Optical module

文档序号：1469787 发布日期：2020-02-21 浏览：2次中文

阅读说明：本技术 一种光模块 (Optical module ) 是由郑龙杨思更于 2019-11-13 设计创作，主要内容包括：本申请提供了一种光模块，包括：电路板，具有供电电路及信号电路，用于供电和提供电信号；光源，与供电电路连接，用于发出不携带信号的出射光；第一光纤带，一端与所述光源连接，另一端与硅光芯片连接，用于将所述光源发出的出射光传递至硅光芯片中；硅光芯片，通过所述第一光纤带接收来自所述光源的出射光，与信号电路电连接，用于根据电信号调制产生携带信号的光；硅光芯片还包括分光单元和若干组光调制单元；分光单元的输入端连接硅光芯片的输入口，分光单元的输出端对应连接每一组光调制单元的输入端，每一组光调制单元的输出端通过光波导对应连接硅光芯片的输出口。实现光模块多路输出调制光信号，有利于满足光模块高速率发展需求。(The application provides an optical module, including: the circuit board is provided with a power supply circuit and a signal circuit and is used for supplying power and electric signals; the light source is connected with the power supply circuit and used for emitting emergent light without carrying signals; one end of the first optical fiber ribbon is connected with the light source, and the other end of the first optical fiber ribbon is connected with the silicon optical chip and used for transmitting emergent light emitted by the light source to the silicon optical chip; the silicon optical chip receives emergent light from the light source through the first optical fiber ribbon, is electrically connected with the signal circuit and is used for generating light carrying signals according to the modulation of the electrical signals; the silicon optical chip also comprises a light splitting unit and a plurality of groups of optical modulation units; the input end of the light splitting unit is connected with the input port of the silicon optical chip, the output end of the light splitting unit is correspondingly connected with the input end of each group of optical modulation units, and the output end of each group of optical modulation units is correspondingly connected with the output port of the silicon optical chip through the optical waveguide. The optical module is used for realizing multi-path output modulation of optical signals, and the requirement of high-speed development of the optical module is favorably met.)

1. A light module, comprising:

the circuit board is provided with a power supply circuit and a signal circuit and is used for supplying power and electric signals;

the light source is connected with the power supply circuit and used for emitting emergent light without carrying signals;

one end of the first optical fiber ribbon is connected with the light source, and the other end of the first optical fiber ribbon is connected with the silicon optical chip and used for transmitting emergent light emitted by the light source to the silicon optical chip;

the silicon optical chip receives emergent light from the light source through the first optical fiber ribbon, is electrically connected with the signal circuit and is used for generating light carrying signals according to the modulation of the electrical signals;

the silicon optical chip comprises: the optical modulator comprises a first light inlet, a second light inlet, a third light inlet, a first optical beam splitter, a second optical beam splitter, a third optical beam splitter, a first optical modulation unit, a second optical modulation unit, a third optical modulation unit and a fourth optical modulation unit;

the first optical fiber ribbon, the second optical fiber ribbon and the third optical fiber ribbon are respectively connected to the first optical fiber ribbon, the first optical fiber ribbon is used for transmitting light from the first optical fiber ribbon to the first optical splitter, the second optical fiber ribbon is used for transmitting light from the first optical fiber ribbon to the third optical splitter, and the third optical fiber ribbon is used for transmitting light from the first optical fiber ribbon to the second optical splitter;

one end of the third optical splitter is connected to the second light inlet, and the other end of the third optical splitter is connected to the first optical splitter and the second optical splitter, and the third optical splitter is used for splitting the received light and then respectively transmitting the split light to the first optical splitter and the second optical splitter;

one end of the first optical beam splitter is connected with the first light inlet and the third optical beam splitter, and the other end of the first optical beam splitter is connected with the first optical modulation unit and the second optical modulation unit, and the first optical beam splitter is used for splitting the received light and then respectively transmitting the split light to the first optical modulation unit and the second optical modulation unit;

one end of the second optical beam splitter is connected with the third light inlet and the third optical beam splitter, and the other end of the second optical beam splitter is connected with the third optical modulation unit and the fourth optical modulation unit, and the second optical beam splitter is used for splitting the received light and then respectively transmitting the split light to the third optical modulation unit and the fourth optical modulation unit;

the first light modulation unit, the second light modulation unit, the third light modulation unit and the fourth light modulation unit are respectively used for receiving light not carrying signals and modulating the light according to the electric signals to generate light carrying signals.

2. The optical module according to claim 1, wherein the first optical modulation unit includes an optical beam splitter, a phase converter, a first modulator, a second modulator, and an optical beam combiner;

the input end of the optical beam splitter is connected with the first optical beam splitter, the first output end of the optical beam splitter is sequentially connected with the phase converter and the first modulator, and the second output end of the optical beam splitter is connected with the second modulator;

and the output end of the first modulator and the output end of the second modulator are respectively connected with the optical beam combiner.

3. The optical module of claim 1, further comprising a second optical fiber ribbon, one end of the second optical fiber ribbon being connected to the silicon optical chip for transmitting light modulated by the silicon optical chip to generate a carrier signal.

4. The optical module of claim 3, wherein an optical fiber connector is disposed at one end of the second optical fiber ribbon, and the optical fiber connector has connector structures therein, which are connected to the plurality of optical fibers in the second optical fiber ribbon in a one-to-one correspondence, and each of the connector structures is coupled to the silicon optical chip.

5. A light module, comprising:

the circuit board is provided with a power supply circuit and a signal circuit and is used for supplying power and electric signals;

the light source is connected with the power supply circuit and used for emitting emergent light without carrying signals;

the silicon optical chip comprises: the optical modulator comprises a first light inlet, a second light inlet, a third light inlet, a fourth light inlet, a fifth light inlet, a first optical beam splitter, a second optical beam splitter, a third optical beam splitter, a fourth optical beam splitter, a fifth optical beam splitter, a sixth optical beam splitter, a seventh optical beam splitter, a first optical modulation unit, a second optical modulation unit, a third optical modulation unit, a fourth optical modulation unit, a fifth optical modulation unit, a sixth optical modulation unit, a seventh optical modulation unit and an eighth optical modulation unit;

the first optical fiber ribbon, the second optical fiber ribbon, the third optical fiber, the fourth optical fiber and the fifth optical fiber are respectively connected to the first optical fiber ribbon, the first optical fiber ribbon is used for transmitting light from the first optical fiber ribbon to the first optical splitter, the second optical fiber ribbon is used for transmitting light from the first optical fiber ribbon to the second optical splitter, the third optical fiber ribbon is used for transmitting light from the first optical fiber ribbon to the fourth optical splitter, the fourth optical fiber ribbon is used for transmitting light from the first optical fiber ribbon to the fifth optical splitter, and the fifth optical fiber ribbon is used for transmitting light from the first optical fiber ribbon to the sixth optical splitter;

one end of the fourth optical splitter is connected to the third light inlet, and the other end of the fourth optical splitter is connected to the third optical splitter and the seventh optical splitter, and the fourth optical splitter is used for splitting the received light and then respectively transmitting the split light to the third optical splitter and the seventh optical splitter;

one end of the third optical splitter is connected with the fourth optical splitter, and the other end of the third optical splitter is connected with the first optical splitter and the second optical splitter, and the third optical splitter is used for splitting the received light and then respectively transmitting the split light to the first optical splitter and the second optical splitter;

one end of the first optical beam splitter is connected with the first light inlet and the third optical beam splitter, and the other end of the first optical beam splitter is connected with the first optical modulation unit and the second optical modulation unit, and the first optical beam splitter and the second optical beam splitter are used for splitting the received light and then respectively transmitting the split light to the first optical modulation unit and the second optical modulation unit;

one end of the second optical beam splitter is connected with the second light inlet and the third optical beam splitter, and the other end of the second optical beam splitter is connected with the third optical modulation unit and the fourth optical modulation unit, and the second optical beam splitter is used for splitting the received light and then respectively transmitting the split light to the third optical modulation unit and the fourth optical modulation unit;

one end of the seventh optical splitter is connected to the fourth optical splitter, and the other end of the seventh optical splitter is connected to the fifth optical splitter and the sixth optical splitter, and is configured to split the received light and transmit the split light to the fifth optical splitter and the sixth optical splitter, respectively;

one end of the fifth optical beam splitter is connected to the fourth light inlet and the seventh optical beam splitter, and the other end of the fifth optical beam splitter is connected to the fifth optical modulating unit and the sixth optical modulating unit, and the fifth optical beam splitter is used for splitting the received light and then respectively transmitting the split light to the fifth optical modulating unit and the sixth optical modulating unit;

one end of the sixth optical beam splitter is connected to the fifth light inlet and the seventh optical beam splitter, and the other end of the sixth optical beam splitter is connected to the seventh optical modulating unit and the eighth optical modulating unit, and is configured to split the received light and transmit the split light to the seventh optical modulating unit and the eighth optical modulating unit, respectively;

the first light modulation unit, the second light modulation unit, the third light modulation unit, the fourth light modulation unit, the fifth light modulation unit, the sixth light modulation unit, the seventh light modulation unit and the eighth light modulation unit are respectively used for receiving light not carrying signals and modulating the light according to the electric signals to generate light carrying signals.

