阅读说明：本技术 一种用于电路板的通孔焊点以及电路板 (Through hole welding spot for circuit board and circuit board ) 是由 王博赟 杨龚轶凡 郑瀚寻 闯小明 于 2019-12-04 设计创作，主要内容包括：本发明公开了一种用于电路板的通孔焊点,尤其适用于有频繁检测需求且有较高灵活性要求的万用板。该通孔焊点包括焊盘、辅助焊接区以及设置在它们之间的过渡区,过渡区表面设置有防焊油墨层。通过辅助焊接区作为检测点,使得电路板的检测更加方便、快捷并且能避免检测操作对焊点的物理影响。在不改变电路板制作流程和电路元件焊接技术的情况下,大幅度降低电路板在开发过程中的查错难度,加快电路板开发过程。(The invention discloses a through hole welding spot for a circuit board, which is particularly suitable for a universal board with frequent detection requirements and higher flexibility requirements. The through hole welding spot comprises a welding disc, an auxiliary welding area and a transition area arranged between the welding disc and the auxiliary welding area, wherein the surface of the transition area is provided with a welding-proof ink layer. The auxiliary welding area is used as a detection point, so that the detection of the circuit board is more convenient and quicker, and the physical influence of the detection operation on a welding spot can be avoided. Under the condition of not changing the circuit board manufacturing process and the circuit element welding technology, the debugging difficulty of the circuit board in the development process is greatly reduced, and the circuit board development process is accelerated.)

1. A through hole welding spot for a circuit board, which comprises a hollow cylinder and a welding disc, wherein the welding disc is a hollow disc, the welding disc is positioned at two ends of the hollow cylinder and is connected with the hollow cylinder,

the through hole welding spot also comprises an auxiliary welding spot disc, and the auxiliary welding spot disc is a structure formed by extending along one radius direction of the welding spot;

the auxiliary welding spot pad comprises an auxiliary welding area, and the auxiliary welding area is positioned at one end of the auxiliary welding spot pad, which is far away from the welding pad;

the auxiliary welding spot disc further comprises a transition area, the transition area is located between the auxiliary welding area and the welding pad, the transition area is used for enabling the inner circle of the auxiliary welding area and the welding pad not to have a mutual overlapped part, the distance between the circle center of the inner circle of the auxiliary welding area and the circle center of the welding pad is not larger than the diameter of the outer circle of the welding pad, and a welding-proof ink layer is arranged on the surface of the transition area.

2. The via pad of claim 1, wherein a solder layer is disposed on the pad on a side away from the hollow cylinder.

3. The via pad of claim 1, wherein a side of the auxiliary land remote from the hollow cylinder is provided with a solder layer.

4. The via pad of claim 1, wherein the via pad is integrally formed.

5. The via pad of claim 1, wherein the pad is spaced from the auxiliary pad by a nearest distance of not less than 0.3 mm.

6. The via pad of claim 1, wherein the via diameter of the hollow cylinder is between 0.3mm and 1.2mm, and the outer diameter of the pad is between 0.6mm and 2mm and is not less than the via diameter of the hollow cylinder.

7. A circuit board, characterized in that a number of through-hole solder bumps as claimed in any one of claims 1-6 are provided.

Technical Field

The invention relates to the technical field of integrated circuits, in particular to a through hole welding spot for a circuit board.

Background

With the increasing variety of printed circuit components, the decreasing size of components, and the increasing complexity of circuit boards, it is more difficult to correct circuit errors using a Universal Board (Universal Board) in the development of printed circuit boards, especially in the process of developing samples using Universal boards. Unevenness of welding spots causes difficulty in positioning and easy slippage of a pen needle of the multimeter, and a surface oxidation layer of the welding spots causes instability and unreliability in measurement. Especially in some sensitive areas, the slippage of the multimeter pen needle can cause damage to a circuit board and even cause problems such as short circuit of welding spots and the like.

Disclosure of Invention

In view of this, the present invention provides a through hole solder joint for a circuit board, so as to facilitate simple, efficient, stable and reliable detection of the circuit board.

