阅读说明：本技术 高密度组装部件用免清洗助焊剂及其制备方法 (Cleaning-free soldering flux for high-density assembly parts and preparation method thereof ) 是由 詹建朝 于 2018-10-16 设计创作，主要内容包括：本发明提供了高密度组装部件用免清洗助焊剂及其制备方法,包括以下重量份组分：巯基乙醇4-9份、活性剂7-11份、成膜剂30-40份、重铬酸钾1-3份、表面活性剂6-10份、磷酸二氧锌1-4份、钼酸钠2.7-4.5份、三乙醇胺3-6份、缓蚀剂5-11份、乙二醇丁醚13-17份、1,4-丁二醇8-12份、去离子水75-95份。本发明制备得到的助焊剂性质稳定,不分层,铺展性好,腐蚀性低,可以满足工业应用需求。(The invention provides a cleaning-free soldering flux for high-density assembly parts and a preparation method thereof, wherein the cleaning-free soldering flux comprises the following components in parts by weight: 4-9 parts of mercaptoethanol, 7-11 parts of an active agent, 30-40 parts of a film forming agent, 1-3 parts of potassium dichromate, 6-10 parts of a surfactant, 1-4 parts of zinc dihydrogen phosphate, 2.7-4.5 parts of sodium molybdate, 3-6 parts of triethanolamine, 5-11 parts of a corrosion inhibitor, 13-17 parts of ethylene glycol butyl ether, 8-12 parts of 1, 4-butanediol and 75-95 parts of deionized water. The soldering flux prepared by the invention has stable property, no delamination, good spreadability and low corrosivity, and can meet the requirements of industrial application.)

1. The cleaning-free soldering flux for the high-density assembly part is characterized by comprising the following components in parts by weight:

4-9 parts of mercaptoethanol,

7-11 parts of an active agent,

30-40 parts of film-forming agent,

1-3 parts of potassium dichromate,

6-10 parts of surfactant,

1-4 parts of zinc dihydrogen phosphate,

2.7 to 4.5 portions of sodium molybdate,

3-6 parts of triethanolamine,

5-11 parts of corrosion inhibitor,

13-17 parts of ethylene glycol butyl ether,

8-12 parts of 1, 4-butanediol,

75-95 parts of deionized water.

2. The no-clean flux for high-density assembly parts according to claim 1, wherein the active agent is a mixture of ammonium succinate, DL-malic acid and anhydrous citric acid in a weight ratio of 2:1: 3.

3. The no-clean soldering flux for high-density assembly parts according to claim 1, wherein the surfactant is prepared by mixing alkylphenol ethoxylate, sodium fatty alcohol polyoxyethylene sulfonate and sucrose ester according to a ratio of 1.1:2: 2.6.

4. The no-clean flux for high-density assembled parts according to claim 1, wherein the corrosion inhibitor is a mixture of aluminum chloride and potassium fluoride in a ratio of 2: 0.8.

5. The no-clean flux for high-density assembled parts according to claim 1, wherein the film-forming agent is silicone modified acrylic resin.

6. The preparation method of the cleaning-free soldering flux for the high-density assembly part is characterized by comprising the following preparation steps of:

(1) mixing 7-11 parts of an active agent and 30-40 parts of a film forming agent uniformly, heating to 60 ℃, stirring for 30min, reducing the temperature to 40 ℃, adding 75-95 parts of deionized water, 6-10 parts of a surfactant, 13-17 parts of butyl cellosolve and 8-12 parts of 1, 4-butanediol, and stirring for 20min until the mixture is uniformly mixed;

(2) and (2) continuously adding 4-9 parts of mercaptoethanol, 1-3 parts of potassium dichromate, 2.7-4.5 parts of sodium molybdate and 5-11 parts of corrosion inhibitor into the mixed solution obtained in the step (1), stirring for 20min, cooling to room temperature, adding 3-6 parts of triethanolamine and 1-4 parts of zinc phosphate, and mixing for 40min to obtain the zinc phosphate corrosion inhibitor.