6. The optical module of claim 5, further comprising a sixth light input and a seventh light input;

the six-in-light port is connected with the first optical splitter and is used for transmitting the light from the first optical fiber ribbon to the three optical splitters; the seventh light inlet is connected to the seventh optical splitter for transmitting light from the first optical fiber ribbon to the seventh optical splitter.

7. The optical module according to claim 5, wherein the first optical modulation unit includes an optical beam splitter, a phase converter, a first modulator, a second modulator, and an optical beam combiner;

and the output end of the first modulator and the output end of the second modulator are respectively connected with the optical beam combiner.

8. The optical module of claim 5, further comprising a second optical fiber ribbon, one end of the second optical fiber ribbon being connected to the silicon optical chip for transmitting light modulated by the silicon optical chip to generate a carrier signal.

9. The optical module of claim 8, wherein an optical fiber connector is disposed at one end of the second optical fiber ribbon, and the optical fiber connector has connector structures therein, which are connected to the plurality of optical fibers in the second optical fiber ribbon in a one-to-one correspondence, and each of the connector structures is coupled to the silicon optical chip.

10. The optical module of claim 8, further comprising an optical interface connecting the other end of the second optical fiber ribbon.

Technical Field

The application relates to the technical field of optical communication, in particular to an optical module.

Background

In the field of optical fiber communication, an optical module is a tool for realizing the interconversion of optical signals, and is one of key devices in optical communication equipment. Meanwhile, with the development and the demand of emerging services such as cloud computing and mobile internet, the speed requirement on the optical module is higher and higher, and then the types of the corresponding optical modules are more and more.

There is an optical module, which includes a laser box and a silicon optical chip, where light emitted from the laser box can be optically coupled into the silicon optical chip, the laser box is used as a light source for emitting optical signals, and the silicon optical chip is used for modulating the optical signals. In the optical signal modulation process, the optical power will have a 20% -30% loss, the light emitting power of the laser chip in the laser box generally needs to be increased in order to meet the requirement of the optical power, and along with the requirement of increasing the speed of the optical module, the requirement of the optical module on the light emitting power of the laser chip in the laser box will be increased, however, the cost of the optical module will be greatly increased when the light emitting power of the laser chip in the laser box is increased, so that the manufacturing cost of the optical module will be greatly increased, and the development of the optical module at a high speed is not facilitated.

Disclosure of Invention

The application provides an optical module, which compensates optical power loss in an optical signal modulation process, realizes that optical signals are modulated by optical module high optical power multi-path output, and is favorable for meeting the high-speed development requirement of the optical module.

In a first aspect, the present application provides an optical module, including:

the circuit board is provided with a power supply circuit and a signal circuit and is used for supplying power and electric signals;

the light source is connected with the power supply circuit and used for emitting emergent light without carrying signals;

In the optical module that this application provided, the light source passes through first optical fiber ribbon and passes through the second and go into light mouthful to the transmission light of third beam splitter, and the third beam splitter transmits to first beam splitter and second beam splitter respectively after splitting the beam with received light, improves the light intensity that first beam splitter and second beam splitter received. And then the optical power loss of light in the modulation process of the first light modulation unit, the second light modulation unit, the third light modulation unit and the fourth light modulation unit is compensated, the multi-path output modulation optical signal of high optical power of the optical module is realized, and the high-speed development requirement of the optical module is favorably met.

In a second aspect, the present application further provides an optical module, including:

the circuit board is provided with a power supply circuit and a signal circuit and is used for supplying power and electric signals;

the light source is connected with the power supply circuit and used for emitting emergent light without carrying signals;

one end of the first optical beam splitter is connected with the first light inlet and the third optical beam splitter, and the other end of the first optical beam splitter is connected with the first optical modulation unit and the second optical modulation unit, and the first optical beam splitter and the second optical beam splitter are used for splitting the received light and then respectively transmitting the split light to the first optical modulation unit and the second optical modulation unit;

In the optical module that this application provided, the light source passes through first optical fiber ribbon and passes through the third and go into light mouthful to transmit light to fourth optical splitter, and fourth optical splitter transmits respectively to third optical splitter and seventh optical splitter after splitting the beam with received light. The third optical beam splitter transmits the received split light to the first optical beam splitter and the second optical beam splitter respectively, so that the light intensity of the light received by the first optical beam splitter and the second optical beam splitter is improved; and the seventh optical beam splitter transmits the received split light to the fifth optical beam splitter and the sixth optical beam splitter respectively, so that the light intensity of the light received by the fifth optical beam splitter and the sixth optical beam splitter is improved. And then the optical power loss of light in the modulation process of the first light modulation unit, the second light modulation unit, the third light modulation unit, the fourth light modulation unit, the fifth light modulation unit, the sixth light modulation unit, the seventh light modulation unit and the eighth light modulation unit is compensated, the multiplexed output modulation optical signal of high optical power of the optical module is realized, and the high-speed development requirement of the optical module is favorably met.

Drawings

In order to more clearly explain the technical solution of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious to those skilled in the art that other drawings can be obtained according to the drawings without any creative effort.

Fig. 1 is a schematic diagram of a connection relationship of an optical communication terminal;

FIG. 2 is a schematic diagram of an optical network unit;

fig. 3 is a schematic structural diagram of an optical module provided in an embodiment of the present application;

fig. 4 is an exploded structural schematic diagram of an optical module provided in an embodiment of the present application;

FIG. 5 is a schematic structural diagram of a circuit board according to an embodiment of the present disclosure;

FIG. 6 is a schematic structural diagram of a silicon optical chip according to an embodiment of the present disclosure;

FIG. 7 is a schematic diagram of a structure of a light modulation unit in an embodiment of the present application;

FIG. 8 is a schematic structural diagram of a 4-output silicon optical chip according to an embodiment of the present disclosure;

fig. 9 is a schematic structural diagram of the light modulation unit 500a in fig. 8;

FIG. 10 is a schematic structural diagram of another 4-output silicon optical chip in the embodiment of the present application;

FIG. 11 is a schematic structural diagram of a first 8-way output silicon microchip in an embodiment of the present application;

FIG. 12 is a schematic structural diagram of a second 8-way output silicon microchip in the embodiment of the present application;

FIG. 13 is a schematic structural diagram of a third 8-way output silicon microchip in the embodiment of the present application;

fig. 14 is a schematic structural diagram of a fourth 8-way output silicon optical chip in this embodiment.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

One of the core links of optical fiber communication is the interconversion of optical and electrical signals. The optical fiber communication uses optical signals carrying information to transmit in information transmission equipment such as optical fibers/optical waveguides, and the information transmission with low cost and low loss can be realized by using the passive transmission characteristic of light in the optical fibers/optical waveguides; meanwhile, the information processing device such as a computer uses an electric signal, and in order to establish information connection between the information transmission device such as an optical fiber or an optical waveguide and the information processing device such as a computer, it is necessary to perform interconversion between the electric signal and the optical signal.

The optical module realizes the function of interconversion of optical signals and electrical signals in the technical field of optical fiber communication, and the interconversion of the optical signals and the electrical signals is the core function of the optical module. The optical module is electrically connected with an external upper computer through a golden finger on an internal circuit board of the optical module, and the main electrical connection comprises power supply, I2C signals, data signals, grounding and the like; the electrical connection mode realized by the gold finger has become the mainstream connection mode of the optical module industry, and on the basis of the mainstream connection mode, the definition of the pin on the gold finger forms various industry protocols/specifications.

