Gold plating suspension device with impact buffering structure
阅读说明:本技术 具备冲击缓冲结构的镀金用悬挂装置 (Gold plating suspension device with impact buffering structure ) 是由 裴民守 于 2017-10-13 设计创作,主要内容包括:本发明涉及一种具备冲击缓冲结构的镀金用悬挂装置,具体涉及一种均速移送吊挂件,减少移送过程中产生的噪音和冲击,从而在基板上形成均匀镀金层的具备冲击缓冲结构的镀金用悬挂装置。根据本发明的具备冲击缓冲结构的镀金用悬挂装置利用来自镀金用悬挂装置和夹具的重量施压弹性弹簧,弹性弹簧依次施压连接轴,连接轴施压移送机架,从而增强移送机架和驱动齿轮之间的贴紧力,以均速移送,并减少通过弹性弹簧移送的过程中产生的噪音和冲击。(The present invention relates to a suspension device for gold plating having an impact buffering structure, and more particularly, to a suspension device for gold plating having an impact buffering structure, which transfers a suspension member at a uniform speed, reduces noise and impact generated during the transfer, and forms a uniform gold plating layer on a substrate. According to the gold plating suspension device with the impact buffering structure, the weight from the gold plating suspension device and the clamp is utilized to press the elastic spring, the elastic spring sequentially presses the connecting shaft, and the connecting shaft presses the transferring rack, so that the adhesion force between the transferring rack and the driving gear is enhanced, the transferring is carried at uniform speed, and the noise and the impact generated in the transferring process through the elastic spring are reduced.)
1. A gold plating suspension device having an impact buffering structure, characterized in that:
the water tank is moved by a transfer device, the transfer device consists of a guide platform and a guide rail frame, and the guide platform is provided with a guide wall arranged outside the water tank; the suspension device, which is provided on the guide table and has a drive gear on the guide table, and moves and fixes a jig on which a substrate immersed in the water tank is fixed, includes:
a transfer frame having a rack portion at a bottom surface thereof so as to be guided by a plurality of driving gears provided at an upper surface of the guide frame to move, a plurality of locking holes formed at the upper surface, and a lifting long hole formed at a side surface thereof so as to communicate with the locking holes;
a fixed block which is clamped into the lifting long hole in a lifting manner, and one end of the fixed block is provided with a connecting shaft provided with a supporting bush;
an elastic spring which is clamped into the locking hole and presses the connecting shaft;
a terminal panel locked to an upper side of the fixing block to pressurize the elastic spring;
a base plate on which the fixing block is fixed, and a bottom surface of which is provided with a plurality of upper rollers so as to guide to a side surface of the guide wall;
a support part composed of a fixing plate formed on one side of the substrate and a support plate formed on the lower part of the fixing plate;
a connecting plate formed on a guide plate disposed below the support plate and a side surface of the guide plate to fix the jig;
and a guide part composed of a lower roller formed on the guide plate and guided to the side of the guide platform.
2. The gold plating suspension device having an impact absorbing structure according to claim 1, characterized in that: one end of the terminal panel presses the elastic spring between the terminal panel and the upper surface of the transfer frame, and is disposed at the upper portion of the transfer frame to form an elastic space.
3. The gold plating suspension device having an impact absorbing structure according to claim 1, characterized in that: the connecting shaft is further clamped into the buffering elastic tube, a plurality of combining grooves are formed outside the buffering elastic tube, and the ball bearings are further locked by the combining grooves.
4. The gold plating suspension device having an impact absorbing structure according to claim 1, characterized in that: the upper surface of the terminal panel of the transfer frame is further provided with a vibration part.
5. The gold plating suspension device having an impact absorbing structure according to claim 1, characterized in that: one end of the lifting long hole is further provided with a hook long groove so as to be convenient for hooking the supporting lining, and a plurality of lifting rollers are further formed on the friction surface of the hook long groove so as to prevent the supporting lining from being rubbed in the lifting process.
Technical Field
The present invention relates to a gold plating suspension device having an impact buffering structure, and more particularly, to a gold plating suspension device having an impact buffering structure, which transfers a hanger at a uniform speed, reduces noise and impact generated during transfer, and forms a uniform gold plating layer on a substrate.
