Method for manufacturing optical sensor module
阅读说明:本技术 光传感器组件制造方法 (Method for manufacturing optical sensor module ) 是由 李贤荣 郑哲珉 于 2018-12-04 设计创作,主要内容包括:本发明提供一种光传感器组件制造方法,包括如下步骤:基底步骤:配置引线框架与输出端子;元器件配置步骤,将接收IR带宽信号的收光电二极管与放大芯片配置于所述引线框架;连接步骤,通过电线连接所述收光电二极管与放大芯片,将所述放大芯片通过电线与所述输出端子连接;盒子配置步骤,所述收光电二极管与放大芯片被配置于内侧,将在一面形成有开口部的密封盒子以侧部与所述引线框架相接的方式配置;及涂覆剂注入步骤,将IR涂覆剂注入所述开口部,将IR涂覆剂注入所述密封盒子内部。(The invention provides a manufacturing method of an optical sensor assembly, which comprises the following steps: a substrate step: configuring a lead frame and an output terminal; a component configuration step, wherein a receiving photodiode for receiving an IR bandwidth signal and an amplifying chip are configured on the lead frame; a connection step of connecting the reception photodiode and an amplification chip by a wire, and connecting the amplification chip to the output terminal by a wire; a box arrangement step of arranging the light receiving diode and the amplifier chip on the inner side, and arranging a sealing box having an opening formed on one surface thereof so that a side portion thereof is in contact with the lead frame; and a coating agent injection step of injecting an IR coating agent into the opening portion and injecting the IR coating agent into the sealed box.)
1. A method of manufacturing a light sensor module,
the method comprises the following steps:
a substrate step: configuring a lead frame and an output terminal;
a component configuration step, wherein a receiving photodiode for receiving an IR bandwidth signal and an amplifying chip are configured on the lead frame;
a connection step of connecting the reception photodiode and an amplification chip by a wire, and connecting the amplification chip to the output terminal by a wire;
a box arrangement step of arranging the light receiving diode and the amplifier chip on the inner side, and arranging a sealing box having an opening formed on one surface thereof so that a side portion thereof is in contact with the lead frame; and
and a coating agent injection step of injecting an IR coating agent into the opening portion and injecting the IR coating agent into the sealed box.
2. The method of manufacturing a light sensor module according to claim 1,
in the step of configuring the cartridge, the cartridge is configured,
the sealing case has an opening formed in a portion corresponding to one surface of the light receiving diode, and has no opening formed in a portion corresponding to the amplification chip.
3. The method of manufacturing a light sensor module according to claim 2,
in the step of configuring the cartridge, the cartridge is configured,
the sealed box includes:
a side portion disposed on a side surface of the photodiode or the amplification chip;
an upper portion connected to the side portion and disposed in a direction corresponding to an upper surface of the light receiving diode,
and comprises the following steps: and a closing part connected to the side part and the upper part at a side opposite to the side where the output terminal is disposed.
4. The method of manufacturing a light sensor module according to claim 3,
in the step of configuring the cartridge, the cartridge is configured,
the opening portion of the sealed box is formed so as to open a partial region of the side portion and a partial region of the upper portion or a partial region of the upper portion and a partial region of the closing portion.
5. The method of manufacturing a light sensor module according to claim 1,
in the step of configuring the cartridge, the cartridge is configured,
a fixing hole is formed at the lead frame,
the side portion is formed with a fixing portion disposed in the fixing hole.
6. The method of manufacturing a light sensor module according to claim 5,
in the step of configuring the cartridge, the cartridge is configured,
the fixing portion is fixed at the fixing hole by a conductive adhesive, and the sealing case is fixed to the lead frame.
7. The method of manufacturing a light sensor module according to claim 1,
the length between the lead frame and the surface of the sealed box which is not connected with the lead frame is at least not less than 0.1 mm.
8. The method of manufacturing a light sensor module according to claim 1,
in the step of injecting the coating agent,
the method comprises the following steps: a mixing step of mixing the IR coating liquid with a curing agent at a ratio of 1:0.15 to 0.25 to produce the IR coating agent.
