阅读说明：本技术 封装盖板、显示面板和显示装置 (Packaging cover plate, display panel and display device ) 是由 罗程远 于 2021-07-20 设计创作，主要内容包括：本发明涉及显示设备技术领域,具体而言,涉及一种封装盖板以及其制备方法,还涉及包含有该封装盖板的显示面板和显示装置。封装盖板包括盖板、黑矩阵和彩膜、平坦层、以及设置在平坦层上的第一辅助电极单元。第一辅助电极单元包括导光柱和第一辅助电极,导光柱形成在平坦层表面且与彩膜层的位置对应,在远离平坦层的方向上宽度渐缩形成倾斜的侧壁；第一辅助电极位于相邻导光柱的间隙内,其具有形成在平坦层表面与黑矩阵的位置对应的第一段和形成在导光柱的倾斜侧壁的第二段。第一辅助电极具有较大的面积,封装盖板与显示基板压合时,可避免较大压合力使电极产生损伤脆裂而影响导电效果,此外还可以辅助光反射,约束出光线路,防止像素侧向漏光。(The invention relates to the technical field of display equipment, in particular to an encapsulation cover plate and a preparation method thereof, and further relates to a display panel and a display device comprising the encapsulation cover plate. The packaging cover plate comprises a cover plate, a black matrix, a color film, a flat layer and a first auxiliary electrode unit arranged on the flat layer. The first auxiliary electrode unit comprises a light guide column and a first auxiliary electrode, the light guide column is formed on the surface of the flat layer and corresponds to the position of the color film layer, and the width of the light guide column is gradually reduced in the direction away from the flat layer to form an inclined side wall; the first auxiliary electrode is positioned in the gap between the adjacent light guide columns and is provided with a first section which is formed on the surface of the flat layer and corresponds to the position of the black matrix and a second section which is formed on the inclined side wall of the light guide column. The first auxiliary electrode has a larger area, when the packaging cover plate is pressed with the display substrate, the electrode can be prevented from being damaged and cracked by larger pressing force to influence the conductive effect, and in addition, the light reflection can be assisted, the light emitting circuit can be restrained, and the lateral light leakage of the pixel can be prevented.)

1. A package cover plate comprising a cover plate, a black matrix and a color film layer formed on the cover plate, a flat layer covering the black matrix and the color film layer, and a first auxiliary electrode unit disposed on the flat layer, the first auxiliary electrode unit comprising:

the light guide column is formed on one side, away from the cover plate, of the flat layer, the light guide column and the orthographic projection of the color film layer on the cover plate are overlapped, and the width of the light guide column is gradually reduced in the direction away from the flat layer to form an inclined side wall;

the first auxiliary electrode is positioned in the gap between the adjacent light guide columns and is provided with a first section formed on the surface of the flat layer and a second section formed on the inclined side wall of the light guide column, and the first section is overlapped with the orthographic projection of the black matrix on the cover plate.

2. The package cover according to claim 1, wherein the light guide pillar has a plurality of protrusions formed on a surface thereof facing away from the planarization layer, and the light guide pillar is configured to collect light emitted from the display substrate toward the cover.

3. The package cover according to claim 2, wherein the shape of the protrusion is spherical, ellipsoidal or conical.

4. The package cover according to claim 1, wherein the light guide pillar has a length or width dimension of 30-50 μm and a height dimension of 20-50 μm.

5. The package cover according to claim 1, wherein the first auxiliary electrode material is a light-reflecting metal, and the thickness of the first auxiliary electrode is 10-300 nm.

6. The package cover according to any one of claims 1 to 5, further comprising a second auxiliary electrode unit, the second auxiliary electrode unit comprising:

the spacer column is made of a light resistance material, penetrates through the flat layer at the position of the black matrix, and one end of the spacer column is connected with the black matrix while the other end extends out of the flat layer;

a second auxiliary electrode coated in the black matrix;

and the auxiliary conductive column is coated in the spacer column, one end of the auxiliary conductive column is connected with the second auxiliary electrode, and the other end of the auxiliary conductive column is exposed out of the end face of the spacer column, which deviates from the black matrix.

7. The package cover according to claim 6, wherein the spacer pillars are made of black photoresist.

8. The package cover according to claim 6, wherein an orthographic projection of the spacer pillar and/or the second auxiliary electrode on the cover is located within an orthographic projection of the black matrix on the cover.

9. The package cover plate according to claim 6, wherein the height of the spacer pillars is 2-5 μm, the diameter is 15-20 μm, and the diameter of the auxiliary conductive pillars is 10-15 μm.

10. The package cover plate according to claim 6, wherein the thickness of the second auxiliary electrode is 10-300nm, and the width dimension of the second auxiliary electrode is 50-80% of the black matrix.

11. The package cover according to claim 6, wherein the first auxiliary electrode unit is distributed in a central region of the package cover and the second auxiliary electrode structure is distributed in an edge region of the package cover.

12. A display panel, comprising:

a display substrate including a driving substrate, a pixel defining layer formed on the driving substrate, a light emitting layer formed on the pixel defining layer, and a top electrode formed on the light emitting layer;

the encapsulating cover plate of any of claims 1 to 11, the first auxiliary electrode being opposite to where the pixel defining layer is located and in contact with the top electrode.