Fig. 1 is a schematic diagram of connection relationship of an optical communication terminal. As shown in fig. 1, the connection of the optical communication terminal mainly includes interconnection among the optical network unit 100, the optical module 200, the optical fiber 101, and the network cable 103.

One end of the optical fiber 101 is connected with a remote server, one end of the network cable 103 is connected with a local information processing device, and the connection between the local information processing device and the remote server is completed by the connection between the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is completed by the optical network unit 100 having the optical module 200.

An optical port of the optical module 200 is connected with the optical fiber 101, and establishes bidirectional optical signal connection with the optical fiber 101; an electrical port of the optical module 200 is accessed into the optical network unit 100, and establishes bidirectional electrical signal connection with the optical network unit 100; the interconversion between the optical signal and the electrical signal is realized inside the optical module 200, so that the connection between the optical fiber 101 and the optical network unit 100 is realized; specifically, the optical signal from the optical fiber 101 is converted into an electrical signal by the optical module 200 and then input to the optical network unit 100, and the electrical signal from the optical network unit 100 is converted into an optical signal by the optical module 200 and input to the optical fiber 101. The optical module 200 is a tool for realizing the mutual conversion of the photoelectric signals, and has no function of processing data, and information is not changed in the photoelectric conversion process.

The optical network unit is provided with an optical module interface 102, which is used for accessing the optical module 200 and establishing bidirectional electrical signal connection with the optical module 200; the optical network unit is provided with a network cable interface 104, which is used for accessing the network cable 103 and establishing bidirectional electric signal connection with the network cable 103; the optical module 200 and the network cable 103 are connected through the optical network unit 100. Specifically, the optical network unit 100 transmits a signal from the optical module 200 to the network cable 103, and transmits a signal from the network cable 103 to the optical module 200, and the optical network unit 100 monitors the operation of the optical module 200 as an upper computer of the optical module 200. Unlike the optical module 200, the optical network unit 100 has a certain information processing capability.

To this end, the remote server establishes a bidirectional signal transmission channel with the local information processing device through the optical fiber 101, the optical module 200, the optical network unit 100, and the network cable 103.

Common information processing apparatuses include routers, switches, electronic computers, and the like; the optical network unit 100 is a host computer of the optical module 200, and provides a data signal to the optical module 200 and receives a data signal from the optical module 200, and a common host computer of the optical module 200 also includes an optical line terminal and the like.

Fig. 2 is a schematic diagram of an optical network unit structure. As shown in fig. 2, the optical network unit 100 includes a circuit board 105, and a cage 106 is disposed on a surface of the circuit board 105; an electric connector is arranged in the cage 106 and used for connecting an electric port of an optical module such as a golden finger; the cage 106 is provided with a heat sink 107, and the heat sink 107 has a convex structure such as a fin for increasing a heat radiation area.

The optical module 200 is inserted into an optical network unit, specifically, an electrical port of the optical module is inserted into an electrical connector in the cage 106, and an optical port of the optical module 200 is connected with the optical fiber 101.

The cage 106 is positioned on the circuit board, enclosing the electrical connectors on the circuit board in the cage; the optical module 200 is inserted into a cage, the optical module 200 is held by the cage, and heat generated by the optical module 200 is conducted to the cage through an optical module case and finally diffused by a heat sink 107 on the cage.

Fig. 3 is a schematic structural diagram of an optical module 200 according to an embodiment of the present disclosure, and fig. 4 is an exploded structural diagram of the optical module 200 according to an embodiment of the present disclosure. As shown in fig. 3 and 4, an optical module 200 provided in an embodiment of the present application includes an upper housing 201, a lower housing 202, an unlocking handle 206, a circuit board 203, and electronic components disposed on the circuit board.

The upper housing 201 is covered on the lower housing 202 to form a package cavity with two openings, and the outer contour of the package cavity is generally in a square shape. Specifically, the lower housing 202 includes a main board and two side boards located at two sides of the main board and arranged perpendicular to the main board; the upper shell 201 comprises a cover plate, and the cover plate covers two side plates of the upper shell 201 to form a wrapping cavity; the upper casing 201 may further include two side walls disposed at two sides of the cover plate and perpendicular to the cover plate, and the two side walls are combined with the two side plates to cover the upper casing 201 on the lower casing 202. Alternatively, the upper case 201 and the lower case 202 are fastened by screws.

The two openings may be two ends (204, 205) in the same direction, or two openings in different directions; one of the openings is an electric port 204, a golden finger of the circuit board 203 extends out of the electric port 204 and is inserted into an upper computer such as an optical network unit, the other opening is an optical port 205 and is used for external optical fiber access to connect an optical transceiver inside the optical module 200, and photoelectric devices such as the circuit board 203 and the optical transceiver are located in a package cavity. To prevent dust from entering the light port 205 when the optical module 200 is not in use, a light port plug 207 is disposed at the light port 205. The light port plug 207 is used to seal the light port 205.

The assembly mode of combining the upper shell 201 and the lower shell 202 is adopted, so that the circuit board 203 and devices arranged on the circuit board can be conveniently installed in the shells, and the outermost packaging protection shell of the optical module is formed by the upper shell and the lower shell. The upper shell 201 and the lower shell 202 are generally made of metal materials, which is beneficial to realizing electromagnetic shielding and heat dissipation; generally, the housing of the optical module 200 is not integrated, so that when devices such as a circuit board are assembled, the positioning component, the heat dissipation structure and the electromagnetic shielding structure cannot be mounted, and the production automation is not facilitated.

The unlocking handle 206 is located on the outer wall of the package cavity/lower housing 202, and is used for realizing the fixed connection between the optical module and the upper computer or releasing the fixed connection between the optical module and the upper computer.

The unlocking handle 206 has a clamping structure matched with the upper computer cage; pulling the end of the unlock handle 206 may cause the unlock handle 206 to move relative to the surface of the outer wall; the optical module is inserted into a cage of the upper computer, and the optical module is fixed in the cage of the upper computer by a clamping structure of the unlocking handle 206; by pulling the unlocking handle 206, the clamping structure of the unlocking handle 206 moves along with the unlocking handle, so that the connection relation between the clamping structure and the upper computer is changed, the clamping relation between the optical module and the upper computer is released, and the optical module can be drawn out from the cage of the upper computer.

The circuit board 203 is provided with circuit traces, electronic components (such as capacitors, resistors, triodes and MOS transistors) and chips (such as an MCU, a laser driving chip, a limiting amplification chip, a clock data recovery CDR, a power management chip, a data processing chip DSP, a silicon optical chip and a laser box), and the like.

The circuit board 203 connects the electrical appliances in the optical module together according to the circuit design through circuit wiring to realize the electrical functions of power supply, electrical signal transmission, grounding and the like.

The circuit board is generally a rigid circuit board, such as a PCB board, which can also realize a bearing effect due to its relatively rigid material, such as the rigid circuit board can stably bear a chip; when the optical transceiver is positioned on the circuit board, the rigid circuit board can also provide stable bearing; the hard circuit board can also be inserted into an electric connector in the upper computer cage, and specifically, a metal pin/golden finger is formed on the surface of the tail end of one side of the hard circuit board and is used for being connected with the electric connector; these are not easily implemented with flexible circuit boards.

Fig. 5 is a schematic structural diagram of a circuit board 203 according to an embodiment of the present application. As shown in fig. 5, a circuit board 203 is provided with a light source 301 and a silicon photo chip 302. Specifically, the light source 301 and the silicon optical chip 302 are mounted on the circuit board 203, connected to corresponding signal circuits on the circuit board 203, and receive electrical signals transmitted through the circuit board 203. The input port of silicon optical chip 302 is connected to light source 301 through a first optical fiber ribbon 303, and the output port of silicon optical chip 302 is connected to optical port 204 through a second optical fiber ribbon 304.

The silicon optical chip 302 is used for outputting a modulated optical signal, but the silicon optical chip 302 itself has no light source, and the light source 301 is used as an external light source of the silicon optical chip 302. Therefore, the light source 301 inputs light without carrying signals to the silicon optical chip 302 through the first optical fiber ribbon 303, the silicon optical chip 302 modulates the received light without carrying signals to obtain light with signals and outputs the light with signals, and optionally, the light with signals enters the optical fiber 101 through the second optical fiber ribbon 304 and the optical port 204 in sequence.