9. The method of manufacturing a light sensor module according to claim 8,
in the step of injecting the coating agent,
the IR coating agent includes: and a stirring step of stirring the IR coating liquid and the curing agent for one minute to seven minutes.
10. The method of manufacturing a light sensor module according to claim 9,
in the step of injecting the coating agent,
the IR coating agent further comprises: and a defoaming step of removing air within two to ten minutes after stirring the IR coating solution and the curing agent.
11. The method of manufacturing a light sensor module according to claim 1,
the manufacturing method of the optical sensor assembly comprises the following steps:
and a curing step of disposing the IR coating agent in a drying oven and curing the IR coating agent at a gradually increasing temperature of 25 to 160 degrees.
12. The method of manufacturing a light sensor module according to claim 11,
the manufacturing method of the optical sensor assembly comprises the following steps:
and a transparent molding step of forming a transparent case having a lens at a position corresponding to the opening of the sealing case.
Technical Field
The present technology relates to a method of manufacturing a light sensor assembly.
And more particularly, to a method of manufacturing a photosensor assembly in which component devices receiving signals of an Infrared (IR) bandwidth and signals of a visible light bandwidth are mounted to a frame.
Background
Technological advances bring convenience to users, but problems to be solved to technicians. A conventional display (for example, CRT) has advantages such as excellent color rendering performance in terms of performance of a product itself based on accumulated technologies and accurate and easy realization of a color rendering, but has disadvantages such as occupying a large volume and not being able to present a more vivid image quality to a user, and recently, a TFT-LED and an OLED (Organic Light-emitting diode) which realize a high-definition image quality and have a very small volume have been attracting attention. .
Therefore, recently, attention has been focused on a TFT-LED (Organic Light-Emitting Diode) TV and a QLED (Quantum dot Light-Emitting Diode) TV which have a high image quality and a very small volume and a high image quality at a 4K,8K level.
Recent displays are driven by digital signals, and it is easier to control correction of color phases and control power than analog devices. A remote control sensor is provided for controlling other devices to be mounted in response to the illuminance or color sensor for detecting the peripheral brightness and the hue correction and demand of the brightness detection level of the illuminance or color sensor, and is used for the hue correction and position conversion of the display. Further, in the currently marketed display products, a light emitting device that emits light to display the reception of the remote control sensor can also be installed.
In the case where the display is small in size, convenience is provided for the user to seek aesthetic appeal and installation is not restricted by a specific position, but a problem arises in that the number of positions where parts are installed is reduced from the standpoint of a technician. The most preferred method for reducing the size of the part is to place two products manufactured differently on one substrate, making a unitary assembly. I.e. a remote control sensor and an illumination or color sensor, are manufactured as one component.
However, in order to manufacture the integrated unit, there is a great problem in that the remote control sensor and the illuminance or color sensor receive signals of different bandwidths.
When the remote control sensor receives a signal of a visible light bandwidth, the entire housing is coated with a black IR coating agent for transmitting only the signal of the IR bandwidth for receiving only the signal of the IR bandwidth due to an error action, that is, the assembly including the remote control sensor is formed such that the housing itself cuts off the visible light.
In contrast, the illuminance or color sensor is manufactured as a transparent case because it needs to transmit a visible light bandwidth, i.e., a signal of all bandwidths.
The difference in the case causes a large problem in attaching the illuminance or color sensor and the remote control sensor to one substrate. When the illuminance or color sensor is disposed in the housing of the remote control sensor coated with the IR coating agent so that the remote control sensor operates, the signal of the visible light bandwidth does not reach the illuminance or color sensor, whereas when the remote control sensor is disposed in the transparent housing, the signal of the visible light bandwidth reaches the remote control sensor, thereby causing an erroneous operation of the remote control sensor.
In order to solve this problem, it is conceivable to form the housing by disposing the illuminance or color sensor and the remote sensor on one substrate and molding them separately, but in this case, a new problem is encountered in molding.
