Target polishing device
阅读说明:本技术 靶材抛光装置 (Target polishing device ) 是由 姚力军 潘杰 王学泽 丁向前 于 2018-09-10 设计创作,主要内容包括:一种靶材抛光装置,包括:固定板,所述固定板包括顶板和位于所述顶板一侧的侧板;抛光片,位于所述固定板内侧面上,其中位于固定板弯折处的抛光片呈弧状。所述靶材抛光装置有助于提高对靶材表面进行抛光的作业效率。(A target polishing apparatus comprising: the fixing plate comprises a top plate and a side plate positioned on one side of the top plate; and the polishing sheet is positioned on the inner side surface of the fixed plate, wherein the polishing sheet positioned at the bent part of the fixed plate is in an arc shape. The target polishing device is beneficial to improving the operation efficiency of polishing the surface of the target.)
1. A target polishing apparatus, comprising:
the fixing plate comprises a top plate and a side plate positioned on one side of the top plate;
and the polishing sheet is positioned on the inner side surface of the fixed plate, wherein the polishing sheet positioned at the bent part of the fixed plate is in an arc shape.
2. The target polishing apparatus of claim 1, wherein the polishing pad surface matches the target sidewall surface and the rounded side edges.
3. The target polishing apparatus of claim 2, wherein the bending portion of the inner side surface of the fixing plate forms an included angle, and the thickness of the polishing sheet at the bending portion of the fixing plate is not uniform.
4. The target polishing apparatus of claim 2, wherein the bent portion of the inner side surface of the fixing plate is curved, and the thickness of the polishing sheet at the bent portion of the fixing plate is uniform.
5. The target polishing apparatus of claim 1, wherein the material of the fixing plate is a metal or an alloy.
6. The target polishing apparatus of claim 1, wherein the polishing pad is sandpaper.
7. The target polishing apparatus according to claim 1, further comprising: the protective layer is positioned between the fixing plate and the polishing sheet.
8. The target polishing apparatus of claim 7, wherein the protective layer is an elastic material.
9. The target polishing apparatus of claim 8, wherein the protective layer is made of silicone, rubber, or cotton.
10. The target polishing apparatus according to claim 1, further comprising: a handle disposed on an outer surface of the fixing plate.
11. The target polishing apparatus of claim 10, wherein the number of the handles is two, one of the handles is disposed on the top of the fixing plate, and the other handle is disposed on the sidewall of the fixing plate.
Technical Field
The invention relates to the technical field of semiconductor manufacturing, in particular to a target polishing device.
Background
The sputtering coating belongs to one of the processes for preparing thin films by a physical vapor deposition method, and particularly relates to a method for forming a thin film by bombarding the surface of a target by using high-energy particles so that target atoms or molecules obtain enough energy to escape and deposit on the surface of a base material or a workpiece.
The back plate has good electric conduction and heat conduction performance and can also play a role in fixing and supporting, so the target material needs to be welded with the back plate before film coating and then assembled to the sputtering base station together.
In general, active metal targets, such as aluminum targets, are prone to oxidation of the target surface material to form a scale due to long term exposure to air. During dc pulsed, intermediate frequency sputtering, the energy of the ion impact is not sufficient to break down the scale, making it difficult for target atoms or molecules to escape, and therefore the target surface needs to be polished before mounting the target to the sputtering station. In addition, for active metal targets and inactive metal targets, the polishing operation is beneficial to improving the stability of the sputtering rate of the targets and is beneficial to improving the sputtering coating quality.
Currently, the surface of the target is usually polished manually in the industry, that is, an operator holds sand paper to polish all the surfaces of the target, so that the operation efficiency is low.
Disclosure of Invention
The invention aims to provide a target polishing device, which is beneficial to improving the working efficiency.
In order to solve the above problems, the present invention provides a target polishing apparatus, comprising: the fixing plate comprises a top plate and a side plate positioned on one side of the top plate; and the polishing sheet is positioned on the inner side surface of the fixed plate, wherein the polishing sheet positioned at the bent part of the fixed plate is in an arc shape.
Optionally, the surface of the polishing sheet is matched with the surface of the side wall of the target and the side edge subjected to fillet treatment.
Optionally, an included angle is formed at the bent position of the inner side surface of the fixing plate, and the thickness of the polishing sheet at the bent position of the fixing plate is not uniform.
Optionally, the bending part of the inner side surface of the fixed plate is arc-shaped, and the thickness of the polishing sheet at the bending part of the fixed plate is uniform.
Optionally, the fixing plate is made of metal or alloy.
Optionally, the polishing sheet is sandpaper.
Optionally, the target polishing apparatus further includes: the protective layer is positioned between the fixing plate and the polishing sheet.