13. A display device characterized by comprising the display panel according to claim 12.

Technical Field

The invention relates to the technical field of display equipment, in particular to an encapsulation cover plate, a display panel comprising the encapsulation cover plate and a display device comprising the encapsulation cover plate.

Background

In recent years, organic electroluminescent displays (OLEDs) are display illumination devices that have been developed in recent years, and particularly in the display industry, organic electroluminescent displays (OLEDs) are considered to have a wide application prospect due to their advantages of high response, high contrast, flexibility, and the like. Especially, top-emitting OLED devices have higher aperture ratio and realize light extraction optimization by using microcavity effect, which is the main direction of research. For the top emission structure, the top electrode as the light emitting surface of the OLED must have good light transmittance. At present, most of the top-emission transparent electrodes are made of thin metal, ITO, IZO, etc., wherein the metal has poor transmittance, and the metal is used as a large-area electrode after thinning, which is likely to cause resistance increase, and is not favorable for the development of large-size devices.

It is also a way to increase the conductivity of the electrodes in the prior art to fabricate the auxiliary electrodes on the package cover plate. Because the auxiliary electrode is mostly made of hard materials such as metal, ITO and the like, when the packaging and pressing are carried out, the auxiliary electrode is in contact with the back plate electrode, the contact is easy to generate brittle fracture at a large-folding-angle inflection point due to overlarge pressure, so that the electrode is disconnected or connected in a virtual mode, and the integral resistance value of the device cannot achieve the expected effect.

Disclosure of Invention

In view of this, embodiments of the present invention provide a package cover plate, and further provide a display panel and a display device including the package cover plate, so as to solve the technical problem in the prior art that the contact between the auxiliary electrode and the backplane electrode is easily brittle due to an excessive pressure, thereby causing the disconnection or virtual connection of the electrode.

To achieve the above object, according to one aspect of an embodiment of the present invention, there is provided a package cover plate.

According to an embodiment of the present invention, a package cover plate includes a cover plate, a black matrix and a color film layer formed on the cover plate, a flat layer covering the black matrix and the color film layer, and a first auxiliary electrode unit disposed on the flat layer, the first auxiliary electrode unit including:

the light guide column is formed on one side, away from the cover plate, of the flat layer, the light guide column and the orthographic projection of the color film layer on the cover plate are overlapped, and the width of the light guide column is gradually reduced in the direction away from the flat layer to form an inclined side wall;

the first auxiliary electrode is positioned in the gap between the adjacent light guide columns and is provided with a first section formed on the flat layer and a second section formed on the inclined side wall of the light guide column, and the first section is overlapped with the orthographic projection of the black matrix on the cover plate.

In some most preferred embodiments, a plurality of protrusions facing away from the flat layer are distributed on the surface of the light guide pillar, and the light guide pillar is used for gathering light rays emitted from the display substrate to the cover plate.

In some most preferred embodiments, the shape of the protrusions is spherical, ellipsoidal, or conical.

In some most preferred embodiments, the light guide has a length or width dimension of 30-50 μm and a height dimension of 20-50 μm.

In some most preferred embodiments, the first auxiliary electrode material is a metal that reflects light, and the thickness of the first auxiliary electrode is 10-300 nm.

In some most preferred embodiments, the package cover further comprises a second auxiliary electrode unit, the second auxiliary electrode unit comprising:

the spacer column is made of a light resistance material, penetrates through the flat layer at the position of the black matrix, and one end of the spacer column is connected with the black matrix while the other end extends out of the flat layer;

a second auxiliary electrode coated in the black matrix;

and the auxiliary conductive column is coated in the spacer column, one end of the auxiliary conductive column is connected with the second auxiliary electrode, and the other end of the auxiliary conductive column is exposed out of the end face of the spacer column, which deviates from the black matrix.

In some most preferred embodiments, the spacer pillars are made of black photoresist.

In some most preferred embodiments, an orthographic projection of the spacer pillar and/or the second auxiliary electrode on the cover plate is located within an orthographic projection of the black matrix on the cover plate.

In some most preferred embodiments, the height of the spacer pillar is 2-5 μm, the diameter is 15-20 μm, and the diameter of the auxiliary conductive pillar is 10-15 μm.

In some most preferred embodiments, the second auxiliary electrode has a thickness of 10 to 300nm, and a width dimension of 50 to 80% of the black matrix.

In some most preferred embodiments, the first auxiliary electrode unit is distributed in a central region of the cover plate, and the second auxiliary electrode structure is distributed in an edge region of the cover plate.

In order to achieve the above object, according to a second aspect of the embodiments of the present invention, there is also provided a display panel including the package cover plate according to the first aspect of the embodiments of the present invention.

In order to achieve the above object, according to a third aspect of the embodiments of the present invention, there is also provided a display device including the display panel according to the second aspect of the embodiments of the present invention.

