阅读说明：本技术 电子零件封装装置 (Electronic component packaging device ) 是由 瀬山耕平 于 2017-03-28 设计创作，主要内容包括：一种电子零件封装装置(100),将半导体裸片(150)热压接于基板,并且利用绝缘树脂将半导体裸片(150)与基板的间隙密封,且所述电子零件封装装置包括将长条膜(210)以切片状切出的膜切出机构(200)、以及真空吸附半导体裸片(150)并热压接于基板的封装工具(110)。由此,能够在使封装头在水平方向上移动的电子零件封装装置(100)中,抑制绝缘树脂附着于封装工具。(An electronic component packaging apparatus (100) which thermocompression bonds a semiconductor die (150) to a substrate and seals a gap between the semiconductor die (150) and the substrate with an insulating resin, the electronic component packaging apparatus comprising a film cutting mechanism (200) which cuts a long film (210) into a cut piece, and a packaging tool (110) which vacuum-adsorbs the semiconductor die (150) and thermocompression bonds to the substrate. Thus, in the electronic component packaging device (100) which moves the packaging head in the horizontal direction, the insulating resin can be prevented from adhering to the packaging tool.)

1. An electronic component packaging device that thermocompression bonds an electronic component to a substrate or another electronic component and seals a gap between the electronic component and the substrate or a gap between the electronic component and the other electronic component with an insulating resin, the electronic component packaging device comprising:

a film cutting mechanism for cutting the long film into a slice-shaped film; and

and a sealing tool for vacuum-sucking the electronic component through the dicing film and thermally press-bonding the electronic component to the substrate or the other electronic component.

2. The electronic parts packaging apparatus of claim 1, comprising:

a film recovery mechanism receiving the cut sheet-like film from a surface of the packaging tool.

3. The electronic part packaging apparatus of claim 1,

the packaging tool includes:

a base portion and an island portion protruding from the base portion and having a surface on which the electronic component is vacuum-sucked,

the film cutting mechanism includes:

a base body portion having a hole with a shape larger than a planar shape of the island portion;

a jig having a hole having the same shape as the base portion, the jig sandwiching the long film between the jig and the base portion; and

a punch which is inserted into or removed from the hole of the base portion and the hole of the jig to cut the cut sheet-like film from the long film,

the surface of the punch contacting the long film is a plane surface for delivering the dicing film to the surface of the packaging tool.

4. The electronic part packaging apparatus of claim 2,

the membrane recovery mechanism includes:

a flat plate-like platform; and

and the adsorption belt moves along the surface of the platform to sequentially receive the sliced film from the surface of the packaging tool.

Technical Field

The present invention relates to a structure of an electronic component packaging apparatus for thermally bonding an electronic component such as a semiconductor die to a substrate.

Background

One of the methods for mounting electronic components such as semiconductor dies on a substrate is as follows: after applying a liquid insulating resin to the substrate or attaching a film-like insulating resin to the back side of the electronic component, the electronic component is thermally pressed against the substrate by a sealing tool. In the packaging method, the substrate and the electronic component can be bonded and the sealing resin between the electronic component and the substrate can be cured at one time. However, the above-mentioned encapsulating method has a problem that the insulating resin oozed out from between the electronic component and the substrate contaminates the encapsulating tool. Therefore, the following method can be used, namely: the film is sandwiched between the sealing tool and the electronic component and thermocompression bonding is performed, thereby preventing the insulating resin oozing from between the electronic component and the substrate from adhering to the sealing tool. The following methods can be used in the method, namely: the film is conveyed by the film conveying mechanism, and the film held between the sealing tool and the electronic component is replaced every time the electronic component is sealed (see, for example, patent document 1).

Disclosure of Invention

Problems to be solved by the invention

The electronic component packaging apparatus described in patent document 1 includes: the package head, make the packaging tool move up and down and capsulate and base plate terrace relative to base plate, keep the base plate and make the base plate move in the horizontal direction and carry on the joint position of the base plate and alignment of the packaging tool, and carry on the packaging head with the membrane carrying mechanism of the renewal membrane sequentially.

On the other hand, in recent years, an electronic component packaging apparatus has been used which moves a packaging head which moves a packaging tool which adsorbs a semiconductor die in an up-down direction in a horizontal direction to thermally press the semiconductor die against a substrate.