Optionally, the protective layer is made of an elastic material.
Optionally, the protective layer is made of silica gel, rubber or cotton.
Optionally, the target polishing apparatus further includes: a handle disposed on an outer surface of the fixing plate.
Optionally, the number of the handles is two, one of the handles is arranged at the top of the fixing plate, and the other handle is arranged on the side wall of the fixing plate.
Compared with the prior art, the technical scheme of the invention has the following advantages:
in the technical scheme of the target polishing device provided by the invention, the target polishing device comprises: the fixing plate comprises a top plate and a side plate positioned on one side of the top plate; and the polishing sheet is positioned on the inner side surface of the fixed plate, wherein the polishing sheet positioned at the bent part of the fixed plate is in an arc shape. The surface of the polishing sheet positioned at the bent part of the fixing plate is suitable for polishing the side edge of the target subjected to fillet treatment, and the surface of the polishing sheet positioned on the side plate is suitable for polishing the surface of the side wall of the target. The target polishing device can simultaneously polish the side wall surface of the target and the side edge subjected to fillet treatment, so that the target polishing device is beneficial to improving the operation efficiency of polishing the surface of the target.
In an alternative scheme, the protective layer is made of elastic materials, the protective layer is soft, buffering can be provided between the fixing plate and the target, and the target is prevented from being damaged due to the fact that the fixing plate collides with the target.
Drawings
Fig. 1 is a schematic perspective view of a target polishing apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic structural view of a target polishing apparatus according to another embodiment of the present invention;
fig. 3 is a front view of a target.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below.
Referring to fig. 1, a
The
In this embodiment, the
In this embodiment, the bending portion of the inner side surface of the
In this embodiment, the
In this embodiment, the
In this embodiment, the thickness of the
The surface of the
In this embodiment, the
In this embodiment, the
The
In addition, because the operator polishes the side wall surface of the target and the side edge processed by the round angle at the same time, the force difference applied to the side wall surface and the side edge of the target by the operator is small, and after the polishing process is finished, the side wall surface of the target and the side edge surface processed by the round angle have similar or even completely same flatness, so that the polished surface has good uniformity and is beneficial to improving the sputtering coating quality. If the side wall surface of the target and the side edge surface subjected to fillet treatment are polished in different steps, the force degrees applied by an operator in the two steps are easy to be greatly different, so that the roughness difference between the side wall surface of the target and the side edge surface is large after polishing treatment, and a step is formed at the joint of the side wall surface of the target and the side edge surface. In the sputtering coating process, the step is easy to cause point discharge, the uniformity of the sputtering coating is influenced, and the coating quality is poor.
In this embodiment, the polishing sheet
In this embodiment, the thickness of the
In this embodiment, the polishing sheet
In this embodiment, the
The
In this embodiment, the thickness of the
In this embodiment, the
In this embodiment, the
The
In this embodiment, the first protective layer and the second protective layer have the same thickness.
In this embodiment, the first protection layer and the second protection layer are integrally formed. In other embodiments, the first protective layer and the second protective layer may be separate.
In this embodiment, the
In order to facilitate the gripping of both hands of an operator, the number of the handles is two, one of the handles is disposed at the top of the fixing
In this embodiment, the two handles are a
In this embodiment, the
In this embodiment, the
In other embodiments, referring to fig. 2, the bending portion of the inner side of the fixing
In addition, unlike the previous embodiment, the polishing sheet first portion 310 (refer to fig. 1), the polishing sheet second portion 320 (refer to fig. 1) and the polishing sheet third portion 330 (refer to fig. 1) are integrally formed. And the polishing sheet
Fig. 3 is a front view of a target, and the working principle of the
The target 600 is rectangular, the top surface of the target is a target sputtering surface 610, the bottom surface of the target is a target welding surface 620, the target welding surface 620 is attached to the surface of the back plate, and the target 600 is welded and fixed with the back plate through the target welding surface 620. The target 600 has four sidewall surfaces 630.
The target 600 has twelve lateral edges 601, and each lateral edge 601 is rounded. Before the fillet process, the position of the lateral edge 601 of the target 600 is sharper. If the target 600 with the side edges not subjected to fillet treatment is used for sputtering coating, the point discharge phenomenon is easily generated at the position of the side edge 601 of the target 600 in the sputtering coating process, so that the coating uniformity is poor, and the coating quality is affected. The rounding passivates the target edges 601 and helps prevent arcing.
When the target 600 is polished by the
In addition, the two sidewall surfaces 630 where the target 600 meets may also be polished simultaneously by the
Although the present invention is disclosed above, the present invention is not limited thereto. Various changes and modifications may be effected therein by one skilled in the art without departing from the spirit and scope of the invention as defined in the appended claims.
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