Small-spacing display screen and manufacturing method thereof
阅读说明:本技术 小间距显示屏及其制作方法 (Small-spacing display screen and manufacturing method thereof ) 是由 庄文荣 孙明 黄志强 卢敬权 于 2019-11-21 设计创作,主要内容包括:本发明提供一种小间距显示屏及其制作方法,小间距显示屏包括:PCB基板;Mini LED芯片,倒装于PCB基板上;压膜层,覆盖于PCB基板上及Mini LED芯片之间,用于防止Mini LED芯片之间的混光,且压膜层具有部分显露Mini LED芯片的出光窗口;封装层,位于压膜层及Mini LED芯片之上,用于保护Mini LED芯片及压膜层。本发明通过压膜层以及在压膜层中形成不同形状尺寸的出光窗口,可以调节红色Mini LED芯片、绿色Mini LED芯片及蓝色Mini LED的发光强度,使得本发明的小间距显示屏具有更高的色域。(The invention provides a small-spacing display screen and a manufacturing method thereof, wherein the small-spacing display screen comprises the following components: a PCB substrate; the Mini LED chip is inversely arranged on the PCB substrate; the film pressing layer covers the PCB substrate and between the Mini LED chips and is used for preventing light mixing between the Mini LED chips, and the film pressing layer is provided with a light emitting window partially exposing the Mini LED chips; and the packaging layer is positioned on the laminating layer and the Mini LED chip and is used for protecting the Mini LED chip and the laminating layer. According to the invention, the light emitting windows with different shapes and sizes are formed in the film pressing layer, so that the luminous intensities of the red Mini LED chip, the green Mini LED chip and the blue Mini LED can be adjusted, and the small-distance display screen has a higher color gamut.)
1. A small-pitch display screen, comprising:
a PCB substrate;
the Mini LED chip is inversely arranged on the PCB substrate;
the film pressing layer covers the PCB substrate and between the Mini LED chips and is used for preventing light mixing between the Mini LED chips, and the film pressing layer is provided with a light emitting window partially exposing the Mini LED chips;
and the packaging layer is positioned on the laminating layer and the Mini LED chip and is used for protecting the Mini LED chip and the laminating layer.
2. The small-pitch display screen of claim 1, wherein: the PCB substrate comprises a first surface and a second surface, the first surface is provided with an electrode and used for being connected with the Mini LED chip, and the second surface is provided with a connecting part and used for being connected with a driving chip.
3. The small-pitch display screen of claim 1, wherein: the size of the Mini LED chip is not more than 100 microns multiplied by 200 microns.
4. The small-pitch display screen of claim 1, wherein: the laminate layer includes an opaque polymeric material.
5. The small-pitch display screen of claim 4, wherein: the lamination layer comprises an opaque thermosetting material or an ultraviolet curing material, and the opaque thermosetting material comprises silicone resin doped with carbon powder or epoxy resin doped with carbon powder.
6. The small-pitch display screen of claim 1, wherein: the packaging layer is made of transparent thermosetting materials or semitransparent thermosetting materials, the transparent thermosetting materials comprise silicon resins or epoxy resins, and the semitransparent thermosetting materials comprise silicon resins or epoxy resins added with emulsifiers or silicon resins or epoxy resins subjected to surface shaping.
7. The small-pitch display screen of claim 1, wherein: the Mini LED chips comprise red Mini LED chips, green Mini LED chips and blue Mini LED chips, and the red Mini LED chips, the green Mini LED chips and the blue Mini LED chips are arranged in an array.
8. The small-pitch display screen of claim 1, wherein: the light-emitting window of the film lamination layer is formed by partially exposing the Mini LED chip, and the shape of the light-emitting window comprises one or a combination of a rectangle, a triangle, a pentagon, a trapezoid, a circle and an ellipse.