The light source 301 may be a laser box. Laser chips are packaged in the laser boxes, the laser chips emit light to generate laser beams, and the laser beams are transmitted to the silicon optical chips 302 through the first optical fiber ribbons 303. Optionally, a plurality of laser chips, such as 1, 2, 3, 4, etc., are packaged in the laser box. In order to output the modulated optical signal through a plurality of output ports and meet the requirement of the optical module on the optical power of the modulated optical signal, a plurality of laser chips, such as 2, 3, 4, 5, etc., can be packaged in the laser box, and each laser chip is used for emitting one path of light. When multiple laser chips are packaged in the laser box, the corresponding first fiber optic ribbons 303 will include the same number of optical fibers. One end of each optical fiber is arranged corresponding to a plurality of laser chips packaged in the light source 301 and receives light beams emitted by the laser chips; the other end of each optical fiber is connected to the light inlet of the silicon optical chip 302, and is used for transmitting the light beam emitted by the corresponding laser chip to the silicon optical chip 302.

In the high-speed development of the optical module, in order to meet the speed requirement of the optical module, a plurality of optical inlets of the silicon optical chip 302 are usually provided, such as 3, 4, 5, 6, and the like, and similarly, a plurality of output ports of the silicon optical chip 302 are usually provided, such as 2, 4, 8, and the like, and the silicon optical chip 302 outputs a modulated optical signal through each output port, and then, the transmission rate of the optical module is increased by outputting the modulated optical signal through a plurality of output ports.

In the present embodiment, one end of the second fiber optic ribbons 304 is provided with an optical fiber connector and the other end of the second fiber optic ribbons 304 is provided with an optical interface. The optical fiber connectors are internally provided with connector structures which are connected with a plurality of optical fibers in the optical fiber ribbon in a one-to-one correspondence manner, each connector structure is coupled with the output port of the silicon optical chip 302, and thus the second optical fiber ribbon 304 is coupled with the output port of the silicon optical chip 302 through the optical fiber connectors. The optical module 200 is connected to the optical fiber 101 through an optical interface.

Fig. 6 is a schematic structural diagram of a silicon optical chip 302 according to an embodiment of the present disclosure. As shown in fig. 6, the silicon optical chip 302 provided in the embodiment of the present application includes an optical splitting unit 400 and a plurality of groups of optical modulation units, an input end of the optical splitting unit 400 is connected to an input port of the silicon optical chip 302 through an optical waveguide, and output ends of the optical splitting unit 400 are connected to the optical modulation units through optical waveguides in a one-to-one correspondence manner.

In the embodiment of the present application, the light splitting unit 400 is configured to receive an optical signal input by the light source 301 through the input port of the silicon optical chip 302, and perform light splitting and integrating processing on the received optical signal. And transmitting the optical signal after the integration treatment to the optical modulation unit.

In the embodiment of the present application, the light splitting unit 400 includes several fractional photonic units. Such as: the light splitting unit 400 comprises a first-stage light splitting subunit 401, the light splitting unit 400 comprises a first-stage light splitting subunit 401 and a second-stage light splitting subunit 402, the light splitting unit 400 comprises a first-stage light splitting subunit 401, a second-stage light splitting subunit 402, a third-stage light splitting subunit 403 and the like. In the embodiment of the present application, each of the primary light splitting subunit 401, the secondary light splitting subunit 402 and the tertiary light splitting subunit 403 includes at least one light splitter. In the embodiment of the present application, the optical beam splitters in the first stage optical sub-unit 401, the second stage optical sub-unit 402, and the third stage optical sub-unit 403 divide the received optical beam into two parts and then output the optical beam, that is, each of the optical beam splitters in the first stage optical sub-unit 401, the second stage optical sub-unit 402, and the third stage optical sub-unit 403 has two output ends. The output end of the first-stage beam splitting subunit 401 is connected to the input end of the optical modulation unit through an optical waveguide, the output end of the second-stage beam splitting subunit 402 is connected to the input end of the first-stage beam splitting subunit 401 through an optical waveguide, the output end of the third-stage beam splitting subunit 403 is connected to the input end of the second-stage beam splitting subunit 402 through an optical waveguide, and the third-stage beam splitting subunit 403 and the second-stage beam splitting subunit 402 are combined to compensate a light beam to the first-stage beam splitting subunit 401, so that the light intensity of the light beam received by the first-stage beam splitting subunit 401 is increased.

In the embodiments of the present application, the optical waveguide is a dielectric device for guiding light waves to propagate therein, and is used for transmission of light beams between devices connected thereto. Specifically, the optical waveguide may be a planar (thin film) dielectric optical waveguide, a strip dielectric optical waveguide, or a cylindrical optical waveguide.

When the light splitting unit 400 includes the first-stage light splitting subunit 401 and the second-stage light splitting subunit 402, the second-stage light splitting subunit 402 is configured to compensate the light beam to the first-stage light splitting subunit 401, and increase the optical power of the light beam transmitted to the first-stage light splitting subunit 401. Specifically, the light beam transmitted to the second-stage light splitting subunit 402 is split by the light splitter therein and then correspondingly transmitted to the light splitter of the first-stage light splitting subunit 401, so as to improve the optical power of the light beam transmitted to the first-stage light splitting subunit 401.

When the light splitting unit 400 includes the first-stage light splitting subunit 401, the second-stage light splitting subunit 402, and the third-stage light splitting subunit 403, the third-stage light splitting subunit 403 is configured to compensate the light beam to the second-stage light splitting subunit 402, and increase the optical power of the light beam transmitted to the second-stage light splitting subunit 401; the second-stage optical splitter subunit 402 is configured to compensate the light beam to the first-stage optical splitter subunit 401, and increase the optical power of the light beam transmitted to the first-stage optical splitter subunit 401. Specifically, the light beam transmitted to the third-stage light splitting subunit 403 is split by the light splitter therein and then correspondingly transmitted to the light splitter of the second-stage light splitting subunit 402, so as to improve the light power of the light beam transmitted to the second-stage light splitting subunit 402; the light beam transmitted to the second-stage light splitting subunit 402 is split by the light splitter therein and then correspondingly transmitted to the light splitter of the first-stage light splitting subunit 401, so as to improve the optical power of the light beam transmitted to the first-stage light splitting subunit 401.

In the embodiment of the present application, the optical modulation unit is configured to perform optical modulation processing on the input light to obtain light carrying a signal. The number of the optical modulation units is the same as that of the output ports of the silicon optical chip 302, the output port of each optical modulation unit is connected to the corresponding output port of the silicon optical chip 302 through an optical waveguide, that is, each optical modulation unit is connected to the output port of the silicon optical chip 302 through waveguides in a one-to-one correspondence manner, so that the modulated optical signal output by each optical modulation unit is output from the silicon optical chip 302 to the second optical fiber ribbon 304 through the corresponding output port.

Fig. 7 is a schematic structural diagram of a light modulation unit according to an embodiment of the present application. As shown in fig. 7, in the embodiment of the present application, each of the optical modulation units 500 includes an optical beam splitter 501, a phase converter 502, a first modulator 503, a second modulator 504, and an optical beam combiner 505. The optical splitter 501 includes two output terminals, one of which is connected to the phase converter 502 and the first modulator 503 in this order via an optical waveguide, and the other of which is connected to the second modulator 504 via an optical waveguide. The output of the first modulator 503 and the output of the second modulator 504 are connected to the input of the optical combiner 505 via waveguides, respectively. The phase converter 502 is used for beam phase conversion, such as 180 ° phase conversion; the first modulator 503 and the second modulator 504 are used for optical modulation processing, and the first modulator 503 and the second modulator 504 may employ mach-zehnder optical modulators; the beam combiner 505 is used to combine the light beams.

For convenience of describing the two output ends of the optical splitter 501, they are referred to as a first output end and a second output end. The first output terminal of the optical splitter 501 is connected to the phase converter 502, or the second output terminal of the optical splitter 501 is connected to the phase converter 502.

It is assumed that a first output terminal of the optical splitter 501 is connected to the phase converter 502 and a second output terminal of the optical splitter 501 is connected to the second modulator 504. The light beam transmitted to the optical modulation unit 500 through the light splitting unit 400 is first transmitted to the optical beam splitter 501, the optical beam splitter 501 receives the light beam and splits the light beam into two light beams, one of the light beams is transmitted to the phase converter 502 through the first output end of the optical beam splitter 501, and the other light beam is transmitted to the second modulator 504 through the second output end of the optical beam splitter 501.