In such an electronic component packaging apparatus, there is also a problem that the packaging tool is contaminated by the insulating resin oozed from between the electronic component and the substrate. However, since the film transfer mechanism as described in patent document 1 is large in size and heavy in weight, when mounted on an electronic component packaging apparatus in which a packaging head is moved in a horizontal direction, there is a problem in that the volume of the electronic component packaging apparatus increases.

Accordingly, an object of the present invention is to suppress adhesion of an insulating resin to a package tool by a simple method.

Means for solving the problems

An electronic component packaging device according to the present invention is an electronic component packaging device that thermocompression bonds an electronic component to a substrate or another electronic component, and seals a gap between the electronic component and the substrate or a gap between the electronic component and another electronic component with an insulating resin, the electronic component packaging device including: a film cutting mechanism for cutting the long film into a slice-shaped film; and a packaging tool for vacuum-sucking the electronic component through the dicing film and thermocompression-bonding the electronic component to the substrate or other electronic components.

The electronic component packaging apparatus of the present invention is also preferably configured such that: there is a film retrieval mechanism that receives the sliced film from the surface of the packaging tool.

The electronic component packaging apparatus of the present invention is also preferably configured such that: the packaging tool includes a base and an island portion protruding from the base and vacuum-sucking the electronic component on the surface, and the film cutting mechanism includes: a base body portion having a hole with a shape larger than a planar shape of the island portion; a jig having a hole having the same shape as the base portion and sandwiching the long film between the jig and the base portion; and a punch which is inserted into or removed from the hole of the base portion and the hole of the jig to cut the cut sheet-like film from the long film, wherein a surface of the punch which is in contact with the long film is a flat surface such that the cut sheet-like film is transferred to a surface of the sealing tool.

The electronic component packaging apparatus of the present invention is also preferably configured such that: the film recovery mechanism includes a flat plate-like stage and an adsorption belt that moves along a surface of the stage and sequentially receives the cut film from a surface of the sealing tool.

ADVANTAGEOUS EFFECTS OF INVENTION

The invention can inhibit the insulating resin from adhering to the packaging tool by a simple method.

Drawings

Fig. 1 is a perspective view of an electronic component packaging apparatus according to an embodiment of the present invention.

FIG. 2 is a plan view of an electronic parts packaging apparatus according to an embodiment of the present invention.

Fig. 3 is a cross-sectional view of a stage frame of an electronic component packaging apparatus according to an embodiment of the present invention.

FIG. 4 is a sectional view showing a detail of the portion A shown in FIG. 3.

Fig. 5 is a perspective view of a film cutting mechanism of an electronic component packaging apparatus according to an embodiment of the present invention.

Fig. 6 is a perspective view of a film recovery mechanism of an electronic component packaging apparatus according to an embodiment of the present invention.

Fig. 7A is an explanatory view showing a film feeding operation of the film cutting mechanism of the electronic component packaging apparatus according to the embodiment of the present invention.

Fig. 7B is an explanatory view showing a film sandwiching operation of the film cutting mechanism of the electronic component packaging apparatus according to the embodiment of the present invention.

Fig. 7C is an explanatory view showing a cut film cutting operation of the film cutting mechanism of the electronic component packaging apparatus according to the embodiment of the present invention.

FIG. 8 is a perspective view showing the cut film of FIG. 7C.

Fig. 9A is an explanatory view (1) showing a delivery operation of a cut film in the electronic component packaging apparatus according to the embodiment of the present invention.

Fig. 9B is an explanatory view (2) showing a delivery operation of the cut film of the electronic component packaging apparatus according to the embodiment of the present invention.

Fig. 10A is an explanatory view showing an operation of a packaging tool for attaching a semiconductor die to an electronic component packaging apparatus according to an embodiment of the present invention.

Fig. 10B is an explanatory view showing an operation of thermally bonding a semiconductor die to a substrate by the electronic component packaging apparatus according to the embodiment of the present invention.

Fig. 11A is an explanatory view showing the sealing tool and the film recovery mechanism after thermocompression bonding shown in fig. 9B.

Fig. 11B is an explanatory view showing a slicing film receiving operation of the electronic component packaging apparatus of the present invention.

