阅读说明：本技术 层叠体的制造方法、层叠体及柔性印刷基板的制造方法 (Method for manufacturing laminate, and method for manufacturing flexible printed board ) 是由 笠井涉 小寺省吾 于 2018-04-24 设计创作，主要内容包括：本发明提供褶皱和层间剥离得到抑制的层叠体及其制造方法、以及褶皱和层间剥离的发生得到抑制的柔性印刷基板的制造方法。该层叠体的制造方法中,在由耐热性基材层和金属箔层中的任一者或两者构成的第一基材的一侧或两侧配置具有第一面和第二面的第二基材,以使所述第一面朝向所述第一基材侧,一边搬运所述第一基材和所述第二基材,一边在0℃～100℃的温度T<Sub>1</Sub>下在厚度方向上加压进行层叠,得到所述第一基材和所述第二基材直接层叠而成的层叠体I；其中,所述第一面含有氟树脂,浸润张力为30～60mN/m；所述第二面的浸润张力比第一面的浸润张力小2mN/m以上。(Hair brushProvided are a laminate in which wrinkles and interlayer peeling are suppressed, a method for manufacturing the laminate, and a method for manufacturing a flexible printed board in which wrinkles and interlayer peeling are suppressed. In the method for producing the laminate, a second substrate having a first surface and a second surface is disposed on one side or both sides of a first substrate composed of either or both of a heat-resistant base material layer and a metal foil layer, and the first substrate and the second substrate are conveyed while the first substrate and the second substrate are moved so that the first surface faces the first substrate side, and the temperature T is 0 to 100 DEG C 1 Laminating the first base material and the second base material under pressure in the thickness direction to obtain a laminate I in which the first base material and the second base material are directly laminated; wherein the first surface contains fluororesin, and the infiltration tension is 30-60 mN/m; the second surface has a wetting tension that is 2mN/m or more lower than that of the first surface.)

1. A method for producing a laminate, characterized in that a second substrate having a first surface and a second surface is disposed on one side or both sides of a first substrate comprising a heat-resistant substrate layer and a metal foil layer, and the first substrate and the second substrate are conveyed while the first substrate and the second substrate are moved so that the first surface faces the first substrate side, and the temperature T is 0 to 100 DEG C₁Laminating the first base material and the second base material under pressure in the thickness direction to obtain a laminate I in which the first base material and the second base material are directly laminated; wherein the first surface contains a fluororesin and has a wetting tension of 30 to 60mN/m as measured in accordance with JIS K6768: 1999; the wetting tension of the second surface is 2mN/m or more smaller than that of the first surface.

2. The method for producing a laminate according to claim 1, wherein a third substrate comprising either or both of a heat-resistant substrate layer and a metal foil layer is disposed on the second substrate of the laminate I, and the laminate I and the third substrate are transported while being kept at a temperature T equal to or higher than the melting point of the fluororesin₂Then, the laminate I and the third base material were directly laminated by pressing in the thickness direction to obtain a laminate II.

3. The method for producing a laminate according to claim 1 or 2, wherein the control of the wetting tension of the second base material of the laminate I is performed by a surface treatment using corona discharge treatment or vacuum plasma treatment.

4. The method for producing a laminate according to any one of claims 1 to 3, wherein, when the first substrate and the second substrate are conveyed, the respective elongations of the first substrate and the second substrate, which are determined by the following formula 1, are 0.05 to 1.0%, and the difference in the elongations between the first substrate and the second substrate is 0.3% or less;

formula 1: elongation (%) { tension (N) applied to the substrate during conveyance)/section of the substrate in a direction orthogonal to the conveyance directionArea (mm)²) }/temperature T₁Modulus of elasticity (N/mm) of the substrate²)×100。

5. The method for producing a laminate according to any one of claims 1 to 4, wherein a pressing force at the time of laminating the first substrate and the second substrate is 3 to 100 kN/m.

6. The method for producing a laminate according to any one of claims 1 to 5, wherein at least one functional group selected from a carbonyl group, a hydroxyl group, an epoxy group, an amide group, an amino group and an isocyanate group is present in either or both of a terminal group of a main chain and a pendant group of a main chain of the fluororesin.

7. The method for producing the laminate according to any one of claims 1 to 6, wherein the first base material is a heat-resistant resin film, and the water contact angle of the surface thereof is 5 ° to 60 ° as measured by the sessile drop method described in JIS R6769: 1999.

8. The method for producing a laminate according to claim 7, wherein the heat-resistant resin film is a film surface-treated by corona discharge treatment, atmospheric pressure plasma treatment, or vacuum plasma treatment.

9. The method for producing a laminate according to claim 7 or 8, wherein the heat-resistant resin film has a water absorption rate of 1.5% or less.

10. A laminate in which a second substrate having a first surface and a second surface is directly laminated on one side or both sides of a first substrate comprising either or both of a heat-resistant substrate layer and a metal foil layer such that the first surface is on the first substrate side; wherein the first surface contains a fluororesin and has a wetting tension of 30 to 60mN/m as measured in accordance with JIS K6768: 1999; the wetting tension of the second surface is 2mN/m or more smaller than that of the first surface.

11. A method for producing a flexible printed board, wherein the laminate II having a metal foil layer as at least one of the outermost layers is obtained by the method for producing a laminate according to claim 2, and a pattern circuit is formed by removing a part of the metal foil layer of the outermost layer by etching.

Technical Field

The present invention relates to a method for manufacturing a laminate, and a method for manufacturing a flexible printed circuit board, in which wrinkles and interlayer peeling are suppressed.

Background

A laminate of a fluororesin and another raw material effectively exhibits heat resistance, electrical properties, chemical resistance and the like peculiar to the fluororesin, and is suitably used for a base material of a flexible printed circuit board, an electromagnetic wave shielding tape for a cable, a bag for a laminated lithium ion battery and the like.

As a conventional method for producing a laminate of a fluororesin and other raw materials, a hot lamination method can be exemplified. The method comprises the following steps: two or more film-like objects are transported in a roll-to-roll manner, and the two or more film-like objects are bonded together by applying pressure while heating to a temperature at which at least one surface of the film-like objects is softened (or melted) or higher. However, when the laminate is produced by the heat lamination method, the fluororesin layer has a low elastic modulus, is not strong and has low strength, and therefore, there is a problem that the fluororesin layer is wrinkled or the fluororesin layer is broken at the time of bonding.

As a method for producing a laminate of a fluororesin and another raw material, the following method is proposed.

(1) A method of laminating a fluororesin film, both surfaces of which have been subjected to electric discharge treatment, on one surface of an aromatic polyimide film, both surfaces of which have been subjected to electric discharge treatment (patent document 1).

(2) A method in which a polyimide film and a fluororesin film are bonded to each other by applying a load to the films with a heated roller, and then annealing is performed at a temperature equal to or higher than the melting point of the fluororesin (patent document 2).

(3) A method in which a fluororesin film containing a fluororesin having a specific functional group and a metal foil are thermally laminated at a temperature lower than the melting point of the fluororesin, and the fluororesin film of the resulting fluororesin-layer-bearing metal foil and a heat-resistant resin film are thermally laminated at a temperature not lower than the melting point of the fluororesin (patent document 3).

Disclosure of Invention

Technical problem to be solved by the invention

In the methods of patent documents 1 to 3, a fluororesin and another raw material are temporarily laminated at a temperature lower than the melting point of the fluororesin, and then the resultant laminate is permanently laminated at a temperature equal to or higher than the melting point of the fluororesin. Since the temperature of the temporary lamination is lower than the melting point of the fluororesin, wrinkles of the fluororesin layer are suppressed as compared with the case where only the main lamination is performed without performing the temporary lamination.

However, the temporary lamination temperature used in patent documents 1 to 3 is still high, and wrinkles of the fluororesin layer cannot be sufficiently suppressed. In addition, the laminate after temporary lamination (temporary laminate) may curl.

According to the studies of the present inventors, in the methods of patent documents 1 to 3, when the temporary lamination is performed at a lower temperature, the fluororesin layer and another raw material layer cannot be bonded to each other, and a temporary laminate cannot be obtained, or even if a temporary laminate can be obtained, there is a problem that a part between the fluororesin layer and another raw material layer adjacent thereto is peeled off and air enters therein. The wrinkles and peeling in the temporary laminated body remain after the main lamination.

The invention aims to provide a laminated body with suppressed wrinkles and interlayer peeling, a manufacturing method thereof, and a manufacturing method of a flexible printed circuit board with suppressed wrinkles and interlayer peeling.

Technical scheme for solving technical problem

The present invention has the following aspects.

[ 1] A method for producing a laminate, wherein a second substrate having a first surface and a second surface is disposed on one side or both sides of a first substrate comprising either or both of a heat-resistant substrate layer and a metal foil layer, and the first substrate and the second substrate are conveyed while the first substrate and the second substrate are moved so that the first surface faces the first substrate side, and the temperature T is 0 to 100 DEG C₁Laminating the first base material and the second base material under pressure in the thickness direction to obtain a laminate I in which the first base material and the second base material are directly laminated; wherein the first surface contains a fluororesin and has a wetting tension of 30 to 60mN/m as measured in accordance with JIS K6768: 1999; the wetting tension of the second surface is 2mN/m or more smaller than that of the first surface.

[ 2] A method for producing a laminate according to the above [ 1], wherein a third substrate comprising either or both of a heat-resistant substrate layer and a metal foil layer is disposed on the second substrate of the laminate I, and the laminate I and the third substrate are transported while being kept at a temperature T equal to or higher than the melting point of the fluororesin₂Then, the laminate I and the third base material were directly laminated by pressing in the thickness direction to obtain a laminate II.

[ 3] A method for producing a laminate according to the above [ 1] or [ 2], wherein the wetting tension of the second base material of the laminate I is controlled by a surface treatment using corona discharge treatment or vacuum plasma treatment.

[ 4] the method for producing a laminate according to any one of [ 1] to [ 3], wherein, when the first substrate and the second substrate are transported, the respective elongations of the first substrate and the second substrate, which are obtained by the following formula 1, are 0.05 to 1.0%, and the difference in the elongations between the first substrate and the second substrate is 0.3% or less.

