Drawings

Fig. 1 is an exploded perspective view of a first embodiment of the present invention.

Fig. 2 is a schematic view of the present invention in a flat configuration.

Fig. 3 is a schematic view of the structure of the present invention when tilted.

Fig. 4 is a schematic structural diagram illustrating a unidirectional sensing structure formed on the first metal conductive layer according to the present invention.

Fig. 5 is a schematic structural diagram of the first metal conductive layer forming a bidirectional sensing structure according to the present invention.

Fig. 6 is a schematic structural view of the first metal conductive layer of the present invention having 2 phase electrical connections.

Fig. 7 is a schematic structural diagram of the first metal conductive layer forming a multidirectional sensing structure according to the present invention.

Fig. 8 is a schematic structural view of the first metal conductive layer having a plurality of phase electrical connections according to the present invention.

Fig. 9 is a schematic structural diagram of a first embodiment of the angle clamping plate back pad of the present invention.

Fig. 10 is a schematic structural view of a second embodiment of the angle clamping plate back pad of the present invention.

Fig. 11 is an exploded perspective view of a second embodiment of the present invention.

Fig. 12 is a schematic structural diagram of a third metal conductive layer forming a bidirectional sensing structure according to the present invention.

Fig. 13 is a schematic structural diagram of a third metal conductive layer forming a multidirectional sensing structure according to the present invention.

Detailed Description

The following description of the embodiments of the present invention will be made with reference to the accompanying drawings:

in the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the positions or elements referred to must have specific orientations, be constructed and operated in specific orientations, and thus, should not be construed as limiting the present invention.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood as appropriate by those of ordinary skill in the art.

As shown in FIGS. 1 to 3 (the dotted line in FIG. 1 indicates the inner side structure after the upper cover plate 1 is turned over), a novel chip tilt ball switch comprises an upper cover plate 1, a middle plate 2, an angle position clamping plate 3 and conductive balls 4, wherein the upper cover plate 1 covers the middle plate 2, the inner side of the upper cover plate 1 is provided with a first metal conductive layer 11, the first metal conductive layer 11 has 1 or 2 formed single direction sensing structures or 2 formed double direction sensing structures or a plurality of formed multi-direction sensing structures, the center of the middle plate 2 is provided with a large round hole 21 for placing the conductive balls 4, the diameter of the large round hole 21 is larger than that of the conductive balls 4, the inner wall of the large round hole 21 and the surface of the middle plate 2 are provided with a second metal conductive layer 22, the height of the large round hole 21 is smaller than that of the conductive balls 4, the angle position clamping plate 3 covers the lower part of the middle plate 2, the center of, the small round hole 31 is a non-conductive blind hole, the cross section of the bottom of the small round hole 31 is conical, the diameter of the small round hole 31 is smaller than the diameter of the conductive ball 4, the inner wall of the small round hole 31 and the surface of the angle clamping plate 3 are provided with the third metal conductive layer 32, the third metal conductive layer 32 is in contact with the ball in a circular normal state, the outer side of the angle clamping plate 3 is provided with a bonding pad 33, the number of the bonding pads 33 is multiple, and the upper cover plate 1, the middle plate 2 and the angle clamping plate 3 are PCB substrates.

As shown in fig. 4, when there are 1 first metal conductive layers 11, the first metal conductive layers 11 are in a semi-annular shape, the first metal conductive layers 11 contact with the second metal conductive layers 22 to form one electric shock conductor, and the third metal conductive layers 32 serve as the other electric shock conductor, when the switch tilting conductive balls 4 roll out from the small circular holes to contact with the first metal conductive layers 11 and the third metal conductive layers 32 respectively, the circuit is triggered.

As shown in fig. 5 and 6, the first metal conductive layer 11 is in a shape of a 'shape' when 2 first metal conductive layers 11 are in contact with the second metal conductive layer 22 to form an electric shock conductor, the third metal conductive layer 32 is used as another electric shock conductor, when the switch tilting conductive ball 4 rolls out from the small circular hole to respectively contact the first metal conductive layer 11 and the third metal conductive layer 32 to communicate with the circuit to be in a trigger state, at this time, if the first metal conductive layer has 2 mutually independent non-electric wire connections, the ball rolls out to contact different first metal conductive layers to trigger 2 different circuits, at this time, if the first metal conductive layer 11 has 2 mutually electric wire connections through wires, a single circuit is also triggered.

As shown in fig. 7 and 8, a plurality of first metal conductive layers 11 are arranged around the central axis of the small circular hole, preferably 8 in this embodiment, the first metal conductive layers 11 are in contact with the second metal conductive layers 22 to form one electric shock conductor, the third metal conductive layers 32 are used as another electric shock conductor, when the switch tilting conductive balls 4 roll out from the small circular holes to respectively contact the first metal conductive layers 11 and the third metal conductive layers 32 to connect with the circuit to be in a trigger state, the first metal conductive layers are independent from each other and are not connected with the electric wire, the ball rolls out to contact different first metal conductive layers to trigger different circuits, and at this time, if the plurality of first metal conductive layers 11 are connected with the electric wire through the electric wire, a single circuit is also triggered.

As shown in fig. 11-13, a novel patch type tilt ball switch, including an upper cover plate 1, a middle plate 2, an angle position clamping plate 3 and a conductive ball 4, the upper cover plate 1 covers the middle plate 2, the inner side of the upper cover plate 1 is provided with a first metal conductive layer 11, the first metal conductive layer 11 is circular as long as the ball rolls out of a small round hole and can contact, the center of the middle plate 2 is provided with a large round hole 21 for placing the conductive ball 4, the diameter of the large round hole 21 is larger than the diameter of the conductive ball 4, the inner wall of the large round hole, the surface of the middle plate is provided with a second metal conductive layer 22, the lower side of the middle plate 2 covers the angle position clamping plate 3, the center of the angle position clamping plate 3 is provided with a small round hole 31 for limiting the conductive ball, the small round hole 31 is a non-conductive blind hole, the diameter of the small round hole is smaller than the diameter of the conductive ball, the inner wall of the small round hole, the surface of the angle position clamping plate is provided In the multi-directional sensing structure, the outer side of the angle position clamping plate 3 is provided with a bonding pad 33, the shape of the third metal conducting layer 32 is semi-annular when 1, the shape of the third metal conducting layer 32 is [ shaped ] when 2, the third metal conducting layer 32 is arranged around the central axis of the small round hole in an equal circumference mode when a plurality of the third metal conducting layers are arranged, the structure of the third metal conducting layer 32 is the same as that of the first metal conducting layer 11 in the first switch, the principle is similar, the structure can be known through the above description for the skilled person, and the description is omitted.

A novel integrated pressing production process of a patch type inclined ball switch comprises the following steps,

① pressing the angle clamping plate and the middle plate into a whole, wherein the small round hole of the angle clamping plate and the big round hole of the middle plate are coaxially overlapped;

② placing the conductive ball into the big round hole of the angle clamping plate, the bottom of the conductive ball can be movably embedded into the angle clamping groove, the small big round hole forms a limit step, and the small big round hole and the big round hole are combined to form the limit step;

③ the upper cover plate is integrated on the middle plate by pressing, and the first metal conductive layer is located on the inner side.

The above description is for the purpose of describing the invention in more detail with reference to specific preferred embodiments, and it should not be construed that the embodiments of the invention are limited to those described herein, and it will be apparent to those skilled in the art that various changes and modifications can be made without departing from the spirit and scope of the invention.