Antenna circuit board and manufacturing method thereof
阅读说明:本技术 天线电路板及其制作方法 (Antenna circuit board and manufacturing method thereof ) 是由 胡先钦 沈芾云 何明展 韦文竹 于 2018-08-10 设计创作,主要内容包括:一种天线电路板的制作方法,包括以下步骤:提供第一基板,包括第一基层及第一铜层与第一导电线路层;在第一导电线路层压合第二基板,第二基板包括第二基层及第二铜层;导通第一导电线路层、第一、第二铜层,并将第二铜层制成第二导电线路层,从而得到带状基板,带状基板包括馈线区域及接受区域;提供天线接受基板,天线接受基板包括第四基层及分别形成于第四基层两相对表面上的两个第三导电线路层;提供一连接基板,连接基板包括一第五基层及填充第五基层上至少两个容置孔的两个导电层;及将带状基板与天线接受基板及连接基板进行相应贴合,并将天线接受基板通过连接基板压合于接受区域上,从而得到天线电路板。本发明还提供一种天线电路板。(A manufacturing method of an antenna circuit board comprises the following steps: providing a first substrate comprising a first base layer, a first copper layer and a first conductive circuit layer; pressing a second substrate on the first conductive circuit layer, wherein the second substrate comprises a second base layer and a second copper layer; conducting the first conductive circuit layer, the first copper layer and the second copper layer, and manufacturing the second copper layer into a second conductive circuit layer, so as to obtain a strip-shaped substrate, wherein the strip-shaped substrate comprises a feeder line area and a receiving area; providing an antenna receiving substrate, wherein the antenna receiving substrate comprises a fourth base layer and two third conductive circuit layers respectively formed on two opposite surfaces of the fourth base layer; providing a connecting substrate, wherein the connecting substrate comprises a fifth base layer and two conducting layers which are filled in at least two accommodating holes in the fifth base layer; and correspondingly laminating the strip-shaped substrate, the antenna receiving substrate and the connecting substrate, and pressing the antenna receiving substrate on the receiving area through the connecting substrate to obtain the antenna circuit board. The invention also provides an antenna circuit board.)
1. A manufacturing method of an antenna circuit board comprises the following steps:
providing a first substrate, wherein the first substrate comprises a first base layer, and a first copper layer and a first conductive circuit layer which are respectively formed on two opposite surfaces of the first base layer;
pressing a second substrate on the surface of the first conductive circuit layer, which is far away from the first base layer, wherein the second substrate comprises a second base layer pressed on the surface of the first conductive circuit layer and a second copper layer formed on the surface of the second base layer;
conducting the first conductive circuit layer, the first copper layer and the second copper layer, and manufacturing the second copper layer into a second conductive circuit layer, so as to obtain a strip-shaped substrate, wherein the strip-shaped substrate comprises a feeder line area and a receiving area;
providing an antenna receiving substrate, wherein the antenna receiving substrate comprises a fourth base layer with a specified thickness and two third conductive circuit layers respectively formed on two opposite surfaces of the fourth base layer;
providing a connecting substrate, wherein the connecting substrate comprises a fifth base layer and two conducting layers which are filled in at least two accommodating holes in the fifth base layer; and
and correspondingly laminating the strip-shaped substrate, the antenna receiving substrate and the connecting substrate, and pressing the antenna receiving substrate on the receiving area through the connecting substrate, thereby obtaining the antenna circuit board with the high offset.
2. The method for manufacturing an antenna circuit board according to claim 1, wherein the step of providing the connection substrate includes: providing a fifth substrate, wherein the fifth substrate comprises a fifth base layer and two tearable film layers respectively formed on two opposite surfaces of the fifth base layer; the fifth substrate is provided with at least two accommodating holes; providing a conductive material, filling the conductive material into the accommodating hole and forming a conductive layer approximately flush with the outer surface of the tearable film layer; the outer two tear film layers are removed.
3. The method of manufacturing an antenna circuit board of claim 1, wherein the step of providing the antenna receiving substrate comprises: providing two third substrates and a plurality of thickening base layers, wherein the two third substrates respectively comprise a third base layer and third copper layers respectively formed on opposite surfaces of the third base layer; pressing the two placed third substrates and the plurality of thickened base layers to enable the two third base layers and the plurality of thickened base layers to be pressed into a whole to form a fourth base layer with the specified thickness; forming at least one through hole on the fourth base layer and the third copper layer, and forming an electroplated layer on the hole wall of the through hole and the surface of the third copper layer in an electroplating mode; and processing the electroplated layer and the third copper layer to form the third conductive circuit layer.