The packaging cover plate provided by the embodiment of the invention has the advantages that the first auxiliary electrode comprises the first section formed on the surface of the flat layer and the second section formed on the inclined side wall of the light guide column, the surface area is larger, when the packaging cover plate is pressed with the display substrate, compared with the traditional auxiliary electrode, the first auxiliary electrode is in contact conduction with the top electrode of the pixel defining layer part, the electrode can be prevented from being damaged and cracked by larger pressing force to influence the conduction effect, in addition, the second section of the first auxiliary electrode which is obliquely arranged can also assist light reflection to restrict a light emitting circuit, and the lateral light leakage of the pixel is prevented.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this application, serve to provide a further understanding of the application and to enable other features, objects, and advantages of the application to be more apparent. The drawings and their description illustrate the embodiments of the invention and do not limit it. In the drawings:

FIG. 1 is a schematic diagram of a display panel according to the related art;

fig. 2 is a schematic structural diagram of a package cover plate according to embodiment 1 of the present invention;

fig. 3 is a schematic structural diagram of a display panel formed by a package cover according to embodiment 1 of the present invention;

FIG. 4 is a schematic diagram of a portion of a light exit path of the display panel shown in FIG. 3;

fig. 5 to 9 are device structure diagrams corresponding to various process stages in a manufacturing process of a package cover plate according to embodiment 1 of the present invention;

fig. 10 is a schematic structural diagram of a package cover plate according to embodiment 2 of the present invention;

fig. 11 is a schematic structural diagram of another package cover plate according to embodiment 2 of the present invention;

fig. 12 is a schematic structural diagram of a display panel formed by a package cover according to embodiment 2 of the present invention; and

fig. 13 to 16 are device structure diagrams corresponding to various process stages in a manufacturing process of a package cover plate according to embodiment 2 of the present invention; and

fig. 17 is a schematic plan view of a package cover plate according to embodiment 3 of the present invention.

In the figure:

10. packaging the cover plate;

11. a cover plate; 12. a black matrix; 13. a color film layer; 14. a planarization layer; 15. an isolation column; 16. an auxiliary electrode layer;

17. a first auxiliary electrode unit; 171. a light guide pillar; 1711. a boss portion; 172. a first auxiliary electrode; 1721. a first stage; 1722. a second stage;

18. a second auxiliary electrode unit; 181. a spacer column; 182. a second auxiliary electrode; 183. an auxiliary conductive post; 1831. a swelling part;

19. a through hole;

20. a display substrate;

21. a drive substrate; 22. a pixel defining layer; 23. a light emitting layer; 24. a top electrode.

Detailed Description

In order to make the technical solutions better understood by those skilled in the art, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only partial embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

It is noted that the terms "comprises" and "comprising," and any variations thereof, in the description and claims of this application and the above-described drawings are intended to cover non-exclusive inclusions, such that a system, product or apparatus that comprises a list of elements is not necessarily limited to those elements explicitly listed, but may include other elements not expressly listed or inherent to such product or apparatus.

In this application, the terms "upper", "lower", "inner", "middle", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings. These terms are used primarily to better describe the present application and its embodiments, and are not used to limit the indicated devices, elements or components to a particular orientation or to be constructed and operated in a particular orientation.

Moreover, some of the above terms may be used to indicate other meanings besides the orientation or positional relationship, for example, the term "on" may also be used to indicate some kind of attachment or connection relationship in some cases. The specific meaning of these terms in this application will be understood by those of ordinary skill in the art as appropriate.

Furthermore, the terms "disposed," "connected," and "secured" are to be construed broadly. For example, "connected" may be a fixed connection, a detachable connection, or a unitary construction; can be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements or components. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.

For the top emission structure, the top electrode as the light emitting surface OLED must have good light transmittance. At present, most of the top-emission transparent electrodes are made of thin metal, ITO, IZO, etc., wherein the metal has poor transmittance, and the metal is used as a large-area electrode after thinning, which is likely to cause resistance increase, and is not favorable for the development of large-size devices. The high-transparency materials such as ITO, IZO and the like have weaker conductivity than metal in a low-temperature manufacturing process, so that in the prior art, the metal is used as an auxiliary electrode and is manufactured in a non-light-emitting area of the back plate by adopting a photoetching method, the overall conductivity of the top electrode is improved, and the resistance is reduced. However, the photolithography technique requires a complex process, involves multiple mask plates and exposure processes, and is not suitable for mass production because of the process characteristics of high temperature, photoresist washing and the like, which can damage the light-emitting layer of the OLED device.

In order to avoid the above problems in the manufacturing process, in the related art, in order to increase the electrode conductivity in the OLED display panel, an auxiliary electrode layer is often formed on the package cover plate. As shown in fig. 1, a schematic structural diagram of a display panel is provided, and the display panel may include an encapsulation cover plate 10 and a display substrate 20, where the encapsulation cover plate 10 and the display substrate 20 are arranged to a box.

The display substrate 20 may include a driving substrate 21, a Pixel Definition Layer (PDL) 22, a light emitting Layer 23, and a top electrode 24. The side of the driving substrate 21 facing the package cover 10 is provided with a pixel defining layer 22, and the pixel defining layer 22 defines a pixel region. A light-emitting layer 23 is disposed on a side of the pixel defining layer 22 facing away from the driving substrate 21, and a top electrode 24 is disposed on a side of the light-emitting layer 23 facing away from the driving substrate 21. The driving substrate 21 may include a bottom electrode (not shown) located at the pixel region, the bottom electrode may be an anode, and the top electrode 24 may be a cathode. The bottom electrode, the light emitting layer 23 and the top electrode 24 positioned at the pixel region may form an OLED device that emits light under the voltage of the bottom electrode and the top electrode 24 to perform display.