Technical Field

The invention relates to the field of soldering flux, in particular to a cleaning-free soldering flux for high-density assembly parts and a preparation method thereof.

Background

The invention provides no-clean soldering flux for high-density assembly parts and a preparation method thereof, wherein the obtained soldering flux has stable property, good spreadability and low corrosivity, and can meet the requirements of industrial application.

Disclosure of Invention

The technical problem to be solved is as follows:

the invention aims to provide kinds of no-clean soldering flux for high-density assembly parts and a preparation method thereof, and the obtained soldering flux has stable property, no delamination, good spreadability and low corrosivity and can meet the requirements of industrial application.

The technical scheme is as follows:

the invention provides a cleaning-free soldering flux for high-density assembly parts, which comprises the following components in parts by weight:

4-9 parts of mercaptoethanol,

7-11 parts of an active agent,

30-40 parts of film-forming agent,

1-3 parts of potassium dichromate,

6-10 parts of surfactant,

1-4 parts of zinc dihydrogen phosphate,

2.7 to 4.5 portions of sodium molybdate,

3-6 parts of triethanolamine,

5-11 parts of corrosion inhibitor,

13-17 parts of ethylene glycol butyl ether,

8-12 parts of 1, 4-butanediol,

75-95 parts of deionized water.

Preferably, the cleaning-free soldering flux for the high-density assembly part is prepared by mixing ammonium succinate, DL-malic acid and anhydrous citric acid according to the weight ratio of 2:1: 3.

Preferably, the cleaning-free soldering flux for the high-density assembly part is prepared by mixing alkylphenol ethoxylates, fatty alcohol polyoxyethylene sodium sulfonate and sucrose ester according to the ratio of 1.1:2: 2.6.

Preferably, the cleaning-free soldering flux for the high-density assembly part is prepared by mixing aluminum chloride and potassium fluoride according to a ratio of 2: 0.8.

Preferably, the high-density assembly part is a no-clean soldering flux, and the film forming agent is organosilicon modified acrylic resin.

The invention also provides a preparation method of the cleaning-free soldering flux for the high-density assembly part, which comprises the following preparation steps:

(1) mixing 7-11 parts of an active agent and 30-40 parts of a film forming agent uniformly, heating to 60 ℃, stirring for 30min, reducing the temperature to 40 ℃, adding 75-95 parts of deionized water, 6-10 parts of a surfactant, 13-17 parts of butyl cellosolve and 8-12 parts of 1, 4-butanediol, and stirring for 20min until the mixture is uniformly mixed;

(2) and (2) continuously adding 4-9 parts of mercaptoethanol, 1-3 parts of potassium dichromate, 2.7-4.5 parts of sodium molybdate and 5-11 parts of corrosion inhibitor into the mixed solution obtained in the step (1), stirring for 20min, cooling to room temperature, adding 3-6 parts of triethanolamine and 1-4 parts of zinc phosphate, and mixing for 40min to obtain the zinc phosphate corrosion inhibitor.

Has the advantages that:

(1) the soldering flux prepared by the invention has stable property, no delamination, good spreadability and low corrosivity, and can meet the requirements of industrial application.

(2) The mercaptoethanol is added in the corrosion inhibitor, so that the corrosion inhibitor can be adsorbed to the surface of metal to form an ordered self-assembled film, and a good corrosion inhibition effect is achieved.

(3) The addition of the components with the slow release effect can play a good protection role and reduce the corrosion of the residues after welding on elements.

(4) The invention selects the ethylene glycol monobutyl ether and the 1, 4-butanediol to be compounded as the solvent, has proper viscosity, ensures that all components can be uniformly dispersed, and can play a good role in protecting the welding surface.

Detailed Description

The following examples are presented to enable one of ordinary skill in the art to more fully understand the present invention and are not intended to limit the invention in any way.