For convenience of description, the light beam transmitted to the phase converter 502 through the first output end of the optical splitter 501 is referred to as a first light beam, and the light beam transmitted to the second modulator 504 through the second output end of the optical splitter 501 is referred to as a second light beam. The first path of light beam is transmitted to the phase converter 502, the phase converter 502 performs phase conversion on the received first path of light beam to obtain a phase-converted light beam, the phase converter 502 transmits the phase-converted light beam to the first modulator 503 through the optical waveguide, the first modulator 503 performs modulation processing on the received light beam to obtain a first modulated optical signal, and the first modulator 503 transmits the first modulated optical signal to the optical beam combiner 505. The second light beam is transmitted to the second modulator 504, the second modulator 504 receives the second light beam and performs modulation processing on the received second light beam to obtain a second modulated optical signal, and the second modulator 504 transmits the second modulated optical signal to the optical beam combiner 505. The optical combiner 505 receives the first modulated optical signal and the second modulated optical signal, combines the first modulated optical signal and the second modulated optical signal to obtain a high-speed modulated optical signal, and then outputs the high-speed modulated optical signal.

In this embodiment, when the number of the optical modulation units 500 is 8N, where N is a positive integer, the first-stage optical sub-unit 401 will include 4N optical splitters, and each output end of each optical splitter is correspondingly connected to one input port of the input end of the optical modulation unit 500. If the light splitting unit 400 includes the second-stage light splitting subunit 402, the second-stage light splitting subunit 402 includes 2N light splitters; if the third-stage optical splitter unit 403 is included in the optical splitting unit 400, the third-stage optical splitter unit 403 includes N optical splitters.

The structure of the light splitting unit 400 in the embodiment of the present application is described in detail below with reference to specific examples.

4-path output silicon optical chip

The silicon optical chip with 4 output paths means that the silicon optical chip 302 has 4 output paths, and supports outputting 4 optical signals, and the 4 output paths of the silicon optical chip 302 are denoted as TX0, TX1, TX2 and TX 3.

Fig. 8 is a schematic structural diagram of a 4-way output port silicon optical chip 302 according to an embodiment of the present disclosure. As shown in fig. 8, the silicon optical chip 302 includes an optical splitting unit 400 and 4 sets of optical modulation units; the optical splitting unit 400 includes a first-stage optical splitting subunit 401, the first-stage optical splitting subunit 401 includes a first-stage optical splitter 401a and a second optical splitter 401b, 4 groups of optical modulation units are respectively marked as a first optical modulation unit 500a, a second optical modulation unit 500b, a third optical modulation unit 500c and a fourth optical modulation unit 500d, and output ends of the fifth optical modulation unit 500a, the sixth optical modulation unit 500b, the seventh optical modulation unit 500c and the eighth optical modulation unit 500d are correspondingly connected to output ports TX0, TX1, TX2 and TX3 of the silicon optical chip 302.

As shown in fig. 8, in the embodiment of the present application, the silicon photonic chip 302 has two light inlets, which are denoted as a first light inlet L0 and a third light inlet L2, and the silicon photonic chip 302 is connected to the first optical fiber ribbon 303 through L0 and L2. The input end of the first optical splitter is connected with L0 through an optical waveguide, and the input end of the first optical splitter is connected with L2 through an optical waveguide. The first optical splitter 401a and the second optical splitter 401b respectively include two output ends, the two output ends of the first optical splitter 401a are used to connect the optical modulation unit 500a and the optical modulation unit 500b through optical waveguides, respectively, and the two output ends of the second optical splitter 401b are used to connect the optical modulation unit 500c and the optical modulation unit 500d through optical waveguides, respectively.

Alternatively, the specific structure of the first light modulation unit 500a is as shown in fig. 9. The first optical modulation unit 500a includes an optical beam splitter 501a, a phase converter 502a, a first modulator 503a, a second modulator 504a, and an optical beam combiner 505 a. The optical splitter 501a includes two output terminals, one of which is connected to the phase converter 502a and the first modulator 503a in this order via an optical waveguide, and the other of which is connected to the second modulator 504a via an optical waveguide. The output of the first modulator 503a and the output of the second modulator 504a are connected to the input of the beam combiner 505a through waveguides, respectively.

Alternatively, the structures of the second light modulation unit 500b, the third light modulation unit 500c, and the fourth light modulation unit 500d may be the same as the structure of the first light modulation unit 500 a.

Fig. 10 is a schematic structural diagram of another 4-way output port silicon optical chip 302 according to an embodiment of the present application. As shown in fig. 10, the silicon optical chip 302 includes an optical splitting unit 400 and 4 sets of optical modulation units; the light splitting unit 400 includes a first-stage light splitting subunit 401 and a second-stage light splitting subunit 402, and the structures of the 4 groups of light modulation units are the same as those of the 4 groups of light modulation units shown in fig. 8.

As shown in fig. 10, in the embodiment of the present application, the silicon optical chip 302 has three light inlets, which are denoted as a first light inlet L0, a second light inlet L1, and a third light inlet L2, and the silicon optical chip 302 is connected to the first optical fiber ribbon 303 through L0, L1, and L2; the first-stage optical splitter unit 401 includes two optical splitters, which are denoted as a first optical splitter 401a and a second optical splitter 401 b; the second stage of the beam splitting subunit 402 includes a beam splitter, denoted as a third beam splitter 402 a. The input of the third optical splitter 402a is connected to L1 through an optical waveguide, and the third optical splitter 402a has two outputs. The first optical splitter 401a and the second optical splitter 401b respectively include two input ends; one input end of the first optical splitter 401a is connected to L0 through an optical waveguide, and the other input end of the first optical splitter 401a is connected to one output end of the third optical splitter 402a through an optical waveguide; one input terminal of the second optical splitter 401b is connected to L2 through an optical waveguide, and the other input terminal of the second optical splitter 401b is connected to the other output terminal of the third optical splitter 402a through an optical waveguide.

The third optical beam splitter 402a splits the light beam received through the L1 into two split light beams, one of which is transmitted to the first optical beam splitter 401a and the other of which is transmitted to the second optical beam splitter 401b, so that the third optical beam splitter 402a serves to evenly compensate the light beam received through the input port L1 to the first optical beam splitter 401a and the second optical beam splitter 401 b. The first optical splitter 401a receives the light beam transmitted thereto through the L0 and through the third optical splitter 402a, and then splits the received light beam into two split light beams, one of which is transmitted to the first optical modulation unit 500a through the optical waveguide and the other of which is transmitted to the second optical modulation unit 500b through the optical waveguide. The second optical splitter 401b receives the light beam transmitted thereto through the L2 and through the third optical splitter 402a, and then splits the received light beam into two split light beams, one of which is transmitted to the third optical modulation unit 500c through the optical waveguide and the other of which is transmitted to the fourth optical modulation unit 500d through the optical waveguide.

Compared with the silicon optical chip shown in fig. 8, the silicon optical chip shown in fig. 10 is added with the second-stage optical splitter unit 402, that is, the third optical splitter 402a is added, and is used for compensating light beams to the first optical splitter 401a and the second optical splitter 401b of the first-stage optical splitter unit 401, increasing the light intensity of the light beams received by the first optical splitter 401a and the second optical splitter 401b, and increasing the optical power loss of the compensated light in the modulation process of the first optical modulator unit 500a, the second optical modulator unit 500b, the third optical modulator unit 500c, and the fourth optical modulator unit 500d, so as to improve the optical power of the optical signals output through the output ports TX0, TX1, TX2, and TX 3. Thus, when the light intensity received by the first optical beam splitter 401a and the second optical beam splitter 401b is constant, the optical power of the silicon optical chip for outputting the modulated optical signal is increased by adding the third optical beam splitter 402 a; meanwhile, when the silicon optical chip outputs a certain optical power of the modulated optical signal, the light intensity received by the first optical beam splitter 401a and the second optical beam splitter 401b can be relatively reduced by adding the third optical beam splitter 402a, and thus, the laser box containing the laser chip with relatively low light emitting power can be used.

8-path output silicon optical chip

The silicon optical chip with 8 output paths means that the silicon optical chip 302 has 8 output paths, and supports to output 8 optical signals, and 4 output paths of the silicon optical chip 302 are denoted as TX0, TX1, TX2, TX3, TX4, TX5, TX6, and TX 7.