Fig. 11C is an explanatory view showing a film feeding operation of the film recovery mechanism of the electronic component sealing apparatus according to the present invention.

Detailed Description

Hereinafter, embodiments of the present invention will be described with reference to the drawings. First, the overall configuration of the electronic component packaging apparatus 100 according to the present embodiment will be described with reference to fig. 1 and 2.

As shown in fig. 1, the electronic component packaging apparatus 100 of the present embodiment includes: the main frame 11, the stage frame 20 supported by the main frame 11, the package head 70 supported by the stage frame 20, the X-direction linear motor 35 that drives the stage frame 20 in the X direction, the Y-direction linear motor 55 that drives the package head 70 in the Y direction, the sub-mount 80 disposed apart from the main frame 11, and the Y-direction load bearing member 54 attached to the sub-mount 80. One end of the Y-direction stator 50 of the Y-direction linear motor 55 is connected to the Y-direction load supporter 54 via a connecting member 53. In the present embodiment, as shown in fig. 1, the direction in which the gantry frame 20 extends is described as the Y direction, and the direction orthogonal thereto is described as the X direction. The Z direction is a vertical direction perpendicular to the XY plane.

As shown in fig. 1, the main frame 11 is a frame having a rectangular plane, and has a package stage 10, a film cutting mechanism 200, and a film recovery mechanism 300 mounted on an upper surface thereof, the package stage 10 vacuum-sucking a substrate 15 on which a semiconductor die 150 as an electronic component is to be packaged. Linear guides 12 are attached in parallel to each other near two opposing sides of the upper surface of the main frame table 11. A slider 26 is movably attached to the linear guide 12 in the X direction. The leg portions 23 of the carriage frame 20 are attached to the sliders 26 of the two linear guides 12. That is, the carriage frame 20 extends in the Y direction so as to straddle the main carriage 11, and the leg portions 23 at both ends are attached to the slider 26 and supported so as to be movable in the X direction.

As shown in fig. 1, the electronic component packaging apparatus 100 according to the present embodiment includes a sub-mount 80 that is distant from the main mount 11 so as to surround the main mount 11. The subframe 80 is a frame including a column 81, a column 82, and a beam 84 connecting the column 81 and the column 82. The X-direction stator 30 of the groove-shaped X-direction linear motor 35 is attached to the beam 84 extending in the X direction, and the permanent magnets 52 are arranged so that the X-direction stator 30 faces each other. Further, an X-direction mover 40 is attached to the tip of the arm 24 extending from the leg portion 23 of the gantry frame 20, and the X-direction mover 40 includes a coil 42 that moves in the X direction between the permanent magnets 52 of the X-direction stator 30. The X-direction mover 40 of the X-direction linear motor 35 moves in the X direction together with each of the gantry frames 20.

As shown in fig. 1 and 3, the carriage frame 20 supports the encapsulation head 70. The sealing head 70 houses a Z-direction drive mechanism 73 that moves a spindle 72, to which the heater 120 and the sealing tool 110 are attached at the tip, up and down in the Z direction. The Z-direction drive mechanism 73 moves the heater 120 and the packaging tool 110 up and down, and presses the semiconductor die 150 on the substrate 15 sucked and fixed to the packaging stage 10. As shown in fig. 3, a space is provided inside the stage frame 20, and two linear guides 27 extending in the Y direction are attached to both sides of the inner surface of the stage frame 20. Sliders 75 are attached to the linear guides 27, respectively, and the suspending members 74 of the package head 70 are attached to the two sliders 75.

As shown in fig. 1 and 2, the Y-direction stator 50 of the Y-direction linear motor 55 is mounted between the legs 23 of the carriage frame 20 via leaf springs 58. As shown in fig. 3, the Y-direction stator 50 is formed by arranging permanent magnets 52 facing each other in an open space on the inner surface of a groove-shaped frame 51. A frame 61, to which a coil 62 is attached and which extends from the package head 70, is disposed in a space between the permanent magnets 52 of the Y-direction stator 50. According to the above configuration, the Y-direction mover 60 moves in the Y-direction together with the package head 70.

As shown in fig. 1 and 2, a linear guide 86 is attached to the beam 85 of the sub-frame 80, and the Y-direction load bearing member 54 is slidably attached to the linear guide 86 in the X direction. The Y-direction load bearing member 54 is connected to the Y-direction stator 50 via a connecting member 53, and the Y-direction load bearing member 54 transmits a Y-direction load to the beam 85.

