阅读说明：本技术 一种具有新型vip孔的pcb板及pcb通孔填孔技术 (PCB with novel VIP hole and PCB through hole filling technology ) 是由 徐景浩 黄志刚 何波 王港生 林均秀 于 2019-11-27 设计创作，主要内容包括：本发明公开并提供了一种具有新型VIP孔的PCB板及PCB通孔填孔技术,具有新型VIP孔的PCB板的结构简单、加工方便,PCB通孔填孔技术可以不使用树脂塞孔工艺,直接采用目前常规镀铜药水生产,达到通孔填孔的目的。具有新型VIP孔的PCB板包括PCB板本体,在PCB板本体上设有盲孔,在盲孔底部且位于盲孔的同心圆位置上设有通孔,通孔的孔径小于盲孔的孔径；盲孔的内壁及底面上均设有镀铜层,通孔内填充满电镀铜,电镀铜与镀铜层导通。PCB通孔填孔技术采用台阶孔,通过黑孔和电镀铜工艺将通孔填满铜,盲孔的内壁和底部也镀上铜但处于未填满的状态；靠近通孔一侧的表面因已被镀铜填平而形成VIP孔。本发明适用于有单面孔上盘设计的PCB板的技术领域。(The invention discloses and provides a PCB with a novel VIP hole and a PCB through hole filling technology, the PCB with the novel VIP hole is simple in structure and convenient to process, the PCB through hole filling technology can be produced by directly adopting the conventional copper plating liquid medicine without using a resin hole filling process, and the purpose of filling the through hole is achieved. The PCB with the novel VIP hole comprises a PCB body, wherein the PCB body is provided with a blind hole, a through hole is formed in the bottom of the blind hole and is positioned at the concentric circle position of the blind hole, and the aperture of the through hole is smaller than that of the blind hole; copper plating layers are arranged on the inner wall and the bottom surface of the blind hole, the through hole is filled with the electro-coppering, and the electro-coppering is communicated with the copper plating layers. The PCB through hole filling technology adopts a step hole, the through hole is filled with copper through a black hole and an electrolytic copper plating process, and the inner wall and the bottom of the blind hole are also plated with copper but are in an unfilled state; the surface near one side of the via hole is filled with copper to form a VIP hole. The invention is suitable for the technical field of PCB boards with single-sided hole upper disc design.)

1. The utility model provides a PCB board with novel VIP hole, includes PCB board body, its characterized in that: the PCB is characterized in that a blind hole (C) is formed in the PCB body, a through hole (D) is formed in the bottom of the blind hole (C) and is positioned on the concentric circle of the blind hole (C), and the aperture of the through hole (D) is smaller than that of the blind hole (C); the inner wall and the bottom surface of the blind hole (C) are both provided with copper plating layers, the through hole (D) is filled with electroplating copper, and the electroplating copper is communicated with the copper plating layers.

2. The PCB board with a novel VIP hole of claim 1, wherein: the aperture of the blind hole (C) is 0.1-0.25 mm.

3. The PCB board with a novel VIP hole of claim 1, wherein: the aperture of the through hole (D) is 0.03mm-0.05 mm.

4. The PCB board with a novel VIP hole of claim 1, wherein: the PCB body comprises a dielectric layer (A), and copper foils (B) are pressed on the upper surface and the lower surface of the dielectric layer (A).

5. A PCB via hole filling technique of a PCB board having a novel VIP hole as claimed in claim 1, wherein: the PCB through hole filling technology comprises the following steps:

a. drilling a blind hole (C) with the diameter of 0.1-0.25mm on the PCB body by using a laser drilling machine, and leaving a plate thickness allowance of 0.03-0.05mm without drilling through;

b. laser forming a through hole (D) with the diameter of 0.03mm-0.05mm at the bottom of the blind hole (C) and on the concentric circle position of the blind hole (C), thereby forming a stepped through hole structure;

c. filling the through hole (D) with copper through a black hole and a copper electroplating process, and plating copper on the inner wall and the bottom of the blind hole (C) but in an unfilled state; the surface close to one side of the through hole (D) is filled with copper to form a VIP hole, so that the surface mounting requirement can be met.

6. A PCB via filling technique according to claim 5, wherein: the PCB board body comprises a dielectric layer (A), copper foils (B) are pressed on the upper surface and the lower surface of the dielectric layer (A), the blind holes (C) are formed by laser from the copper foils (B) on the upper surface of the dielectric layer (A), and the copper foils (B) on the upper surface and the lower surface of the dielectric layer (A) are plated with copper and are conducted through the copper in the VIP hole.

Technical Field

The invention relates to a PCB and a PCB through hole filling technology, in particular to a PCB with a novel VIP hole and a PCB through hole filling technology.

Background

The conventional minimum through hole diameter of the PCB is generally 0.1mm, when a via hole of a VIP hole on a bonding pad is designed, a resin hole plugging process is required, the process flow is complex and high in cost, the copper plating solution on the market at present is limited in processing capacity, the via hole cannot be directly filled by adopting a copper plating mode, and the via hole diameter is only suitable for a thinner PCB by adopting a laser drilling process and reducing the hole diameter to be less than 0.05 mm.