4. The method for manufacturing an antenna circuit board according to claim 1, further comprising printing solder masks on the surface of the laminated antenna circuit board to form a protective layer after the step of laminating the tape substrate, the connection substrate, and the antenna receiving substrate; and performing a chemical nickel gold processing process on the antenna circuit board.
5. The method for manufacturing an antenna circuit board according to claim 1, wherein the first base layer, the second base layer, the fourth base layer and the fifth base layer are made of the same material.
6. An antenna circuit board comprising:
the band-shaped substrate comprises a first base layer, a grounding layer and a first conductive circuit layer which are respectively formed on two opposite surfaces of the first base layer, a second base layer formed on the surface of the first conductive circuit layer, and a second conductive circuit layer formed on the surface of the second base layer, and the band-shaped substrate comprises a feeder line area and a receiving area;
the antenna receiving substrate comprises a fourth base layer with a specified thickness and two third conductive circuit layers respectively formed on two opposite surfaces of the fourth base layer; and
and the connecting substrate comprises a fifth base layer and a conductive layer which is arranged in the fifth base layer and is used for electrically connecting the second conductive circuit layer and the third conductive circuit layer, wherein the connecting substrate and the antenna receiving substrate are sequentially laminated on the receiving area to form a high-level difference with the feeder line area.
7. The antenna circuit board of claim 6, wherein the first base layer, the second base layer, the fourth base layer and the fifth base layer are made of the same material.
8. The antenna circuit board of claim 6, further comprising a protective layer covering the surfaces of the strip substrate and the antenna receiving substrate.
9. The antenna circuit board of claim 8, further comprising a metal layer formed on the surface of the protective layer by electroless nickel gold processing.
10. The antenna circuit board of claim 6, wherein the conductive layer is a copper paste.
Technical Field
The present disclosure relates to circuit boards, and particularly to an antenna circuit board and a method for manufacturing the same.
Background
In recent years, electronic products are widely used in daily work and life. At present, earphones with built-in high-frequency receiving antennas appear in the market, and can be paired with a single earphone and multiple devices. Such antennas include a feed line area and a receiving area. The feeder line area adopts a strip line structure; the receiving region receives signals using a parallel plate capacitor scheme. The requirement of the thickness of the added layer of the receiving area exceeds 0.5mm, and the requirement has larger offset with the feeder line area, the traditional layer adding mode needs electroplating every time of adding layers, and the increase of the number (thickness) of the layers of the circuit and the layers brings more flows and is difficult to complete.
Disclosure of Invention
In view of the above, it is desirable to provide a method for manufacturing an antenna circuit board that can solve the above problems.
The antenna circuit board manufactured by the manufacturing method is also provided.
A manufacturing method of an antenna circuit board comprises the following steps: providing a first substrate, wherein the first substrate comprises a first base layer, and a first copper layer and a first conductive circuit layer which are respectively formed on two opposite surfaces of the first base layer; pressing a second substrate on the surface of the first conductive circuit layer, which is far away from the first base layer, wherein the second substrate comprises a second base layer pressed on the surface of the first conductive circuit layer and a second copper layer formed on the surface of the second base layer; conducting the first conductive circuit layer, the first copper layer and the second copper layer, and manufacturing the second copper layer into a second conductive circuit layer, so as to obtain a strip-shaped substrate, wherein the strip-shaped substrate comprises a feeder line area and a receiving area; providing an antenna receiving substrate, wherein the antenna receiving substrate comprises a fourth base layer with a specified thickness and two third conductive circuit layers respectively formed on two opposite surfaces of the fourth base layer; providing a connecting substrate, wherein the connecting substrate comprises a fifth base layer and two conducting layers which are filled in at least two accommodating holes in the fifth base layer; and correspondingly attaching the strip-shaped substrate, the antenna receiving substrate and the connecting substrate, and pressing the antenna receiving substrate on the receiving area through the connecting substrate, thereby obtaining the antenna circuit board with the high offset.
