阅读说明：本技术 一种微电子组装助焊剂及其制备方法 (microelectronic assembly soldering flux and preparation method thereof ) 是由 詹建朝 于 2018-10-25 设计创作，主要内容包括：本发明提供了一种微电子组装助焊剂及其制备方法,包括以下重量份组分制备而成：成膜剂11-15份、活化剂14-18份、十六烷基三甲基溴化铵8-12份、缓蚀剂7-14份、硼酸0.8-1.6份、烷基苯甲酸1-2份、甲基二乙醇胺9-14份、醋酸乙酯16-24份、乙二醇醋酸酯14-20份、乙二醇21-27份、琥珀酸二甲酯18-26份。本发明制备得到的微电子组装助焊剂综合性能优良,可以满足工业应用需求。(The invention provides microelectronic assembly soldering flux and a preparation method thereof, wherein the soldering flux is prepared from the following components, by weight, 11-15 parts of a film-forming agent, 14-18 parts of an activating agent, 8-12 parts of cetyl trimethyl ammonium bromide, 7-14 parts of a corrosion inhibitor, 0.8-1.6 parts of boric acid, 1-2 parts of alkylbenzoic acid, 9-14 parts of methyldiethanolamine, 16-24 parts of ethyl acetate, 14-20 parts of ethylene glycol acetate, 21-27 parts of ethylene glycol and 18-26 parts of dimethyl succinate.)

1, kinds of microelectronic assembly soldering flux, which is characterized by comprising the following components in parts by weight:

11-15 parts of film-forming agent,

14-18 parts of activating agent,

8-12 parts of hexadecyl trimethyl ammonium bromide,

7-14 parts of corrosion inhibitor,

0.8 to 1.6 portions of boric acid,

1-2 parts of alkyl benzoic acid,

9-14 parts of methyldiethanolamine,

16-24 parts of ethyl acetate,

14-20 parts of glycol acetate,

21-27 parts of ethylene glycol,

18-26 parts of dimethyl succinate.

2. The microelectronic assembly flux according to claim 1, wherein the film-forming agent is a mixture of polyvinyl acetate emulsion, styrene-acrylic emulsion, and hydroxyl acrylic emulsion at a weight ratio of 2:1: 2.

3. The microelectronic assembly flux according to claim 1, wherein the activator is a mixture of succinic acid, DL-malic acid, bromosuccinate, and sebacic acid at a weight ratio of 1:3:1: 2.

4. The microelectronic assembly flux according to claim 1, wherein the corrosion inhibitor is prepared by the following preparation method:

adding 34 parts of diethylaminoethanol into a stirrer, adding 100 parts of deionized water, adding 4 parts of coconut oil fatty acid diethanolamide and 5 parts of hexadecyl trimethyl ammonium bromide, uniformly stirring, adding 7 parts of sodium molybdate, 4 parts of diethylenetriamine and 9 parts of sodium tripolyphosphate, and uniformly mixing to obtain the corrosion inhibitor.

5, A method for preparing a microelectronic assembly flux, which is characterized by comprising the following steps:

(1) adding 11-15 parts of film forming agent into a reactor, then adding 16-24 parts of ethyl acetate, 14-20 parts of glycol acetate, 21-27 parts of ethylene glycol and 18-26 parts of dimethyl succinate, heating to 60 ℃, stirring for 8min, then adding 8-12 parts of cetyl trimethyl ammonium bromide and 14-18 parts of activating agent, and stirring for 15 min;

(2) and reducing the temperature to 50 ℃, continuously adding 7-14 parts of corrosion inhibitor, 0.8-1.6 parts of boric acid, 1-2 parts of alkyl benzoic acid and 9-14 parts of methyldiethanolamine, stirring for 30min, and cooling to room temperature to obtain the microelectronic assembly soldering flux.

Technical Field

The invention relates to the field of soldering flux, in particular to microelectronic assembly soldering flux and a preparation method thereof.

Background

The flux has an important position in connection materials in the electronic industry, can effectively remove oxides on the surface of a welded material, and can guide solder to disperse to the periphery to play a good soldering assisting role, the flux developed at home at present has defects in technology, and cannot achieve the higher quality of foreign flux, for example, components in the flux have definite corrosion action on circuits on the surface of a printed circuit board, the service life of the circuit board is shortened, the too high surface tension of the flux and the like can cause the poorer comprehensive performance of the flux.

Disclosure of Invention

The technical problem to be solved is as follows:

the invention aims to provide microelectronic assembly soldering flux and a preparation method thereof, and the prepared microelectronic assembly soldering flux has excellent comprehensive performance and can meet the industrial application requirements.

The technical scheme is as follows:

the invention provides microelectronic assembly soldering flux which is prepared from the following components in parts by weight:

11-15 parts of film-forming agent,

14-18 parts of activating agent,

8-12 parts of hexadecyl trimethyl ammonium bromide,

7-14 parts of corrosion inhibitor,

0.8 to 1.6 portions of boric acid,

1-2 parts of alkyl benzoic acid,

9-14 parts of methyldiethanolamine,

16-24 parts of ethyl acetate,

14-20 parts of glycol acetate,

21-27 parts of ethylene glycol,

18-26 parts of dimethyl succinate.

Preferably, the kinds of microelectronic assembly soldering flux is formed by mixing a polyvinyl acetate emulsion, a styrene-acrylic emulsion and a hydroxy acrylic emulsion according to a weight ratio of 2:1: 2.

Preferably, the kinds of microelectronic assembly soldering flux are prepared by mixing succinic acid, DL-malic acid, bromosuccinate and sebacic acid according to the weight ratio of 1:3:1: 2.

Preferably, the kinds of microelectronic assembly flux is prepared by the following preparation method, adding 34 parts of diethylaminoethanol into a stirrer, adding 100 parts of deionized water, then adding 4 parts of coconut oil fatty acid diethanolamide and 5 parts of hexadecyl trimethyl ammonium bromide, uniformly stirring, then adding 7 parts of sodium molybdate, 4 parts of diethylenetriamine and 9 parts of sodium tripolyphosphate, and uniformly mixing to obtain the corrosion inhibitor.

The invention also provides a preparation method of kinds of microelectronic assembly soldering flux, which comprises the following preparation steps:

(1) adding 11-15 parts of film forming agent into a reactor, then adding 16-24 parts of ethyl acetate, 14-20 parts of glycol acetate, 21-27 parts of ethylene glycol and 18-26 parts of dimethyl succinate, heating to 60 ℃, stirring for 8min, then adding 8-12 parts of cetyl trimethyl ammonium bromide and 14-18 parts of activating agent, and stirring for 15 min;

(2) and reducing the temperature to 50 ℃, continuously adding 7-14 parts of corrosion inhibitor, 0.8-1.6 parts of boric acid, 1-2 parts of alkyl benzoic acid and 9-14 parts of methyldiethanolamine, stirring for 30min, and cooling to room temperature to obtain the microelectronic assembly soldering flux.

Has the advantages that:

(1) the solvent in the invention can effectively dissolve the components such as the activating agent and the like, and plays a good role in assisting the activating agent to exert, the compound activating agent keeps higher activity in the welding process, the soldering aid effect of the soldering flux is improved, the microelectronic assembly soldering flux prepared by compounding the components has excellent comprehensive performance, and the industrial application requirements can be met.

(2) The soldering flux prepared by the invention can ensure that the solder spreading rate is high, the welding spot is bright and full, the corrosivity of the soldering flux can be effectively reduced, and no residue is left after welding.

Detailed Description

The following examples are presented to enable one of ordinary skill in the art to more fully understand the present invention and are not intended to limit the invention in any way.