Fig. 11 is a schematic structural diagram of a first 8-output-port silicon optical chip 302 according to an embodiment of the present application. As shown in fig. 11, the silicon optical chip 302 includes an optical splitting unit 400 and 8 sets of optical modulation units 500; the light splitting unit 400 includes a first-stage light splitting subunit 401, and the 8 groups of light modulation units 500 are a first light modulation unit 500a, a second light modulation unit 500b, a third light modulation unit 500c, a fourth light modulation unit 500d, a fifth light modulation unit 500e, a sixth light modulation unit 500f, a seventh light modulation unit 500g, and an eighth light modulation unit 500h, respectively. The output ends of the first light modulation unit 500a, the second light modulation unit 500b, the third light modulation unit 500c, the fourth light modulation unit 500d, the fifth light modulation unit 500e, the sixth light modulation unit 500f, the seventh light modulation unit 500g and the eighth light modulation unit 500h are correspondingly connected with the output ports TX0, TX1, TX2, TX3, TX4, TX5, TX6 and TX7 of the silicon microchip 302.

As shown in fig. 11, in the embodiment of the present application, the silicon optical chip 302 has four light inlets, which are denoted as a first light inlet L0, a second light inlet L1, a fourth light inlet L3 and a fifth light inlet L4, and the silicon optical chip 302 is connected to the first optical fiber ribbon 303 through L0, L1, L3 and L4; the first-stage optical splitter unit 401 includes a first optical splitter 401a, a second optical splitter 401b, a fifth optical splitter 401c, and a sixth optical splitter 401 d. The input end of the first optical splitter 401a is connected to L0 through an optical waveguide, the input end of the second optical splitter 401b is connected to L1 through an optical waveguide, the fifth optical splitter 401c is connected to L3 through an optical waveguide, and the sixth optical splitter 401d is connected to the input port L4 through an optical waveguide. The first optical splitter 401a, the second optical splitter 401b, the fifth optical splitter 401c, and the sixth optical splitter 401d include two output terminals, respectively. Two output ends of the first optical beam splitter 401a are used to connect the first optical modulation unit 500a and the second optical modulation unit 500b through optical waveguides, two output ends of the second optical beam splitter 401b are used to connect the third optical modulation unit 500c and the fourth optical modulation unit 500d through optical waveguides, two output ends of the fifth optical beam splitter 401c are used to connect the fifth optical modulation unit 500e and the sixth optical modulation unit 500f through optical waveguides, and two output ends of the third optical beam splitter 401d are used to connect the seventh optical modulation unit 500g and the eighth optical modulation unit 500h through optical waveguides.

The first optical beam splitter 401a is configured to split the light beam received through the L0 into two light beams, one of the light beams is transmitted to the first optical modulation unit 500a through the optical waveguide, and the other light beam is transmitted to the second optical modulation unit 500b through the optical waveguide. The second optical splitter 401b is configured to split the light beam received through the L1 into two light beams, one of the light beams is transmitted to the third optical modulation unit 500c through the optical waveguide, and the other light beam is transmitted to the fourth optical modulation unit 500d through the optical waveguide. The fifth optical beam splitter 401c is configured to split the light beam received through the L0 into two light beams, one of the light beams is transmitted to the fifth optical modulation unit 500e through the optical waveguide, and the other light beam is transmitted to the sixth optical modulation unit 500f through the optical waveguide. The sixth optical beam splitter 401d is configured to split the light beam received through the L1 into two light beams, one of the light beams is transmitted to the seventh optical modulation unit 500g through the optical waveguide, and the other light beam is transmitted to the eighth optical modulation unit 500g through the optical waveguide. The first light modulation unit 500a, the second light modulation unit 500b, the third light modulation unit 500c, the fourth light modulation unit 500d, the fifth light modulation unit 500e, the sixth light modulation unit 500f, the seventh light modulation unit 500g and the eighth light modulation unit 500h respectively perform modulation processing on the optical signals input thereto, and then output the optical signals after modulation processing to the second optical fiber ribbon 304 through output ports TX0, TX1, TX2, TX3, TX4, TX5, TX6 and TX7 respectively.

Alternatively, the structure of the first light modulation unit 500a in the silicon microchip 302 shown in fig. 11 is as shown in fig. 9. The structures of the second light modulation unit 500b, the third light modulation unit 500c, the fourth light modulation unit 500d, the fifth light modulation unit 500e, the sixth light modulation unit 500f, the seventh light modulation unit 500g, and the eighth light modulation unit 500h may be the same as the structure of the first light modulation unit 500 a.

Compared with the silicon optical chip 302 provided in fig. 8, the silicon optical chip 302 shown in fig. 11 is increased by 1 time in comparison with the silicon optical chip 302 provided in fig. 8 in terms of the number of input ports, output ports, the light splitting unit 400 and the components in the light modulation unit 500 of the silicon optical chip 302 provided in fig. 11, so that the silicon optical chip 302 has 8 paths of light output, and the optical module is more convenient to realize high transmission rate development.

Fig. 12 is a schematic structural diagram of a second 8-output silicon optical chip 302 according to an embodiment of the present application. As shown in fig. 12, the silicon optical chip 302 includes an optical splitting unit 400 and 8 sets of optical modulation units 500; the light splitting unit 400 includes a first-stage light splitting subunit 401 and a second-stage light splitting subunit 402, and the structure of the 8 groups of light modulation units 500 is the same as that of the 8 groups of light modulation units 500 shown in fig. 11.

As shown in fig. 12, in the embodiment of the present application, the silicon optical chip 302 has six light inlets, which are denoted as a first light inlet L0, a second light inlet L1, a fourth light inlet L3, a fifth light inlet L4, a sixth light inlet L5 and a seventh light inlet L6, and the silicon optical chip 302 is connected to the first optical fiber ribbon 303 through L0, L1, L3, L4, L5 and L6; the first-stage optical splitter unit 401 includes a first optical splitter 401a, a second optical splitter 401b, a fifth optical splitter 401c, and a sixth optical splitter 401 d; the second-stage optical sub-unit 402 includes a third optical splitter 402a and a seventh optical splitter 402 b. The input end of the third optical splitter 402a is connected to L5 through an optical waveguide, and the third optical splitter 402a has two output ends; the input of the seventh optical splitter 402b is connected by an optical waveguide L6, and the seventh optical splitter 402b has two outputs. The first optical splitter 401a, the second optical splitter 401b, the fifth optical splitter 401c, and the sixth optical splitter 401d respectively include two input ends; one input end of the first optical splitter 401a is connected to L0 through an optical waveguide, and the other input end of the first optical splitter 401a is connected to one output end of the third optical splitter 402a through an optical waveguide; one input end of the second optical splitter 401b is connected to L1 through an optical waveguide, and the other input end of the second optical splitter 401b is connected to the other output end of the third optical splitter 402a through an optical waveguide; one input end of the fifth optical splitter 401c is connected to L3 through an optical waveguide, and the other input end of the fifth optical splitter 401c is connected to an output end of the seventh optical splitter 402b through an optical waveguide; one input terminal of the sixth optical splitter 401d is connected to L4 through an optical waveguide, and the other input terminal of the sixth optical splitter 401d is connected to the other output terminal of the seventh optical splitter 402b through an optical waveguide.

The third optical beam splitter 402a splits the light beam received through L5 into two split light beams, one of which is transmitted to the first optical beam splitter 401a and the other of which is transmitted to the second optical beam splitter 401b, and thus the third optical beam splitter 402a serves to average out the light beam received through L5 to the first optical beam splitter 401a and the second optical beam splitter 401 b. The first optical splitter 401a receives the light beam transmitted thereto through the L0 and through the third optical splitter 402a, and then splits the received light beam into two split light beams, one of which is transmitted to the first optical modulation unit 500a through the optical waveguide and the other of which is transmitted to the second optical modulation unit 500b through the optical waveguide. The second optical splitter 401b receives the light beam transmitted thereto through the L1 and through the third optical splitter 402a, and then splits the received light beam into two split light beams, one of which is transmitted to the third optical modulation unit 500c through the optical waveguide and the other of which is transmitted to the fourth optical modulation unit 500d through the optical waveguide.