Background
In general, the manufacture of printed circuit boards is an aggregate of numerous processes, the steps of which are also extremely complex. The gold plating process, i.e., the metallization process, plays a central role in providing current and voltage to electrical components. Further, recently, printed circuit boards have been on the trend of being light, thin, short, and small, and the sizes of via holes for accessing metal wires and electronic components have been gradually reduced, which requires that gold plating be performed more uniformly. In the gold plating process of the printed wiring board, a method of forming a grain layer by electroless gold plating and then forming a metal layer by electrolytic gold plating is generally used for forming a circuit or a gold plating via. In order to implement the above fixing process, a technique for transferring a printed circuit board is disclosed, such as Korean registration No. 10-2001-.
As described above, when gold plating is performed on a printed circuit board, the hanger is moved along the guide rail by the driving device, the hanger is provided with the jig to which the printed circuit board is fixed, and the hanger and the printed circuit board are simultaneously moved by the driving of the driving device in a state where the printed circuit board is immersed in the water tank filled with the gold plating solution to form a uniform gold plating layer.
However, the conventional printed circuit board transfer structure has disadvantages in that: the hanger and the guide rail are coupled by the rack to move, and in the moving process, vibration or shaking is generated by meshing between the gears, the vibration is transmitted to the hanger, and parts of the hanger are loosened, so that the maintenance is required to be repeated. Also, the following serious drawbacks often occur: the vibration is transmitted to the jig combined with the hanger and the printed circuit board, causing the printed circuit board to be separated from the jig or the gold plating to be unevenly formed.
The above-described invention is a background art to which the present invention pertains, and does not mean a conventional art.
Disclosure of Invention
Technical problem
In order to solve the above-described problems, the present invention provides a gold plating suspension device having an impact buffering structure, characterized in that: the weight from gold plating suspension device and clamp presses the elastic spring, the elastic spring presses the connecting shaft in turn, the connecting shaft presses the transfer frame, thereby enhancing the adhesion force between the transfer frame and the driving gear, transferring at uniform speed, and reducing the noise and impact generated in the process of transferring through the elastic spring.
Technical scheme
The invention is characterized in that: the water tank is moved by a transfer device, the transfer device consists of a guide platform and a guide rail frame, and the guide platform is provided with a guide wall arranged outside the water tank; the suspension device, which is provided on the guide table and has a drive gear on the guide table, and moves and fixes a jig on which a substrate immersed in the water tank is fixed, includes: a transfer frame having a rack portion at a bottom surface thereof so as to be guided by a plurality of driving gears provided at an upper surface of the guide frame to move, a plurality of locking holes formed at the upper surface, and a lifting long hole formed at a side surface thereof so as to communicate with the locking holes; a fixed block which is clamped into the lifting long hole in a lifting manner, and one end of the fixed block is provided with a connecting shaft provided with a supporting bush; an elastic spring which is clamped into the locking hole and presses the connecting shaft; a terminal panel locked to an upper side of the fixing block to pressurize the elastic spring; a base plate on which the fixing block is fixed, and a bottom surface of which is provided with a plurality of upper rollers for guiding to the side surface of the guide wall; a support part composed of a fixing plate formed on one side of the substrate and a support plate formed on the lower part of the fixing plate; a connecting plate formed on a guide plate disposed below the support plate and a side surface of the guide plate to fix the jig; and a guide part composed of a lower roller formed on the guide plate and guided to the side of the guide platform.
And an elastic space is formed between the end panel and the upper surface of the transfer frame, and one end of the elastic space end panel presses the elastic spring and is disposed at the upper part of the transfer frame.
And, the connecting axle further clip buffering elasticity pipe, the outside of buffering elasticity pipe forms a plurality of combination groove, combination groove further locks ball bearing.
The upper surface of the end panel of the transfer frame is further provided with a vibration part.
And one end of the lifting long hole is further provided with a hook long groove so as to be convenient for hooking the supporting bush, and a plurality of lifting rollers are further formed on the friction surface of the hook long groove so as to avoid friction generated in the process of lifting the supporting bush.
