阅读说明：本技术 一种pcb超厚厚铜板的字符加工方法 (Character processing method for PCB (printed circuit board) super-thick copper plate ) 是由 胡小义 黄明安 何小国 于 2019-11-06 设计创作，主要内容包括：本发明公开了一种PCB超厚厚铜板的字符加工方法,在PCB的单面进行印刷字符且字符横跨基材面和铜面时,包括以下步骤：在生产板需印刷字符的基材面上喷墨字符；使用丝网在生产板上丝印位于铜面上的字符,所述丝网包括铜面区和基材区,所述基材区对应于生产板上的基材面,铜面区对应于生产板上的铜面,所述丝网上仅在铜面区对应字符处设有图文网孔；烘烤生产板,使丝印在生产板上的油墨固化。本发明方法可避免PCB超厚厚铜板上字符不下墨和不清晰的问题,确保制作的字符不会因摩擦而脱落,并保证了字符的清晰美观。(The invention discloses a character processing method of a PCB (printed circuit board) super-thick copper plate, which comprises the following steps of printing characters on a single surface of the PCB, wherein the characters cross over a base material surface and a copper surface: ink-jetting characters on the surface of a substrate on which characters are to be printed on a production board; silk screen printing characters on a copper surface on a production board by using a silk screen, wherein the silk screen comprises a copper surface area and a substrate area, the substrate area corresponds to the substrate surface on the production board, the copper surface area corresponds to the copper surface on the production board, and only the copper surface area corresponding to the characters is provided with image-text meshes on the silk screen; and baking the production board to solidify the printing ink printed on the production board. The method can avoid the problems of no ink drop and no definition of characters on the PCB super-thick copper plate, ensure that the manufactured characters do not fall off due to friction, and ensure that the characters are clear and beautiful.)

1. A character processing method of a PCB super-thick copper plate is characterized in that when characters are printed on a single surface of the PCB and cross over a base material surface and a copper surface, the character processing method comprises the following steps:

s1, ink-jetting characters on the surface of the substrate on which the characters are to be printed in the production board;

s2, silk screen printing characters on the copper surface on the production board by using a silk screen, wherein the silk screen comprises a copper surface area and a substrate area, the substrate area corresponds to the substrate surface on the production board, the copper surface area corresponds to the copper surface on the production board, and only the copper surface area corresponding to the characters is provided with image-text meshes on the silk screen;

and S3, baking the production board to solidify the printing ink printed on the production board.

2. The method for processing characters on an ultra-thick copper plate for PCB as claimed in claim 1, wherein in step S1, characters are inkjet printed on the substrate surface of the production plate by inkjet printing using inkjet printer.

3. The method for processing characters on an ultra-thick copper plate of a PCB as claimed in claim 1 or 2, wherein in step S1, when the characters are jetted, the edges of the jetted characters extend into the copper surface by 0.05-0.1mm across.

4. The method for processing characters on an ultra-thick copper plate of a PCB as claimed in claim 3, wherein in step S1, the width of the ink-jet character line extending across the copper surface is reduced by 0.03-0.1mm based on the design.

5. The method for processing the characters on the ultra-thick copper plate of the PCB as claimed in claim 1, wherein in step S2, the silk screen is a nylon screen with 200-480 meshes, and the air pressure during silk screen printing is 6 ± 2kg/cm²The scraping and printing speed is 0.1-4m/min, the ink returning speed is 1-6m/min, the scraping hardness is 65-80 degrees, and the scraper angle is 5-30 degrees.

6. The method for processing characters on an ultra-thick copper plate of a PCB as claimed in claim 1, wherein in step S3, the baking is a step baking, and the conditions of the step baking are as follows:

a first stage: the temperature is 80 ℃, and the time is 40 min;

and a second stage: the temperature is 100 ℃, and the time is 30 min;

a third stage: the temperature is 125 ℃, and the time is 20 min;

a fourth stage: the temperature is 155 ℃, and the time is 90 min.

7. The method for processing characters on an ultra-thick copper plate of a PCB as claimed in claim 1, wherein step S1 is preceded by the steps of:

and S0, printing the ink on the surface of the production board by adopting a silk screen, pre-baking the production board to preliminarily solidify the ink on the board, and then sequentially exposing and developing to form the solder resist pattern on the production board.

8. The method for processing characters on an ultra-thick copper plate of a PCB according to claim 1, wherein the production board is a core board or a multi-layer board formed by laminating an inner core board and an outer copper foil into a whole by a prepreg, and the core board or the multi-layer board is subjected to the processes of drilling, copper deposition, full-board electroplating and outer circuit manufacturing in sequence.