Formula 1: elongation (%) { tension (N) applied to the substrate during conveyance)/cross-sectional area (mm) of the substrate in a direction perpendicular to the conveyance direction²) }/temperature T₁Modulus of elasticity (N/mm) of the substrate²)×100

The method for producing a laminate according to any one of [ 1] to [ 4] above, wherein a pressing force at the time of laminating the first base material and the second base material is 3 to 100 kN/m.

The method for producing a laminate according to any one of [ 1] to [ 5] above, wherein at least one functional group selected from a carbonyl group, a hydroxyl group, an epoxy group, an amide group, an amino group and an isocyanate group is present in either or both of a terminal group of the main chain and a pendant group of the main chain of the fluororesin.

The method for producing a laminate according to any one of [ 1] to [ 6] above, wherein the first base material is a heat-resistant resin film, and the contact angle of water on the surface thereof is 5 ° to 60 ° as measured by the static drop method described in JIS R6769: 1999.

The method for producing a laminate according to item [ 7 ] above, wherein the heat-resistant resin film is a film subjected to a surface treatment by corona discharge treatment, atmospheric pressure plasma treatment or vacuum plasma treatment.

The method for producing a laminate according to [ 7 ] or [ 8 ] above, wherein the heat-resistant resin film has a water absorption rate of 1.5% or less.

A laminate in which a second substrate having a first surface and a second surface is directly laminated on one side or both sides of a first substrate comprising either a heat-resistant substrate layer or a metal foil layer so that the first surface is on the first substrate side; wherein the first surface contains a fluororesin and has a wetting tension of 30 to 60mN/m as measured in accordance with JIS K6768: 1999; the wetting tension of the second surface is 2mN/m or more smaller than that of the first surface.

A method for producing a flexible printed board, wherein the laminate II having a metal foil layer as at least one of the outermost layers is obtained by the method for producing a laminate according to [ 2], and a pattern circuit is formed by removing a part of the metal foil layer of the outermost layer by etching.

ADVANTAGEOUS EFFECTS OF INVENTION

The method for producing a laminate of the present invention can continuously and stably produce a laminate in which occurrence of wrinkles, curls, and delamination is suppressed. In the laminate of the present invention, occurrence of wrinkles, curls, and delamination is suppressed. The method for manufacturing a flexible printed board according to the present invention can manufacture a flexible printed board in which the occurrence of wrinkles, curls, and interlayer peeling is suppressed.

Drawings

Fig. 1 is a schematic cross-sectional view showing an example of a laminate I.

Fig. 2 is a schematic cross-sectional view showing an example of the laminate II.

Fig. 3 is a schematic cross-sectional view showing another example of the laminate I.

Fig. 4 is a schematic cross-sectional view showing another example of the laminate II.

Fig. 5 is a schematic configuration diagram showing a laminating apparatus used in the first embodiment of the present invention.

Fig. 6 is a schematic configuration diagram showing a laminating apparatus used in a second embodiment of the present invention.

Fig. 7 is a schematic configuration diagram showing a laminating apparatus used in a third embodiment of the present invention.

Fig. 8 is a diagram illustrating an evaluation method of curl in the example.

Detailed Description

The following terms in the present specification have the following meanings.

The "melting point" refers to a temperature corresponding to the maximum value of a melting peak measured by a Differential Scanning Calorimetry (DSC) method.

The "wetting tension" is a value measured in accordance with JIS K6768: 1999. In the measurement of the wetting tension, a cotton swab soaked with a test solution having a known wetting tension was swiftly wiped on a test piece to form a 6cm length²The state of the liquid film after 2 seconds of application was observed, and the liquid film was considered to be wet if no break occurred. The maximum wetting tension at which no liquid film break occurs is the wetting tension of the test piece. The lower limit of the wetting tension of the test solution defined in JIS K6768: 1999 was 22.6 mN/m.

"thermal expansion and contraction ratio" refers to a value in both the flow direction (MD) and The Direction (TD) perpendicular to the flow direction, which are measured under the conditions of 175 ℃ for 30 minutes by the method specified in ISO11501: 1995.

The "arithmetic average roughness (Ra)" is an arithmetic average roughness measured based on ISO4287:1997, Amd.1:2009(JIS B0601: 2013). The standard length lr (cutoff value λ c) for obtaining the roughness curve in Ra was set to 0.8 mm.

"Melt Flow Rate" means a Melt Flow Rate (MFR) specified in JIS K7210: 1999(ISO 1133: 1997).

"Unit" refers to a radical derived from a monomer formed by polymerization of the monomer. The unit may be a unit directly formed by polymerization, or a unit in which a part of the unit is converted into another structure by treating a polymer.

The "acid anhydride group" refers to a group represented by — C (═ O) -O — C (═ O) -.

A "carbonyl-containing group" is a group having a structure containing a carbonyl group (-C (═ O) -).

"(meth) acrylate" is a generic term for both acrylates and methacrylates.

"to" indicating a numerical range means to include the numerical values described before and after the range as the lower limit value and the upper limit value. When the units of these are the same, they are only described in the upper limit value and omitted in the lower limit value.

"%" means "% by mass" unless otherwise specified.

[ laminate ]

In the method for producing a laminate of the present invention, the following laminate I is produced, and the following laminate II is produced from the laminate I as necessary.

A laminate I: a laminate is formed by directly laminating a second base material on one side or both sides of a first base material such that the first surface thereof is on the first base material side.

And (3) a laminate II: and a laminate wherein a third base material is directly laminated on the second base material of the laminate I.

The first base material is composed of either or both of a heat-resistant base material layer and a metal foil layer.

The second substrate contains a fluororesin. The second base material has a first surface having a wetting tension of 30-60 mN/m and a second surface having a wetting tension of not more than (the wetting tension of the first surface is-2 mN/m).

The second base material may be laminated on one side or both sides of the first base material. From the viewpoint of suppressing warpage of the laminate and obtaining a double-sided metal-clad laminate excellent in electrical reliability, it is preferable to laminate the second base material on both sides of the first base material.

When the second base materials are stacked on both sides of the first base material, the second base materials may be the same or different. From the viewpoint of suppressing warpage of the laminate, it is preferable that the second base materials are the same. Here, the second substrates are the same, and the materials (the type of the fluororesin, the types of other resins and additives, and the compositions such as the contents thereof) constituting the second substrates are the same, and the thicknesses thereof are the same.

The third substrate is composed of either or both of a heat-resistant substrate layer and a metal foil layer.

In the case where the laminate I is a laminate in which the second base material is laminated on both sides of the first base material, the third base material may be laminated on one side of the laminate I or may be laminated on both sides.

When the third base materials are laminated on both sides of the laminate I, the third base materials may be the same or different. From the viewpoint of suppressing warpage of the laminate, the third base materials are preferably the same.

Fig. 1 is a schematic cross-sectional view showing an example of a laminate I. The laminate 10 of this example has a heat-resistant base material layer 12 (first base material) and a second base material 14. The second base material 14 is directly laminated on one side of the heat-resistant base material layer 12 such that the first surface 14a is on the first base material side.

Fig. 2 is a schematic cross-sectional view showing an example of the laminate II. The laminate 20 of this example uses the laminate 10 as the laminate I, and includes the laminate 10 and the metal foil layer 16 (third substrate). The metal foil layer 16 is directly laminated on the second substrate 14 of the laminate 10, and is in contact with the second surface 14b of the second substrate 14.

Fig. 3 is a schematic cross-sectional view showing another example of the laminate I. The laminate 10A of this example has a heat-resistant base material layer 12 (first base material) and two second base materials 14. The two second base materials 14 are laminated on both sides of the heat-resistant base material layer 12 such that the first surface 14a is on the first base material side.

Fig. 4 is a schematic cross-sectional view showing another example of the laminate II. The laminate 20A of this example uses the laminate 10A as the laminate I, and includes the laminate 10A and two metal foil layers 16 (third substrates). The two metal foil layers 16 are directly laminated on the two second substrates 14 of the laminate 10A, respectively, and are in contact with the second surfaces 14b of the second substrates 14.

However, the structures of the laminate I and the laminate II are not limited to the examples shown in fig. 1 to 4, and the first base material and the third base material combined with the first base material may be appropriately changed. The size ratio of the layers in FIGS. 1 to 4 may be changed as appropriate.

For example, in the example shown in fig. 1 and 2, the heat-resistant base material layer 12 of the first base material may be a metal foil layer or a base material composed of a heat-resistant base material layer and a metal foil layer. In the example shown in fig. 2, the metal foil layer 16 of the third substrate may be a substrate composed of a heat-resistant substrate layer or a heat-resistant substrate layer and a metal foil layer.

When the laminate II is used for manufacturing a flexible printed circuit board, the first base material and the third base material are preferably selected so that the outermost layer of at least one of the laminates II is a metal foil layer.

Examples of the laminate structure of the laminate II in which at least one of the outermost layers is a metal foil layer include the following laminate structure.

(1) Heat-resistant substrate layer/second substrate/metal foil layer

(2) (Metal foil layer/Heat-resistant substrate layer)/second substrate/Metal foil layer

(3) (Metal foil layer/Heat-resistant substrate layer)/second substrate/Heat-resistant substrate layer

(4) (Metal foil layer/Heat-resistant substrate layer)/second substrate/(Heat-resistant substrate layer/Metal foil layer)

(5) Metal foil layer/second substrate/heat-resistant substrate layer/second substrate/metal foil layer

(6) (Metal foil layer/Heat-resistant substrate layer)/second substrate/Heat-resistant substrate layer/second substrate/Metal foil layer

(7) (Metal foil layer/Heat-resistant substrate layer)/second substrate/Heat-resistant substrate layer

(8) (Metal foil layer/Heat-resistant substrate layer)/second substrate/Heat-resistant substrate layer/second substrate/(Heat-resistant substrate layer/Metal foil layer)

Here, "heat-resistant substrate layer/second substrate/metal foil layer" in the laminated structure of the above (1) means that the heat-resistant substrate layer, second substrate, and metal foil layer are laminated in this order, and the same applies to other laminated structures.