The package cover 10 may include a cover 11, a Black matrix 12 (BM) disposed at one side of the cover 11, and a Color Film layer 13 (CF). The black matrix 12 is disposed corresponding to the pixel defining layer 22. The color film layer 13 may include a red color film, a green color film, and a blue color film. One side of the color film layer 13 departing from the cover plate 11 is provided with a flat layer 14, one side of the flat layer 14 departing from the cover plate 11 is provided with an isolation column 15, and the isolation column 15 is arranged corresponding to the black matrix 12. The isolation columns 15 and the side of the flat layer 14 facing away from the cover plate 11 are provided with an auxiliary electrode layer 16, and the auxiliary electrode layer covers the surface of the isolation column 15 and the surface of the flat layer 14 between adjacent isolation columns 15.

In the process of packaging the package cover plate 10 and the display substrate 20, the isolation pillars 15 are pressed against the package adhesive material, so that the auxiliary electrode layer 16 of the package cover plate 10 is in contact with the top electrode 24 of the display substrate 20. The technical solution of manufacturing the auxiliary electrode on the package cover plate 10 shown in fig. 1 is a method for increasing the conductivity of the electrode, but because the auxiliary electrode is mostly made of hard materials such as metal and ITO, when the package cover plate 10 and the display substrate 20 are packaged and pressed, the contact form of the auxiliary electrode layer 16 and the top electrode 24 is represented as a protrusion pressing contact protrusion, and the contact between the two is easy to generate brittle fracture at a large inflection point due to excessive pressure, which causes electrode disconnection or virtual connection, so that the overall resistance value of the device cannot achieve the expected effect. In addition, for the top-emitting OLED device in fig. 1, the improvement of light extraction efficiency is also a factor that must be considered for the device, and since the auxiliary electrode layer 16 is mostly made of a metal material with good conductivity, after the encapsulation and lamination are completed, the light emitted by the OLED is reflected at the auxiliary electrode, the reflected light is reflected again after encountering the metal electrode and is emitted from other peripheral opening regions, and a color mixing phenomenon occurs, which affects the display effect of the product.

Based on this, in order to solve the above technical problem, the present application provides the structure of the cover plate 11 of embodiments 1 to 3, which can be used in an OLED display panel.

Example 1

As shown in fig. 2 to 4, the package cover plate 10 provided in this embodiment includes a cover plate 11, a black matrix 12 and a color film layer 13 formed on the cover plate 11, a flat layer 14 covering the black matrix 12 and the color film layer 13, and a first auxiliary electrode unit 17 disposed on the flat layer 14, where the color film layer 13 includes a red color film, a green color film, and a blue color film, and the black matrix 12 and the color film layer 13 are arranged at intervals. The first auxiliary electrode unit 17 includes a light guide pillar 171 and a first auxiliary electrode 172, the light guide pillar 171 is formed on one side of the flat layer 14 away from the cover plate 11 and corresponds to the position of the color film layer 13, that is, the light guide pillar 171 and the color film layer 13 overlap in an orthographic projection on the cover plate 11, and the light guide pillar 171 is tapered in width in a direction away from the flat layer 14 to form an inclined side wall; the first auxiliary electrode 172 is located in the gap between adjacent light guide posts 171, and has a first segment 1721 formed on the surface of the planarization layer 14 corresponding to the position of the black matrix 12 and a second segment 1722 formed on the inclined sidewall of the light guide post 171, wherein the first segment 1721 overlaps with the orthographic projection of the black matrix 12 on the cover plate 11. In the cross-sectional view of the package cover plate 10, the shape of each first auxiliary electrode 172 is a groove structure, the first section 1721 is a groove bottom of the groove structure, the second sections 1722 at two sides are groove walls of the groove structure, the width of the opening of the groove structure is greater than the width of the groove bottom, and the shape is matched with the shape of the top electrode 24 corresponding to the pixel defining layer 22 on the display substrate 20. Specifically, the top electrode 24 corresponding to the pixel defining layer 22 portion on the display substrate 20 has a convex shape having a top surface parallel to the surface of the pixel defining layer 22 and inclined side surfaces disposed along the inclined side walls of the pixel defining layer 22. In a state where the package cover 10 is assembled with the display substrate 20, the first segment 1721 of the first auxiliary electrode 172 is in contact with the top surface of the top electrode 24, and the second segment 1722 of the first auxiliary electrode 172 is in contact with the side surface of the top electrode 24. The shape of the second segment 1722 of the first auxiliary electrode 172 can be a plane or a cambered surface, and the design and selection can be performed by those skilled in the art according to the principle of matching the shape of the corresponding top electrode 24.

Compared with the traditional contact mode that the top end of the protrusion is pressed and contacted, the scheme of the embodiment has a larger contact surface area, when the package cover plate 10 is pressed with the display substrate 20, the method belongs to a matching form of the protrusion and the groove, and compared with the traditional auxiliary electrode layer 16, the first auxiliary electrode 172 is contacted and conducted with the top electrode 24 corresponding to the pixel defining layer 22 part, so that the phenomenon that the electrode is damaged and cracked due to larger pressing force to affect the conducting effect can be avoided.

