阅读说明：本技术 远近光一体的照明灯 (Far and near light integrated lighting lamp ) 是由 龙涛 黄帆 邹诚 孙振国 于 2019-10-23 设计创作，主要内容包括：本发明公开了一种远近光一体的照明灯,包括近光模组、远光模组和透镜,所述近光模组包括近光LED光源和与所述近光LED光源对应的近光反光杯,所述远光模组包括远光LED光源和与所述远光LED光源对应的远光反光杯,所述远光LED光源包括多个LED芯片以及依次设于所述多个LED芯片上方的荧光粉层和匀光层。通过将多个LED芯片形成一个整体,并在其上方依次设置荧光粉层和匀光层,LED芯片发出的光线入射到荧光粉层上,经过荧光粉层转换形成白色光线,该白色光线经匀光层进行匀光后出射形成远光光斑,避免因相邻LED芯片之间有缝隙而导致远光光斑不均匀,提高了照明效果。(The invention discloses a high-beam and low-beam integrated illuminating lamp which comprises a low-beam module, a high-beam module and a lens, wherein the low-beam module comprises a low-beam LED light source and a low-beam light reflecting cup corresponding to the low-beam LED light source, the high-beam module comprises a high-beam LED light source and a high-beam light reflecting cup corresponding to the high-beam LED light source, and the high-beam LED light source comprises a plurality of LED chips, a fluorescent powder layer and a light homogenizing layer which are sequentially arranged above the LED chips. The LED lamp holder has the advantages that the LED chips form a whole, the fluorescent powder layer and the light homogenizing layer are sequentially arranged above the LED chips, light emitted by the LED chips is incident on the fluorescent powder layer and converted into white light through the fluorescent powder layer, the white light is emitted after being homogenized through the light homogenizing layer to form a far light spot, the phenomenon that the far light spot is uneven due to the fact that gaps exist between the adjacent LED chips is avoided, and the lighting effect is improved.)

1. The utility model provides an integrative light of distance light, includes passing light module, distance light module and lens, its characterized in that, the passing light module include passing light LED light source and with the anti-light cup of passing light that the passing light LED light source corresponds, the distance light module include the distance light LED light source and with the anti-light cup of distance light that the distance light LED light source corresponds, the distance light LED light source includes a plurality of LED chips and locates in proper order the fluorescent powder layer and the even photosphere of a plurality of LED chip tops.

2. The high and low beam integrated illuminating lamp according to claim 1, wherein the light homogenizing layer is a glass sheet.

3. The high-beam and low-beam integrated illuminating lamp as claimed in claim 2, wherein the glass sheet is made of quartz or sapphire material.

4. The far and near light integrated illuminating lamp according to claim 1, wherein the surface of the light homogenizing layer on the side far from the fluorescent powder layer is coated with an antireflection film.

5. The high-beam and low-beam integrated illuminating lamp as claimed in claim 1, wherein the surface of the light homogenizing layer on the side close to the fluorescent powder layer is roughened.

6. The high-beam and low-beam integrated illuminating lamp as claimed in claim 1, wherein a white diffuse reflection layer is wrapped around the high-beam LED light source.

7. The high-beam and low-beam integrated illuminating lamp as claimed in claim 6, wherein the white diffuse reflection layer is white wall glue.

8. The high-beam and low-beam integrated illuminating lamp according to claim 1, wherein the high-beam LED light source is processed by the following steps: eutectic welding a plurality of LED chips into a whole, spraying a fluorescent powder layer on the upper surface of the LED chips, and then placing a light homogenizing layer above the fluorescent powder layer for curing.

9. The high-beam and low-beam integrated illuminating lamp according to claim 1, wherein the high-beam LED light source is processed by the following steps: eutectic welding a plurality of LED chips into a whole, spraying the fluorescent powder layer on the light homogenizing layer, bonding one side of the sprayed fluorescent powder layer to the upper surface of the whole formed by the plurality of LED chips, and curing.

10. The high-beam and low-beam integrated illuminating lamp according to any one of claims 8 or 9, further comprising a white diffuse reflection layer wrapped around the high-beam LED light source.

Technical Field

The invention relates to the technical field of illumination, in particular to a high-beam and low-beam integrated illuminating lamp.

Background

With the development of semiconductor technology, LED (Light Emitting Diode) Light sources have the advantages of high efficiency, energy saving, environmental protection, low cost, long service life, etc., and are gradually replacing traditional incandescent lamps and energy saving lamps, becoming a general illumination Light source.