In the laminated structures (metal foil layer/heat-resistant substrate layer) and (heat-resistant substrate layer/metal foil layer) of the above-described (2) to (4) and (6) to (8), the portion is a substrate composed of the heat-resistant substrate layer and the metal foil layer. The base material is laminated with the second base material in a manner that the outermost layer on the side opposite to the second base material is a metal foil layer.

In the laminated structure of the above (1), either one of the left side (heat-resistant substrate layer side) and the right side (metal foil layer side) of the second substrate may be the first surface side. The same applies to the laminated structures of (2) to (4) above.

The thickness of the laminate II is not particularly limited, but is usually 25 to 200. mu.m. When used for manufacturing a flexible printed circuit board, the thickness is preferably 25 to 200 μm, and particularly preferably 30 to 150 μm.

The interlayer adhesion strength (the adhesion strength at the interface between the first base material and the second base material) in the laminate I is preferably 0.05N/cm or more, more preferably 0.2N/cm or more, and still more preferably 0.3N/cm or more. The upper limit is not particularly limited, but is typically 1.0N/cm or less.

The interlayer adhesion strength (the lower of the adhesion strength at the interface between the first base material and the second base material and the adhesion strength at the interface between the second base material and the third base material) in the laminate II is preferably 9N/cm or more, more preferably 13N/cm or more, and still more preferably 15N/cm or more. The higher the interlayer adhesion strength in the laminate II, the better, and the upper limit is not particularly limited.

The adhesive strength of each laminate I, II was measured by the method described in the following examples.

(first substrate)

The first base material is composed of either or both of a heat-resistant base material layer and a metal foil layer.

< Heat-resistant base Material layer >

The heat-resistant base material layer is a layer containing a heat-resistant base material other than the metal foil.

Examples of the heat-resistant substrate include a heat-resistant resin film, a woven or nonwoven fabric made of inorganic fibers, and a woven or nonwoven fabric made of organic fibers.

Examples of the heat-resistant resin include polyimide (such as aromatic polyimide), polyarylate, polysulfone, polyallyl sulfone (such as polyethersulfone), aromatic polyamide, aromatic polyetheramide, polyphenylene sulfide, polyallyl ether ketone, polyamideimide, and liquid crystal polyester.

The inorganic fibers may, for example, be glass fibers or carbon fibers. Examples of the woven fabric and nonwoven fabric made of inorganic fibers include glass fiber fabrics and glass nonwoven fabrics.

Examples of the organic fiber include aramid fiber and polybenzo

Azole fibers, polyarylate fibers, and the like. Examples of the woven and nonwoven fabrics made of organic fibers include aramid paper and aramidAmine cloth and polyphenyl

Azole cloth and polybenzene

Azole nonwoven fabrics, and the like.

The heat-resistant substrate layer may have a single-layer structure or a multilayer structure.

In the case of an aromatic polyimide film, various commercially available products can be used. For example, カプトン (trade name) EN is available from Tooli-Dupont, Inc. (Egyo レ & デュポン) of single-layer structure. Further, for example, in the case of a multilayer structure, ユーピレックス (trade name) VT and ユーピレックス NVT made by yuken (a yuken china) and ピクシオ (trade name) BP made by bella (カネカ) can be exemplified as those having thermoplastic polyimide layers formed on both sides of an aromatic polyimide film. The liquid crystal polyester may, for example, be ベクスター (trade name) CT-Z manufactured by Colorado corporation (クラレ Co.).

In the polyimide film, the lower the water absorption rate, the less the deterioration of dielectric properties upon moisture absorption, and the less foaming upon lamination at high temperature, which is preferable. As such a polyimide, a copolymer in which the diamine is p-phenylenediamine and the dicarboxylic acid is 3,3 ', 4' -biphenyltetracarboxylic dianhydride is preferred. Further, an aromatic polyimide film having no thermoplastic polyimide layer is preferable.

The water absorption of the heat-resistant base material layer is preferably 2.0% or less, more preferably 1.5% or less, and further preferably 1.3% or less. The water absorption is a weight change rate after immersion in water at 23 ℃ for 24 hours as defined in ASTM D570.

The term "heat resistance" as used herein means that the tensile modulus of elasticity at 260 ℃ which is the lowest temperature in the reflow process is not less than 8 pascals which is 10.

The thickness of the heat-resistant substrate layer is usually 5 to 150 μm, preferably 7.5 to 100 μm, and particularly preferably 12 to 75 μm.

< Metal foil layer >

The metal foil layer is a layer composed of a metal foil. The metal foil can be appropriately selected according to the use of the laminate. For example, when the laminate is used in an electronic device or an electrical device, examples of the material of the metal foil include copper, a copper alloy, stainless steel, an alloy thereof, nickel, a nickel alloy (including 42 alloy), aluminum, and an aluminum alloy. In general laminates used in electronic and electric devices, copper foils such as rolled copper foils and electrolytic copper foils are often used, and copper foils are also suitably used in the present invention.

A rust-proof layer (e.g., an oxide film such as a chromate film) or a heat-resistant layer may be formed on the surface of the metal foil. The surface of the metal foil may be subjected to a surface treatment (for example, a coupling agent treatment) for improving the adhesion strength with the second base material.

The thickness of the metal foil layer may be appropriately selected depending on the use of the laminate, and the thickness is sufficient for the function. For example, when the laminate is used in an electronic device or an electrical device, the thickness may be in the range of 5 to 75 μm.

The lower the surface roughness of the metal foil layer is within a range capable of maintaining the adhesive strength, the better. In particular in Rz_jisPreferably 0.1 to 2.0 μm. Rz_jisWhen the thickness is 0.1 μm or more, the adhesiveness is excellent, and when the thickness is 2.0 μm or less, the electric characteristics are excellent.

Surface roughness Rz as used herein_jisIs the ten-point average roughness specified in JISB0601:2013 annex JA.

When the metal foil is a copper foil, it may be an electrolytic copper foil produced by electrolysis or a rolled copper foil obtained by rolling a copper ingot.

When the first substrate is composed of a heat-resistant substrate layer and a metal foil layer, the heat-resistant substrate layer and the metal foil layer may be directly laminated or may be laminated via an adhesive layer. Examples of the material of the adhesive layer include thermoplastic polyimide, epoxy resin, and the like.

(second substrate)

The second substrate contains a fluororesin, and the second substrate constitutes a fluororesin-containing layer (fluororesin layer) in the laminate I, II.

The second base material may contain an additive, a resin other than the fluororesin, and the like in addition to the fluororesin.

The content of the fluororesin in the second substrate is preferably 50% by mass or more, more preferably 80% by mass or more, relative to the total mass (100% by mass) of the second substrate. The upper limit of the content of the fluororesin is not particularly limited, and may be 100 mass%.

The wetting tension of the first surface of the second base material is 30-60 mN/m, preferably 30-50 mN/m.

The first surface having the wetting tension of the above lower limit value or more generally has an adhesive functional group (for example, a carbonyl group-containing group, a hydroxyl group, an amino group, or the like) generated by surface treatment such as corona discharge treatment, and the amount of the adhesive functional group tends to be larger, and the wetting tension tends to be higher. If the wetting tension of the first surface is not less than the lower limit, sufficient reaction between the adhesive functional group of the first surface and the first substrate can be caused even at a low temperature when the first substrate and the second substrate are laminated, and sufficient adhesion force can be obtained. If the wetting tension of the first surface is not more than the upper limit, the amount of contaminants generated by the surface treatment is small, adhesion failure due to contaminants does not occur, and a sufficient adhesion force can be obtained.

The second surface of the second base material has a wetting tension that is 2mN/m or more lower than the wetting tension of the first surface, preferably 4mN/m or more lower than the wetting tension of the first surface, and particularly preferably 6mN/m or more lower than the wetting tension of the first surface. Therefore, the difference in wetting tension between the first surface and the second surface (wetting tension of the first surface-wetting tension of the second surface) is 2mN/m or more, preferably 4mN/m or more, and particularly preferably 6mN/m or more. The second surface of the second base material preferably has a wetting tension of 22.6 to 30.0mN/m, more preferably 22.6 to 27.3 mN/m.

When the first base material and the second base material are laminated, the first base material and the second base material are pressed from both sides by a laminating device such as a pair of rollers. At this point, the first side of the second substrate is in contact with the first substrate and the second side is in contact with the laminate device.

When the difference in wetting tension is not less than the lower limit, a sufficient difference is generated between the adhesion force of the second base material to the first base material and the adhesion force to the laminate when the first base material and the second base material are laminated. That is, the adhesion force to the laminated device is sufficiently low compared to the adhesion force to the first substrate. Therefore, when the laminate I is separated from the multilayer device after pressurization, the second substrate is prevented from being pulled by the multilayer device and separated from the first substrate, and a laminate I free from interlayer peeling can be obtained.

The larger the difference in the wetting tension, the better, and the upper limit thereof, that is, the lower limit of the wetting tension of the second surface is not particularly limited.

The wetting tension of each of the first and second surfaces of the second base material is a value before the second base material and the first base material are laminated and when the laminate I is produced.

When the laminate II is obtained, the temperature T is not lower than the melting point of the fluororesin₂The lower heating causes the wetting tension of the first and second surfaces to change. However, the wetting tension before lamination was substantially maintained at a temperature T1 of 0 to 100 ℃ at which the laminate I was obtained.

If a functional group is generated on the outermost surface (first surface or second surface) by surface treatment, the elemental composition of the outermost surface changes as compared with before surface treatment.

Examples of the element formed on the outermost surface by the surface treatment include oxygen and nitrogen.

The presence ratio of oxygen in the first surface (after surface treatment) is preferably 0.1 to 10 mol%, more preferably 0.5 to 8 mol%. If the range is within this range, the wetting tension of the first surface easily falls within a desired range.

The presence ratio of nitrogen in the first surface is preferably 0.01 to 5 mol%, and more preferably 0.02 to 4 mol%. If the range is within this range, the wetting tension of the first surface easily falls within a desired range. The presence ratio of the element as referred to herein is a value measured by X-ray photoelectron spectroscopy.