9. A manufacturing method of a small-spacing display screen is characterized by comprising the following steps:
1) providing a PCB substrate, and inversely installing a Mini LED chip on the PCB substrate;
2) forming a pressure film layer on the PCB substrate and between the Mini LED chips for preventing light mixing between the Mini LED chips;
3) forming a light-emitting window on the film pressing layer, wherein the light-emitting window at least comprises a light-emitting window partially exposing the Mini LED chip;
4) and forming a packaging layer on the laminating layer and the Mini LED chip for protecting the Mini LED chip and the laminating layer.
10. The method for manufacturing a small-pitch display screen according to claim 9, wherein the step 1) comprises the steps of:
1-1) transferring the Mini LED chip to the PCB substrate;
1-2) welding the Mini LED chip on the PCB substrate.
11. The method of manufacturing a small-pitch display screen according to claim 10, wherein the method comprises the following steps: the transfer in the step 1-1) comprises one of pick-and-place transfer and thimble alignment transfer; the welding in the step 1-2) comprises one of reflow welding and laser welding.
12. The method for manufacturing a small-pitch display screen according to claim 9, further comprising a step of printing solder paste on the PCB substrate by using a mask before the step 1), wherein the solder paste is used as an electrode and a solder.
13. The method of manufacturing a small-pitch display screen according to claim 9, wherein the step 2) of forming the lamination layer comprises:
2-1) providing a tank body, laying a release film at the bottom of the tank body, and then injecting a liquid opaque polymer material into the tank body;
2-2) immersing the side of the PCB substrate with the Mini LED chip in the groove body downwards;
2-3) curing the opaque polymeric material.
14. The method of manufacturing a small-pitch display screen according to claim 13, wherein the lamination layer comprises an opaque thermosetting material, the opaque thermosetting material comprises silicone resin doped with carbon powder or epoxy resin doped with carbon powder, and the step 2-3) cures the thermosetting material by heating.
15. A method of manufacturing a small-pitch display screen according to claim 13, wherein the lamination layer comprises an ultraviolet curing material, and step 2-3) the ultraviolet curing material is cured by ultraviolet irradiation.
16. The method for manufacturing a small-pitch display screen according to claim 9, wherein the step 3) comprises the steps of:
3-1) forming a mask layer on the pressure film layer;
3-2) etching the pressure film layer based on the mask layer to form a light-emitting window in the pressure film layer;
3-3) removing the mask layer.
17. The method for manufacturing a small-pitch display screen according to claim 9, wherein the step 4) comprises the steps of:
4-1) providing a groove body, wherein the bottom of the groove body is provided with an imprinting mold, and a release film is laid on the imprinting mold;
4-2) injecting liquid silicone resin or epoxy resin into the tank body;
4-3) enabling the film pressing layer to face downwards, and immersing the PCB substrate into a tank body;
4-4) heating the silicone resin or epoxy resin to cure the silicone resin or epoxy resin.
18. The method for manufacturing a small-pitch display screen according to claim 9, wherein the step 4) comprises the steps of:
4-1) providing a tank body, laying a release film at the bottom of the tank body, and injecting liquid silicon resin or epoxy resin into the tank body;
4-2) enabling the film pressing layer to face downwards, and immersing the PCB substrate into a tank body;
4-3) heating the silicone resin or epoxy resin to cure the silicone resin or epoxy resin.
Technical Field
The invention belongs to the field of display screen design and manufacture, and particularly relates to a small-spacing display screen and a manufacturing method thereof.
Background
With the continuous improvement of indoor display application technology, currently used display application products such as projection/DLP/LCD/PDP and the like cannot completely meet the market application requirements. There are also some drawbacks in various aspects that make it impossible to break through the technological development. The LED full-color display screen overcomes the defects of the products, and becomes a first choice for indoor and outdoor large-screen display, such as occasions of command centers, outdoor advertising screens, conference centers and the like.