To achieve the above objects, the present invention provides a through hole pad for a circuit board. The through hole welding spot comprises a hollow cylinder and a welding disc, wherein the welding disc is a hollow disc, and the welding disc is positioned at two ends of the hollow cylinder and is connected with the hollow cylinder. The through hole welding spot also comprises an auxiliary welding spot disc, wherein the auxiliary welding spot disc is a structure formed by extending along one radius direction of the welding spot; the auxiliary welding spot plate comprises an auxiliary welding area which is positioned at one end of the auxiliary welding spot plate far away from the welding spot plate; the auxiliary welding spot plate further comprises a transition area, the transition area is located between the auxiliary welding area and the welding pad, the transition area is used for enabling the inner circle of the auxiliary welding area and the welding pad not to have a mutual coincident part, the distance between the circle center of the inner circle of the auxiliary welding area and the circle center of the welding pad is not larger than the diameter of the outer circle of the welding pad, and a welding-proof ink layer is arranged on the surface of the transition area.

The invention provides a reliable and stable detection point for the detection of the circuit board by arranging the auxiliary welding area. Simultaneously, through the surface at the transition district sets up the solder mask ink layer, guaranteed to use the universal meter to detect the time measuring to the circuit board, supplementary weld region is for the solder mask ink layer concavity form, ensures that universal meter pen needle does not slide, avoids causing circuit board short circuit or damage because sliding of universal meter pen needle. When the distance between the circle center of the inscribed circle of the auxiliary welding area and the circle center of the welding pad is not more than the diameter of the excircle of the welding pad, the number of through hole welding spots which can be arranged on the circuit board is basically the same as the number of common welding spots.

Preferably, a solder layer is disposed on the pad at a side away from the hollow cylinder. Through the soldering tin layer that sets up in advance, when preventing the pin of welding circuit component, soldering tin slides on preventing welding ink layer, when the used soldering tin of welding pin is in the molten condition, changes in each other with the soldering tin layer that sets up in advance and fuses. On the other hand, the preset soldering tin layer covers the surface of the pad, the influence of the oxide layer on the conductivity of the pad is avoided, and meanwhile, the step of using excessive rosin to remove the oxide film during welding is also reduced.

Preferably, the auxiliary welding area is provided with a solder layer at a side far away from the hollow cylinder. Through setting up the soldering tin layer, guaranteed to use the universal meter to examine time measuring through this through-hole solder joint to the circuit board, because the relatively softer characteristic of soldering tin, this soldering tin layer can be stabbed by universal meter pen needle and press and form the recess, guarantees that universal meter pen needle does not slide, avoids a pen needle to slide and causes the circuit damage.

Preferably, the through hole welding points are integrally formed. The through hole welding spot adopts the integrated forming process, and avoids using multiple times of electroplating in the processing process.

Preferably, the pad and the auxiliary land are spaced by a nearest distance of not less than 0.3 mm. Because the surface of the transition region between the bonding pad and the auxiliary welding region is usually provided with the anti-welding ink layer, in order to facilitate the arrangement of the anti-welding ink layer, the distance between the bonding pad and the auxiliary welding region, which is the nearest distance, is usually not less than the narrowest processing requirement of the anti-welding ink layer, and the narrowest processing requirement is usually 0.3 mm.

Preferably, the diameter of the through hole of the hollow cylinder is between 0.3mm and 1.2mm, and the diameter of the outer circle of the pad is between 0.6mm and 2mm and is not smaller than the diameter of the through hole of the hollow cylinder. When the diameter of the through hole of the hollow cylinder is between 0.3mm and 1.2mm, the standardized processing is convenient to carry out according to the standard of the circuit board.

In order to solve the above problem, according to a second aspect of the present invention, there is also provided a circuit board provided with any one of the through-hole lands of the first aspect described above.

Each through-hole pad provided in the circuit board includes auxiliary lands by which the circuit board is inspected so that each inspection point corresponds to the through-hole pad one to one. In practical engineering application, description or record of the detection point can be matched with the through hole welding point, and reliability and traceability of measurement data are guaranteed.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

FIG. 1 is a schematic diagram of a through-hole solder 100 according to the present invention;

FIG. 2A is a schematic diagram of a through-hole solder 200 according to the present invention;

FIG. 2B is a schematic diagram of another alternative through-hole pad 200 according to the present invention;

FIG. 3 is a schematic diagram of another alternative via pad 300 according to the present invention;

fig. 4 is a schematic structural diagram of a circuit board provided with a through-hole solder joint 300 according to the present invention;

FIG. 5 is a schematic cross-sectional view of a circuit board provided with a via pad 300 according to the present invention;

FIG. 6 is a schematic structural diagram of a circuit board according to the present invention;

fig. 7 is a schematic structural diagram of another circuit board provided by the invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

It will be understood that the terms "row direction," "column direction," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, as used herein, refer to an orientation or positional relationship indicated in the drawings, which is meant only to facilitate describing the invention and to simplify the description, and are not meant to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be taken as limiting the invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.