The arithmetic average roughness Ra of the first surface and the second surface of the second base material is preferably 0.001 to 3 μm, and more preferably 0.005 to 2 μm. If Ra is not less than the lower limit, the free roller is not easily stuck when the sheet is transported in a roll-to-roll manner. When Ra is not more than the above upper limit, adhesion is more excellent when the film is laminated on another substrate.

The thermal expansion/contraction ratio of the second base material is preferably 0.0 to-2.0%, more preferably 0.0 to-1.0%. If the thermal expansion/contraction ratio is 0.0% or less, wrinkles due to thermal expansion of the second base material can be easily prevented. When the thermal expansion/contraction ratio is-2.0% or more, the dimension in the width direction after lamination is stable.

The thermal expansion/contraction ratio can be adjusted by the conditions for forming the second substrate into a film.

The thickness of the second substrate is usually 1 to 1000. mu.m, preferably 5 to 500. mu.m, and preferably 10 μm or more from the viewpoint of chemical resistance and flame retardancy. Among them, the particle size is preferably 10 to 500. mu.m, more preferably 10 to 300. mu.m, particularly preferably 10 to 200. mu.m, and still more preferably 12 to 50 μm.

From the viewpoint of productivity of the laminate, handling of the laminate, and the like, the second substrate is preferably composed of a film containing a fluororesin (hereinafter also referred to as a fluororesin film). The second substrate may be a single-layer substrate made of one fluororesin film or a multilayer substrate made of a plurality of fluororesin films.

The fluororesin film can be produced by molding a molding material containing a fluororesin by a known molding method (extrusion molding, inflation molding, or the like). The molding material may contain additives, resins other than fluorine resins, and the like.

The fluororesin in the fluororesin film is preferably a melt-moldable fluororesin. That is, as the fluororesin film, a film obtained by molding a molding material containing a melt-moldable fluororesin into a film is preferable.

That is, the second substrate can be manufactured by, for example, (α) a method of surface-treating only the first surface of the fluororesin film, (β) a method of surface-treating the first surface and the second surface of the fluororesin film under different conditions, or (γ) a method of penetrating the first surface of the fluororesin film and surface-treating the second surface as well.

In the methods (α), (β), and (γ), the surface treatment is performed so that the difference between the wetting tension of the first surface and the second surface after the surface treatment (the wetting tension of the first surface — the wetting tension of the second surface) satisfies the above values.

The wetting tension may vary depending on the surface treatment conditions, the fluorine content of the fluororesin contained in the second substrate, and the like. For example, when the surface treatment is a discharge treatment such as corona discharge treatment, the higher the discharge amount, the higher the wetting tension tends to be. The fluorine content of the fluororesin is preferably 70 to 78 mass%, and in this range, the lower the fluorine content of the fluororesin, the higher the wetting tension tends to be even at the same discharge amount.

The surface treatment of the fluororesin film may be any treatment as long as it is a treatment for increasing the wetting tension of the treated surface, and examples thereof include a discharge treatment such as a corona discharge treatment or a plasma treatment (except for the corona discharge treatment), a plasma graft polymerization treatment, an electron beam irradiation treatment, a light irradiation treatment such as excimer UV light irradiation, an ITRO treatment using a flame, a wet etching treatment using sodium metal, and the like. When these surface treatments are performed, adhesive functional groups are formed on the surface of the fluororesin film, and the wetting tension is increased.

As the surface treatment, an electric discharge treatment is preferable from the viewpoint of economical efficiency and easy achievement of a desired wetting tension, and particularly, a corona discharge treatment, an atmospheric pressure plasma treatment, and a vacuum plasma treatment are preferable. In the discharge treatment, oxygen radicals and ozone are generated by changing the environment in the discharge to an environment in which oxygen exists, and carbonyl-containing groups can be efficiently introduced to the film surface. The reason for this is as follows.

Under the action of high-energy electrons (about 1 to 10 eV) generated by the discharge, the main chain or side chain of the bond of the surface material (in the case of metal, an oxide layer or an oil film on the surface) is dissociated into radicals. In addition, molecules of an atmospheric gas such as air or moisture are also dissociated into radicals. By recombination reaction between these two kinds of radicals, hydrophilic functional groups such as hydroxyl, carbonyl, and carboxyl groups are formed on the surface of the object to be treated. As a result, the free energy of the surface of the object to be treated is increased, and adhesion and bonding to other surfaces are facilitated.

In particular, in the case of vacuum plasma treatment, the lamination temperature can be lowered in the second step described below, and therefore, this is more preferable from the viewpoint of dimensional stability.

The corona discharge treatment may employ a known treatment system (corona discharge treatment device). Typically, the treatment system includes a corona discharge treatment section in which a pair of electrodes are arranged, one of the electrodes being an uncoated electrode and the other being a dielectric-coated roller electrode (dielectric roller). A high-frequency high voltage is applied between the electrodes to cause breakdown of the atmosphere, thereby forming a corona discharge. The film surface is treated by passing the film conveyed by the roller through the area under discharge. The membrane passes near one electrode or near the center between the electrodes. When the film passes through the vicinity of the center between the electrodes, both surfaces of the film are treated. On the other hand, when the film is conveyed along the dielectric roller, the surface of the electrode side which is not covered with the dielectric is treated. The constitution in this manner has been known for a long time and is suitable for surface treatment of various resin films. Further, since the distance between the electrodes is required to be several centimeters or less, it is difficult to process a three-dimensional object or a large object, but a large area can be processed for an object having a shape such as a film.

The electrode shape may be a wire electrode or a segment electrode. The shape of the segment electrode may, for example, be a needle electrode, a groove electrode, a blade electrode or a hemispherical electrode. From the viewpoint of uniformity of discharge, the segment electrode is preferable, and the blade-shaped electrode is preferable as the shape.

Examples of the material of the dielectric include silicone rubber, glass, and ceramics. From the viewpoint of uniformity of discharge, silicone rubber is preferable.

The corona discharge treatment of the first surface of the fluororesin film is preferably 10 to 200 W.min/m in terms of discharge amount²More preferably 20 to 150 W.min/m². If the discharge amount is within the above range, the wetting tension of the treated first surface easily falls within the above range.

The corona discharge treatment of the first side may be a single treatment or a plurality of treatments. The same applies to the second side when it is subjected to corona discharge treatment.

The gas in the corona discharge treatment section may be atmospheric air, but an additional gas may be used. Examples of the additional gas include nitrogen, argon, oxygen, helium, and a polymerizable gas (e.g., ethylene).

The absolute humidity of the corona discharge treatment part is preferably 10-30 g/m³. Absolute humidity of 10g/m³Thus, the discharge can be stably performed without generating sparks. If it is at 30g/m³Hereinafter, the change in the discharge amount is small, and uniform wetting tension is easily achieved.

The vacuum plasma treatment is carried out by glow discharge in a vacuum vessel. Since the plasma treatment is performed by glow discharge, the applied voltage can be reduced as compared with the voltage used in the conventional corona discharge, and the power consumption can be reduced. From the viewpoint of treatment efficiency, glow discharge treatment, i.e., so-called low-temperature plasma treatment, in which discharge is sustained at a treatment pressure of preferably 0.1 to 1330Pa, more preferably 1 to 266Pa, is preferable.

In this case, the treatment in vacuum is preferably performed with a wide selection range of the treatment gas. The process gas is not particularly limited, and He, Ne, Ar, nitrogen, oxygen, carbon dioxide gas, air, water vapor, or the like may be used alone or in a mixed state. Among them, Ar or carbon dioxide gas is preferable from the viewpoint of discharge initiation efficiency. Further, since a functional group having high reactivity can be provided to the substrate, a combination of Ar, hydrogen, and nitrogen is also preferable.

By applying a power of 10W to 100KW between the discharge electrodes at a high frequency of, for example, 10KHz to 2GHz under the gas pressure, stable glow discharge can be performed. In addition, as the discharge frequency band, a low frequency, a microwave, a direct current, or the like may be used in addition to a high frequency. The vacuum plasma generator is preferably of an internal electrode type, but may be of an external electrode type in some cases, or may be of any of capacitive coupling and inductive coupling such as a coil furnace.

The electrode may be in various shapes such as a flat plate, a ring, a rod, and a cylinder, and may be in a shape in which one of the electrodes is a metal inner wall of the processing apparatus grounded. In order to maintain a stable plasma state by applying a voltage of 1000 volts or more between the electrodes, it is preferable to apply an insulating coating having a relatively high withstand voltage to the input electrode. Since arc discharge is likely to occur when the electrode is made of a metal such as copper, iron, or aluminum, it is preferable to apply an enamel coating, a glass coating, or a ceramic coating to the electrode surface.

When the fluororesin film is subjected to vacuum plasma treatment, the treatment intensity (output power) is preferably 5 to 400 W.min/m²The range of (1). Thereby, the above wetting tension range of the surface of the fluororesin film can be obtained.

In the atmospheric pressure plasma discharge treatment, glow discharge is generated by discharging in an inert gas (argon gas, nitrogen gas, helium gas, or the like) at 0.8 to 1.2 atmospheres. The inert gas may contain a trace amount of an active gas (oxygen, hydrogen, carbon dioxide, ethylene, tetrafluoroethylene, etc.). As the gas, a gas in which hydrogen gas is mixed with nitrogen gas is preferable from the viewpoint that the wetting tension of the surface of the fluororesin layer easily falls within the above range.

The voltage for the atmospheric plasma discharge treatment is usually 1 to 10 kV. The frequency of the power supply is usually 1 to 20 kHz. The treatment time is usually 0.1 second to 10 minutes.

The discharge power density of the atmospheric pressure plasma discharge treatment is preferably 5 to 400 W.min/m². If the discharge power density is within the above range, the wetting tension of the surface of the fluororesin layer easily falls within the above range.

When the first substrate and the third substrate are heat-resistant resin films, the same surface treatment as that for the fluororesin film may be performed. As the surface treatment, corona discharge treatment, atmospheric pressure plasma treatment, or vacuum plasma treatment is preferable, and atmospheric pressure plasma treatment or vacuum plasma treatment is more preferable. By subjecting the heat-resistant resin film to these treatments, the adhesive strength after the second step described below is improved.