At present, the minimum point distance of the LED display screen is 0.9375mm, but the market has wide requirements on the LED display screen with the smaller point distance. The picture can be clearer due to the small dot spacing. Generally, the LED display screen is seamlessly spliced into a large-sized display screen by a certain number of small-sized display screen modules. Because human eyes have different sensitivities to different colors and require different luminous intensities of red, green and blue chips, different chip sizes are required. However, in the manufacture of small-pitch display modules, the size of the red, green and blue Mini LED chips used is the same due to the limitations of the equipment and the precision of the substrate (mostly PCB). An alternative solution is to drive the highly eye sensitive chip at low current, such as green light. However, the Mini LED chip has a problem of uniformity of light emission under a low driving current. Although this problem can be solved by sorting, sorting too finely results in an increase in production cost and a decrease in production efficiency.
Disclosure of Invention
In view of the above-mentioned shortcomings of the prior art, the present invention is directed to a small-pitch display panel and a method for manufacturing the same, which are used to solve the problem of uniformity of the light intensity of the Mini LEDs of the display panel in the prior art.
To achieve the above and other related objects, the present invention provides a small-pitch display screen, including: a PCB substrate; the Mini LED chip is inversely arranged on the PCB substrate; the film pressing layer covers the PCB substrate and between the Mini LED chips and is used for preventing light mixing between the Mini LED chips, and the film pressing layer is provided with a light emitting window partially exposing the Mini LED chips; and the packaging layer is positioned on the laminating layer and the Mini LED chip and is used for protecting the Mini LED chip and the laminating layer.
Optionally, the PCB substrate includes a first surface and a second surface, the first surface has an electrode for connecting with the Mini LED chip, and the second surface has a connecting portion for connecting with a driving chip.
Optionally, the Mini LED chip has a size of no more than 100 microns x 200 microns.
Optionally, the laminate layer comprises a polymeric material that is opaque to light.
Optionally, the laminate layer comprises an opaque thermoset material or uv curable material, the opaque thermoset material comprising silicone resin doped with carbon powder or epoxy resin doped with carbon powder.
Optionally, the encapsulation layer is a transparent thermosetting material or a translucent thermosetting material, the transparent thermosetting material includes a silicone resin or an epoxy resin, and the translucent thermosetting material includes a silicone resin or an epoxy resin added with an emulsifier, or a silicone resin or an epoxy resin formed by surface shaping.
Optionally, the Mini LED chips include a red Mini LED chip, a green Mini LED chip, and a blue Mini LED chip, and the red Mini LED chip, the green Mini LED chip, and the blue Mini LED chip are arranged in an array.
Optionally, the light exit window of the pressure film layer partially exposes the Mini LED chip, and the shape of the light exit window includes one or a combination of a rectangle, a triangle, a pentagon, a trapezoid, a circle, and an ellipse.
The invention also provides a manufacturing method of the small-spacing display screen, which comprises the following steps: 1) providing a PCB substrate, and inversely installing a Mini LED chip on the PCB substrate; 2) forming a pressure film layer on the PCB substrate and between the Mini LED chips for preventing light mixing between the Mini LED chips; 3) forming a light-emitting window on the film pressing layer, wherein the light-emitting window at least comprises a light-emitting window partially exposing the Mini LED chip; 4) and forming a packaging layer on the laminating layer and the Mini LED chip for protecting the Mini LED chip and the laminating layer.
Optionally, step 1) comprises the steps of: 1-1) transferring the Mini LED chip to the PCB substrate; 1-2) welding the Mini LED chip on the PCB substrate.
Optionally, the transferring in step 1-1) includes one of pick-and-place transferring and thimble alignment transferring; the welding in the step 1-2) comprises one of reflow welding and laser welding.
Optionally, before the step 1), a step of printing a solder paste on the PCB substrate by using a mask, where the solder paste serves as an electrode and a solder is further included.
Optionally, the step 2) of forming the laminate layer includes: 2-1) providing a tank body, laying a release film at the bottom of the tank body, and then injecting a liquid opaque polymer material into the tank body; 2-2) immersing the side of the PCB substrate with the Mini LED chip in the groove body downwards; 2-3) curing the opaque polymeric material.
