阅读说明：本技术 一种保持芯片工作温度的控温组件及其控温方法 (Temperature control assembly for keeping working temperature of chip and temperature control method thereof ) 是由 刘贤甫 王宗旺 夏晓亮 于 2019-12-03 设计创作，主要内容包括：本发明提供一种保持芯片工作温度的控温组件及其控温方法,控温组件包括芯片、加热器、热敏电阻、绝缘基板、绝缘隔热板,芯片置于绝缘隔热板上,加热器、热敏电阻粘贴于绝缘基板同一侧外部,并通过绝缘基板粘贴于芯片上。本发明摒弃了TEC控温方案,采用加热器加热、热敏电阻监控以保持温度稳定的控温方法,同时结合了绝缘隔热板的尺寸、材质设计,可以满足对位置摆放要求较高的芯片应用场景,且在提高集成度的同时能有效降低成本。(The invention provides a temperature control assembly for keeping the working temperature of a chip and a temperature control method thereof. According to the invention, a TEC temperature control scheme is abandoned, a temperature control method of keeping temperature stable by heating of a heater and monitoring of a thermistor is adopted, and meanwhile, the size and material design of the insulating heat insulation plate are combined, so that a chip application scene with higher requirements on position and placement can be met, and the cost can be effectively reduced while the integration level is improved.)

1. The utility model provides a keep temperature control subassembly of chip operating temperature which characterized in that: comprises a chip, a heater, a thermistor and an insulating substrate,

also comprises an insulating thermal baffle for isolating the heat conduction between the chip and the device shell,

the chip is arranged on one side of the insulated heat-insulating plate, the insulated substrate is arranged outside the chip and used for heat conduction between the chip and the heater and the thermistor, and the heater and the thermistor are fixed outside the same side of the insulated substrate.

2. The temperature control assembly for maintaining the operating temperature of a chip according to claim 1, wherein: the insulating and heat insulating plate is arranged in a step shape, so that the chip is in a suspended state.

3. The temperature control assembly for maintaining the operating temperature of a chip according to claim 1, wherein: the insulating and heat insulating plate is a pair of heat insulating blocks and is symmetrically arranged below the chip.

4. The temperature control assembly for maintaining the operating temperature of a chip according to claim 1, wherein: the insulating substrate is made of ceramic or heat-conducting silicone grease.

5. The temperature control assembly for maintaining the operating temperature of a chip according to claim 1, wherein: the insulating and heat insulating plate is made of special glass or epoxy resin with good heat insulating property.

6. The temperature control assembly for maintaining the operating temperature of a chip according to claim 1, wherein: the heater adopts thermal resistance heating.

7. A temperature control method for keeping the working temperature of a chip is characterized in that: comprises the following steps of (a) carrying out,

firstly, setting a target temperature through software,

secondly, the thermistor detects the temperature, when the detected temperature is lower than the target temperature, the heater starts to work and heat,

and thirdly, monitoring the temperature of the chip by the thermistor in real time, and when the temperature of the chip is equal to the target temperature, enabling the heater to work in a dynamic balance state.

Technical Field

The invention relates to the field of chip working temperature control, in particular to a temperature control assembly for keeping the working temperature of a chip and a temperature control method thereof.

Background

With the advancement of the times, miniaturization of communication products is gradually becoming a market trend. The miniaturization of the product is mainly realized by a high-integration chip and a high-integration packaging mode. In optical devices and optical module products, an integrated IC is commonly used at present, and a chip and various functional elements are integrated on the chip, so that the volume of the product is reduced, miniaturization is a trend in the field of optical communication at present, and the application of an IC with high integration is the key point of miniaturization. Furthermore, for cost reasons, reducing the number or size of functional elements is generally employed to reduce the package size of the assembly.

Part of integrated ICs have higher requirements on the stability of working temperature, and at present, a TEC (semiconductor cooler) is mostly used as a temperature control assembly to achieve the effect of stabilizing the working temperature of the ICs. Admittedly, TEC has excellent temperature control performance as an IC temperature control component, and can rapidly and stably reach the target temperature of an IC, but TEC has disadvantages under some specific conditions. On one hand, for a part of chips which need to be kept at a high temperature for a long time, the TEC cooling function is not wasted (the TEC is expensive); on the other hand, the structure of the TEC is not flexible enough, and is difficult to match and apply to some chips with higher requirements on the placement position. Therefore, a low-cost, simple and flexible way to replace TEC is needed.

Disclosure of Invention

The invention aims to provide a heating assembly with flexible structure and low cost to replace a common TEC scheme, thereby meeting some chip application scenes with higher requirements on placement positions.

The invention provides a temperature control assembly for keeping the working temperature of a chip, which comprises the chip, a heater, a thermistor and an insulating substrate,

also comprises an insulating thermal baffle for isolating the heat conduction between the chip and the device shell,

the chip is arranged on one side of the insulated heat-insulating plate, the insulated substrate is arranged outside the chip and used for heat conduction between the chip and the heater and the thermistor, and the heater and the thermistor are fixed outside the same side of the insulated substrate. The low-temperature control function of the TEC is abandoned, a simpler mode is adopted, the cost of the temperature control assembly is reduced, and meanwhile, the sticking position, the thickness and the cross-sectional area of the insulating heat-insulating plate can be freely set, so that the application of a chip with higher requirements on the placing position can be met.

Preferably, the insulating and heat insulating board is stepped, so that the chip is in a suspended state.

Preferably, the insulated heat shield is a pair of heat insulation blocks symmetrically arranged below the chip.

Preferably, the insulating substrate is made of ceramic or heat-conducting silicone grease. The ceramic has better heat conductivity in the insulating material, and the heat dissipation performance of the assembly can be fully improved under the condition of meeting the insulating requirement by selecting the ceramic as the insulating substrate.

Preferably, the insulating and heat insulating board is made of special glass or epoxy resin with good heat insulating property. The insulating and heat insulating board has the main function of insulating heat transfer between the chip and the device shell, so that temperature change of the device only occurs inside the device.

Preferably, the heater is heated by a thermal resistance. The heating requirement of the temperature control assembly can be met by adopting resistance heating, the cost is lower, and the packaging cost can be effectively reduced.

The invention also provides a temperature control method for keeping the working temperature of the chip, which comprises the following steps,

firstly, setting a target temperature through software,

secondly, the thermistor detects the temperature, when the detected temperature is lower than the target temperature, the heater starts to work and heat,

and thirdly, monitoring the temperature of the chip by the thermistor in real time, and when the temperature of the chip is equal to the target temperature, enabling the heater to work in a dynamic balance state.

Drawings

FIG. 1 is a schematic view of the overall structure of the temperature control assembly of example 1

FIG. 2 is a schematic view of the overall structure of the temperature control assembly of example 2.

Detailed Description

The following provides a more detailed description of the present invention, with reference to the accompanying drawings.