The seventh optical beam splitter 402b splits the light beam received through L6 into two light beams, one of which is transmitted to the fifth optical beam splitter 401c and the other of which is transmitted to the sixth optical beam splitter 401d, so that the seventh optical beam splitter 402b serves to average-compensate the light beam received through L6 to the fifth optical beam splitter 401c and the sixth optical beam splitter 401 d. The fifth optical splitter 401c receives the light beam transmitted thereto through the L3 and through the fifth optical splitter 402b, and then splits the received light beam into two light beams, one of which is transmitted to the fifth optical modulation unit 500e through the optical waveguide and the other of which is transmitted to the sixth optical modulation unit 500f through the optical waveguide. The sixth optical splitter 401d receives the light beam transmitted thereto through the output L4 and through the seventh optical splitter 402b, and then splits the received light beam into two light beams, one of which is transmitted to the seventh optical modulating unit 500g through the optical waveguide and the other of which is transmitted to the eighth optical modulating unit 500h through the optical waveguide.

Compared with the silicon optical chip shown in fig. 11, the silicon optical chip shown in fig. 12 is added with a second-stage beam splitter unit 402, where the second-stage beam splitter unit 402 includes a third beam splitter 402a and a seventh beam splitter 402b, and is used to compensate light beams to the first beam splitter 401a, the second beam splitter 401b, the fifth beam splitter 401c, and the sixth beam splitter 401d of the first-stage beam splitter unit 401, increase the light intensities of the light beams received by the first beam splitter 401a, the second beam splitter 401b, the fifth beam splitter 401c, and the sixth beam splitter 401d, compensate the light intensities of the light beams received by the first light modulator unit 500a, the second light modulator unit 500b, the third light modulator unit 500c, the fourth light modulator unit 500d, the fifth light modulator unit 500e, the sixth light modulator unit 500f, the seventh light modulator unit 500g, and the eighth light modulator unit 500h, and further improve the light intensity of the light beams passing through the output ports TX0, TX1, TX0, and TX1, TX2, TX3, TX4, TX5, TX6, and TX7 output the optical power of the optical signal.

Thus, when the light intensity received by the first optical beam splitter 401a, the second optical beam splitter 401b, the fifth optical beam splitter 401c and the sixth optical beam splitter 401d is constant, the optical power of the silicon optical chip for outputting the modulated optical signal is improved by adding the third optical beam splitter 402a and the seventh optical beam splitter 402 b; meanwhile, when the optical power of the modulated optical signal output by the silicon optical chip is constant, the light intensity received by the first optical beam splitter 401a, the second optical beam splitter 401b, the fifth optical beam splitter 401c and the sixth optical beam splitter 401d can be relatively reduced by adding the third optical beam splitter 402a and the seventh optical beam splitter 402b, and therefore the laser box containing the laser chip with relatively low light emitting power can be used.

Fig. 13 is a schematic structural diagram of a third 8-output-port silicon optical chip 302 according to an embodiment of the present application. As shown in fig. 13, the silicon optical chip 302 includes an optical splitting unit 400 and 8 sets of optical modulation units 500; the light splitting unit 400 includes a first-stage light splitting subunit 401, a second-stage light splitting subunit 402, and a third-stage light splitting subunit 403, and the structure of the 8 groups of light modulation units 500 is the same as that of the 8 groups of light modulation units shown in fig. 11.

As shown in fig. 13, in the embodiment of the present application, the silicon optical chip 302 has five light inlets, which are denoted as a first light inlet L0, a second light inlet L1, a third light inlet L2, a fourth light inlet L3 and a fifth light inlet L4, and the silicon optical chip 302 is connected to the first optical fiber ribbon 303 through L0, L1, L2, L3 and L4; the first-stage optical splitter unit 401 includes a first optical splitter 401a, a second optical splitter 401b, a fifth optical splitter 401c, and a sixth optical splitter 401 d; the second-stage optical sub-unit 402 includes a third optical splitter 402a and a seventh optical splitter 402 b; the third-stage optical sub-unit 403 includes a fourth optical beam splitter 403 a.

The input end of the fourth optical splitter 403a is connected to L2 through an optical waveguide, and the fourth optical splitter 403a has two output ends. One output terminal of the fourth optical splitter 403a is connected to the input terminal of the third optical splitter 402a through an optical waveguide, and the other output terminal of the fourth optical splitter 403a is connected to the input terminal of the seventh optical splitter 402b through an optical waveguide.

The third optical splitter 402a and the seventh optical splitter 402b have two output terminals, respectively. The first optical splitter 401a, the second optical splitter 401b, the fifth optical splitter 401c, and the sixth optical splitter 401d respectively include two input ends; one input end of the first optical splitter 401a is connected to L0 through an optical waveguide, and the other input end of the first optical splitter 401a is connected to one output end of the third optical splitter 402a through an optical waveguide; one input end of the second optical splitter 401b is connected to L1 through an optical waveguide, and the other input end of the second optical splitter 401b is connected to the other output end of the third optical splitter 402a through an optical waveguide; one input end of the fifth optical splitter 401c is connected to L3 through an optical waveguide, and the other input end of the fifth optical splitter 401c is connected to an output end of the seventh optical splitter 402b through an optical waveguide; one input terminal of the sixth optical splitter 401d is connected to L4 through an optical waveguide, and the other input terminal of the sixth optical splitter 401d is connected to the other output terminal of the seventh optical splitter 402b through an optical waveguide.

The fourth optical beam splitter 403a splits the light beam received through L2 into two light beams, one of which is transmitted to the third optical beam splitter 402a and the other of which is transmitted to the seventh optical beam splitter 402b, and thus the fourth optical beam splitter 403a serves to transmit the light beam received through L2 to the third optical beam splitter 402a and the seventh optical beam splitter 402 b.

The third optical beam splitter 402a receives the light beam transmitted thereto by the fourth optical beam splitter 403a and splits the light beam into two light beams, one of which is transmitted to the first optical beam splitter 401a and the other of which is transmitted to the second optical beam splitter 401b, so that the third optical beam splitter 402a serves to evenly compensate the light beam received through L1 to the first and second optical beam splitters 401a and 401 b. The first optical splitter 401a receives the light beam transmitted thereto through the L0 and through the third optical splitter 402a, and then splits the received light beam into two split light beams, one of which is transmitted to the first optical modulation unit 500a through the optical waveguide and the other of which is transmitted to the second optical modulation unit 500b through the optical waveguide. The second-stage optical splitter 401b receives the light beam transmitted thereto through the L2 and through the third optical splitter 402a, and then splits the received light beam into two light beams, one of which is transmitted to the third optical modulating unit 500c through the optical waveguide and the other of which is transmitted to the fourth optical modulating unit 500d through the optical waveguide.

The seventh optical beam splitter 402b receives the light beam transmitted thereto by the fourth optical beam splitter 403a, and splits the light beam into two light beams, one of which is transmitted to the fifth optical beam splitter 401c and the other of which is transmitted to the sixth optical beam splitter 401d, so that the seventh optical beam splitter 402b serves to average out the light beam received through L4 to the fifth optical beam splitter 401c and the sixth optical beam splitter 401 d. The fifth optical splitter 401c receives the light beam transmitted thereto through the L3 and through the seventh optical splitter 402b, and then splits the received light beam into two split light beams, one of which is transmitted to the fifth optical modulation unit 500e through the optical waveguide and the other of which is transmitted to the sixth optical modulation unit 500f through the optical waveguide. The sixth optical splitter 401d receives the light beam transmitted thereto through the L4 and through the seventh optical splitter 402b, and then splits the received light beam into two light beams, one of which is transmitted to the seventh optical modulating unit 500g through the optical waveguide and the other of which is transmitted to the eighth optical modulating unit 500h through the optical waveguide.

Compared with the silicon optical chip shown in fig. 12, the silicon optical chip shown in fig. 13 has a structure in which a third-stage optical splitter 403 is added and the connection relationship between the third optical splitter 402a and the seventh optical splitter 402b in the second-stage optical splitter 402 and the light inlet is changed. In the silicon optical chip shown in fig. 13, the third-stage splitter subunit 403 is connected to the light inlet, splits the light beam received through the input port of the silicon optical chip 302 into two, transmits the two to the third optical splitter 402a and the seventh optical splitter 402b, and then compensates the light beam to the first optical splitter 401a, the second optical splitter 401b, the fifth optical splitter 401c, and the sixth optical splitter 401d through the third optical splitter 402a and the seventh optical splitter 402 b. Therefore, the light intensity of the light beams received by the first optical beam splitter 401a, the second optical beam splitter 401b, the fifth optical beam splitter 401c and the sixth optical beam splitter 401d is increased, the light intensity of the light beams received by the first optical modulation unit 500a, the second optical modulation unit 500b, the third optical modulation unit 500c, the fourth optical modulation unit 500d, the fifth optical modulation unit 500e, the sixth optical modulation unit 500f, the seventh optical modulation unit 500g and the eighth optical modulation unit 500h is compensated, and the optical power of the optical signals output through the output ports TX0, 1, TX2, TX3, TX4, TX5, TX6 and TX7 is improved.