Optionally, the lamination layer comprises an opaque thermosetting material comprising silicone resin doped with carbon powder or epoxy resin doped with carbon powder, and step 2-3) cures the thermosetting material by heating.
Optionally, the lamination layer includes an ultraviolet curing material, and step 2-3) cures the ultraviolet curing material by ultraviolet irradiation.
Optionally, step 3) comprises the steps of: 3-1) forming a mask layer on the pressure film layer; 3-2) etching the pressure film layer based on the mask layer to form a light-emitting window in the pressure film layer; 3-3) removing the mask layer.
Optionally, step 4) comprises the steps of: 4-1) providing a groove body, wherein the bottom of the groove body is provided with an imprinting mold, and a release film is laid on the imprinting mold; 4-2) injecting liquid silicone resin or epoxy resin into the tank body; 4-3) enabling the film pressing layer to face downwards, and immersing the PCB substrate into a tank body; 4-4) heating the silicone resin or epoxy resin to cure the silicone resin or epoxy resin.
Optionally, step 4) comprises the steps of: 4-1) providing a tank body, laying a release film at the bottom of the tank body, and injecting liquid silicon resin or epoxy resin into the tank body; 4-2) enabling the film pressing layer to face downwards, and immersing the PCB substrate into a tank body; 4-3) heating the silicone resin or epoxy resin to cure the silicone resin or epoxy resin.
As mentioned above, the small-spacing display screen and the manufacturing method thereof have the following beneficial effects:
the invention realizes the small-distance display screen with different light-emitting windows and the manufacturing method thereof by forming the light-emitting windows with different shapes and sizes in the film pressing layer and manufacturing the through holes with openings with different shapes and sizes in the film pressing layer, and can adjust the luminous intensity of the red Mini LED chip, the green Mini LED chip and the blue Mini LED chip, so that the small-distance display screen has higher color gamut.
On the other hand, the film pressing layer can prevent light mixing among the Mini LED chips, avoid the light mixing phenomenon among the Mini LEDs with different colors, and simultaneously enable the display screen to have higher ink color consistency.
The invention has higher production and manufacturing efficiency and lower production cost, and has wide application prospect in the field of display screen manufacturing and designing.
Drawings
Fig. 1 to 10 are schematic structural diagrams showing steps of the method for manufacturing a small-pitch display screen according to the present invention.
Description of the element reference numerals
101 PCB substrate
102 Mini LED chip
103 first electrode
104 second electrode
204 strip-shaped electrode
105 first chip electrode
106 second chip electrode
107 lamination film layer
108 mask layer
109 light exit window
110 encapsulation layer
Detailed Description
The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and effects of the present invention will be easily understood by those skilled in the art from the disclosure of the present specification. The invention is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present invention.
As in the detailed description of the embodiments of the present invention, the cross-sectional views illustrating the device structures are not partially enlarged in general scale for convenience of illustration, and the schematic views are only examples, which should not limit the scope of the present invention. In addition, the three-dimensional dimensions of length, width and depth should be included in the actual fabrication.
For convenience in description, spatial relational terms such as "below," "beneath," "below," "under," "over," "upper," and the like may be used herein to describe one element or feature's relationship to another element or feature as illustrated in the figures. It will be understood that these terms of spatial relationship are intended to encompass other orientations of the device in use or operation in addition to the orientation depicted in the figures. Further, when a layer is referred to as being "between" two layers, it can be the only layer between the two layers, or one or more intervening layers may also be present.
In the context of this application, a structure described as having a first feature "on" a second feature may include embodiments in which the first and second features are formed in direct contact, and may also include embodiments in which additional features are formed in between the first and second features, such that the first and second features may not be in direct contact.
It should be noted that the drawings provided in the present embodiment are only for illustrating the basic idea of the present invention, and the drawings only show the components related to the present invention rather than being drawn according to the number, shape and size of the components in actual implementation, and the type, quantity and proportion of each component in actual implementation may be changed arbitrarily, and the layout of the components may be more complicated.