The water contact angle of the surface of the heat-resistant resin film is preferably 5 ° to 60 °, more preferably 10 ° to 50 °, and still more preferably 10 ° to 30 °. When the water contact angle is within the above range, the adhesion between the fluororesin layer and the heat-resistant resin layer after lamination is more excellent.

For example, when the heat-resistant resin film is an aromatic polyimide film, the water contact angle before surface treatment of the surface of the aromatic polyimide film is preferably 70 ° to 80 °. The water contact angle is a value measured by the sessile drop method described in JIS R6769: 1999.

< fluororesin >

As the fluororesin, a melt-moldable fluororesin is preferable from the viewpoint of easy film production. As the fluororesin, a known fluororesin can be used.

The melt-moldable fluororesin is preferably a fluororesin having a melt flow rate of 0.1 to 1000g/10 min (preferably 0.5 to 100g/10 min, more preferably 1 to 30g/10 min, and further preferably 5 to 20g/10 min) at a temperature of 20 ℃ or higher than the melting point of the fluororesin under a load of 49N. When the melt flow rate is not less than the lower limit of the above range, the fluororesin film has excellent moldability and the fluororesin film has excellent surface smoothness and appearance. If the melt flow rate is not more than the upper limit of the above range, the fluororesin film is excellent in mechanical strength.

The melting point of the fluororesin is preferably 100 to 325 ℃, more preferably 250 to 320 ℃, and further preferably 280 to 315 ℃. If the melting point of the fluororesin is not less than the lower limit of the above range, the heat resistance of the resulting laminate is more excellent. If the melting point of the fluororesin is not more than the upper limit of the above range, a general-purpose molding apparatus can be used for producing the laminate. Hereinafter, unless otherwise specified, the fluororesin means a fluororesin having the above-mentioned melting point.

The fluorine content of the fluororesin is preferably 70 to 80 mass%, particularly preferably 70 to 78 mass%. The fluorine content is a ratio of the total mass of fluorine atoms to the total mass of the fluororesin. If the fluorine content is not less than the lower limit, the heat resistance is more excellent, and if the fluorine content is not more than the upper limit, the moldability is more excellent. Fluorine content is determined by¹⁹F-NMR measurement.

The fluororesin may be a fluororesin having no adhesive functional group or a fluororesin having an adhesive functional group. The fluororesin having an adhesive functional group is preferable from the viewpoint of better adhesive strength between the second substrate and the first substrate or the third substrate when the laminate II is produced.

Examples of the fluororesin having no adhesive functional group include tetrafluoroethylene/perfluoro (alkyl vinyl ether) copolymer (PFA), tetrafluoroethylene/hexafluoropropylene copolymer (FEP), ethylene/tetrafluoroethylene copolymer (ETFE), polyvinylidene fluoride (PVDF), Polychlorotrifluoroethylene (PCTFE), and ethylene/chlorotrifluoroethylene copolymer (ECTFE).

As the fluororesin having no adhesive functional group, a fluororesin having a hydrogen atom bonded to a carbon atom such as ETFE or PVDF is preferable from the viewpoint that the adhesive functional group can be efficiently introduced into the surface of the fluororesin film by a surface treatment such as corona discharge treatment.

Examples of the fluororesin having an adhesive functional group include the above-mentioned fluororesins containing a unit having an adhesive functional group or a terminal group having an adhesive functional group. Specifically, PFA having an adhesive functional group, FEP having an adhesive functional group, ETFE having an adhesive functional group, and the like can be mentioned.

The adhesive functional group in the fluororesin having an adhesive functional group is preferably at least one functional group selected from the group consisting of a carbonyl-containing group, a hydroxyl group, an epoxy group, an amide group, an amino group and an isocyanate group. The adhesive functional group in the fluororesin may be one kind or two or more kinds.

The adhesive functional group in the fluororesin is preferably a carbonyl group-containing group from the viewpoint of adhesiveness at the interface. Examples of the carbonyl group-containing group include a group having a carbonyl group between carbon atoms of a hydrocarbon group, a carbonate group, a carboxyl group, a haloformyl group, an alkoxycarbonyl group, and an acid anhydride group.

Examples of the hydrocarbon group in the group having a carbonyl group between carbon atoms of the hydrocarbon group include an alkylene group having 2 to 8 carbon atoms. The carbon number of the alkylene group is the carbon number of the carbon atom not including the carbonyl group. The alkylene group may be linear or branched.

The haloformyl group is represented by — C (═ O) -X (wherein X is a halogen atom). The halogen atom in the haloformyl group may, for example, be a fluorine atom or a chlorine atom, and preferably a fluorine atom. That is, as the haloformyl group, a fluoroformyl group (also referred to as a carbonyl fluoro group) is preferable.

The alkoxy group in the alkoxycarbonyl group may be linear or branched, and an alkoxy group having 1 to 8 carbon atoms is preferable, and a methoxy group or an ethoxy group is particularly preferable.

The carbonyl group-containing group is preferably an acid anhydride group or a carboxyl group.

The content of the adhesive functional group in the fluororesin is 1X 10 relative to the number of carbon atoms in the main chain of the fluororesin⁶Preferably 10 to 60000, more preferably 100 to 50000, further preferably 100 to 10000, and particularly preferably 300 to 5000. If the content is more than the lower limit of the above range, the adhesiveness at the interface is more excellent. If the content is not more than the upper limit of the above range, the adhesive strength between the second base material and the first base material or the third base material in the production of the laminate II is more excellent.

The content of the adhesive functional group can be measured by Nuclear Magnetic Resonance (NMR) analysis, infrared absorption spectrum analysis, or the like. For example, as described in Japanese patent laid-open No. 2007-314720, the content of the adhesive functional group can be calculated from the proportion (mol%) of the unit having the adhesive functional group among all the units constituting the fluororesin, which is obtained by a method such as infrared absorption spectrum analysis.

From the viewpoint of adhesiveness at the interface, the adhesive functional group is preferably present as either or both of a terminal group of the fluororesin main chain and a pendant group of the main chain.

The fluororesin can be produced by a method such as copolymerizing a monomer having an adhesive functional group at the time of monomer polymerization, and polymerizing the monomer using a chain transfer agent or a polymerization initiator having an adhesive functional group introduced therein. These methods may be used in combination. In particular, it is preferable that the fluororesin in which the adhesive functional group is present at least as a pendant group of the main chain is prepared by copolymerizing a monomer having the adhesive functional group.

The monomer having an adhesive functional group is preferably a monomer having a carbonyl group, a hydroxyl group, an epoxy group, an amide group, an amino group, or an isocyanate group, and particularly preferably a monomer having an acid anhydride group or a carboxyl group. Specifically, the monomer may include a monomer having a carboxyl group such as maleic acid, itaconic acid, citraconic acid, and undecylenic acid, a monomer having an acid anhydride group such as Itaconic Anhydride (IAH), Citraconic Anhydride (CAH), 5-norbornene-2, 3-dicarboxylic anhydride (NAH), and maleic anhydride, and a hydroxyalkyl vinyl ether and an epoxyalkyl vinyl ether.

As the chain transfer agent having an adhesive functional group introduced therein, a chain transfer agent having a carboxyl group, an ester bond, a hydroxyl group, or the like is preferable. Specifically, acetic acid, acetic anhydride, methyl acetate, ethylene glycol, propylene glycol and the like may be mentioned.

As the polymerization initiator for introducing the adhesive functional group, peroxide-based polymerization initiators such as peroxycarbonate, diacylperoxide, peroxyester and the like are preferable. Specifically, di-n-propyl peroxydicarbonate, diisopropyl peroxycarbonate, tert-butylperoxyisopropyl carbonate, bis (4-tert-butylcyclohexyl) peroxydicarbonate, di-2-ethylhexyl peroxydicarbonate, and the like may be mentioned.

The fluorine-containing resin having an adhesive functional group at least as a pendant group of the main chain is particularly preferably the following fluorine-containing polymer a from the viewpoint of better adhesion.

Fluorine-containing polymer A: a fluoropolymer having units derived from Tetrafluoroethylene (TFE), units derived from a cyclic hydrocarbon monomer having an acid anhydride group (hereinafter also referred to as an acid anhydride monomer), and units derived from a fluorine-containing monomer (TFE is not included).

In addition, hereinafter, the unit derived from TFE is also referred to as "TFE unit", the unit derived from an acid anhydride monomer is referred to as "unit (2)", and the unit derived from the above fluorine-containing monomer is referred to as "unit (3)".

The acid anhydride monomer may, for example, be IAH, CAH, NAH or maleic anhydride, and these may be used singly or in combination of two or more.

The acid anhydride monomer is preferably at least one selected from IAH, CAH and NAH. When any of IAH, CAH and NAH is used, the fluoropolymer A having an acid anhydride group can be easily produced without using a special polymerization method which is necessary when maleic anhydride is used (see Japanese patent application laid-open No. 11-193312).

Among the acid anhydride monomers, IAH and NAH are particularly preferable in view of better adhesiveness at the interface.

In the fluoropolymer a, a part of the acid anhydride groups in the unit (2) is hydrolyzed, and as a result, a unit of dicarboxylic acid (itaconic acid, citraconic acid, 5-norbornene-2, 3-dicarboxylic acid, maleic acid, or the like) corresponding to the acid anhydride monomer may be contained. In the case of containing the unit of the dicarboxylic acid, the content of the unit is regarded as being contained in the content of the unit (2).