The existing LED high-low beam integrated automobile headlamp structure is shown in fig. 1 and comprises a low-beam LED light source module 1, a high-beam LED light source module 2 and a lens 4. The light source of passing light LED light source module 1 and distance light LED light source module 2 all includes a plurality of LED chips, and has the gap between two adjacent LED chips, is about 0.1mm, however because distance light illumination light is more concentrated, the gap between the LED chip can lead to the homogeneity of distance light facula not good.

Disclosure of Invention

Aiming at the problems in the prior art, the invention provides a high-beam and low-beam integrated illuminating lamp which can effectively improve the uniformity of high-beam light spots.

In order to solve the technical problems, the technical scheme of the invention is as follows: the utility model provides an integrative light of distance light, includes short-distance beam module, distance light module and lens, the short-distance beam module include short-distance beam LED light source and with the short-distance beam reflection of light cup that short-distance beam LED light source corresponds, the distance light module include the distance light LED light source and with the reflection of light cup of distance light that the distance light LED light source corresponds, the distance light LED light source includes a plurality of LED chips and locates in proper order the phosphor powder layer and the even photosphere of a plurality of LED chip tops.

Further, the light homogenizing layer is a glass sheet.

Further, the glass sheet is made of quartz or sapphire materials.

Furthermore, an antireflection film is plated on the surface of the side, away from the fluorescent powder layer, of the light homogenizing layer.

Further, the surface of one side, close to the fluorescent powder layer, of the light uniformizing layer is roughened.

Further, a white diffuse reflection layer is wrapped around the high-beam LED light source.

Further, the white diffuse reflection layer is white wall glue.

Further, the processing steps of the high beam LED light source are: eutectic welding a plurality of LED chips into a whole, spraying a fluorescent powder layer on the upper surface of the LED chips, and then placing a light homogenizing layer above the fluorescent powder layer for curing.

Further, the processing steps of the high beam LED light source are: eutectic welding a plurality of LED chips into a whole, spraying the fluorescent powder layer on the light homogenizing layer, bonding one side of the sprayed fluorescent powder layer to the upper surface of the whole formed by the plurality of LED chips, and curing.

Further, the method also comprises the step of finally wrapping a white diffuse reflection layer on the periphery of the high-beam LED light source.

The invention provides a high-beam and low-beam integrated illuminating lamp which comprises a low-beam module, a high-beam module and a lens, wherein the low-beam module comprises a low-beam LED light source and a low-beam light reflecting cup corresponding to the low-beam LED light source, the high-beam module comprises a high-beam LED light source and a high-beam light reflecting cup corresponding to the high-beam LED light source, and the high-beam LED light source comprises a plurality of LED chips, and a fluorescent powder layer and a light homogenizing layer which are sequentially arranged above the LED chips. The LED lamp holder has the advantages that the LED chips form a whole, the fluorescent powder layer and the light homogenizing layer are sequentially arranged above the LED chips, light emitted by the LED chips is incident on the fluorescent powder layer and converted into white light through the fluorescent powder layer, the white light is emitted after being homogenized through the light homogenizing layer to form a far light spot, the phenomenon that the far light spot is uneven due to the fact that gaps exist between the adjacent LED chips is avoided, and the lighting effect is improved.

Drawings

FIG. 1 is a schematic structural diagram of an LED high-low beam integrated automobile headlamp in the prior art;

FIG. 2 is a schematic structural diagram of an embodiment of a high-beam and low-beam integrated illumination lamp according to the present invention;

fig. 3 is a schematic structural diagram of an embodiment of the high beam LED light source of the present invention.

Shown in FIG. 1: 1. a dipped beam LED light source module; 2. a high beam LED light source module; 4. a lens.

Shown in FIGS. 2-3: 10. a short-distance light module; 110. a low beam LED light source; 120. a near-light reflecting cup; 20. a high beam module; 210. a high beam LED light source; 211. an LED chip; 212. a phosphor layer; 213. a light homogenizing layer; 220. a high beam reflector cup; 30. a lens; 40. a white diffuse reflective layer.

Detailed Description

The invention is described in detail below with reference to the attached drawing figures:

as shown in fig. 2-3, the present invention provides a high beam and low beam integrated lighting lamp, which includes a low beam module 10, a high beam module 20 and a lens 30, wherein the low beam module 10 includes a low beam LED light source 110 and a low beam reflector 120 corresponding to the low beam LED light source 110, the high beam module 20 includes a high beam LED light source 210 and a high beam reflector 220 corresponding to the high beam LED light source 210, and the high beam LED light source 210 includes a plurality of LED chips 211, and a phosphor layer 212 and a light homogenizing layer 213 sequentially disposed above the plurality of LED chips 211. Specifically, a plurality of LED chips 211 form a whole, and phosphor layer 212 is a holistic phosphor powder piece, covers a plurality of LED chips 211 top, and the light that LED chips 211 sent incides phosphor layer 212 on, forms white light through phosphor layer 212 conversion, and this white light goes out after even light is carried out to even light layer 213 and forms the distance light facula, avoids having the gap because of having between the adjacent LED chips 211 and leads to the distance light facula inhomogeneous, has improved illuminating effect.

