阅读说明：本技术 散热结构及其光模块 (Heat radiation structure and optical module thereof ) 是由 张超 于 2018-09-07 设计创作，主要内容包括：一种散热结构,其包括相互组装在一起的发热组件、散热垫和散热元件,所述散热垫将所述发热组件产生的热散发至所述散热元件,所述散热元件将热量散发出来；所述散热垫包括多个不完全相连的散热片。散热垫由多个散热片组成,各个散热片之间的空隙能够吸收组装时产生的应力,从而避免散热垫和发热组件组装在一起形成散热结构时产生应力的问题。(A heat dissipation structure comprises a heating assembly, a heat dissipation pad and a heat dissipation element which are assembled together, wherein the heat dissipation pad dissipates heat generated by the heating assembly to the heat dissipation element, and the heat dissipation element dissipates heat; the thermal pad includes a plurality of incompletely attached thermal fins. The radiating pad is composed of a plurality of radiating fins, and the gap between the radiating fins can absorb the stress generated during assembly, so that the problem of stress generated when the radiating pad and the heating component are assembled together to form a radiating structure is avoided.)

1. A heat radiation structure is characterized in that: the heat dissipation device comprises a heating assembly, a heat dissipation pad and a heat dissipation element which are mutually assembled, wherein the heat dissipation pad dissipates heat generated by the heating assembly to the heat dissipation element, and the heat dissipation element dissipates the heat; the thermal pad includes a plurality of incompletely attached thermal fins.

2. The heat dissipation structure according to claim 1, wherein: the radiating fins are arranged on the surface of the radiating element or the surface of the heating component in an array mode.

3. The heat dissipation structure according to claim 1, wherein: after the heat dissipation structure is assembled, grooves and/or gaps are formed among the plurality of heat dissipation fins.

4. The heat dissipation structure according to any one of claims 1 to 3, wherein: the radiating fins are polygonal, circular or a combination of the polygonal and the circular.

5. The heat dissipation structure according to any one of claims 1 to 3, wherein: the heat dissipation pad is formed in a mode of extrusion coating.

6. The heat dissipation structure according to any one of claims 1 to 3, wherein: the heating component comprises a heating element and a bearing plate, and the heating element is fixed on the bearing plate.

7. The utility model provides an optical module, optical module includes the casing, locates circuit board in the casing and the power component who produces heat, power component with be equipped with the cooling pad between the casing, the cooling pad with the heat dissipation that power component produced extremely the casing, its characterized in that: the thermal pad includes a plurality of incompletely attached thermal fins.

8. The light module of claim 7, wherein: and after the optical module is assembled, grooves and/or gaps are formed among the plurality of radiating fins.

9. The light module of claim 7, wherein: the radiating fins are arranged on the surface of the circuit board or the surface of the shell in an array mode.

10. The light module according to any one of claims 7-9, characterized in that: the heat dissipation pad is formed in a mode of extrusion coating.

Technical Field

The application relates to the technical field of heat dissipation, in particular to a heat dissipation structure and an optical module thereof.

Background

In electronic products, it is often necessary to dissipate heat from the power device to maintain the operating temperature of the power device within a reasonable range. Heat conduction is a common way of dissipating heat. Heat conduction is generally achieved by contacting the power device with a material (usually a metal casing or heat sink) that conducts heat well, so that the heat is conducted to the material that conducts heat well and then dissipated. Or the power device is fixed with a carrier plate firstly, and the carrier plate is contacted with a material with good heat conduction.

A thermal pad is typically disposed between the power device (or carrier board) and the thermally conductive material (e.g., housing). The heat dissipation pad can make the power device form good heat conduction contact with the shell so as to improve the heat dissipation efficiency. Sometimes, in order to ensure good contact, the power device and the case are pressed together with an external force. The existence of the heat dissipation pad can cause that the local pressure is higher, and larger stress is formed.