The following specifically describes embodiments of the present invention.

Fig. 1 is a schematic structural diagram of a through hole solder 100 according to an embodiment of the present invention. As shown in fig. 1, the via pad 100 includes a hollow cylinder 110, a pad 120, and an auxiliary pad 130, and the auxiliary pad 130 includes an auxiliary land 131 and a transition region 132.

One end of the hollow cylinder 110 is provided with a pad 120, the pad 120 is a hollow disk, and the pad 120 is connected to the hollow cylinder 110. In a preferred embodiment of the present invention, the inner circle diameter of the pad 120 is equal to the diameter of the through hole of the hollow cylinder 110, and in the case that the inner circle diameter of the pad 120 is equal to the diameter of the through hole of the hollow cylinder 110, it is convenient to insert the pin of the circuit component into the through hole of the hollow cylinder 110, thereby facilitating the soldering stability of the circuit component. In one embodiment of the present invention, the outer diameter of the bonding pad 120 is 2mm, and the diameter of the through hole of the hollow cylinder 110 is 1.2 mm. In another embodiment of the present invention, the outer diameter of the bonding pad 120 is 1.3mm, and the diameter of the through hole of the hollow cylinder 110 is 0.75 mm. In another embodiment of the present invention, the outer diameter of the bonding pad 120 is 0.6mm, and the diameter of the through hole of the hollow cylinder is 0.3 mm. In general, the diameter of the through hole of the hollow cylinder 110 is between 0.3mm and 1.2mm, and the diameter of the outer circle of the bonding pad 120 is between 0.6mm and 2mm and is not smaller than the diameter of the through hole of the hollow cylinder 110. The size is convenient for standardized processing of the circuit board or the universal board, and the process flow required by processing is simplified.

The pad 120 extends in a direction of one radius thereof to form an auxiliary pad 130, and the auxiliary land 131 is located at an end of the auxiliary pad 130 away from the pad 120. Generally, the auxiliary land 131 is spaced apart from the pad 120 by a nearest distance of not less than 0.3 mm. In a preferred embodiment of the present invention, the auxiliary land 131 has a circular shape, but the present invention is not particularly limited to a specific shape of the auxiliary land 131.

The transition region 132 is located between the pad 120 and the auxiliary land 131, and the transition region 132 is used to make no portion overlapped with each other between inscribed circles of the pad 120 and the auxiliary land 131, the distance between the center of the inscribed circle and the center of the pad 120 being not greater than the outer diameter of the pad 120. When the distance between the center of the inscribed circle of the auxiliary welding area 131 and the center of the pad 120 is not greater than the diameter of the outer circle of the pad 120, the number of through hole welding points which can be arranged on the unit area of the circuit board is basically the same as the number of common welding points, thereby providing detection flexibility and ensuring the full utilization of the circuit board or the universal board.

The surface of the transition region 132 is provided with a solder mask ink layer. In a preferred embodiment of the present invention, the transition area 132 provided with the solder resist ink layer has a height slightly higher than the height of the pad 120 and the auxiliary land 131. Because the solder mask is higher for supplementary weld region 131, use the universal meter to detect time measuring to supplementary weld region, guarantee that the universal meter pen needle does not slide, avoided the universal meter pen needle to slide and caused physical damage to the circuit board.

In a preferred embodiment of the present invention, a tangent line between the pad 120 and the auxiliary land 131 constitutes a side of the transition region 132. In actual implementation, however, the shape of the transition region 132 can be adjusted according to actual conditions.

In a preferred embodiment of the present invention, the hollow cylinder 110, the pad 120, and the auxiliary pad 130 of the through-hole pad 100 are integrally formed.