In addition, the second segment 1722 where the first auxiliary electrode 172 is obliquely disposed may also assist light reflection, as shown in fig. 4. When the light emitted from the display substrate 20 is emitted to the second segment 1722 of the first auxiliary electrode 172, the reflected light is deflected upward and enters the color film layer 13 due to the specific inclination manner, so as to restrict the light emitting line and reduce the side light leakage of the pixel.

In the package cover 10 of the present embodiment, the light guide posts 171 are a light guide material, which may be manufactured by a photolithography process from an organic material such as acrylic, benzocyclobutene, polyimide, and fluorine resin. When the package cover 10 and the display substrate 20 are in a press-fit state, the light guide posts 171 are located at positions corresponding to pixels of the display substrate 20, that is, the light guide posts 171 are located in spaces between adjacent pixel defining layers 22.

Preferably, as shown in fig. 2 to 4, a plurality of protrusions 1711 facing away from the flat layer 14 are distributed on the surface of the light guide pillar 171 facing away from the cover plate 11, the light guide pillar 171 with the protrusions 1711 is used for collecting the light emitted from the display substrate 20 to the cover plate 11, and the light emitted from the top is more deflected through multiple reflections and refractions by the protrusions 1711 arranged in an array, so that the light extraction efficiency of the device is enhanced. In addition, the protrusion 1711 may also form a fit with the second segment 1722 of the first auxiliary electrode 172 in the above embodiments, and the light deflected by the protrusion 1711 toward the first auxiliary electrode 172 is reflected by the first auxiliary electrode 172 and deflected toward the color film layer 13 to exit the light guide pillar 171, thereby further improving the light extraction efficiency of the device.

The shape of the convex portion 1711 may be spherical, ellipsoidal or conical, and the concrete form of the cone includes but is not limited to a rectangular pyramid, a cone or a triangular pyramid.

In the package cover plate 10 of the present embodiment, the length or width dimension of the bottom of the connection between the light guide pillar 171 and the planarization layer 14 should not be greater than the length or width of the pixel, preferably 30-50 μm; the height of the light guide pillar 171 should be no greater than the box thickness of the device after the cover plate 10 and the display substrate 20 are laminated, and preferably 20-50 μm.

In the package cover plate 10 of the present embodiment, the material of the first auxiliary electrode 172, which is a metal capable of reflecting light, including but not limited to Mg, Ag, Mo, Nd, Al and their alloys, may be formed on the planarization layer 14 at the side surfaces and the gaps of the light guide pillar 171 by physical deposition (PVD), and the thickness of the first auxiliary electrode 172 is preferably 10-300 nm.

In the package cover plate 10 of the present embodiment, a plurality of color film layers 13 may be disposed on the package cover plate 10 at intervals and arranged in an array, and the adjacent color film layers 13 respectively cover the edge area of the black matrix 12, so as to expose the middle area of the black matrix 12. The flat layer 14 covers the middle area of the black matrix 12 and each color film layer 13; the flat layer 14 may be made of a resin material having elasticity, such as phenol-based resin, polypropylene-based resin, polyimide-based resin, acryl-based resin, etc., and the thickness of the flat layer 14 is preferably 1 μm to 2 μm, but is not limited thereto.

This embodiment further provides a manufacturing method of the package cover 10, where the package cover 10 is the package cover 10 described in embodiment 1, and as shown in fig. 5 to 9, the manufacturing method of the package cover 10 may include the following steps 1 to 3.

Step 1, as shown in fig. 5, a black matrix 12 and a color film layer 13 are formed on a cover plate 11.

Specifically, the black matrix 12 and the color film layer 13 may be sequentially formed on the cover plate 11 by exposure, development, or the like. For example, a black matrix 12 film is coated on one side of the cover plate 11, and then the black matrix 12 film is subjected to patterning treatment to form the black matrix 12, wherein the black matrix 12 corresponds to the position of the pixel defining layer 22 in the display substrate 20; a color film layer 13 is formed on one side of the black matrix 12, which is away from the cover plate 11, the color film layer 13 may include a red color film, a green color film, and a blue color film, wherein the red color film is formed on one side of the black matrix 12, which is away from the cover plate 11, and then the red color film is subjected to patterning processing, and a red color film is formed in a corresponding area. The forming process of the green color film and the blue color film is the same as that of the red color film, and is not described herein again.

Step 2, as shown in fig. 6, a flat layer 14 covering the black matrix 12 and the color film layer 13 is formed.

Specifically, the flat layer 14 covering the black matrix 12 and the color film layer 13 may be formed on the cover plate 11 by spin coating or dicing.

And step 3, forming a first auxiliary electrode unit 17 on the planarization layer 14, wherein the first auxiliary electrode unit 17 includes a conductive pillar and a first auxiliary electrode 172. The light guide pillar 171 is formed on the surface of the flat layer 14 and corresponds to the position of the color film layer 13, and the width of the light guide pillar is gradually reduced to form an inclined side wall in the direction away from the flat layer 14; the first auxiliary electrode 172 is located in the gap between adjacent light guide posts 171, and has a first segment 1721 formed on the surface of the planarization layer 14 corresponding to the position of the black matrix 12 and a second segment 1722 formed on the inclined sidewall of the light guide post 171.

