阅读说明：本技术 为达更高信噪比的电容式麦克风传感器设计及制造方法 (Capacitive microphone sensor design and manufacturing method for achieving higher signal-to-noise ratio ) 是由 凯色盖迈桑德仁·苏力娅固马尔 阿努·奥斯汀 伊恩·罗斯·拜哈格 朋万·苏 珍佳颖·苏 于 2020-02-21 设计创作，主要内容包括：一种电容式变换器或麦克风,其包含一或多个分层的一第一基板及所述第一基板包含一第一表面、在所述第一表面中的一第一空腔及一凸台-隔膜(mesa diaphragm),所述凸台-隔膜横跨所述第一空腔。所述电容式变换器或麦克风包含一第二基板,所述第二基板被固定到所述第一基板。所述第二基板具有一或多个分层,所述分层包含一第二空腔,所述第二空腔具有一非平面的(例如,波状的或结构化的或阶状的)底表面,所述底表面面对所述凸台-隔膜。所述空腔的所述底表面的一形状或浮雕可以是至少一定程度有利地与所述隔膜的一变形形状互补。所述第二基板可能包含一或多个声学孔,不均匀地分布在所述第二基板上。一或多个通风口可以使所述第二空腔通风。(A capacitive transducer or microphone comprising one or more layered first substrates and the first substrate comprising a first surface, a first cavity in the first surface, and a boss-diaphragm (mesa diaphragm) spanning the first cavity. The capacitive transducer or microphone includes a second substrate secured to the first substrate. The second substrate has one or more layers including a second cavity having a non-planar (e.g., contoured or structured or stepped) bottom surface facing the boss-diaphragm. A shape or relief of the bottom surface of the cavity may be at least somewhat advantageously complementary to a deformed shape of the diaphragm. The second substrate may include one or more acoustic holes that are not uniformly distributed on the second substrate. One or more vents may vent the second cavity.)