As shown in fig. 1a to 3b and fig. 8 to 10, the present embodiment provides a small-pitch display screen, which includes a
As shown in fig. 1a and fig. 2, wherein fig. 2 is a schematic cross-sectional view taken along a-a' of fig. 1a, the
As shown in fig. 1b, the
As shown in fig. 3a to 3b and fig. 8, the
Fig. 3a is a schematic structural view of fig. 1a after the
Fig. 3b is a schematic structural diagram of fig. 1b after the
As shown in fig. 8 to 10, the
The
As shown in fig. 8 to 10, the
As shown in fig. 8, the encapsulation layer 110 is disposed on the
As an example, the encapsulation layer 110 is a transparent thermosetting material including a silicone resin or an epoxy resin or a translucent thermosetting material including a silicone resin or an epoxy resin added with an emulsifier or a silicone resin or an epoxy resin by surface shaping. The encapsulation layer 110 can isolate the display screen from oxygen, moisture and dust.
As shown in fig. 1a to 10, this embodiment further provides a method for manufacturing a small-pitch display screen, where the method includes:
as shown in fig. 1a to 4, step 1) is performed first, a
As an example, before the step 1), a step of printing a solder paste on the
As shown in fig. 1a and fig. 2, wherein fig. 2 is a schematic cross-sectional view taken along a-a' of fig. 1a, the
As shown in fig. 1b, the
As shown in fig. 3a to 4, specifically, the step 1) includes the steps of:
step 1-1), transferring the
The
Step, 1-2) welding the
A specific embodiment is shown in fig. 3a, wherein fig. 3a is a schematic structural view of fig. 1a after a
Another specific embodiment is shown in fig. 3b, wherein fig. 3b is a schematic structural diagram of fig. 1b after the
As shown in fig. 5, step 2) is then performed to form a
As an example, the step 2) of forming the
step 2-1), providing a tank body, laying a release film at the bottom of the tank body, and then injecting a liquid opaque polymer material into the tank body;
step 2-2), immersing the side, provided with the
step 2-3), curing the opaque polymeric material.
In one specific implementation, the
In yet another specific implementation, the
The
As shown in fig. 6 to 10, step 3) is performed to form a
As an example, step 3) comprises the steps of:
as shown in fig. 6, step 3-1) is performed first to form a
As shown in fig. 7, step 3-2) is then performed) the
As shown in fig. 7, step 3-3) is finally performed to remove the
As shown in fig. 8 to 10, the
As shown in fig. 8, step 4) is finally performed to form an encapsulation layer 110 on the
In one embodiment, step 4) may comprise the steps of:
step 4-1), providing a groove body, wherein the bottom of the groove body is provided with an imprinting mold, and a release film is laid on the imprinting mold;
step 4-2), injecting liquid silicone resin or epoxy resin into the tank body;
step 4-3), enabling the
and 4-4) heating the silicon resin or the epoxy resin to cure the silicon resin or the epoxy resin.
The method can prepare the packaging layer 110 with the imprinted pattern on the surface, so that the surface of the packaging layer 110 is in a matte form.
In a further embodiment, step 4) may also include the steps of:
step 4-1), providing a tank body, laying a release film at the bottom of the tank body, and injecting liquid silicon resin or epoxy resin into the tank body;
step 4-2), enabling the
and 4-3) heating the silicon resin or the epoxy resin to cure the silicon resin or the epoxy resin.
The encapsulation layer 110 may be a transparent or semitransparent material, and the semitransparent material may be obtained by adding an emulsifier to the transparent material or by shaping the surface of the transparent material by an embossing method.
As mentioned above, the small-spacing display screen and the manufacturing method thereof have the following beneficial effects:
the small-distance display screen with different light-emitting
On the other hand, the
The invention has higher production and manufacturing efficiency and lower production cost, and has wide application prospect in the field of display screen manufacturing and designing.
Therefore, the invention effectively overcomes various defects in the prior art and has high industrial utilization value.
The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
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