Disclosure of Invention

The technical problem to be solved by the invention is to overcome the defects of the prior art and provide a PCB with a novel VIP hole and a PCB through hole filling technology, wherein the PCB with the novel VIP hole has a simple structure and is convenient to process and can well meet market requirements, the PCB through hole filling technology can solve the problem of the VIP hole filling of the PCB with the plate thickness of more than or equal to 0.07mm and the hole diameter of 0.1-0.2mm, and the through hole filling technology can be produced by directly adopting the conventional copper plating liquid medicine without using a resin hole filling process to achieve the purpose of through hole filling.

The technical scheme adopted by the invention is as follows: the PCB with the novel VIP hole comprises a PCB body, wherein a blind hole C is formed in the PCB body, a through hole D is formed in the bottom of the blind hole C and located in the position of a concentric circle of the blind hole C, and the aperture of the through hole D is smaller than that of the blind hole C; and copper plating layers are arranged on the inner wall and the bottom surface of the blind hole C, the through hole D is filled with electroplated copper, and the electroplated copper is communicated with the copper plating layers.

Furthermore, the aperture of the blind hole C is 0.1-0.25 mm.

Further, the aperture of the through hole D is 0.03mm-0.05 mm.

Furthermore, the PCB body comprises a dielectric layer A, and copper foils B are pressed on the upper surface and the lower surface of the dielectric layer A.

The PCB through hole filling technology comprises the following steps:

a. drilling a blind hole C with the diameter of 0.1-0.25mm on the PCB body by using a laser drilling machine, and leaving a plate thickness allowance of 0.03-0.05mm without drilling through;

b. laser forming a through hole D with the diameter of 0.03mm-0.05mm at the bottom of the blind hole C and on the concentric circle position of the blind hole C, thereby forming a stepped through hole structure;

c. filling the through hole D with copper through a black hole and an electrolytic copper plating process, and plating copper on the inner wall and the bottom of the blind hole C but keeping the blind hole C in an unfilled state; the surface close to one side of the through hole D is filled with copper to form a VIP hole, so that the surface mounting requirement can be met.

Furthermore, the PCB board body comprises a dielectric layer A, copper foils B are pressed on the upper surface and the lower surface of the dielectric layer A, the blind hole C is formed by laser from the copper foil B on the upper surface of the dielectric layer A, and the copper foils B on the upper surface and the lower surface of the dielectric layer A are plated with copper and are conducted through the copper in the VIP hole.

The invention has the beneficial effects that: the invention adopts the design of the stepped holes, so that the problems of complex production process flow and high cost of the VIP hole of the PCB with the plate thickness of more than or equal to 0.07mm and the through hole diameter of 0.1-0.2mm can be effectively solved.

Drawings

FIG. 1 is a schematic diagram of a PCB double-sided copper-clad plate;

FIG. 2 is a schematic view of a first laser blind hole pattern;

FIG. 3 is a schematic diagram of a via pattern obtained by the second laser irradiation;

FIG. 4 is a schematic view of a via-filling copper plated second via location being filled;

fig. 5 is a schematic view of the upper disk of the hole after line etching.

Detailed Description

In this embodiment, the PCB with the novel VIP hole includes a PCB body, a blind hole C is formed in the PCB body, a through hole D is formed in the bottom of the blind hole C and located at a concentric circle position of the blind hole C, and a hole diameter of the through hole D is smaller than that of the blind hole C; and copper plating layers are arranged on the inner wall and the bottom surface of the blind hole C, the through hole D is filled with electroplated copper, and the electroplated copper is communicated with the copper plating layers.

In this embodiment, the diameter of the blind hole C is 0.1-0.25 mm.

In this embodiment, the diameter of the through hole D is 0.03mm to 0.05 mm.

In this embodiment, as shown in fig. 1, the PCB board body includes a dielectric layer a, and copper foils B are laminated on upper and lower surfaces of the dielectric layer a.

As shown in the figure 1 and the figure 2, blind holes with the diameter of 0.1-0.25mm are laser-drilled on the double-sided board of the PCB, and the board thickness allowance of 0.03-0.05m is left without drilling through.

As shown in fig. 3, a second laser through hole is formed in the concentric circle position of the first blind hole, the aperture of the through hole is 0.03-0.05um, and the aperture of the through hole is smaller than that of the blind hole, so that a stepped hole is formed.

Because the second laser through hole and the first laser blind hole adopt the same drilling program, and the program is provided with cutter splitting processing, the concentricity of the two apertures can be kept.

As shown in FIG. 4, by using a black hole-copper plating technique and using a common PCB copper plating solution, the TP value is required to be larger than 1.5, and the copper plating parameters are adjusted to plate the hole copper, because the hole type is a stepped hole, the position of the hole is filled quickly, and the end of the stepped hole with a large aperture is not filled but is plated with copper.

As shown in fig. 5, the diagram is a schematic diagram after the circuit etching, and the position H is a hole upper plate, and the PCB optical plate can be used for surface mounting after being completed; the G position is a blind hole, and is not suitable for surface mounting.

The technology can solve the problem of the PCB with the plate thickness of more than or equal to 0.07mm and the through hole diameter of 0.1-0.2 mm.

The invention is suitable for the technical field of PCB boards with single-sided hole upper disc design.

While the embodiments of the present invention have been described in terms of practical embodiments, they are not to be construed as limiting the meaning of the present invention, and modifications of the embodiments and combinations with other embodiments will be apparent to those skilled in the art in light of the present description.