阅读说明：本技术 一种可提高结合力的焊接金手指 (Welding golden finger capable of improving binding force ) 是由 曹传春 郑成军 冯杰 丁进新 胡念 于 2019-10-17 设计创作，主要内容包括：本发明公开了一种可提高结合力的焊接金手指,通过在金手指上设置贯穿金手指的过锡孔,使得当将金手指焊接在焊盘上时,焊盘上从过锡孔的渗过的锡与从金手指的外侧溢出的锡重新结合成一体,熔化的锡固化后形成封闭的锁定环,采用这种设计能提高金手指与焊盘之间焊接之后的结合力,防止金手指与焊盘脱离；本发明通过在金手指上设置贯穿金手指的过锡孔,使得当将金手指焊接在焊盘上时,焊盘上从过锡孔的渗过的锡与从金手指的外侧溢出的锡重新结合成一体,熔化的锡固化后形成封闭的锁定环,采用这种设计能提高金手指与焊盘之间焊接之后的结合力,防止金手指与焊盘脱离。(The invention discloses a welding golden finger capable of improving the binding force, wherein a tin passing hole penetrating through the golden finger is arranged on the golden finger, so that when the golden finger is welded on a welding pad, tin permeated from the tin passing hole on the welding pad is recombined with tin overflowing from the outer side of the golden finger into a whole, and a closed locking ring is formed after the molten tin is solidified; according to the invention, the tin passing hole penetrating through the golden finger is formed in the golden finger, so that when the golden finger is welded on the bonding pad, the tin permeated from the tin passing hole on the bonding pad is recombined with the tin overflowing from the outer side of the golden finger into a whole, and the molten tin is solidified to form the closed locking ring.)

1. The utility model provides a can improve welding golden finger of cohesion which characterized in that: including substrate (1) that adopts insulating heat-resistant material to make, substrate (1) on be equipped with at least one golden finger (2) of being connected with the circuit, golden finger (2) on be equipped with tin hole (3) of crossing through golden finger (2), make when welding golden finger (2) on pad (4), the tin that oozes from tin hole (3) on pad (4) and the tin that overflows from the outside of golden finger (2) recombine integratively, form confined locked loop (5) after the solidification of molten tin.

2. The soldering gold finger capable of improving the bonding force according to claim 1, wherein the tin through hole (3) is circular, and the diameter of the tin through hole (3) is 0.2mm to 1.0 mm.

3. The soldering golden finger capable of improving the bonding force according to claim 2, characterized in that the distance between the tin through hole (3) and the end of the golden finger (2) is L, wherein L is more than or equal to 0.15mm and less than or equal to 2.00 mm.

4. The welding golden finger capable of improving the bonding force according to claim 2, characterized in that the distance between two adjacent golden fingers (2) is D, wherein D is more than or equal to 0.5 mm.

5. The welding golden finger capable of improving the bonding force according to claim 1, characterized in that the area of the bonding pad (4) along the direction vertical to the projection direction of the bonding pad is larger than the area of the golden finger (2) along the direction vertical to the projection direction of the bonding pad.

[ technical field ] A method for producing a semiconductor device

The invention relates to a welding golden finger capable of improving binding force.

[ background of the invention ]

[ summary of the invention ]

The technical problem to be solved by the invention is to provide a welding golden finger capable of improving the binding force, wherein the golden finger is provided with a tin passing hole penetrating through the golden finger, so that when the golden finger is welded on a welding pad, tin permeated from the tin passing hole on the welding pad is recombined with tin overflowing from the outer side of the golden finger into a whole, and the molten tin is solidified to form a closed locking ring.

In order to solve the technical problem, the welding golden finger capable of improving the bonding force comprises a base material made of an insulating heat-resistant material, wherein at least one golden finger connected with a circuit is arranged on the base material, and a tin passing hole penetrating through the golden finger is formed in the golden finger, so that when the golden finger is welded on a welding pad, tin penetrating through the tin passing hole on the welding pad and tin overflowing from the outer side of the golden finger are recombined into a whole, and a closed locking ring is formed after the molten tin is solidified.

According to the soldering gold finger capable of improving the bonding force, the tin passing hole is circular, and the diameter of the tin passing hole is 0.2 mm-1.0 mm.

According to the soldering gold finger capable of improving the bonding force, the distance between the tin through hole and the tail end of the gold finger is L, wherein L is more than or equal to 0.15mm and less than or equal to 2.00 mm.

According to the welding golden finger capable of improving the binding force, the distance between two adjacent golden fingers is D, wherein D is larger than or equal to 0.5 mm.

According to the welding golden finger capable of improving the bonding force, the area of the bonding pad in the direction perpendicular to the projection direction of the bonding pad is larger than that of the golden finger in the direction perpendicular to the projection direction of the bonding pad.

Compared with the prior art, the invention has the following advantages:

1. according to the invention, the tin passing hole penetrating through the golden finger is formed in the golden finger, so that when the golden finger is welded on the bonding pad, the tin permeated from the tin passing hole on the bonding pad is recombined with the tin overflowing from the outer side of the golden finger into a whole, and the molten tin is solidified to form the closed locking ring.

[ description of the drawings ]

The following detailed description of embodiments of the invention is provided in conjunction with the appended drawings, in which:

FIG. 1 is a schematic view of a gold finger soldered on a pad (solder not shown) according to the present invention;

fig. 2 is a cross-sectional view (showing solder) taken along a-a in fig. 1.

[ detailed description ] embodiments

Embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

As shown in fig. 1 and fig. 2, the soldering gold finger capable of improving the bonding force of the embodiment includes a substrate 1 made of an insulating heat-resistant material, at least one gold finger 2 connected to a circuit is disposed on the substrate 1, and a tin through hole 3 penetrating through the gold finger 2 is disposed on the gold finger 2, so that when the gold finger 2 is soldered on a pad 4, tin seeped from the tin through hole 3 on the pad 4 and tin overflowing from the outer side of the gold finger 2 are recombined into a whole, and a closed locking ring 5 is formed after the molten tin is solidified. According to the invention, the tin passing hole penetrating through the golden finger is formed in the golden finger, so that when the golden finger is welded on the bonding pad, the tin permeated from the tin passing hole on the bonding pad is recombined with the tin overflowing from the outer side of the golden finger into a whole, and the molten tin is solidified to form the closed locking ring.

In the embodiment, the tin passing hole 3 is circular, and the diameter of the tin passing hole 3 is 0.2mm to 1.0 mm. The tin passing hole is convenient for the melted soldering tin to seep through the tin passing hole by adopting the structure.

In order to facilitate the tin seeped from the tin through hole and the tin overflowing from the outer side of the gold finger to be recombined into a whole, the distance between the tin through hole 3 and the tail end of the gold finger 2 is L, wherein L is more than or equal to 0.15mm and less than or equal to 2.00 mm.

In order to prevent short circuit between two adjacent golden fingers, the distance between two adjacent golden fingers 2 is D, wherein D is more than or equal to 0.5 mm.

In order to facilitate welding, the bonding force between the bonding pad and the gold finger is improved, and the area of the bonding pad 4 in the direction perpendicular to the projection direction of the bonding pad is larger than the area of the gold finger 2 in the direction perpendicular to the projection direction of the bonding pad.

The technical contents of the present invention are further illustrated by the examples only for the convenience of the reader, but the embodiments of the present invention are not limited thereto, and any technical extension or re-creation based on the present invention is protected by the present invention. The protection scope of the invention is subject to the claims.