In the electronic component packaging apparatus 100 configured as described above, the stage frame 20 is moved in the X direction by the X-direction linear motor 35, and the packaging head 70 attached to the stage frame 20 is moved in the Y direction by the Y-direction linear motor 55. Further, the electronic component packaging apparatus 100 moves the heater 120 and the packaging tool 110 in the Z direction by the Z-direction driving mechanism 73 attached to the packaging head 70. Therefore, the X-direction linear motor 35, the Y-direction linear motor 55, and the stage frame 20 constitute an XY-direction driving mechanism 65 in the horizontal direction as a horizontal-direction driving mechanism for driving the sealing head 70. In the electronic component packaging apparatus 100 according to the present embodiment, the sub-mount 80 disposed away from the main mount 11 receives a reaction force in the X direction when the mount frame 20 is moved in the X direction and a reaction force in the Y direction when the packaging head 70 is moved in the Y direction. Therefore, the main frame 11 on which the sealing stage 10, the film cutting mechanism 200, and the film collecting mechanism 300 are mounted hardly vibrates.

Next, with reference to fig. 4, the configuration of the heater 120 and the sealing tool 110 attached to the tip of the spindle 72 will be described.

As shown in fig. 4, the packaging tool 110 includes a base 111 in the shape of a square plate, and an island 112 protruding from a lower surface 119 of the base 111 in the shape of a square pedestal. Island 112 vacuum chucks the semiconductor die 150 shown in fig. 3 to surface 118. The island 112 is smaller than the base 111 and has substantially the same rectangular shape as the semiconductor die 150 vacuum-sucked on the surface 118. In the center of the packaging tool 110, a vacuum hole 114 for vacuum-sucking the semiconductor die 150 is provided. Further, a plurality of vacuum holes 115 are provided in the base portion 111 at positions adjacent to the outer peripheral surface of the island portion 112. The vacuum holes 115 communicate with each other through an annular groove 116 provided on the upper surface of the base 111.

As shown in fig. 4, the heater 120 is a square plate-like object in which a heat-generating resistor containing platinum, tungsten, or the like is embedded in a ceramic such as aluminum nitride, for example, and has substantially the same size as the base 111 of the package tool 110. A vacuum hole 122 communicating with the vacuum hole 114 of the encapsulation tool 110 is provided in the center of the heater 120. Further, a groove 124 is provided on the lower surface of the heater 120, and a vacuum hole 123 penetrating the heater 120 in the thickness direction communicates with one end of the groove 124. Further, a vacuum hole 121 is provided at a position of the heater 120 communicating with the annular groove 116 of the sealing tool 110. The vacuum holes 121, 122, and 123 of the heater 120 penetrate in the thickness direction.

As shown in fig. 4, the main shaft 72 is provided with vacuum holes 76, 77, and 78 at positions corresponding to the vacuum holes 121, 122, and 123 of the heater 120, respectively, and the vacuum holes 121, 122, and 123 of the heater 120 communicate with the vacuum holes 76, 77, and 78 of the main shaft 72, respectively. As shown in fig. 4, when the vacuum hole 78 is evacuated by a vacuum device not shown, the vacuum hole 123 communicating with the vacuum hole 78 and the groove 124 communicating with the vacuum hole 123 are evacuated, and the package tool 110 is sucked and fixed to the lower surface of the heater 120.

Next, referring to fig. 5, the film cutting mechanism 200 will be described in detail. The film cutting mechanism 200 moves the punch 203 in the Z direction while sandwiching the long film 210 between the upper surface 201a of the base portion 201 and the lower surface 204a of the jig 204, and cuts the four-sided sliced film 220 as shown in fig. 8 from the long film 210. As shown in fig. 5, when the cut sheet-like film 220 is cut, four holes 212 having the same size as the cut sheet-like film 220 remain in the long film 210.