The fluorine-containing monomer constituting the unit (3) is preferably a fluorine-containing compound having 1 polymerizable carbon-carbon double bond. Examples thereof may include fluoroolefins (chlorotrifluoroethylene, vinyl fluoride, vinylidene fluoride, trifluoroethylene, Hexafluoropropylene (HFP), hexafluoroisobutylene, etc., with TFE excluded), CF₂＝CFOR^f1(wherein, R^f1Is a C1-10 perfluoroalkyl group or a group containing an oxygen atom between carbon atoms of a C2-10 perfluoroalkyl group) (hereinafter also referred to as PAVE), CF₂＝CFOR^f2SO₂X¹(wherein, R^f2Is a C1-10 perfluoroalkyl group or a group containing an oxygen atom between carbon atoms of a C2-10 perfluoroalkyl group, X¹Is a halogen atom or a hydroxyl group), CF₂＝CFOR^f3CO₂X²(wherein, R^f3Is a C1-10 perfluoroalkyl group or a group containing an oxygen atom between carbon atoms of a C2-10 perfluoroalkyl group, X²Hydrogen atom or C1-3 alkyl group), CF₂＝CF(CF₂)_pOCF＝CF₂(wherein p is 1 or 2), CH₂＝CX³(CF₂)_qX⁴(wherein, X³Is a hydrogen atom or a fluorine atom, q is an integer of 2 to 10, X⁴Hydrogen atom or fluorine atom) (hereinafter also referred to as FAE), a fluorine-containing monomer having a ring structure (perfluoro (2, 2-dimethyl-1, 3-dioxole), 2, 4-trifluoro-5-trifluoroMethyl-1, 3-dioxole, perfluoro (2-methylene-4-methyl-1, 3-dioxolane), etc.).

The fluorine-containing monomer is preferably at least one selected from HFP, PAVE and FAE from the viewpoint of excellent moldability of the fluorine-containing polymer a, bending resistance of the polymer layer, and the like.

As PAVE, CF is mentioned₂＝CFOCF₂CF₃、CF₂＝CFOCF₂CF₂CF₃、CF₂＝CFOCF₂CF₂CF₂CF₃、CF₂＝CFO(CF₂)₈F, etc., preferably CF₂＝CFOCF₂CF₂CF₃(PPVE)。

As FAE, CH may be mentioned₂＝CF(CF₂)₂F、CH₂＝CF(CF₂)₃F、CH₂＝CF(CF₂)₄F、CH₂＝CF(CF₂)₅F、CH₂＝CF(CF₂)₈F、CH₂＝CF(CF₂)₂H、CH₂＝CF(CF₂)₃H、CH₂＝CF(CF₂)₄H、CH₂＝CF(CF₂)₅H、CH₂＝CF(CF₂)₈H、CH₂＝CH(CF₂)₂F、CH₂＝CH(CF₂)₃F、CH₂＝CH(CF₂)₄F、CH₂＝CH(CF₂)₅F、CH₂＝CH(CF₂)₆F、CH₂＝CH(CF₂)₈F、CH₂＝CH(CF₂)₂H、CH₂＝CH(CF₂)₃H、CH₂＝CH(CF₂)₄H、CH₂＝CH(CF₂)₅H、CH₂＝CH(CF₂)₈H, and the like.

As FAE, CH is preferred₂＝CH(CF₂)_q1X⁴(wherein q1 is 2 to 6, preferably 2 to 4), more preferably CH₂＝CH(CF₂)₂F、CH₂＝CH(CF₂)₃F、CH₂＝CH(CF₂)₄F、CH₂＝CF(CF₂)₃H、CH₂＝CF(CF₂)₄H, particularly preferably CH₂＝CH(CF₂)₄F(PFBE)、CH₂＝CH(CF₂)₂F(PFEE)。

The fluoropolymer a may have a unit derived from a non-fluorine-containing monomer (excluding an acid anhydride monomer) in addition to the TFE unit and the units (2) and (3).

The non-fluorine-containing monomer is preferably a non-fluorine compound having 1 polymerizable carbon-carbon double bond, and examples thereof include olefins (e.g., ethylene, propylene, and 1-butene) and vinyl esters (e.g., vinyl acetate). The non-fluorine-containing monomer may be used alone or in combination of two or more.

Preferred examples of the fluoropolymer A include TFE/NAH/PPVE copolymer, TFE/IAH/PPVE copolymer, TFE/CAH/PPVE copolymer, TFE/IAH/HFP copolymer, TFE/CAH/HFP copolymer, TFE/IAH/PFBE/ethylene copolymer, TFE/CAH/PFBE/ethylene copolymer, TFE/IAH/PFEE/ethylene copolymer, TFE/CAH/PFEE/ethylene copolymer, TFE/IAH/HFP/PFBE/ethylene copolymer and the like. Among them, TFE/NAH/PPVE copolymers are preferable because of their good heat resistance.

Here, the "TFE/NAH/PPVE copolymer" means a copolymer having TFE units and NAH units and PPVE units, and the same applies to other copolymers.

When the fluoropolymer a is composed of TFE units and units (2) and (3), the content of TFE units is preferably 50 to 99.89 mol%, more preferably 50 to 99.4 mol%, and still more preferably 50 to 98.9 mol%, based on 100 mol% of the total of TFE units and units (2) and (3). The content of the unit (2) is preferably 0.01 to 5 mol%, more preferably 0.1 to 3 mol%, and still more preferably 0.1 to 2 mol%. The content of the unit (3) is preferably 0.1 to 49.99 mol%, more preferably 0.5 to 49.9 mol%, and still more preferably 1 to 49.9 mol%.

When the ratio of each unit is within the above range, the second substrate is more excellent in heat resistance, chemical resistance and elastic modulus at high temperatures. When the proportion of the unit (2) is within the above range, the amount of the acid anhydride group in the fluoropolymer A is suitable, and the adhesiveness is more excellent. When the proportion of the unit (3) is within the above range, the fluoropolymer A is excellent in moldability and the laminate is more excellent in bending resistance.

The proportion of each unit can be calculated by melt NMR analysis, fluorine content analysis, infrared absorption spectrum analysis, and the like of the fluoropolymer.

The preferable ratio of each unit in the case where the fluoropolymer a is composed of TFE units, units (2), units (3) and units derived from a non-fluorine-based monomer, and the units derived from a non-fluorine-based monomer are units derived from ethylene (hereinafter also referred to as E units) is as follows.

The content of the TFE unit is preferably 25 to 80 mol%, more preferably 40 to 65 mol%, and further preferably 45 to 63 mol% with respect to 100 mol% of the total of the TFE unit and the unit (2) and the unit (3) and the E unit. The content of the unit (2) is preferably 0.01 to 5 mol%, more preferably 0.03 to 3 mol%, and still more preferably 0.05 to 1 mol%. The content of the unit (3) is preferably 0.2 to 20 mol%, more preferably 0.5 to 15 mol%, and still more preferably 1 to 12 mol%. The content of the E unit is preferably 20 to 75 mol%, more preferably 35 to 50 mol%, and further preferably 37 to 55 mol%.

If the content of each unit is within the above range, chemical resistance and the like are more preferable. When the proportion of the unit (2) is within the above range, the amount of the acid anhydride group in the fluoropolymer A is suitable, and the adhesiveness is more excellent. When the proportion of the unit (3) is within the above range, the fluoropolymer A is excellent in moldability, and the laminate is more excellent in bending resistance and the like.

The fluoropolymer a may be produced by conventional methods. The fluoropolymer a can be produced, for example, by polymerizing at least TFE and an acid anhydride-based monomer and a fluorine-containing monomer. In the polymerization of the monomers, a radical polymerization initiator is preferably used.

Examples of the polymerization method include a bulk polymerization method, a solution polymerization method using an organic solvent (e.g., hydrofluorocarbon, chlorohydrocarbon, fluorochlorohydrocarbon, alcohol, hydrocarbon, etc.), a suspension polymerization method using an aqueous medium and an appropriate organic solvent used as needed, and an emulsion polymerization method using an aqueous medium and an emulsifier, and the solution polymerization method is preferable.

In the production of the fluoropolymer a, the concentration of the acid anhydride monomer during polymerization is preferably 0.01 to 5 mol%, more preferably 0.1 to 3 mol%, and still more preferably 0.1 to 2 mol% based on the total monomers. If the concentration of the monomer is within the above range, the polymerization rate is suitable. If the concentration of the monomer is too high, the polymerization rate tends to decrease.

It is preferable that the acid anhydride monomer is consumed by polymerization, and the consumed amount is continuously or intermittently supplied into the polymerization vessel, and the concentration of the monomer is maintained within the above range.

(third base material)

The third substrate is composed of either or both of a heat-resistant substrate layer and a metal foil layer. Examples of the heat-resistant substrate layer and the metal foil layer may include the same layers as those exemplified for the first substrate.

When the third substrate is composed of a heat-resistant substrate layer and a metal foil layer, the heat-resistant substrate layer and the metal foil layer may be directly laminated or may be laminated via an adhesive layer. The adhesive layer may be the same as the adhesive layer exemplified in the first substrate. The first substrate and the third substrate may be the same or different.

[ method for producing laminate ]

The method for producing a laminate of the present invention includes the following first step and, if necessary, the following second step.

A first step: disposing a second substrate on one side or both sides of the first substrate so that the first surface faces the first substrate, and conveying the first substrate and the second substrate at a temperature T of 0 to 100 DEG C₁And a step of laminating the substrates in the thickness direction (lamination direction) under pressure to obtain a laminate I in which the first substrate and the second substrate are directly laminated.

A second step: a third substrate is disposed on the second substrate of the laminate I, and the laminate I and the third substrate are conveyed while the temperature T is not lower than the melting point of the fluororesin contained in the second substrate₂Down in the thickness directionAnd (d) a step of laminating the laminate I and the third base material directly by applying pressure (in the laminating direction) to obtain a laminate II.

(first step)

The first step is preferably performed continuously by a laminating apparatus including at least one pair of laminating devices.

The laminated device refers to a device in which a plurality of members are pressure-bonded by pressing in the stacking direction. The laminate device may have a heating mechanism as necessary. The one or more pairs of laminating devices may be, for example, one or more pairs of rollers (e.g., metal rollers) or one or more pairs of belts (e.g., metal belts).

Examples of the laminating apparatus include a roll laminating apparatus having one or more pairs of rolls, and a double belt press having one or more pairs of belts.

Here, the double belt press device refers to the following devices: and a device for continuously feeding a plurality of sheet materials between endless belts arranged in a pair up and down, and thermocompressing the sheet materials with the endless belts interposed therebetween by a thermocompression bonding device to form a laminate. As the above-mentioned thermocompression bonding apparatus, there are various types such as a system of performing surface pressing using a hydraulic platen (referred to as a hydraulic system), a roll press system of performing thermocompression bonding by using a drum for rotating an endless belt and/or a roller provided between the drums, and the like.