First, a film layer shown in fig. 7 is formed on the surface of the planarization layer 14 by spin coating the organic material forming the light guide posts 171, a photoresist is coated on the formed film layer with a constant thickness, the film layer is patterned by photolithography to form the main body of the light guide posts 171 and the gaps formed between the main bodies of the light guide posts 171, the corresponding structure is shown in fig. 8, and then a plurality of protrusions 1711 arranged in an array are formed on the end surface of the main body of the light guide posts 171, and the corresponding structure is shown in fig. 9. The protrusion 1711 may be formed by a photolithography process, but is not limited thereto. When adjusting a heat treatment process to be performed under a photolithography process, the form of the protrusion 1711 may be adjusted by coating a photoresist and patterning the photoresist into a convex shape with the photolithography process, and then performing the heat treatment. In this case, the shape of the boss 1711 may be formed when the heat treatment is not performed at once but performed stepwise in two steps. For example, before the final heat treatment is performed in a temperature range of about 200 ℃ to about 250 ℃, the intermediate heat treatment should be first performed in a temperature range of about 100 ℃ to 130 ℃. In this case, the time for performing the intermediate heat treatment is related to the form of the convex portion 1711. As the time for performing the intermediate heat treatment increases, the final formation form of the convex portion 1711 increases.

The material of the first auxiliary electrode 172 can then be deposited on the surface of the device by PVD (Physical Vapor Deposition) to form the first auxiliary electrode 172 as shown in fig. 9, wherein the first auxiliary electrode 172 covers the sidewalls of the light guide posts 171 and also covers the planarization layer 14 between the adjacent light guide posts 171. The first auxiliary electrode 172 may be made of, but not limited to, magnesium (Mg), silver (Ag), molybdenum (Mo), neodymium (Nd), aluminum (Al), Indium Zinc Oxide (IZO), or Indium Tin Oxide (ITO).

Compared with the traditional contact mode that the top end of the protrusion is in pressing contact with the top end of the protrusion, the first auxiliary electrode unit 17 has a larger contact surface area, and when the package cover plate 10 is pressed against the display substrate 20, the first auxiliary electrode unit is in a protrusion and groove matching mode. In addition, the second section 1722 of the first auxiliary electrode 172 is disposed obliquely to assist light reflection, and when the light emitted from the display substrate 20 is emitted to the second section 1722 of the first auxiliary electrode 172, the light is deflected upward and enters the color film layer 13 due to the specific oblique manner, so as to restrict the light emitting line and reduce the side light leakage of the pixel.

Example 2

As shown in fig. 10 to 12, the package cover plate 10 provided in this embodiment includes a cover plate 11, a black matrix 12 and a color film layer 13 formed on the cover plate 11, a flat layer 14 covering the black matrix 12 and the color film layer 13, and a second auxiliary electrode unit 18, where the color film layer 13 includes a red color film, a green color film, and a blue color film, and the black matrix 12 and the color film layer 13 are arranged at intervals. Wherein the second auxiliary electrode unit 18 includes a spacer pillar 181, a second auxiliary electrode 182, and an auxiliary conductive pillar 183. The spacer columns 181 are made of a photoresist material, penetrate through the flat layer 14 at the positions of the black matrix 12, and have one end connected with the black matrix 12 and the other end extending out of the flat layer 14; the second auxiliary electrode 182 is encapsulated in the black matrix 12; the auxiliary conductive pillar 183 is covered in the spacer pillar 181, and one end thereof is connected to the second auxiliary electrode 182, and the other end thereof is exposed out of an end surface of the spacer pillar 181 facing away from the black matrix 12. The spacer columns 181 are formed on the planarization layer 14 and the positions thereof correspond to the positions of the black matrix 12, and the end of the auxiliary conductive column 183 exposed out of the spacer columns 181 is used for contacting the top electrode 24 on the display substrate 20, so as to electrically connect the second auxiliary electrode 182 and the top electrode 24.

In the above embodiment, on one hand, the spacer columns 181 and the black matrix 12 are made of photoresist material, the second auxiliary electrodes 182 are covered by the black matrix 12, the auxiliary conductive columns 183 are covered by the spacer columns 181, and after the encapsulation and lamination are completed, the light emitted by the OLED is not reflected by the second auxiliary electrodes 182, so as to prevent the light from being emitted from other opening regions around the OLED and causing color mixing; in the second aspect, the second auxiliary electrode 182 and the auxiliary conductive pillar 183 are wrapped inside the black matrix 12 and the spacer pillar 181, which can play a role of physical protection, and can reduce the risk of physical damage to the second auxiliary electrode 182 and the auxiliary conductive pillar 183.