9. A character processing method of a PCB super-thick copper plate is characterized by comprising the following steps of printing characters on two sides of the PCB, wherein the characters cross over a base material surface and a copper surface:

s1, ink-jetting characters on the substrate surface of the first surface of the production board;

s2, ink-jetting characters on the substrate surface of the second surface of the production board;

s3, silk-screen printing characters on the copper surface on the first surface of the production board by using a first silk screen, wherein the first silk screen comprises a copper surface area and a substrate area, the substrate area on the first silk screen corresponds to the substrate surface on the production board, the copper surface area corresponds to the copper surface on the production board, and only the character position of the copper surface area corresponding to the first surface of the production board is provided with image-text meshes on the first silk screen;

s4, pre-baking the production board to primarily cure the character ink screened in the step S3;

s5, silk-screen printing characters on the copper surface on the second surface of the production board by using a second silk screen, wherein the second silk screen comprises a copper surface area and a substrate area, the substrate area on the second silk screen corresponds to the substrate surface on the production board, the copper surface area corresponds to the copper surface on the production board, and only the characters, corresponding to the second surface of the production board, of the copper surface area on the second silk screen are provided with image-text meshes;

and S6, baking the production board to solidify the printing ink printed on the production board.

10. The method for processing characters on an ultra-thick copper plate of PCB as claimed in claim 9, wherein in step S4, the production plate is baked at a temperature of 100-165 ℃ for 10-30 min; in step S6, the production board is baked at the temperature of 145-165 ℃ for 10-30min or at the temperature of 145-165 ℃ for 45-90 min.

Technical Field

The invention relates to the technical field of printed circuit board manufacturing, in particular to a character processing method of a PCB (printed circuit board) super-thick copper plate.

Background

According to different use requirements, in order to meet the requirements of passing of large current and rapid heat dissipation, the thickness of a copper layer (the thickness of a copper surface) of an outer layer circuit needs to be more than or equal to 180 micrometers, and the PCB substrate is called as a PCB super-thick copper plate.

The existing PCB character production process generally comprises the steps of firstly manufacturing a solder mask layer and then manufacturing characters in a specified area, and specifically comprises the following method processes: the substrate after the solder resist development → the ink-jet surface A character → the ink-jet surface B character → post curing → post process processing; solder resist developed substrate → silk screen A surface character → silk screen B surface character → post curing → post process processing; the substrate after the solder resist development → the first printing of the face a character → curing → the second silk-screen printing of the face a character → curing → the first printing of the face B character → curing → the second silk-screen printing of the face B character → post-curing → post-process processing.

In the production process of the PCB super-thick copper plate, because the height difference between the copper surface and the base material surface on the plate is very large (the step height difference is large), when character printing ink is printed on the PCB super-thick copper plate according to the primary silk-screen printing character manufacturing method or the secondary silk-screen printing character manufacturing method, the ink can not be printed at the joint position of the circuit (copper surface) and the circuit (copper surface) or the copper surface and the base material surface, so that the manufactured characters are unclear; in addition, if a more advanced character ink jet printer is used, although the problem that the characters with height difference cannot be printed, the factors of insufficient adhesive force and toughness exist in the characteristics of the ink jet ink in the current market, and the situation that the characters on the protruding positions fall off by friction easily occurs because the quality of the substrate is generally heavier, so that the manufactured characters fall off and are complainted by customers.

Disclosure of Invention

Aiming at the defects of the prior art, the invention provides the character manufacturing method which can prevent characters on the PCB super-thick copper plate from being not inked and not clear, ensure that the manufactured characters can not fall off due to friction, and ensure that the characters are clear and beautiful.

In order to solve the technical problem, the invention provides a character processing method of a PCB (printed circuit board) ultra-thick copper plate, which comprises the following steps of when characters are printed on a single surface of the PCB and cross over a base material surface and a copper surface:

s1, ink-jetting characters on the surface of the substrate on which the characters are to be printed in the production board;

s2, silk screen printing characters on the copper surface on the production board by using a silk screen, wherein the silk screen comprises a copper surface area and a substrate area, the substrate area corresponds to the substrate surface on the production board, the copper surface area corresponds to the copper surface on the production board, and only the copper surface area corresponding to the characters is provided with image-text meshes on the silk screen;

and S3, baking the production board to solidify the printing ink printed on the production board.

Further, in step S1, characters are inkjet printed on the substrate surface of the production board by inkjet printing using an inkjet printer.

Further, in step S1, the edge of the ink-jetted character extends 0.05-0.1mm across the copper face when the character is jetted.

Further, in step S1, the width of the inkjet word line extending across the copper face is reduced by 0.03-0.1mm based on the design.

Further, in step S2, the silk screen is made of a nylon mesh with 200-480 meshes, and the air pressure during silk screen printing is 6 + -2 kg/cm²The scraping and printing speed is 0.1-4m/min, the ink returning speed is 1-6m/min, the scraping hardness is 65-80 degrees, and the scraper angle is 5-30 degrees.