The film cutting mechanism 200 includes: a rectangular parallelepiped base portion 201 provided with a rectangular hole 202 at the center, a rectangular frame-shaped jig 204 disposed above the base portion 201, a punch 203 disposed in the hole 202 of the base portion 201, a cylindrical film feeding roller 206 rotating around a central axis 207, and a cylindrical film take-up roller 208 disposed on the opposite side of the base portion 201 from the film feeding roller 206 and rotating around a central axis 209. In the initial state, the long film 210 is wound around the film feeding roller 206, and one end thereof extends to the film winding roller 208 across the upper surface 201a of the base portion 201 and is fixed to the film winding roller 208.

The square hole 202 of the base portion 201 shown in fig. 5 has a shape larger than the square island portion 112 described with reference to fig. 4. Since the island 112 has a square shape having substantially the same size as the semiconductor die 150 to be packaged, the hole 202 of the base portion 201 has a square cross-section larger than the semiconductor die 150 to be packaged in the electronic component packaging apparatus 100. The hole 205 of the jig 204 is the same size as the hole 202 of the base portion 201.

The jig 204 is moved in the Z direction by a driving device, not shown, so that the lower surface 204a comes into contact with or separates from the upper surface 201a of the base 201. As described above, since the hole 205 of the jig 204 and the hole 202 of the base 201 are the same size, when the lower surface 204a of the jig 204 and the upper surface 201a of the base 201 are in contact with each other, the hole 202 of the base 201 and the hole 205 of the jig 204 constitute an integrated hole communicating with each other.

The punch 203 is disposed in the hole 202 of the base portion 201 and moves in the Z direction. The outer surface of the punch 203 is slightly smaller in size than the inner surface of the holes 202 and 205, and is sized to form a slight clearance with the inner surfaces of the holes 202 and 205. The upper surface 203a of the punch 203 is a plane and is a surface in contact with the long film 210.

The long film 210 shown in fig. 5 has heat resistance that can withstand the temperature at which the semiconductor die 150 is thermocompression bonded to the substrate 15, and adhesion prevention properties that prevent the insulating resin 153 shown in fig. 10B from adhering thereto. As the long film 210, for example, a fluororesin such as polytetrafluoroethylene, a tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer, or the like is suitable. The thickness of the long film 210 is preferably about 20 μm to 50 μm in consideration of mechanical strength and thermal conductivity to the semiconductor die 150. As shown in fig. 5, a hole 211 is provided in the center of the long film 210 in the width direction so as not to block the vacuum hole 114, and the vacuum hole 114 is provided in the center of the packaging tool 110 while vacuum-sucking the semiconductor die 150. The holes 211 are provided at a pitch larger than the longitudinal length of the holes 202 along the longitudinal direction of the strip film 210.

The long film 210 is not limited to the fluororesin and the like as long as it has heat resistance and adhesion prevention properties, and a nonwoven fabric or a porous resin material having air permeability and water repellency in addition to heat resistance and adhesion prevention properties is suitably used. When a nonwoven fabric or a porous resin material is used, the dicing film 220 does not block the vacuum holes 114 of the vacuum-sucked semiconductor die 150, and therefore, it is not necessary to provide the holes 211 in the strip film 210.

Next, the film collecting mechanism 300 will be described with reference to fig. 6. As shown in fig. 11A to 11C, which will be described later, the film collecting mechanism 300 causes the dicing film 220 held on the front surface 118 and the lower surface 119 of the sealing tool 110 to be sucked to the suction tape 310 positioned on the upper surface 301A of the stage 301, and winds the suction tape 310 on which the dicing film 220 is sucked around the tape winding roller 304.

As shown in fig. 6, the film recovery mechanism 300 includes: a flat plate-like platform 301, a cylindrical tape feed roller 302 that rotates about a central axis 303, and a cylindrical tape take-up roller 304 that is disposed on the opposite side of the platform 301 from the tape feed roller 302 and rotates about a central axis 305. In the initial state, the suction tape 310 is wound around the tape feed roller 302, and one end thereof extends to the tape take-up roller 304 over the upper surface 301a of the platen 301 and is fixed to the tape take-up roller 304. The upper surface 301a of the stage 301 is a flat surface.

As shown in fig. 1, the electronic component sealing apparatus 100 according to the present embodiment includes a controller 90 inside the main frame 11, and the controller 90 controls the operations of the X-direction linear motor 35, the Y-direction linear motor 55, the Z-direction drive mechanism 73, the film cutting mechanism 200, and the film collecting mechanism 300. The control unit 90 is a computer including a central processing unit for performing arithmetic processing, and a storage unit for storing control programs and control data.