It should be noted that the orthographic projection of the spacer post 181 on the cover plate 11 should be located in the orthographic projection of the black matrix 12 on the cover plate 11, so that the black matrix 12 can completely block the spacer post 181 to avoid the user viewing the spacer post 181 through the color film layer 13. In addition, the orthographic projection of the second auxiliary electrode 182 on the cover plate 11 should be located in the orthographic projection of the black matrix 12 on the cover plate 11, and the orthographic projection of the auxiliary conductive column 183 on the cover plate 11 is located in the orthographic projection of the spacer column 181 on the cover plate 11, so as to meet the purpose that the black matrix 12 can cover the second auxiliary electrode 182, and the spacer column 181 can cover the auxiliary electrode column.

As shown in fig. 10 to 12, the diameter of the spacer posts 181 after protruding out of the flat layer 14 is significantly larger than that of the flat layer 14, so that a portion of the spacer posts 181 can cover the flat surface, increasing the connection strength of the spacer posts 181, and during the pressing process, the pressing force applied to the spacer posts 181 can be transmitted to the flat layer 14 and the black matrix 12 simultaneously, and the pressing force can be dispersed and transferred, so that the device structure is more stable.

In the package cover plate 10 of the present embodiment, the material of the black matrix 12 and the spacer 181 is preferably black photoresist. The height dimension of the spacer columns 181 is preferably 2 to 5 μm, and the diameter is preferably 15 to 20 μm, but is not limited thereto; the thickness of the black rectangle is preferably 1 to 2 μm, and the length or width dimension is preferably 20 μm to 100 μm.

In the package cover plate 10 of the present embodiment, the materials of the second auxiliary electrode 182 and the auxiliary conductive pillar 183 include, but are not limited to, Mg, Ag, Mo, Nd, Al, etc., and the second auxiliary electrode 182 and the auxiliary conductive pillar 183 are formed by physical deposition (PVD). The second auxiliary electrode 182 has a thickness of preferably 10 to 300nm, and forms a grid structure having a width dimension of 50 to 80% of the black matrix 12; the auxiliary conductive pillar 183 preferably has a diameter of 10-15 μm and a height of the second auxiliary electrode 182 to the top of the spacer pillar 181. It is possible to secure a certain area of the second auxiliary electrode 182, ensuring conductivity.

Preferably, as shown in fig. 11, the cross-sectional area of the portion of the auxiliary conductive stud 183 on the side of the planarization layer 14 away from the cover plate 11, which is parallel to the planarization layer 14, is increased to form an expanded portion 1831, and the arrangement of the expanded portion 1831 can enhance the stability of the auxiliary conductive stud 183, so as to prevent the auxiliary conductive stud 183 from being broken during the package bonding.

This embodiment further provides a method for manufacturing a package cover 10, where the package cover 10 is the package cover 10 described in embodiment 2, and as shown in fig. 13 to 16, the method for manufacturing the package cover 10 may include the following steps 1 to 4.

In step 1, as shown in fig. 13, a second auxiliary electrode 182 is formed on the cap plate 11.

Specifically, the second auxiliary electrode 182 is formed at the center of the predetermined position of the black matrix 12 on the cover plate 11, a PVD (Physical Vapor Deposition) method is used to deposit a material of the second auxiliary electrode 182 on the surface of the cover plate 11 to form the second auxiliary electrode 182, and the second auxiliary electrode 182 may be made of, but not limited to, magnesium (Mg), silver (Ag), molybdenum (Mo), neodymium (Nd), aluminum (Al), Indium Zinc Oxide (IZO), or Indium Tin Oxide (ITO).

Step 2, as shown in fig. 14, a black matrix 12 and a color film layer 13 are manufactured.

Specifically, the black matrix 12 and the color film layer 13 may be sequentially formed on the cover plate 11 by exposure, development, or the like. For example, a black matrix 12 film is coated on one side of the cover plate 11, and then the black matrix 12 film is subjected to patterning treatment to form the black matrix 12, wherein the black matrix 12 corresponds to the position of the pixel defining layer 22 in the display substrate 20; a color film layer 13 is formed on one side of the black matrix 12, which is away from the cover plate 11, the color film layer 13 may include a red color film, a green color film, and a blue color film, wherein the red color film is formed on one side of the black matrix 12, which is away from the cover plate 11, and then the red color film is subjected to patterning processing, and a red color film is formed in a corresponding area. The forming process of the green color film and the blue color film is the same as that of the red color film, and is not described herein again.

Step 3, as shown in fig. 15 and 16, a flat layer 14 is formed to cover the black matrix 12 and the color film layer 13.

Specifically, the flat layer 14 covering the black matrix 12 and the color film layer 13 may be formed on the cover plate 11 by spin coating; then, a through hole 19 as shown in fig. 16 is formed in the planarization layer 14 and the black matrix 12 by etching at a predetermined position corresponding to the spacer pillar 181, the through hole 19 penetrating from the surface of the planarization layer 14 to the surface of the second auxiliary electrode 182.

Step 4, as shown in fig. 16, auxiliary conductive pillars 183 and spacer pillars 181 are formed.

Specifically, the auxiliary conductive pillar 183 is formed in the center of the through hole 19, and a material of the auxiliary conductive pillar 183 may be deposited on the surface of the second auxiliary electrode 182 by PVD (Physical Vapor Deposition) to form the auxiliary conductive pillar 183, where the auxiliary conductive pillar 183 may be made of, but not limited to, magnesium (Mg), silver (Ag), molybdenum (Mo), neodymium (Nd), aluminum (Al), Indium Zinc Oxide (IZO), or Indium Tin Oxide (ITO). The organic material forming the spacer posts 181 is formed into a film layer on the surface of the planarization layer 14 and in the through holes 19 by spin coating, and then the film layer is patterned to form the spacer posts 181.