Further, in step S3, the baking is a sectional baking, and the conditions of the sectional baking are sequentially:

a first stage: the temperature is 80 ℃, and the time is 40 min;

and a second stage: the temperature is 100 ℃, and the time is 30 min;

a third stage: the temperature is 125 ℃, and the time is 20 min;

a fourth stage: the temperature is 155 ℃, and the time is 90 min.

Further, step S1 is preceded by the following steps:

and S0, printing the ink on the surface of the production board by adopting a silk screen, pre-baking the production board to preliminarily solidify the ink on the board, and then sequentially exposing and developing to form the solder resist pattern on the production board.

Furthermore, the production board is a core board or a multilayer board formed by pressing an inner core board and an outer copper foil into a whole by using a prepreg, and the core board or the multilayer board is subjected to the working procedures of drilling, copper deposition, full-board electroplating and outer-layer circuit manufacturing in sequence.

The character processing method of the PCB super-thick copper plate is also provided, when characters are printed on both sides of the PCB and the characters cross the surface of the base material and the surface of the copper plate, the character processing method comprises the following steps:

s1, ink-jetting characters on the substrate surface of the first surface of the production board;

s2, ink-jetting characters on the substrate surface of the second surface of the production board;

s3, silk-screen printing characters on the copper surface on the first surface of the production board by using a first silk screen, wherein the first silk screen comprises a copper surface area and a substrate area, the substrate area on the first silk screen corresponds to the substrate surface on the production board, the copper surface area corresponds to the copper surface on the production board, and only the character position of the copper surface area corresponding to the first surface of the production board is provided with image-text meshes on the first silk screen;

s4, pre-baking the production board to primarily cure the character ink screened in the step S3;

s5, silk-screen printing characters on the copper surface on the second surface of the production board by using a second silk screen, wherein the second silk screen comprises a copper surface area and a substrate area, the substrate area on the second silk screen corresponds to the substrate surface on the production board, the copper surface area corresponds to the copper surface on the production board, and only the characters, corresponding to the second surface of the production board, of the copper surface area on the second silk screen are provided with image-text meshes;

and S6, baking the production board to solidify the printing ink printed on the production board.

Further, in steps S1 and S2, the characters are inkjet printed on the substrate surface of the production board by inkjet printing using an inkjet printer.

Further, in steps S1 and S2, the edge of the ink-jetted character extends 0.05-0.1mm across and into the copper face when the character is jetted.

Further, in steps S1 and S2, the width of the inkjet word line extending across the copper face is reduced by 0.03-0.1mm on a design basis.

Further, in steps S3 and S5, the first silk screen and the second silk screen are both made of nylon mesh with 200-480 meshes, and the air pressure during silk screen printing is 6 +/-2 kg/cm²The scraping and printing speed is 0.1-4m/min, the ink returning speed is 1-6m/min, the scraping hardness is 65-80 degrees, and the scraper angle is 5-30 degrees.

Further, in step S4, the production board is baked at the temperature of 100 ℃ and 165 ℃ for 10-30 min.

Further, in step S6, the production board is baked at the temperature of 145-165 ℃ for 10-30min or at the temperature of 145-165 ℃ for 45-90 min.

Compared with the prior art, the invention has the following beneficial effects:

the ink-jet characters are jetted on the surface of the base material of the production board, so that the problem that oil cannot be printed on the characters due to step fall at the joint position of the copper surface and the base material surface is solved, the ink-jet characters on the surface of the base material and the copper surface form height fall, the ink-jet characters cannot be rubbed in the subsequent carrying, moving and finishing processes, the clear and attractive effects of the ink-jet characters are further achieved, then the characters on the copper surface are silk-printed and are butted with the ink-jet characters on the surface of the base material, the integral characters required by design are spliced, the silk-printed character ink on the copper surface is generally hot-set ink, the adhesion and the toughness are good, the silk-printed characters cannot fall off in the friction in the subsequent processing process, the clear and attractive effects of the silk-printed characters are guaranteed, and the clear and attractive effects of the integral characters are further guaranteed; the invention also makes one end or two ends connected with the copper surface character cross and extend into the copper surface for 0.05-0.1mm when the character is ink-jetted, thereby avoiding the ink-jetted character and silk-screen printing character disconnection caused by the automatic alignment and silk-screen printing alignment deviation of the ink-jetted machine, and the line width of the ink-jetted character which crosses and extends into the copper surface is reduced by 0.03-0.1mm on the basis of design, thus the ink-jetted character which crosses and extends into the copper surface can be covered by the character silk-printed on the copper surface at the later stage, the character ghost image caused by the automatic alignment and silk-screen printing alignment deviation of the ink-jetted machine is reduced, and the character manufacturing quality and definition are further improved.

Detailed Description

In order to more fully understand the technical contents of the present invention, the technical solutions of the present invention will be further described and illustrated with reference to specific embodiments.