Advantageous effects
The invention relates to a gold plating suspension device with an impact buffer structure, which utilizes the weight from the gold plating suspension device and a clamp to press an elastic spring, the elastic spring sequentially presses a connecting shaft, and the connecting shaft presses a transfer rack, thereby enhancing the adhesion force between the transfer rack and a driving gear, transferring at uniform speed and reducing the noise and impact generated in the process of transferring through the elastic spring.
Drawings
Fig. 1 is a schematic structural view of a suspension for gold plating having an impact buffering structure according to the present invention.
Fig. 2 shows a state where the transfer frame is removed in the suspension for gold plating having an impact buffering structure according to the present invention.
Fig. 3 is a side view of a gold plating suspension device having an impact buffering structure according to the present invention.
Fig. 4 is a cross-sectional view of a gold plating suspension device having an impact buffering structure according to the present invention.
Fig. 5 shows an activated state of the suspension for gold plating provided with the shock-absorbing structure according to the present invention.
Fig. 6 shows a mounted state of a suspension for gold plating provided with an impact buffering structure according to the present invention.
Fig. 7 shows another embodiment of a suspension for gold plating provided with an impact buffering structure according to the present invention.
Fig. 8 shows yet another embodiment of a gold plating suspension device provided with an impact buffering structure according to the present invention.
Fig. 9 shows yet another embodiment of a gold plating suspension device provided with an impact buffering structure according to the present invention.
Fig. 10 shows yet another embodiment of a gold plating suspension device provided with an impact buffering structure according to the present invention.
Detailed Description
Hereinafter, a suspension for gold plating having an impact buffering structure according to the present invention will be described in detail with reference to the accompanying drawings and preferred embodiments. In this process, the thickness of the line body or the size of the member shown in the drawings, etc. is shown in an enlarged scale for the sake of clarity and convenience in explaining the present invention. Also, the following terms are terms defined in consideration of functions of the present invention, which are according to the purpose or convention of users, operators, or are different. Therefore, the terms are to be defined according to the entire contents of the present specification.
The scope of the present invention is not limited to the following examples, which are intended to provide examples only, and various embodiments achieved by the technical idea can be provided.
As shown in the drawings, a suspension device for gold plating 10 having an impact buffering structure according to the present invention (hereinafter, referred to as a "suspension device for gold plating" for convenience) provides a suspension device to be moved by a transfer device composed of a
The
The
The
The
At this time, as shown in fig. 4, a
Wherein, preferably, the hooking
The
The
As shown in fig. 1, the
The
The
The protruding panel supports the
The
The
As shown in fig. 6, the
The
The jig 400 is composed of a frame or a frame having a plurality of chucks, and moves in a state where the chucks are fixed with the printed circuit board, and the jig 400 or the printed circuit board fixed to the jig 400 is immersed in the
At this time, one end of the
Preferably, guide protrusions are formed on both sides of the
The guide rail groove is further locked with a U-shaped elastic buffering hose so as to be buffered when collision occurs with the guide rail protrusion, and optimally, the inner side surface of the elastic buffering hose is further locked with a ball bearing so as to reduce friction between the elastic buffering hose and the guide rail protrusion.
Hereinafter, the
At this time, as the weight of the
Further, when the
A magnetic strip may be further inserted into the
As shown in fig. 7, the
That is, in order to prevent the connecting
As shown in fig. 8, the vibrating portion 24 is further screwed or welded to the upper surface of the
The vibration part 24 is a vibrator, and the vibration of the vibration part 24 is transmitted to the jig 400 and the printed circuit board, and is transmitted to the
As shown in fig. 9, a hooking
As shown in fig. 10, a uniform
That is, when the
The gold
As described above, one embodiment of the present invention is merely an example, and it will be understood by those skilled in the art of the present invention that various modifications may be made and other embodiments equivalent thereto may be derived.
[ possibility of Industrial application ]
The present invention is applicable to a suspension for gold plating for plating gold on a substrate, and is industrially applicable.
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