Next, the operation of the electronic component packaging apparatus 100 according to the present embodiment will be described with reference to fig. 7A to 11C.

As shown in fig. 7A, in the initial state, the jig 204 of the film cutting mechanism 200 is positioned above the base portion 201, and a gap is formed between the upper surface 201a of the base portion 201 and the lower surface 204a of the jig 204. The long film 210 is wound around the film feeding roller 206, and one end thereof extends to the film winding roller 208 through a gap between the upper surface 201a of the base portion 201 and the lower surface 204a of the jig 204, and is fixed to the film winding roller 208. The upper surface 203a of the punch 203 accommodated in the hole 202 of the base 201 is formed at a position slightly lower in the Z direction than the upper surface 201a of the base 201.

As shown in fig. 7A, the control section 90 rotates the film feeding roller 206 and the film take-up roller 208, and feeds the long film 210 in the X direction so that the holes 211 provided in the long film 210 at predetermined intervals come to the center of the punch 203 as shown in fig. 5.

Next, as shown in fig. 7B, the control unit 90 lowers the jig 204 in the Z direction, and sandwiches and fixes the long film 210 between the upper surface 201a of the base portion 201 and the lower surface 204a of the jig 204. The hole 202 of the base body 201 is the same size as the hole 205 of the jig 204, and the hole 202 and the hole 205 are arranged at the same position. Therefore, when the strip film 210 is sandwiched as shown in fig. 7B, the holes 202 and 205 constitute an integrated hole communicating with each other through the strip film 210.

Next, as shown in fig. 7C, the control unit 90 raises the punch 203 in the Z direction until the upper surface 203a of the punch 203 exceeds the upper surface 201a of the base portion 201 and enters the hole 205 of the jig 204. As a result, the cut film 220 having substantially the same size as the hole 205 of the base portion 201 is cut out from the long film 210 (see fig. 7). The cut piece-like film 220 has a hole 211 in the center. In the state shown in fig. 7C, the cut piece-like film 220 is positioned on the upper surface 203a of the planar punch 203.

After the cutting of the dicing sheet 220 is completed, as shown in fig. 9A, the control section 90 drives the X-direction linear motor 35, the Y-direction linear motor 55, and the Z-direction driving mechanism 73, adjusts the XY-direction position so that the vacuum hole 114 of the sealing tool 110 is at the position of the hole 211 of the dicing sheet 220 shown in fig. 8, and lowers the surface 118 of the sealing tool 110 to the upper surface 203a of the punch 203. Then, as shown in fig. 9B, the controller 90 vacuums the vacuum hole 76 of the main shaft 72 by a vacuum device, not shown. Then, the grooves 116 on the upper surface of the sealing tool 110 are evacuated through the vacuum holes 121 communicating with the vacuum holes 76, and the plurality of vacuum holes 115 communicating with the grooves 116 are evacuated. Thus, as shown in fig. 9B, the sliced film 220 positioned on the upper surface 203a of the punch 203 is attracted to the lower side of the package tool 110 in the Z direction so as to cover the surface 118 of the island 112, the side surface of the island 112, and the lower surface 119 of the base 111. Further, the vacuum holes 114 of the encapsulation tool 110 are not blocked due to the presence of the holes 211 of the dicing film 220.

As shown in fig. 9B, after the transfer of the cut sheet-like film 220 from the upper surface 203a of the punch 203 to the lower surface of the sealing tool 110 is completed, the control unit 90 rotates the film feeding roller 206 and the film take-up roller 208, winds the portion of the long film 210 including the hole 212 of the cut sheet-like film 220 around the film take-up roller 208, and feeds out a new long film 210 from the film feeding roller 206 onto the base portion 201 and the punch 203, as shown in fig. 5.

As shown in fig. 10A, the controller 90 moves the package tool 110 onto the semiconductor die 150 by driving the X-direction linear motor 35 and the Y-direction linear motor 55, and lowers the package tool 110 onto the upper surface of the semiconductor die 150 by the Z-direction drive mechanism 73. When the vacuum hole 77 is evacuated, the vacuum hole 114 of the packaging tool 110 communicating with the vacuum hole 77 is evacuated, and the semiconductor die 150 is vacuum-sucked to the surface 118 via the dicing film 220. As shown in fig. 10A, an electrode 151 is formed on a surface of a semiconductor die 150 to be thermocompression bonded, and an insulating resin film 152 is attached to a side surface of the electrode.