The illuminance or color sensor and the remote sensor are all manufactured by manufacturing a housing from very small components, and for this purpose, the housing is disposed in a mold having a cavity, and the cavity is filled with a molding material.
In the case of manufacturing an integrated package by disposing an illuminance or color sensor and a remote control sensor on one substrate, a mold for covering only the remote control sensor and a mold for covering only the illuminance or color sensor are separately manufactured to manufacture one package, and components can be double molded.
Disclosure of the invention
Technical problem to be solved by the invention
The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a method for manufacturing a remote control sensor and an illuminance or color sensor that receive signals having different bandwidths, as an integrated unit.
Also, an object of the present invention is to provide a method of manufacturing an optical sensor module, which does not require additional manufacturing of a mold for double molding, pursues convenience of manufacturing, and avoids an increase in manufacturing cost.
The technical problem to be achieved by the present invention is not limited to the technical problems described above, and those having no description or other technical problems will be clearly understood by those having ordinary skill in the art to which the present invention pertains from the following descriptions.
Means for solving the problems
The manufacturing method of the optical sensor assembly of the present invention comprises the steps of: a substrate step: configuring a lead frame and an output terminal; a component configuration step of configuring a receiving photodiode for receiving an IR bandwidth signal and an amplification chip on the lead frame; a connection step of connecting the receiving photodiode and an amplification chip by a wire, and connecting the amplification chip to the output terminal by a wire; a box arrangement step of arranging the light receiving diode and the amplifier chip on the inner side, and arranging a sealing box having an opening formed on one surface thereof so that a side portion thereof is in contact with the lead frame; and a coating agent injection step of injecting an IR coating agent into the opening portion and injecting the IR coating agent into the sealed box.
In the case arranging step, the sealing case has an opening formed in a portion corresponding to one surface of the light receiving diode, and has no opening formed in a portion corresponding to the amplification chip.
In the cartridge disposing step, the sealing cartridge includes: a side portion disposed on a side surface of the photodiode or the amplification chip; an upper portion connected to the side portion and disposed in a direction corresponding to an upper surface of the light receiving diode, the upper portion including: and a sealing part connected to the side part and the upper part at the opposite side where the output terminal is arranged.
In the cartridge arranging step, the opening of the sealed cartridge is formed so as to open a partial region of the side portion and a partial region of the upper portion or a partial region of the upper portion and a partial region of the closing portion.
In the case arranging step, a fixing hole is formed in the lead frame, and a fixing portion arranged in the fixing hole is formed in the side portion.
In the case arranging step, the fixing portion is fixed to the fixing hole by a conductive adhesive, whereby the sealing case is fixed to the lead frame.
And the length between the lead frame and the surface of the sealed box which is not connected with the lead frame is at least not less than 0.1 mm.
In the coating agent injecting step, comprising: a mixing step of mixing the IR coating liquid and the curing agent at a ratio of 1:1 or 1: 0.7 to produce the IR coating agent.
In the coating agent injecting step, the IR coating agent includes: a stirring step of stirring the IR coating liquid with the curing agent for one minute to ten minutes, including the conditions used within 5 hours.
In the coating agent injecting step, the IR coating agent further includes: and a defoaming step of removing air within one minute to fifteen minutes after the IR coating liquid and the curing agent are stirred.
The optical sensor assembly manufacturing method includes: and a curing step of disposing the IR coating agent in a drying oven and curing the IR coating agent by gradually raising the temperature from 25 to 160 degrees.
The optical sensor assembly manufacturing method includes: and a transparent molding step of forming a transparent case having a lens at a position corresponding to the opening portion of the sealing case.
ADVANTAGEOUS EFFECTS OF INVENTION
The present invention applies the sealing case as a mold box and molds only the remote sensor with the IR coating agent, whereby the remote sensor and the illuminance or color sensor can be attached as one body.
In addition, the present invention uses a sealing case, which must be provided, as a mold, and performs double molding for removing interference, thereby manufacturing an integrated optical sensor module that seeks manufacturing convenience without increasing manufacturing costs.