Compared with the silicon optical chip shown in fig. 10, in the silicon optical chip shown in fig. 13, when the light intensity received by the first optical beam splitter 401a, the second optical beam splitter 401b, the fifth optical beam splitter 401c, and the sixth optical beam splitter 401d is a certain time, the optical power of the silicon optical chip for outputting the modulated optical signal is increased by adding the third optical beam splitter 402a, the seventh optical beam splitter 402b, and the fourth optical beam splitter 403 a; meanwhile, when the optical power of the modulated optical signal output by the silicon optical chip is constant, the light intensity received by the first optical beam splitter 401a, the second optical beam splitter 401b, the fifth optical beam splitter 401c and the sixth optical beam splitter 401d only through the light inlet can be relatively reduced by adding the third optical beam splitter 402a, the seventh optical beam splitter 402b and the fourth optical beam splitter 403a, and therefore the laser box containing the laser chip with relatively low light emitting power can be used. However, when the light intensity of the input light beam at each input port of the silicon optical chip is constant, the light intensity compensation for the first optical splitter 401a, the second optical splitter 401b, the fifth optical splitter 401c and the sixth optical splitter 401d in the silicon optical chip shown in fig. 13 is different from that in the silicon optical chip shown in fig. 11, and further, the optical power of the output light signals at the output ports TX0, TX1, TX2, TX3, TX4, TX5, TX6 and TX7 will also be different. The silicon optical chip shown in fig. 13 and the silicon optical chip shown in fig. 12 can widen the light intensity compensation range, so that the silicon optical chip is more suitable for the development of the high-rate optical module.

Fig. 14 is a schematic structural diagram of a fourth 8-output-port silicon optical chip 302 according to an embodiment of the present application. As shown in fig. 14, the silicon optical chip 302 includes an optical splitting unit 400 and 8 sets of optical modulation units 500; the light splitting unit 400 includes a first-stage light splitting subunit 401, a second-stage light splitting subunit 402, and a third-stage light splitting subunit 403, and the structure of the 8 groups of light modulation units 500 is the same as that of the 8 groups of light modulation units 500 shown in fig. 10.

As shown in fig. 14, in the embodiment of the present application, the silicon optical chip 302 has seven light inlets, which are denoted as a first light inlet L0, a second light inlet L1, a third light inlet L2, a fourth light inlet L3, a fifth light inlet L4, a sixth light inlet L5, and a seventh light inlet L6, and the silicon optical chip 302 is connected to the first optical fiber ribbon 303 through L0, L1, L2, L3, L4, L5, and L6; the first-stage optical splitter unit 401 includes a first optical splitter 401a, a second optical splitter 401b, a fifth optical splitter 401c, and a sixth optical splitter 401 d; the second-stage optical sub-unit 402 includes a third optical splitter 402a and a seventh optical splitter 402 b; the third-stage optical sub-unit 403 includes a fourth optical beam splitter 403 a. Unlike the silicon photonic chip 302 shown in fig. 13, the input ends of the third optical splitter 402a and the seventh optical splitter 402b in the silicon photonic chip 302 shown in fig. 14 are not only connected to the third stage optical splitter 403a through an optical waveguide, but also receive the light transmitted by the third stage optical splitter 403 a; light transmitted to the light inlets L5 and L6 by the first optical fiber ribbon 303 is also received by connecting the light inlets L5 and L6 through optical waveguides through the other input ends, respectively.

In the silicon microchip shown in fig. 14, compared to the silicon microchip shown in fig. 13, the third optical splitter 402a and the seventh optical splitter 402b receive not only the light transmitted by the fourth optical splitter 403a but also the light transmitted by the light input ports L5 and L6. When the light intensity of the input light beam at each input port of the silicon optical chip is constant, the light intensity compensation for the first optical splitter 401a, the second optical splitter 401b, the fifth optical splitter 401c and the sixth optical splitter 401d in the silicon optical chip shown in fig. 14 is different from that in the silicon optical chip shown in fig. 13, and further, the optical power of the output light signals at the output ports TX0, TX1, TX2, TX3, TX4, TX5, TX6 and TX7 will also be different. The silicon optical chip shown in fig. 14 and the silicon optical chip shown in fig. 13 can widen the light intensity compensation range, so that the silicon optical chip is more suitable for the development of the high-speed optical module.

Further, when the silicon optical chip has odd number multiple (2M, M is an odd number) output ports of 2, such as 6, 10, 14, etc., the structure of the silicon optical chip shown in fig. 8 can be seen in the internal arrangement of the silicon optical chip. The silicon optical chip comprises 2M groups of optical modulation units, the light splitting unit comprises a first-stage light splitting subunit, and the first-stage light splitting subunit comprises M optical beam splitters.

Further, when the silicon optical chip has 4-fold (marked as 4X, where X is an integer) output ports such as 12, 16, 20, etc., the structure of the silicon optical chip shown in fig. 8 and the structure of the silicon optical chip shown in fig. 10 are provided inside the silicon optical chip. Similar to the structure of the silicon optical chip shown in fig. 10, the silicon optical chip includes 4X groups of optical modulation units, and the optical splitting unit includes a first-stage optical splitting subunit and a second-stage optical splitting subunit, where the first-stage optical splitting subunit includes 2X optical beam splitters, and the second-stage optical splitting subunit includes X optical beam splitters.

Furthermore, when the silicon optical chip has multiple (8Y, Y is an integer) output ports of 8, such as 16, 24, 32, etc., the structure of the silicon optical chip shown in fig. 13 can be seen in addition to the structure of the silicon optical chip shown in fig. 8 and 10. Similar to the structure of the silicon optical chip shown in fig. 10, the silicon optical chip includes 8Y groups of optical modulation units, and the optical splitting unit includes a first-stage optical splitting subunit, a second-stage optical splitting subunit and a third-stage optical splitting subunit, the first-stage optical splitting subunit includes 4Y optical beam splitters, the second-stage optical splitting subunit includes 2Y optical beam splitters, and the third-stage optical splitting subunit includes Y optical beam splitters.

Further, when the silicon photonics chip has a power of 2 (2) of 16, 32, 64, etc^ZZ is an integer and Z is more than or equal to 3) channel transmissionWhen the silicon optical chip is exported, the fourth-stage splitter subunit can be further added in the silicon optical chip, which can refer to the structures of the silicon optical chips shown in fig. 8, 10 and 13, that is, the splitter unit includes the first-stage splitter subunit, the second-stage splitter subunit, the third-stage splitter subunit and the fourth-stage splitter subunit. The silicon optical chip comprises 2^ZA light modulation unit is combined, and a first-stage light splitting subunit comprises a light splitting unit 2^Z2 optical splitters, the second-stage optical sub-unit comprises 2^ZA third-stage light splitting subunit comprising 2^ZA fourth-stage light splitting subunit comprising 2^Z16 optical beam splitters.

The number of the output ports of the silicon optical chip can be selected according to the actual specification requirement of the optical module, and the structure of the light splitting unit in the silicon optical chip needs to be selected by combining the number of the output ports of the silicon optical chip, the optical power of the optical signal output by the silicon optical chip and the luminous power of the light source.

All the embodiments in the present specification are described in a progressive manner, and the same and similar parts among the embodiments may be referred to each other, and each embodiment focuses on the differences from the other embodiments, and the relevant points may be referred to the part of the description of the method embodiment. It is noted that other embodiments of the present invention will become readily apparent to those skilled in the art from consideration of the specification and practice of the invention herein. This application is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the invention and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the invention being indicated by the following claims.

It will be understood that the present application is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the application is limited only by the appended claims.

28页详细技术资料下载

上一篇：一种医用注射器针头装配设备

下一篇：一种宽带噪声源的产生装置及其信号产生方法

Optical module

相关技术

网友询问留言