An antenna circuit board comprising: the band-shaped substrate comprises a first base layer, a grounding layer and a first conductive circuit layer which are respectively formed on two opposite surfaces of the first base layer, a second base layer formed on the surface of the first conductive circuit layer, and a second conductive circuit layer formed on the surface of the second base layer, and the band-shaped substrate comprises a feeder line area and a receiving area; the antenna receiving substrate comprises a fourth base layer with a specified thickness and two third conductive circuit layers respectively formed on two opposite surfaces of the fourth base layer; and the connecting substrate comprises a fifth base layer and a conducting layer which is arranged in the fifth base layer and is used for electrically connecting the second conducting circuit layer and the third conducting circuit layer, wherein the connecting substrate and the antenna receiving substrate are sequentially stacked on the receiving area to form a high-level difference with the feeder line area.
According to the antenna circuit board, the strip-shaped substrate and the antenna receiving substrate are manufactured respectively, are connected through the conductive plug holes of the conductive layer of the connecting substrate, and can be formed through one-time pressing, so that the manufacturing process is simple, and the utilization rate of materials is improved.
Drawings
Fig. 1 is a schematic cross-sectional view of a first substrate according to a preferred embodiment of the invention.
FIG. 2 is a schematic cross-sectional view of the first substrate shown in FIG. 1 bonded to a second substrate.
FIG. 3 is a schematic cross-sectional view of the laminated first and second substrates of FIG. 2 with blind holes and electroplated coating.
FIG. 4 is a schematic cross-sectional view illustrating etching of a second copper layer on the laminated first and second substrates shown in FIG. 3.
Fig. 5 is a schematic cross-sectional view of a third substrate and a plurality of thickened base layers according to a preferred embodiment of the invention.
Fig. 6 is a schematic cross-sectional view of a fourth substrate obtained by laminating the third substrate and the plurality of thickened base layers shown in fig. 5.
FIG. 7 is a schematic cross-sectional view of the fourth substrate shown in FIG. 6 through-holes and plated with a plating layer.
Fig. 8 is a schematic cross-sectional view of processing the fourth substrate shown in fig. 7.
FIG. 9 is a schematic cross-sectional view of a fifth substrate according to a preferred embodiment of the invention.
Fig. 10 is a schematic cross-sectional view of the fifth substrate shown in fig. 9 with a receiving hole opened therein.
Fig. 11 is a schematic cross-sectional view illustrating filling of the accommodating hole formed in the fifth substrate shown in fig. 10 with a conductive material.
Fig. 12 is a schematic cross-sectional view of the fifth substrate of fig. 11 with the tearable film layer removed.
Fig. 13 is a schematic cross-sectional view illustrating the first substrate, the second substrate, the fourth substrate and the fifth substrate bonded together shown in fig. 4, 8 and 12.
Fig. 14 is a schematic cross-sectional view of the structure of fig. 13 with a surface printed solder mask.
Fig. 15 is a schematic cross-sectional view of the structure shown in fig. 4 subjected to electroless nickel-gold processing.
Description of the main elements
The following detailed description will further illustrate the invention in conjunction with the above-described figures.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
Some embodiments of the invention are described in detail below with reference to the accompanying drawings. The embodiments described below and the features of the embodiments can be combined with each other without conflict.
Referring to fig. 1 to 15, a method for manufacturing an
in step S1, referring to fig. 1, a
The material of the
In step S2, referring to fig. 2, a
In step S3, referring to fig. 3, at least two blind holes are formed in the laminated
The blind holes respectively penetrate through the second copper layer 23, the
Referring to fig. 4, the
The
In step S5, referring to fig. 5, two third substrates 40 and a plurality of thickened
In this embodiment, the
In step S6, referring to fig. 6, the two third substrates 40 and the plurality of thickened
In step S7, referring to fig. 7, at least one through
In step S8, referring to fig. 8, the fourth substrate 60 is etched or opened to form openings in the
In step S9, please refer to fig. 9, a
In step S10, referring to fig. 10, at least two
In step S11, referring to fig. 11, a conductive material is provided and filled in the
In step S12, referring to fig. 12, the outer two
In step S13, referring to fig. 13, the
At the time of pressing, the
In step S14, referring to fig. 14, solder masks are printed on the surfaces of the
In step S15, please refer to fig. 15, post-processing, performing an electroless nickel-gold process on the circuit board to form the
Referring to fig. 15, a preferred embodiment of the invention further provides an
The
The
The
The
The
The
Although the present invention has been described with reference to the above preferred embodiments, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims.
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