Drawings
FIG. 1 is a block diagram of a method of manufacturing a light sensor assembly of the present invention;
fig. 2 (a) is a perspective view of lead frames, output terminals, and ground terminals, which are components of a base step of the method for manufacturing an optical sensor module according to the present invention, (B) is a view of fig. 2 (a) viewed along the a direction, and (c) is a view of fig. 2 (a) viewed along the B direction;
fig. 3 is a perspective view showing a state in which each structure is arranged in a component arrangement step in the method for manufacturing an optical sensor module according to the present invention;
fig. 4 is a perspective view of a state where respective structures are connected in a connection step of the manufacturing method of the optical sensor module of the present invention;
fig. 5(a) is a perspective view showing a sealing case used in the method of manufacturing a photosensor assembly of the present invention, (B) is a drawing in which fig. 5(a) is viewed along direction a, and (c) is a drawing in which fig. 5(a) is viewed along direction B;
fig. 6(a) is a perspective view showing a state where a sealing case is provided on a lead frame, and fig. 6(b) is a view of fig. 6(a) as viewed from a direction a;
fig. 7 is a view showing a state in which a conductive adhesive is applied after fixing portions of the sealing case are disposed at fixing holes of the lead frame;
FIG. 8 is a block diagram showing a specific step in the coating agent injecting step of the manufacturing method of the photosensor assembly of the present invention;
fig. 9(a) is a perspective view showing a state where an IR coating agent is injected into the inside of a sealed case and molded in a coating agent injection step of a method of manufacturing a photosensor assembly according to the present invention, (B) is a drawing showing fig. 9(a) viewed from a direction, and (c) is a drawing showing fig. 9(a) viewed from a direction B.
Fig. 10(a) is a perspective view of a transparent case manufactured by the method of manufacturing an optical sensor module according to the present invention, (B) is a drawing showing fig. 10(a) viewed from a direction, and (c) is a drawing showing fig. 10(a) viewed from a direction B.
Description of the reference numerals
S1, base step S2, component configuration step
S3 connecting step S4 Box configuring step
S5 coating agent injection step S6 transparent molding step
A1 mixing step A2 stirring step
A3 defoaming step A4 solidifying step
10
100
120 second body portion 130 fixing holes
200 output terminal
300 ground terminal
400 sealed
411
430
450
500 receiving
700 light receiving
900 IR coating Agents
1000
1200
Detailed Description
An embodiment of the present invention will be specifically described below with reference to the accompanying drawings. It is not intended to limit the scope of the invention.
Reference numerals are attached to the components in the respective drawings, and it should be noted that the same components are denoted by the same reference numerals as much as possible even when they are displayed in different drawings. In describing the present invention, a detailed description of a known structure or function related to the judgment will be omitted in a case where the gist of the present invention is obscured.
In addition, the sizes, shapes, and the like of the constituent elements illustrated in the drawings are exaggerated for clarity and convenience of description. Terms specifically defined based on the configuration and operation of the present invention are used only for describing the embodiment of the present invention, and do not limit the scope of the present invention.
In the present invention, the term "includes" or "including" a part of a constituent element means that the constituent element is included without excluding other constituent elements unless it is specifically stated that the constituent element is included.
For convenience of explanation, the front side, the rear side, the upper side, and the lower side are divided based on fig. 3. However, they are merely for convenience of explanation and are not intended to limit the present invention to the above-described matters.
Fig. 1 is a block diagram of a method of manufacturing a light sensor assembly of the present invention.
Fig. 2 (a) is a perspective view of a lead frame, an output terminal, and a ground terminal, which are components of a base step of the method for manufacturing an optical sensor module according to the present invention, (B) is a view of fig. 2 (a) viewed along the a direction, and (c) is a view of fig. 2 (a) viewed along the B direction.
The method for manufacturing the optical sensor module of the present invention includes: a substrate step (S1), a component arrangement step (S2), a connection step (S3), a cartridge arrangement step (S4), a coating agent injection step (S5), and a transparent molding step (S6).