The greater the stress of the heat sink pad on the carrier or the housing, etc., the stress is due to the compression of the heat sink pad. Because the heat dissipation pad is generally mud-shaped, belongs to non-Newtonian fluid, and is incompressible fluid, the roughness of the contact surface of the heat dissipation pad is not good, and the flowing performance is not good. The compression causes that the fluid in the middle circle part cannot extend to the outer area due to too large flow resistance, so that the local pressure is larger, and larger stress is formed. The existence of stress can lead to the machine component perk, influences product assembly precision.

Disclosure of Invention

An object of the application is to provide a heat radiation structure and an optical module thereof, which can solve the problem that a heat radiation pad generates stress after the assembly of the heat radiation structure is completed.

In order to achieve one of the above objects, the present application provides a heat dissipation structure, including a heat generating component, a heat dissipation pad and a heat dissipation element, which are assembled together, wherein the heat dissipation pad dissipates heat generated by the heat generating component to the heat dissipation element, and the heat dissipation element dissipates heat; the heat dissipation pad comprises a plurality of incompletely connected heat dissipation fins

In one embodiment, the heat dissipation fins are arranged in an array on the surface of the heat dissipation element or the surface of the heat generating component.

In an embodiment, after the heat dissipation structure is assembled, grooves and/or gaps are formed among the plurality of heat dissipation fins.

In one embodiment, the heat sink is polygonal, circular or a combination of polygonal and circular.

In one embodiment, the heat dissipation pad is formed by extrusion coating.

In one embodiment, the heat generating assembly includes a heat generating element and a carrier plate, and the heat generating element is fixed on the carrier plate.

The application also provides an optical module, the optical module includes the casing, locates circuit board in the casing and the power component who produces heat, power component with be equipped with the cooling pad between the casing, the cooling pad will the heat dissipation that power component produced extremely the casing, the cooling pad includes a plurality of incomplete continuous fin.

In an embodiment, after the optical module is assembled, grooves and/or gaps are formed between the plurality of heat dissipation fins.

In one embodiment, the heat sinks are arranged in an array on the surface of the circuit board or the surface of the housing.

In one embodiment, the heat dissipation pad is formed by extrusion coating.

The beneficial effect of this application: the radiating pad comprises a plurality of radiating fins, and the stress generated during assembling can be absorbed by the gaps among the radiating fins, so that the problem of stress generation when the radiating pad and the heating component are assembled together to form a radiating structure is avoided.

Drawings

FIG. 1 is an exploded view of an optical module structure according to one embodiment;

FIG. 2 is a schematic diagram of the optical module of FIG. 1 with a heat sink coated on a lower housing;

FIG. 3 is a schematic diagram illustrating a stress analysis of the optical module heatsink pad shown in FIG. 1.

Detailed Description

The present application will now be described in detail with reference to specific embodiments thereof as illustrated in the accompanying drawings. These embodiments are not intended to limit the present application, and structural, methodological, or functional changes made by those skilled in the art according to these embodiments are included in the scope of the present application.

In the various illustrations of the present application, certain dimensions of structures or portions may be exaggerated relative to other structures or portions for ease of illustration and, thus, are provided to illustrate only the basic structure of the subject matter of the present application.

Also, terms used herein such as "upper," "above," "lower," "below," and the like, denote relative spatial positions of one element or feature with respect to another element or feature as illustrated in the figures for ease of description. The spatially relative positional terms may be intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary term "below" can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly. When an element or layer is referred to as being "on," or "connected" to another element or layer, it can be directly on, connected to, or intervening elements or layers may be present.

The application provides a heat dissipation structure, and the heat dissipation structure comprises a heating component, a heat dissipation pad and a heat dissipation element which are assembled together. The heat dissipation pad dissipates heat generated by the heating assembly to the heat dissipation element, and the heat dissipation element dissipates the heat. The thermal pad includes a plurality of incompletely attached fins. The heat dissipation structure will be described in detail below by taking an optical module using the heat dissipation structure as an example.