The specific configuration of the roll lamination device is not particularly limited. Typically, a device having a pair of or more rollers capable of heating and pressing a plurality of members is used.

As a heating method of the laminate device, for example, a known method capable of heating at a predetermined temperature such as a heat cycle method, a hot air heating method, an induction heating method, or the like can be used.

The pressure application method of the laminate device may be a known method capable of applying a predetermined pressure, such as a hydraulic method, an air pressure method, or an inter-gap pressure method.

The laminating apparatus may have a feeding device for feeding out each member at a front stage of the laminating device (a pair of or more rolls, etc.), or may have a winding device for winding up the bonded member at a rear stage of the laminating device. The productivity can be further improved by providing the feeding device and the winding device for each member.

Specific configurations of the feeding means and the winding means for each member include, for example, a known winder capable of winding each member in a roll shape.

Next, the first step will be described with reference to the first embodiment, the second embodiment, and the third embodiment, respectively, with reference to the drawings.

< first embodiment >

Fig. 5 is a schematic configuration diagram showing the roller laminating apparatus 100 used in the first embodiment. The roll laminating apparatus 100 is provided with a pair of laminating rolls 101 (laminating device). A first delivery roller 103 (delivery means) and a second delivery roller 105 (delivery means) disposed on the side of the first delivery roller 103 are provided in the front stage of the laminating roller 101. A winder (not shown) is provided at a subsequent stage of the laminating roller 101.

The laminating roller 101 is provided with a heating mechanism, and the roller surface temperature can be adjusted to an arbitrary temperature. Examples of the roller provided with a heating mechanism include an electric heating roller, a heat medium circulating roller, and an induction heating roller. The induction heating roller is preferable in view of the temperature uniformity of the entire roller.

The heat-resistant base material layer 12 (first base material) is wound up by the first delivery roller 103. The unwinding speed of the heat-resistant base material layer 12 is controlled by the first feed roller 103, and the tension applied to the heat-resistant base material layer 12 conveyed to the laminating roller 101 can be controlled.

The second substrate 14 is taken up by the second delivery roll 105. Further, when the second base material 14 is wound around the second feed roller 105 so as to be unwound from the second feed roller 105, the first surface 14a is positioned on the first feed roller 103 side (the heat-resistant base material layer 12 side). The unwinding speed of the second substrate 14 is controlled by the second delivery roller 105, and the tension applied to the second substrate 14 conveyed to the laminating roller 101 can be controlled.

In the roll laminator 100, the heat-resistant base material layer 12 in a long strip shape continuously fed out from the first feed-out roller 103 and the second base material 14 in a long strip shape continuously fed out from the second feed-out roller 105 have a surface temperature T₁Is overlapped with each other, and is at a temperature T when continuously passing between the pair of laminating rollers 101₁Lower part is thickThe laminate 10 (laminate I) is formed by pressing in the transverse direction.

The obtained laminate 10 may be continuously wound by a subsequent winder or may be directly supplied to the second step.

The surface temperature of the laminating roller 101 (laminating roller temperature), that is, the temperature T when the heat-resistant base material layer 12 and the second base material 14 are pressurized while being conveyed₁Is 0 to 100 ℃, more preferably 20 to 80 ℃, and still more preferably 30 to 60 ℃. If the temperature T is₁When the lower limit value is not less than the lower limit value, the heat-resistant base material layer 12 and the second base material 14 can be bonded to each other with such a degree that they do not peel off when the laminate 10 is transported. If the temperature T is₁When the upper limit or less is less than the above upper limit, curling of the laminate 10 and wrinkles of the second base material 14 are suppressed.

The laminating roller temperature is the temperature obtained by measuring the roller surface with a contact thermocouple.

The pressure between the pair of laminating rollers 101, that is, the pressure applied when the heat-resistant base material layer 12 and the second base material 14 are laminated, is preferably 3 to 100kN/m, and more preferably 10 to 50 kN/m. If the pressure in the first step is not less than the lower limit, it is easy to obtain a sufficient adhesive strength to prevent the heat-resistant base material layer 12 and the second base material 14 from being peeled off when the laminate 10 is transported. If the applied pressure in the first step is not more than the upper limit value, wrinkles of the second substrate 14 can be further suppressed.

In the first step, it is preferable that the heat-resistant base material layer 12 and the second base material 14 have an elongation of 0.05 to 1.0% when the heat-resistant base material layer 12 and the second base material 14 are conveyed, and a difference in elongation between the heat-resistant base material layer 12 and the second base material 14 is 0.3% or less. The heat-resistant base material layer 12 and the second base material 14 each have an elongation of more preferably 0.2 to 0.6%. The difference in elongation between the heat-resistant base material layer 12 and the second base material 14 is more preferably 0.2% or less.

The elongation is a value obtained by the following formula 1.

Formula 1: elongation (%) { tension (N) applied to the substrate during conveyance)/cross-sectional area (mm) of the substrate in a direction perpendicular to the conveyance direction²) }/temperature T₁Modulus of elasticity (N/mm) of the substrate²)×100

The substrate in the formula is the heat-resistant substrate layer 12 or the second substrate 14.

If the elongation is not less than the lower limit, the substrate can be transported without causing lateral wrinkles due to sagging. If the elongation is not more than the upper limit, the substrate can be transported without generating longitudinal wrinkles due to excessive stretching. If the difference in the elongation is not more than the above upper limit, the laminate 10 can be further inhibited from curling.

The tension applied to the heat-resistant base material layer 12 and the tension applied to the second base material 14 during conveyance are determined by tension sensor rollers. The tension of each base material can be adjusted by the first delivery roller 103 and the second delivery roller 105.

The heat-resistant base material layer 12 and the second base material 14 each have an elastic modulus (N/mm)²MPa) was determined by dynamic viscoelasticity measurement.

The traveling speed (laminating speed) of the heat-resistant base material layer 12 and the second base material 14 passing between the pair of laminating rollers 101 may be in a range capable of laminating, and may be, for example, 0.5 to 5.0 m/min.

The angle between the heat-resistant base material layer 12 and the second base material 14 when these base materials enter between the laminating rollers 101 is preferably 3 ° to 45 °. If the angle between the heat-resistant base material layer 12 and the second base material 14 is 3 ° or more, air between these base materials can be satisfactorily evacuated at the time of lamination. If the angle is 45 DEG or less, wrinkles are less likely to occur during lamination.

< second embodiment >

Fig. 6 is a schematic configuration diagram showing a roller laminator 200 used in the second embodiment. In the second embodiment, the same reference numerals are given to the components corresponding to those of the first embodiment, and detailed description thereof will be omitted.

The roller laminating apparatus 200 includes a pair of laminating rollers 101. A first delivery roller 103, and a second delivery roller 105 and a third delivery roller 107 (delivery means) respectively disposed above and below the first delivery roller 103 are provided in a stage preceding the laminating roller 101. A winder (not shown) is provided at a subsequent stage of the laminating roller 101.

The roller laminating apparatus 200 is the same as the roller laminating apparatus 100 according to the first embodiment except that it further includes a third feed roller 107.

The second substrate 14 is taken up by the third delivery roll 107. Further, when the second base material 14 is wound around the third feed roller 107 so as to be unwound from the third feed roller 107, the first surface 14a is positioned on the first feed roller 103 side (the heat-resistant base material layer 12 side). The unwinding speed of the second substrate 14 is controlled by the third delivery roller 107, and the tension applied to the second substrate 14 conveyed to the laminating roller 101 can be controlled.

In the roll laminator 200, the second elongated base material 14 continuously fed out from the third feed-out roller 107, the heat-resistant base material layer 12 continuously fed out from the first feed-out roller 103, and the second elongated base material 14 continuously fed out from the second feed-out roller 105 have a surface temperature T₁Is overlapped with each other, and is at a temperature T when continuously passing between the pair of laminating rollers 101₁Next, the laminate 10A (laminate I) is obtained by pressing in the thickness direction.

The resulting laminate 10A may be continuously wound by a subsequent winder or may be directly supplied to the second step.

Laminating roller temperature (temperature T)₁) The preferred embodiment is the same as the first embodiment. In addition, preferable values of the pressure, the elongation of each of the heat-resistant base material layer 12 and the second base material 14 when the heat-resistant base material layer 12 and the second base material 14 are conveyed, and the difference in elongation between the heat-resistant base material layer 12 and the second base material 14 are also the same as those in the first embodiment.

In addition, the elongation of the second base material 14 in the second embodiment is the elongation of each of the two second base materials 14. The elongation of the two second substrates 14 may be the same or different, and is preferably the same from the viewpoint of suppressing curling.

< third embodiment >

Fig. 7 is a schematic configuration diagram showing a double belt press apparatus 300 used in the third embodiment. The double belt press device 300 is constituted by a pair of front upper drum 301a and front lower drum 301b, and a pair of rear upper drum 302a and rear lower drum 302b, and belts 303a, 303b respectively spanning and wound around the set of two upper drums and the set of two lower drums. In fig. 7, the two front drums 301a and 301b are heating drums, and the two rear drums 302a and 302b are cooling drums. The heating and pressing device of the double belt press device 300 is composed of heating and pressing tools 304a and 304b provided in the upper and lower sides, and is configured to apply pressure to the laminate which is sandwiched and conveyed by the upper and lower belts 303a and 303b in the double belt press by the mutual contact of the upper and lower heating and pressing tools 304a and 304 b. In the double belt press apparatus 300 of fig. 7, pressure cooling apparatuses 305a and 305b are further provided behind the heating and pressing apparatuses, and the laminate subjected to the pressing treatment at a high temperature is cooled.

A first feed roller 306 (feed means) and a second feed roller 307 (feed means) disposed on the side of the first feed roller 306 are provided at the front stage of the double belt press apparatus 300. Further, a winder (not shown) is provided at a rear stage of the rear drums 302a and 302 b.

The heat-resistant base material layer 12 (first base material) is wound up by the first feeding roller 306. The unwinding speed of the heat-resistant base material layer 12 is controlled by the first delivery roller 306, and the tension applied to the heat-resistant base material layer 12 conveyed to the belts 303a and 303b can be controlled.