Referring to fig. 2A, a through hole pad 200 according to the present invention is shown. The hollow cylinder 210 is provided at one end with a bonding pad 220, an auxiliary pad 230, and the auxiliary pad 230 includes an auxiliary bonding area 231 and a transition area 232.

The other end of the hollow cylinder 210 is provided with another bonding pad corresponding to the bonding pad 220, the bonding pad is a hollow disc, the bonding pad extends along a radial direction of the bonding pad to form another auxiliary welding point disc, the auxiliary welding point disc is also provided with an auxiliary welding area and a transition area, the auxiliary welding area is positioned at one end, away from the bonding pad, of the auxiliary welding point disc, the transition area is used for enabling no part of mutual superposition to exist between the bonding pad and an inner circle of the auxiliary welding area, the distance between the circle center of the inner circle and the circle center of the bonding pad is not larger than the diameter of an outer circle of the bonding pad, and the surface of. In a preferred embodiment, the configuration of the two ends of the hollow cylinder 210 is mirror symmetric.

Fig. 2B shows another embodiment of the present invention. The through-hole solder 200 further comprises a second hollow cylinder 233. A second hollow cylinder 233 is provided at one end of the auxiliary welding region 231 near the other auxiliary welding region, and the second hollow cylinder 233 is connected to the auxiliary welding region 231. The auxiliary land 231 is provided with a through-hole, and the through-hole of the auxiliary land 231 and the through-hole of the second hollow cylinder 233 have a portion that coincides in the vertical direction. In a preferred embodiment of the present invention, the through-hole of the auxiliary land 231 is the same size as the through-hole of the second hollow cylinder 233 and coincides in the vertical direction. When the universal meter is used for detection, the pen needle of the universal meter can be inserted into the through hole of the auxiliary welding area 231 and the through hole of the second hollow cylinder 233, and the pen needle of the universal meter is guaranteed not to slide. The diameter of the through hole of the auxiliary land 231 and the diameter of the through hole of the second hollow cylinder 233 are generally not less than 0.3mm, facilitating the processing.

Fig. 3 is a schematic structural diagram of another through hole solder 300 according to the present invention. The via pad 300 includes a hollow cylinder 310, a pad 320, an auxiliary pad 330, the auxiliary pad 330 including an auxiliary land area 331 and a transition area 332.

One end of the hollow cylinder 310 is provided with a pad 320, the pad 320 is a hollow disk, and the pad 320 is connected with the hollow cylinder 310.

The bonding pad 320 extends in a direction of one radius thereof to form an auxiliary bonding pad 330, and the auxiliary bonding pad 331 is located at an end of the auxiliary bonding pad 330 remote from the bonding pad 320.

The transition area 332 is located between the bonding pad 320 and the auxiliary welding area 331, the transition area 332 is used for enabling the inscribed circle of the bonding pad 320 and the auxiliary welding area 331 not to have a mutual overlapped part, the distance between the circle center of the inscribed circle and the circle center of the bonding pad 320 is not larger than the diameter of the outer circle of the bonding pad 320, and the surface of the transition area 332 is provided with the anti-welding ink layer.

A first solder layer 340 is provided on the pad 320, and a second solder layer 350 is provided on the auxiliary land 331. Generally, the first solder layer 340 covers the entire pad 320, but in some embodiments, the first solder layer 340 may cover only a portion of the pad 320. Similarly, in some preferred embodiments, the second solder layer 350 covers the entire auxiliary land 331, but the second solder layer 350 may cover only a portion of the auxiliary land 331. Through setting up first soldering tin layer 340, prevent that pad 320 from because its oxide layer influences electric conductive property, simultaneously, when the welding, can avoid using the influence that the oxide layer just can be eliminated to the rosin of excess, the welding of being convenient for. During soldering, the soldering tin in a molten state is better fused with the first soldering tin layer 340, and the stability of the circuit element soldering is improved. Through setting up second soldering tin layer 350, because soldering tin softer characteristic relatively, use the universal meter to detect time measuring, second soldering tin layer 350 can be stabbed by universal meter pen needle and pressed the formation indentation, guarantees that universal meter pen needle does not slide, avoids a pen needle to slide and causes physical damage to the circuit.