As shown in fig. 10B, the controller 90 drives the X-direction linear motor 35 and the Y-direction linear motor 55 to move the sealing tool 110 to a position directly above the sealing position of the substrate 15. The controller 90 turns on the heater 120 to heat the semiconductor die 150 to about 250 to 300 ℃. Then, the controller 90 lowers the packaging tool 110 by the Z-direction drive mechanism 73, thermally bonds the electrodes 151 of the semiconductor die 150 to the electrodes 154 of the substrate 15, and thermally cures the insulating resin film 152 between the semiconductor die 150 and the substrate 15 to seal the gap with the insulating resin 153. At this time, a part of the insulating resin 153 seeps around the semiconductor die 150, and the insulating resin 153 reaches the side surface of the island 112 of the packaging tool 110. However, since the surface of this portion is covered with the cut film 220, the insulating resin 153 does not adhere to the surface of the sealing tool 110.

After the semiconductor die 150 is thermally pressure bonded to the substrate 15 for a predetermined time, the control unit 90 releases the vacuum in the vacuum holes 77 and 114 to release the suction of the semiconductor die 150, turns off the heater 120, raises the package tool 110 by the Z-direction drive mechanism 73, drives the X-direction linear motor 35 and the Y-direction linear motor 55, and moves the package tool 110 to a position directly above the stage 301 of the film collecting mechanism 300 as shown in fig. 11A. At this time, the residue 156 of the insulating resin 153 adheres to the surface of the sliced film 220.

Next, as shown in fig. 11B, the controller 90 operates the Z-direction drive mechanism 73 to lower the sealing tool 110 onto the stage 301 of the film collecting mechanism 300, thereby releasing the vacuum in the vacuum holes 76, the grooves 116, and the vacuum holes 115. Then, the portion attracted to the lower surface 119 of the base 111 by the vacuum holes 115 of the cut sheet-like film 220 is separated from the lower surface 119. In addition, a portion of the cut sheet-like film 220 covering the surface 118 of the sealing tool 110 is adsorbed to the surface of the adsorption tape 310. The suction belt 310 may be, for example, an adhesive tape or the like as long as it has an adhesive force or a suction force larger than the adhesive force or the attraction force of the surface 118 of the sealing tool 110 for holding the dicing film 220.

As shown in fig. 11C, when the control unit 90 operates the Z-direction drive mechanism 73 to raise the sealing tool 110, the dicing film 220 adsorbed on the adsorption tape 310 remains in an adsorbed state. After the suction tape 310 receives the cut sheet-like film 220 from the lower surface 118 and the lower surface 119 of the sealing tool 110, the controller 90 drives the tape feed roller 302 and the tape take-up roller 304 to wind the portion on which the cut sheet-like film 220 is sucked into the tape take-up roller 304, and feeds a new suction surface of the suction tape 310 from the tape feed roller 302 onto the upper surface 301a of the stage 301, as shown in fig. 6 and 11C.

As described above, according to the electronic component packaging apparatus 100 of the present embodiment, the cut-out dicing film 220 is attached to the front surface 118 and the lower surface 119 of the packaging tool 110, and the semiconductor die 150 is thermocompressively bonded to the substrate 15 via the dicing film 220, whereby the insulating resin 153 can be prevented from adhering to the packaging tool 110 without mounting a heavy film conveyance mechanism on the package head 70 that moves in the XY direction. Furthermore, while the insulating resin 153 is prevented from adhering to the packaging tool 110, the packaging head 70 can be moved at a high speed, and the packaging time of the semiconductor die 150 can be shortened.

In addition, in the electronic component packaging apparatus 100 according to the present embodiment, since it is not necessary to always dispose a roll-shaped film on the front surface 118 side of the packaging tool 110, as in the film transfer mechanism of the related art described in patent document 1, the packaging tool 110 can be easily replaced according to the type of the semiconductor die 150 to be thermocompression bonded. In addition, additional operations such as position correction may be performed by using a glass mark in a state where the cut film 220 is not attracted, and the sealing accuracy can be improved.