The package cover plate 10, the spacer columns 181 and the black matrix 12 manufactured by the above-mentioned manufacturing method of the embodiment are made of photoresist materials, the second auxiliary electrode 182 is covered by the black matrix 12, the auxiliary conductive columns 183 are covered by the spacer columns 181, and after the package and the lamination are completed, light emitted by the OLED is not reflected by the second auxiliary electrode 182, so that light can be prevented from being emitted from other opening areas around the package and color mixing can be avoided. The second auxiliary electrode 182 and the auxiliary conductive column 183 are covered inside the black matrix 12 and the spacer columns 181, which can also play a role of physical protection, and can reduce the risk of physical damage to the second auxiliary electrode 182 and the auxiliary conductive column 183.

Example 3

As shown in fig. 17, the package cover 10 provided in this embodiment includes a plurality of auxiliary electrode units, and each of the auxiliary electrode units may be arranged in an array, where the auxiliary electrode unit includes both the first auxiliary electrode unit 17 in embodiment 1 and the second auxiliary electrode unit 18 in embodiment 2. Namely, the first auxiliary electrode unit 17 includes a light guide pillar 171 and a first auxiliary electrode 172, the light guide pillar 171 is formed on the surface of the flat layer 14 and corresponds to the position of the color film layer 13, and the width of the light guide pillar 171 is gradually reduced in the direction away from the flat layer 14 to form an inclined side wall; the first auxiliary electrode 172 is located in the gap between adjacent light guide posts 171, and has a first segment 1721 formed on the surface of the planarization layer 14 corresponding to the position of the black matrix 12 and a second segment 1722 formed on the inclined sidewall of the light guide post 171. The second auxiliary electrode unit 18 includes a spacer pillar 181, a second auxiliary electrode 182, and an auxiliary conductive pillar 183. The spacer columns 181 are made of a photoresist material, penetrate through the flat layer 14 at the positions of the black matrix 12, and have one end connected with the black matrix 12 and the other end extending out of the flat layer 14; the second auxiliary electrode 182 is encapsulated in the black matrix 12; the auxiliary conductive pillar 183 is covered in the spacer pillar 181, and one end thereof is connected to the second auxiliary electrode 182, and the other end thereof is exposed out of an end surface of the spacer pillar 181 facing away from the black matrix 12.

Since the height of the second auxiliary electrode unit 18 is larger than that of the first auxiliary electrode unit 17 due to the existence of the spacer columns 181, in practice, the edge of the display panel formed by laminating the package panel and the display substrate 20 will be tilted due to the existing lamination process, resulting in a thickness of the middle of the display panel being smaller than that of the edge, and the larger the size of the display panel, the more the problem is. In view of this, the first auxiliary electrode units 17 are distributed in the middle region of the cover plate 10, and the second auxiliary electrode 182 is structurally distributed in the edge region of the cover plate 10, so as to adapt to the structural characteristics of thin middle and thick edge of the display panel.

The first auxiliary electrode unit 17 in this embodiment refers to the description related to embodiment 1, and the second auxiliary electrode unit 18 refers to the description related to embodiment 2, and the description thereof is omitted here. It should be understood that the package panel of the present embodiment should also have the technical effects of embodiments 1 and 2. In a specific preparation stage, the first auxiliary electrode unit 17 and the second auxiliary electrode unit 18 of the package cover plate region may be formed synchronously, or may be formed in a staged preparation manner, and may be adjusted and changed according to actual production design requirements.

The embodiment of the invention also provides a display panel and a display device, wherein the display panel adopts the packaging cover plate 10 provided by the embodiment of the invention.

Display panel as shown in fig. 3 and 12, the display panel includes a display substrate 20 and a package cover 10. The display substrate 20 includes a driving substrate, a pixel defining layer 22 formed on the driving substrate, a light emitting layer 23 formed on the pixel defining layer 22, and a top electrode 24 formed on the light emitting layer 23; the package cover 10 is the package cover 10 of any of embodiments 1-3. The first auxiliary electrode 172 and the second auxiliary electrode 182 on the package cover 10 are both opposite to the location where the pixel defining layer 22 is located and are in contact with the top electrode 24.

The display device provided by the embodiment of the application can be as follows: any product or component with a display function, such as a liquid crystal panel, electronic paper, an Organic Light Emitting Diode (OLED) panel, an Active Matrix Organic Light Emitting Diode (AMOLED) panel, a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, or a navigator. Since the display device disclosed in the embodiment of the present application includes the package cover 10 provided in the above embodiment, the display panel and the display device having the package cover 10 also have all the above technical effects, and details are not repeated herein. Other configurations, principles, and methods of making display panels and display devices will be known to those of ordinary skill in the art and will not be described in detail herein.

Some embodiments in this specification are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.

The foregoing are merely exemplary embodiments of the present invention, which enable those skilled in the art to understand or practice the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.