Fig. 4 is a schematic structural diagram of a circuit board 400 according to the present invention. The circuit board is provided with through-hole solder joints 300. The via pad 300 includes a first solder layer 340 and a second solder layer 350, and the circuit board further includes a top solder mask ink layer 360, a bottom solder mask ink layer 370, and a dielectric layer 380. The top solder mask ink layer 360 and the bottom solder mask ink layer 370 are used to protect the circuit on the circuit board, prevent the circuit from being oxidized, and prevent the circuit board from being damaged or short-circuited due to accidental scratching; the solder resist ink layer is also used for isolating non-welding areas, and short circuit between the non-welding areas due to redundant soldering tin is avoided.

Fig. 5 is a schematic cross-sectional view of a circuit board 400. The via pads 300 extend through the dielectric layer 380. In a preferred embodiment, the hollow cylinder 310 has a height equal to the height of the dielectric layer 380, and the pad 320 is disposed at one end of the hollow cylinder 310 and connected to the dielectric layer 380. A first solder layer 340 is provided on the pad 320 and a second solder layer 350 is provided on the auxiliary land 331.

In a preferred embodiment, the first solder layer 340 is at a higher elevation relative to the dielectric layer 380 than the top solder mask ink layer 360 is at the dielectric layer 380. Similarly, the height of the second solder layer 350 relative to the dielectric layer 380 is higher than the height of the top solder mask ink layer 360 relative to the dielectric layer 380. In the processing of the circuit board, the first solder layer 340 and/or the second solder layer 350 are disposed on the solder resist ink layer surface through a pre-soldering step. When the top layer solder resist ink layer 360 is lower than the second solder layer 350, and the multimeter is used for detecting the second solder layer 350, the pen needle of the universal board does not need to touch the top layer solder resist ink layer 360, so that the top layer solder resist ink layer 360 is prevented from being scratched.

The invention provides a circuit board provided with a plurality of through hole welding spots. Referring to fig. 6, in some preferred embodiments, the via pads are formed in a two-dimensional matrix in the circuit board in the row and column directions. Wherein, the pads of the through hole welding points all extend along the same direction to form an auxiliary welding point disc. The auxiliary pads on these auxiliary pad pads also form a two-dimensional matrix in the circuit board in the row and column directions. The through hole welding points form a two-dimensional matrix so as to arrange the through hole welding points as much as possible under the condition that the area of the circuit board or the universal board is certain, so that the circuit board or the universal board is fully utilized. In other embodiments, the through-hole pads may be arranged on the circuit board or the universal board in other forms.

Fig. 7 shows another circuit board provided by the present invention, in which a plurality of through-hole pads are disposed on the circuit board.

In a preferred embodiment, the circuit board comprises 150 via pads, which in the row and column direction form a two-dimensional matrix in the circuit board, which has a total of 10 rows and 15 columns. For convenience of description, (x, y) is used to denote a via pad.

The via pads (0, 0), (1, 0), …, (9, 0), the via pads (5, 1), (5, 2), …, (5, 13) and the via pads (9, 1), (9, 2), …, (9, 13) are connected to the positive electrode. In a preferred embodiment, since these through-hole pads are mainly used to maintain the overall circuit continuity of the universal board, the circuit components are not usually soldered, and therefore the auxiliary pads may not be provided in bulk.

The via pads (0, 14), (1, 14), …, (9, 14), the via pads (4, 1), (4, 2), …, (4, 13) and the via pads (0, 1), (0, 2), …, (0, 13) are connected to the negative electrode. In a preferred embodiment, since these through-hole pads are mainly used to maintain the overall circuit continuity of the universal board, the circuit components are not usually soldered, and therefore the auxiliary pads may not be provided in bulk.

Except the through hole welding points, 3 adjacent through hole welding points in the row direction are communicated with each other to form a triple structure. In other embodiments, several through-hole welding points may be connected to each other according to the number of the through-hole welding points to form a multi-connected structure, not limited to the triple structure shown in the embodiment. In a preferred embodiment, each of the via-pads constituting the triple structure or the multiple structure is provided with an auxiliary land.

It is obvious that in practical implementation, the number of through-hole pads in the circuit board or the universal board is not limited to 150 as shown in the above embodiments, but can be adjusted according to the area of the circuit board or the universal board and the spacing between the through-hole pads.

While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.