The film collecting mechanism 300 of the electronic component sealing apparatus 100 described above has been described as a form in which the cut sheet-like film 220 is sucked and collected by the suction belt 310, but is not limited to this, and for example, a vacuum suction hole may be disposed on the upper surface 301a of the stage 301, and the cut sheet-like film 220 may be sucked and collected by vacuum suction with a force larger than the adhesive force, the attractive force, or the like of the surface 118 of the sealing tool 110 for holding the cut sheet-like film 220. Alternatively, the tip of the sealing tool 110 may be placed in a box having a vacuum suction hole disposed on the lower surface thereof, the vacuum of the vacuum hole 115 of the sealing tool 110 may be released, the interior of the box may be evacuated, and the cut sheet-like film 220 may be sucked into the box and collected.

Further, the description has been given of the upper surface 203a of the punch 203 of the film cutting mechanism 200 of the electronic component packaging apparatus 100 according to the present embodiment as a plane, but a thimble may be disposed at the position of the hole 211 shown in fig. 5. When the punch 203 is raised to cut the dicing film 220 from the long film 210, the hole 211 is opened in the long film 210 by the ejector pin, and then the sealing tool 110 is lowered to the upper surface 203a of the punch 203 so that the ejector pin enters the vacuum hole 114 of the sealing tool 110, and the dicing film 220 may be transferred from the upper surface 203a of the punch 203 to the surface 118 and the lower surface 119 of the sealing tool 110 by making the vacuum hole 115 vacuum.

In addition, although the above description has been made in the form of thermocompression bonding the semiconductor die 150 on the substrate 15, the present invention is also applicable to the case where after the semiconductor die 150 is thermocompression bonded on the substrate 15, another semiconductor die is thermocompression bonded on the semiconductor die 150.

Further, in the above description, the insulating resin film 152 is attached to the electrode side surface of the semiconductor die 150, and the insulating resin film 152 between the semiconductor die 150 and the substrate 15 is thermally cured to seal the gap as the insulating resin 153 when the semiconductor die 150 is thermally compression-bonded to the substrate 15, but instead of the insulating resin film 152, the insulating resin paste may be applied to the electrode side surface of the semiconductor die 150, and the insulating resin paste may be thermally cured to produce the insulating resin 153 when the semiconductor die 150 is thermally compression-bonded. Alternatively, the insulating resin paste may be applied to the surface of the substrate 15 and thermally cured to form the insulating resin 153 in the thermocompression bonding of the semiconductor die 150. In the electronic component packaging apparatus 100 according to the present embodiment, the cut-out dicing film 220 is attached to the front surface 118 and the lower surface 119 of the packaging tool 110, and the semiconductor die 150 is thermocompression bonded to the substrate 15 via the dicing film 220, so that the insulating resin 153 can be prevented from adhering to the packaging tool 110 in either case.

Description of the symbols

10: packaging platform

11: main frame platform

12. 86: linear guide

15: substrate

20: rack frame

23: foot part

24: arm(s)

26. 75: sliding block

27: linear guide

30: x-direction stator

35: x-direction linear motor

40: x-direction mover

42. 62: coil

50: y-direction stator

51: frame structure

52: permanent magnet

53: connecting member

55: y-direction linear motor

60: y-direction mover

61: frame structure

65: XY-direction drive mechanism

70: packaging head

72: main shaft

73: z-direction driving mechanism

74: suspension member

76. 77, 78, 114, 115, 121, 122, 123: vacuum hole

80: secondary support

81. 82: column

84. 85: beam

90: control unit

100: electronic component packaging device

110: packaging tool

111: base part

112: island part

116. 124: trough

118: surface of

119: lower surface

120: heating device

150: semiconductor bare chip

151. 154: electrode for electrochemical cell

152: insulating resin film

153: insulating resin

156: residue of rice

200: film cutting mechanism

201: base body part

201a, 203a, 301 a: upper surface of

202. 205: hole(s)

203: punch head

204: clamp apparatus

204 a: lower surface

206: film delivery roller

207. 209, 303, 305: center shaft

208: film take-up roll

210: long film

211. 212, and (3): hole(s)

220: sheet-like film

300: film recovery mechanism

301: platform

302: belt delivery roller

304: tape take-up roll

310: adsorption band