Referring to fig. 1, fig. 1 is an exploded view of an optical module. The optical module 100 of this embodiment includes a housing 110. The housing 110 is divided into an upper housing 112 and a lower housing 114, which may be secured together by screws. The optical module 100 includes a circuit board 120, a power element for generating heat, and a heat dissipation pad 140 provided in a housing 110. Among the components that generate power from heat are electronic components 122 and optical components 130 disposed on circuit board 120. The optical assembly 130 includes a laser, lens, photodetector, wavelength division multiplexer, and the like. The laser generally generates more heat, which is the main heat generating component of the optical assembly 130.

The heat pad 140 is disposed between the optical module 130 and the lower case 114 for effectively conducting heat generated from the optical module 130 to the lower case 114. For better heat dissipation, the optical assembly 130 and the lower housing 114 are typically pressed tightly together. The heat sink pad 114 is generally proximate to the laser in the optical assembly 130, i.e., proximate to the heat source, to facilitate rapid heat dissipation. The lower housing 114 is generally made of metal, and has good heat conductivity, so as to rapidly dissipate heat.

Of course, in other embodiments, the location and number of the pads may be adjusted as desired. For example, a thermal pad may be disposed between the optical assembly and the upper housing; or the number of the heat dissipation pads is increased, and the heat dissipation pads are also arranged between the circuit board and the lower shell. A bearing plate can also be arranged between the heating element and the radiating pad, the emitting element is fixed on the bearing plate, and the bearing plate is in heat conduction connection with the radiating pad, so that heat generated by the heating element is firstly transmitted to the bearing plate and then transmitted to the radiating pad, and preferably the shell can radiate the heat.

Referring to fig. 2, the heat sink pad 140 includes a plurality of incompletely coupled heat sinks 142. The thermal pad 140 is formed by extrusion coating. That is, a single extruder may be used to extrude a single piece of the heat sink 142 to form the entire heat sink pad 140. Here, the heat dissipation pad 140 is pressed on the lower housing 114 (i.e., the heat dissipation element), and in other embodiments, on the surface of the optical component (heat generating component). Thus, the heat sink fins 142 are arranged in an array on the surface of the heat dissipation element or the surface of the heat generating component. The extruded heat sink 142 may have a polygonal shape, a circular shape, or a combination of a polygonal shape and a circular shape on the lower case 114.

After the extrusion machine extrudes the heat sink fins 142 to form the heat sink pad 140, grooves or gaps are formed between the heat sink fins 142. The fins 142 may be connected by a portion of the area therebetween such that a groove is formed between the fins. When the fins 142 are not joined together, a gap is formed between the fins. When the lower housing 114 and the optical assembly 130 are assembled together, a certain pressure is applied to each other when the lower housing 112 and the optical assembly 130 are assembled together to ensure good contact. At this time, the grooves or gaps between the plurality of fins may become small. If the gaps between the fins 142 are completely the same during coating, the gaps may be of different sizes after the lower housing 114 and the optical assembly 130 are assembled due to stress non-uniformity.

Referring to fig. 3, when the lower housing 114 and the optical assembly 130 are close to each other, a force is applied to the heat sink 142 in the left-right direction shown in the drawing. Thereby enabling the force in the up-down direction in the figure to be more uniform. When the stress in the up-and-down direction at a certain local position is larger, the heat sink 142 will generate a certain flow to reduce the stress, and the gap and the groove provide a space for the flow of the heat sink 142, so that the overall stress between the lower housing 114 and the optical assembly 130 will be more uniform, and the generation of the local stress can be reduced.

The radiating pad comprises a plurality of radiating fins, and the stress generated during assembling can be absorbed by the gaps among the radiating fins, so that the problem of stress generated during assembling the radiating pad and the heating component together to form a radiating structure is avoided. Therefore, the problem of tilting of mechanism parts caused by stress can be avoided, and the assembly precision of the product is higher.

The above list of details is only for the concrete description of the feasible embodiments of the present application, they are not intended to limit the scope of the present application, and all equivalent embodiments or modifications that do not depart from the technical spirit of the present application are intended to be included within the scope of the present application.