Preferably, eutectic soldering is adopted between the plurality of LED chips 211, so as to form a whole, and a gap between two adjacent LED chips 211 is about 0.1 mm.

Preferably, the leveling layer 213 is a glass plate. Specifically, the length and width of the glass sheet are consistent with those of the LED chip 211, and the thickness of the glass sheet is 0.1-0.3 mm. Preferably, the glass sheet is made of quartz or sapphire material, so that the heat generated by the phosphor layer 212 can be led out downwards while the light is uniformized, and the heat dissipation efficiency is improved. Preferably, an antireflection film is plated on the surface of the light uniformizing layer 213 away from the phosphor layer 212, so as to improve the light extraction rate and the illumination brightness.

Preferably, the surface of the light uniformizing layer 213 close to the phosphor layer 212 is roughened, and the roughened surface can diffuse the light excited by the phosphor layer 212, so as to achieve the effect of light uniformization.

Preferably, the white diffuse reflection layer 40 is wrapped around the far-light LED light source 210, as shown in fig. 3, the white diffuse reflection layer 40 may be white wall glue formed by mixing silica gel and white oxide particles, and is wrapped around the phosphor layer 212, so as to reflect light emitted from the side surface of the phosphor layer 212 back to the phosphor layer 212, thereby improving the light emitting probability from the front surface of the phosphor layer 212 and improving the brightness of the light emitting surface of the far-light LED light source 210.

Preferably, there are two methods for processing the high beam LED light source 210.

The first processing method comprises the following steps: the LED light source is characterized in that a plurality of LED chips 211 are eutectic-welded into a whole, then a fluorescent powder layer 212 is sprayed on the upper surface of the LED chips, and then a light homogenizing layer 213 is placed above the fluorescent powder layer 212 for solidification, wherein the light homogenizing layer 213 is a glass sheet, can be made of quartz materials or sapphire materials, and can also be made of other transparent materials. Of course, the side of the dodging layer 213 close to the phosphor layer 212 may also be roughened before the dodging layer 213 is placed over the phosphor layer 212.

The other processing method of the high beam LED light source comprises the following steps: eutectic soldering of the LED chips 211 into a whole is firstly carried out, then the fluorescent powder layer 212 is sprayed on the light homogenizing layer 213, and then one side of the sprayed fluorescent powder layer 212 is bonded to the upper surface of the whole formed by the LED chips 211 for curing. Of course, the sprayed surface of the dodging layer 213 may be roughened before the phosphor layer 212 is sprayed.

Finally, a white diffuse reflection layer is required to be wrapped on the periphery of the high-beam LED light source 210 formed by the LED chip 211, the fluorescent powder layer 212 and the light homogenizing layer 213, in this embodiment, the white diffuse reflection layer 40 is white wall glue formed by mixing silica gel and white oxide particles, and is wrapped around the fluorescent powder layer 212, so that light emitted from the side surface of the fluorescent powder layer 212 can be reflected back to the fluorescent powder layer 212, and further, the light emitting probability from the front surface of the fluorescent powder layer 212 is improved, and the brightness of the light emitting surface of the high-beam LED light source 210 is improved.

In summary, the high beam and low beam integrated lighting lamp provided by the present invention includes a low beam module 10, a high beam module 20 and a lens 30, wherein the low beam module 10 includes a low beam LED light source 110 and a low beam reflector 120 corresponding to the low beam LED light source 110, the high beam module 20 includes a high beam LED light source 210 and a high beam reflector 220 corresponding to the high beam LED light source 210, and the high beam LED light source 210 includes a plurality of LED chips 211, and a phosphor layer 212 and a light uniformizing layer 213 sequentially disposed above the plurality of LED chips 211. The LED chips 211 are integrated, the fluorescent powder layer 212 and the dodging layer 213 are sequentially arranged above the LED chips 211, light rays emitted by the LED chips 211 are incident on the fluorescent powder layer 212 and are converted into white light rays through the fluorescent powder layer 212, the white light rays are emitted after being dodged through the dodging layer 213 to form far light spots, the fact that the far light spots are uneven due to gaps among the adjacent LED chips 211 is avoided, and the lighting effect is improved.

Although the embodiments of the present invention have been described in the specification, these embodiments are merely provided as a hint, and should not limit the scope of the present invention. Various omissions, substitutions, and changes may be made without departing from the spirit of the invention and are intended to be within the scope of the invention.