The mounting step (S1) is a step of arranging the
The
The
Thus, the reason why the
The
The
The reason why the
The same is true when the
A fixing hole 130 is formed at one side of the
The fixing hole 130 serves to fix the position of the sealing
An
Further, a
The
The
Fig. 3 is a perspective view showing a state in which the respective components are arranged in the component arrangement step in the method for manufacturing the optical sensor module according to the present invention.
The component placement step (S2) is a step of placing the
The receiving
Fig. 4 is a perspective view of a state in which the respective structures are connected in the connection step of the method of manufacturing the optical sensor module of the present invention.
The connection step (S3) is a step of connecting the components arranged on the
The receiving
That is, it is preferable that the receiving
The
The light-receiving
After the components arranged on the
Fig. 5(a) is a perspective view showing a sealing case used in the method of manufacturing the optical sensor module according to the present invention, (B) is a drawing in which fig. 5(a) is viewed along the a direction, and (c) is a drawing in which fig. 5(a) is viewed along the B direction.
Fig. 6(a) is a perspective view showing a state where the sealing case is provided on the lead frame, and fig. 6(b) is a view of fig. 6(a) as viewed from the a direction.
Fig. 7 is a view showing a state in which a conductive adhesive is applied after the fixing portion of the sealing case is disposed at the fixing hole of the lead frame.
The box arranging step (S4) sets the
The front side of the sealing
The sealing
More precisely, the fixing
The
The
Since the front side of the sealed
The problematic portions are the
Therefore, it is preferable that the
Therefore, the
The
The lower side of the
Fig. 8 is a block diagram showing a specific step in the coating agent injecting step of the method for manufacturing a photosensor assembly of the present invention.
Fig. 9(a) is a perspective view showing a state where an IR coating agent is injected into the inside of a sealed case and molded in a coating agent injection step of a method of manufacturing a photosensor assembly according to the present invention, (B) is a drawing showing fig. 9(a) viewed from a direction, and (c) is a drawing showing fig. 9(a) viewed from a direction B.
The coating agent injection step (S5) is a step of providing the sealed
The signal of the visible light band is completely cut off by the
When the
The thickness of the
The
Therefore, the
The mixing step (a1) refers to a step of mixing the IR coating liquid with the curing agent to manufacture the
The stirring step (a2) mixes the IR coating liquid and the curing agent to produce the IR coating liquid, and the IR coating liquid produced by mixing is stirred for one minute to seven minutes as shown in the mixing step (a1) by a step of well mixing the IR coating liquid and the curing agent. Stirring for less than one minute or more than seven minutes is preferable because the IR coating liquid and the curing agent are not mixed well, or too much air flows into the
The defoaming step (A3) is a step of removing air from the IR coating solution produced in the stirring step (a2), mixing the coating solution with a curing agent at a ratio of 1:0.15 to 0.25, and removing air from the
The
Thereafter, in a state where the
The curing step (a4) steps up the temperature of 25 to 160 degrees and cures the
Here, the curing step (a4) increases the temperature stepwise according to the time. For example, the
As described above, the method of manufacturing the optical sensor module according to the present invention uses the sealed
Fig. 10(a) is a perspective view of a transparent case manufactured by the method of manufacturing an optical sensor module according to the present invention, (B) is a drawing showing fig. 10(a) viewed from a direction, and (c) is a drawing showing fig. 10(a) viewed from a direction B.
While the
Here, the
The
In the transparent molding step (S6), the
The
Thus, the integrated optical sensor assembly of the present invention is formed on another substrate in a surface mounting manner, and has an advantage of additionally printing a circuit on another substrate because the
The
Therefore, the integrated optical sensor module manufactured by the manufacturing method of the present invention can be attached to the surface even if the front side is attached to another substrate.
Therefore, the
While the present invention has been described with reference to the specific embodiments, it will be apparent to those skilled in the art that various modifications and changes may be made to the present invention without departing from the scope of the technical idea of the present invention as set forth in the claims.
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