The second base material 14 is taken up by the second delivery roller 307. Further, when the second base material 14 is wound around the second feed roller 307 so as to be unwound from the second feed roller 307, the first surface 14a is positioned on the first feed roller 306 side (the heat-resistant base material layer 12 side). The unwinding speed of the second substrate 14 is controlled by the second feed-out roller 306, and the tension applied to the second substrate 14 conveyed to the belts 303a, 303b can be controlled.

In the double belt press apparatus 300, the heat-resistant base material layer 12 in a long strip shape continuously fed out from the first feed-out roller 306 and the second base material 14 in a long strip shape continuously fed out from the second feed-out roller 307 have a surface temperature T₁Are overlapped with each other, and pass continuously between the belts 303a, 303b at a temperature T₁Next, the laminate 10 (laminate I) is formed by pressing in the thickness direction.

The obtained laminate 10 may be continuously wound by a subsequent winder or may be directly supplied to the second step.

Belt temperature (temperature T)₁) The preferred embodiment is the same as the first embodiment. In addition, preferable values of the pressure, the elongation of each of the heat-resistant base material layer 12 and the second base material 14 when the heat-resistant base material layer 12 and the second base material 14 are conveyed, and the difference in elongation between the heat-resistant base material layer 12 and the second base material 14 are also the same as those in the first embodiment.

The first step is described above by showing the first to third embodiments, but the first step of the present invention is not limited to the above embodiments. The configurations and combinations thereof in the above embodiments are examples, and additions, omissions, substitutions, and other modifications of the configurations may be made within the scope of the present invention.

For example, in the roll laminating apparatuses 100 and 200, a preheating device (such as a preheating roll or a preheating heater) may be provided in a stage preceding the pair of laminating rolls 101 to preheat the heat-resistant base material layer 12 and/or the second base material 14. When preheating, the preheating temperature is preferably 20-100 ℃.

Further, the pressurization may be performed 2 times or more. For example, one roller may be disposed adjacent to one of the two rollers constituting the pair of laminating rollers 101, and the laminated substrate may be passed between the three rollers while being pressed.

As the first substrate, a metal foil layer may be used instead of the heat-resistant substrate layer 12, or a substrate composed of a heat-resistant substrate layer and a metal foil layer may be used instead of the heat-resistant substrate layer 12.

(second Process)

In the second step, a third substrate is placed on the second substrate of the laminate I obtained in the first step, and the laminate I and the third substrate are conveyed while the temperature T is at a temperature not lower than the melting point of the fluororesin contained in the second substrate₂Then, the laminate II was obtained by laminating the layers under pressure in the thickness direction (lamination direction).

The second step is preferably performed continuously by a laminating apparatus including at least one pair of laminating devices, as in the first step. The laminating apparatus may be the same as that described in the description of the first step.

The laminate I is a laminate in which a second base material is laminated on one side of a first base material, and when a third base material is laminated on one side of the laminate I (on the second base material side), the second step can be performed using, for example, a roll laminating apparatus similar to the roll laminating apparatus 100 shown in fig. 5. At this time, the laminate I is wound by the first delivery roller 103, and the third base material is wound by the second delivery roller 105. Further, when the laminate I is wound around the first feed roller 103 so as to be unwound from the first feed roller 103, the second base material side (second surface of the second base material) is positioned on the second feed roller 105 side (third base material side).

In the roll laminator 100, the long laminate I continuously fed out from the first feed-out roller 103 and the long third base material continuously fed out from the second feed-out roller 105 have a surface temperature T₂Is overlapped with each other, and is at a temperature T when continuously passing between the pair of laminating rollers 101₂Next, the laminate II was formed by pressing in the thickness direction. The resulting laminate II can be continuously wound by a subsequent winder. At this time, if the laminate I is the laminate 10 and the third substrate is the metal foil layer 16, the laminate 20 shown in fig. 2 can be obtained.

The laminate I is a laminate in which the second base material is laminated on both sides of the first base material, and when the third base material is laminated on both sides of the laminate I, the second step can be performed using, for example, a roll laminating apparatus similar to the roll laminating apparatus 200 shown in fig. 6. At this time, the laminate I is wound by the first delivery roller 103, and the third base material is wound by the second delivery roller 105 and the third delivery roller 107, respectively.

In the roll laminator 200, the third elongated base material continuously fed out from the third feed-out roller 107, the laminate I continuously fed out from the first feed-out roller 103, and the third elongated base material continuously fed out from the second feed-out roller 105 have a surface temperature T₂Is overlapped with each other, and is at a temperature T when continuously passing between the pair of laminating rollers 101₂Next, the laminate II was formed by pressing in the thickness direction. The resulting laminate II can be continuously wound by a subsequent winder. In this case, if the laminate I is a laminate 10A, two third groupsWhen the materials are the metal foil layers 16, a laminate 20A shown in fig. 4 can be obtained.

Temperature T at which the laminate I and the third base material are conveyed while being pressurized₂The melting point of the fluororesin contained in the second base material of the laminate I is preferably not less than (the melting point +15 ℃) and more preferably not less than (the melting point +30 ℃). If the temperature T is₂When the lower limit value is not less than the above lower limit value, the second base material melts, and the adhesive strength between the second base material and the third base material is excellent. Particularly, if the fluororesin has an adhesive functional group, the adhesive strength is more excellent. In addition, since wrinkles of the second substrate are suppressed in the laminate I and both sides of the second substrate are in contact with other substrates (the first substrate or the third substrate) during lamination in the second step, wrinkles are less likely to occur in the second substrate even when heating is performed at a temperature equal to or higher than the melting point of the fluororesin.

The temperature is preferably 400 ℃ or less, more preferably 380 ℃ or less, from the viewpoint of preventing oxidation of the metal foil layer.

Wherein the temperature T is set to a value at which the second substrate is vacuum-plasma-treated₂The melting point of the fluororesin contained in the second base material of the laminate I is preferably not less than (the melting point ± 0 ℃) and more preferably not less than (the melting point +5 ℃) c. If the above temperature T is₂When the value is not less than the lower limit value, the vacuum plasma treated layer of the second base material is activated, and the adhesive strength between the second base material and the third base material is excellent. By lowering the temperature T₂Thus, a laminate II having a small dimensional change rate was obtained.

When the heat-resistant resin films of the first substrate and the third substrate are subjected to vacuum plasma treatment, the temperature is also preferably (the melting point ± 0 ℃) or higher, and more preferably (the melting point +5 ℃) or higher. If the above temperature T is₂When the vacuum plasma treatment layer is activated, the vacuum plasma treatment layer of the first base material and the vacuum plasma treatment layer of the third base material are activated, and the adhesion strength between the second base material and the first base material is excellent. By lowering the temperature T₂Thus, a laminate II having a small dimensional change rate was obtained.

Further, when the heat-resistant resin film is brought into contact with a high-temperature roll in the second step, if the water absorption rate of the heat-resistant resin film is high and water is actually absorbed, foaming occurs. It is preferable to use a heat-resistant resin film having a low water absorption rate and to remove water by heating it just before contacting a high-temperature roll.

The pressure between the pair of laminating rollers 101, that is, the pressing force when laminating the laminate I and the third substrate, may be within a range capable of lamination, and may be, for example, 10 to 100 kN/m.

The traveling speed (lamination speed) of the laminate I and the third substrate passing between the pair of lamination rollers 101 may be in a range capable of lamination, and may be, for example, 0.5 to 5.0 m/min.

The angle between the laminate I and the third substrate when they enter the laminating roller may be in a range in which lamination is possible, and may be, for example, 3 ° to 45 °.

The method for producing a laminate of the present invention may further include steps other than the first step and the second step, as necessary. As another step, for example, a step of bringing the laminate II after the second step into contact with a laminating roller heated to a temperature not lower than the melting point of the second substrate without applying pressure to improve the adhesiveness between the second substrate and another layer may be mentioned.

In the method for producing a laminate of the present invention, the temperature T at which the first base material and the second base material are laminated in the first step is set₁The temperature is 0 to 100 ℃, so that the generation of wrinkles in the second base material (fluorine resin layer) and the curling of the laminated body I can be suppressed. Further, since the first surface (the surface laminated with the first substrate) of the second substrate has a wetting tension of 30 to 60mN/m, and the second surface (the surface in contact with the multilayer device) on the opposite side has a wetting tension smaller than that of the first surface by 2mN/m or more, interlayer peeling between the first substrate and the second substrate can be suppressed. Therefore, the laminate I with less wrinkles, curls, and delamination can be obtained. Further, when the third substrate is laminated on the laminate I, the laminate II with less wrinkles and interlayer peeling can be obtained.

< method for producing Flexible printed substrate >

By using the method for producing a laminate of the present invention, a laminate having at least one outermost layer of a metal foil layer is obtained as a laminate II, and a flexible printed board can be produced through a step of forming a pattern circuit by removing a part of the metal foil layer of the outermost layer of the laminate by etching.

An example of the laminate structure of the laminate II in which at least one of the outermost layers is a metal foil layer is as described above.

For example, in the case where the second substrate is laminated on one side of the first substrate in the first step, a laminate II in which at least one of the outermost layers is a metal foil layer can be obtained by using the metal foil layer as at least one of the first substrate and the third substrate. In the case where the second base material is laminated on both sides of the first base material in the first step and the second base material is laminated on both sides of the laminate I in the second step, it can be obtained by using a metal foil layer as the third base material. Instead of the metal foil layer, a substrate including a heat-resistant substrate layer and a metal foil layer and having a metal foil layer as the outermost layer on the side opposite to the second substrate side may be used.

The lower the dimensional change rate of the laminate II, the less warpage and circuit defects after the step of forming the patterned circuit. The dimensional change rate of the laminate II is preferably within ± 0.15%, more preferably within ± 0.08%. The flexible printed board of the present invention may be a board on which various miniaturized and high-density components are mounted.

In the method for producing a flexible printed circuit board of the present invention, since the method for producing a laminate of the present invention is used, a flexible printed circuit board with less wrinkles and interlayer peeling can be obtained.